Power unit and electrical equipment
By constructing a heat spreader and heat dissipation channels on an aluminum substrate, and utilizing the phase change heat transfer of the thermally conductive working fluid and the cooperation of heat dissipation components, the problem of low thermal conductivity of the aluminum substrate is solved, and temperature balance and power density improvement of the heating element are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN INOVANCE TECH CO LTD
- Filing Date
- 2025-05-30
- Publication Date
- 2026-04-28
AI Technical Summary
The low thermal conductivity of aluminum substrates results in poor heat dissipation performance of heat-generating components, which affects the improvement of power density.
A heat dissipation plate consisting of a first plate and a second plate is used to form a heat dissipation channel. The channel is filled with a heat-conducting working fluid, and the heat is evenly distributed through the phase change heat transfer principle. Heat is then dissipated in conjunction with heat dissipation components.
It improves the temperature uniformity of the heating element, reduces the power consumption of the heating element, increases the power density, and reduces the size of the heat dissipation component, thus achieving a lightweight power unit.
Smart Images
Figure CN224178365U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of industrial control technology, and in particular to a power unit and electrical equipment. Background Technology
[0002] With the development of technology, more and more electrical products have emerged, such as frequency converters, servo drives, on-board chargers, motor controllers, etc., which include power units. Generally, a power unit includes an aluminum substrate and multiple heating elements, which are mounted on the aluminum substrate.
[0003] Understandably, aluminum substrates are usually made of aluminum alloys. Aluminum substrates have a low thermal conductivity and generally poor temperature uniformity, which is not conducive to heat dissipation of heating elements and affects the improvement of power density of heating elements. Utility Model Content
[0004] Therefore, it is necessary to provide a power unit and electrical device that can improve temperature uniformity and thus increase power density, in order to address the problem that the low thermal conductivity of aluminum substrates in current power units affects the improvement of power density of heating elements.
[0005] A power unit, comprising:
[0006] A first plate and a second plate, wherein a heat dissipation channel is formed between the first plate and the second plate;
[0007] An insulating layer is disposed on the first plate.
[0008] Circuit components are disposed on the side of the insulating layer away from the first plate; and
[0009] A heating element is disposed on the side of the circuit component away from the insulating layer and is electrically connected to the circuit component.
[0010] In one embodiment of this application, the heat dissipation channel includes a plurality of bent branch channels, with a first spacing between two adjacent branch channels, and the ratio of the equivalent diameter of the heat dissipation channel to the first spacing is in the range of 0.5-2.
[0011] In one embodiment of this application, the equivalent diameter of the heat dissipation channel is less than or equal to 2 mm.
[0012] In one embodiment of this application, the first spacing is less than or equal to 2 mm.
[0013] In one embodiment of this application, the heat dissipation channel is filled with a thermally conductive medium, which includes at least one of water, ethanol, acetone, chloroform, or tetrafluoroethane.
[0014] In one embodiment of this application, the surface of the first plate facing the second plate has a plurality of first channel grooves, and / or the surface of the second plate facing the first plate has a plurality of second channel grooves;
[0015] The first plate is disposed on the second plate, and each of the first channel grooves and each of the second channel grooves surrounds the branch channel, or each of the first channel grooves and the second plate surrounds the branch channel, or the first plate and each of the second channel grooves surround the branch channel.
[0016] In one embodiment of this application, the first plate and the second plate are welded together, or the first plate and the second plate are formed by extrusion molding.
[0017] In one embodiment of this application, the first plate is provided with a heat dissipation component, and the heat-generating element is spaced apart from the heat dissipation component.
[0018] In one embodiment of this application, the second plate is provided with a heat dissipation component.
[0019] In one embodiment of this application, the projections of the heating element and the heat dissipation component in the thickness direction of the first plate and the second plate do not overlap at least partially.
[0020] In one embodiment of this application, the second plate body is further provided with the insulating layer, the circuit components and the heating element in sequence.
[0021] In one embodiment of this application, the first plate and the second plate constitute a heat exchange plate. The heat exchange plate includes a first connecting plate and a second connecting plate that are connected to each other. The included angle between the first connecting plate and the second connecting plate is in the range of 0-180 degrees. The heat dissipation component is disposed on the first connecting plate, and the insulating layer, the circuit component and the heating element are disposed on the second connecting plate.
[0022] An electrical device comprising a power unit as described in any of the foregoing technical features.
[0023] In one embodiment of this application, the electrical device further includes a heat dissipation component, which is disposed on the first plate or the second plate in the power unit, and the heat from the heating element is conducted to the heat dissipation component through a heat spreader.
[0024] By adopting the above technical solution, this application has at least the following technical effects:
[0025] The power unit and electrical equipment of this application include an insulating layer disposed on a first plate, circuit components disposed on the side of the insulating layer away from the heat spreader, and heating elements disposed on the side of the circuit assembly away from the insulating layer and electrically connected to the circuit assembly. A heat dissipation channel is formed between the first plate and the second plate, which together constitute a heat spreader. The heat generated by the heating elements during operation can be conducted evenly through the heat spreader to ensure a relatively uniform temperature throughout the heat spreader and to reduce the temperature of each heating element.
[0026] Thus, by using the first and second plates as the substrate of the power unit, the first and second plates, after absorbing heat from the heating element, exhibit uniform temperature characteristics. This ensures even temperature distribution across the heating element, preventing heat concentration at any particular point, reducing power consumption, and increasing the output power of the heating element, thereby enhancing the power density of the power unit. Furthermore, it reduces the thermal resistance of the heat transfer path, thereby reducing the size of the heat dissipation components, the overall dimensions of the device, and its weight. Attached Figure Description
[0027] Figure 1 This is a schematic diagram of the power unit according to the first embodiment of this application.
[0028] Figure 2 for Figure 1 The top view of the power unit shown.
[0029] Figure 3 for Figure 1 The diagram shows the breakdown of the power unit.
[0030] Figure 4 for Figure 2 The power unit shown is a cross-sectional view at AA.
[0031] Figure 5 for Figure 3 A schematic diagram of the heat spreader in the power unit shown.
[0032] Figure 6 for Figure 5 A perspective view of the heat spreader shown.
[0033] Figure 7 for Figure 6 The top view of the temperature distribution plate shown.
[0034] Figure 8 for Figure 7 The image shows a cross-sectional view of the heat exchanger along the BB direction.
[0035] Figure 9 for Figure 5 The diagram shown is an exploded view of the heat spreader.
[0036] Figure 10for Figure 9 The diagram shown is an exploded view of the heat spreader from another perspective.
[0037] Figure 11 for Figure 1 The front view of the power unit is shown.
[0038] Figure 12 This is a schematic diagram of the power unit in the second embodiment of this application.
[0039] Figure 13 This is a schematic diagram of the power unit in the third embodiment of this application.
[0040] Figure 14 This is a schematic diagram of the power unit in the fourth embodiment of this application.
[0041] Wherein: 10, electrical equipment; 100, power unit; 110, heat spreader; 111, first plate; 1111, first channel groove; 112, second plate; 1121, second channel groove; 113, heat dissipation channel; 1131, branch channel; 120, circuit component; 130, heating element; 140, insulation layer; 200, heat dissipation component. Detailed Implementation
[0042] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0043] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0044] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0045] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0046] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact, or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0047] It should be noted that if an element is referred to as being "fixed to" or "attached to" another element, it can be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element present. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.
[0048] Understandably, electrical products such as frequency converters, servo drives, on-board chargers, and motor controllers include power units. Generally, a power unit consists of an aluminum substrate and multiple heating elements mounted on the aluminum substrate. The aluminum substrate is typically a 2mm thick aluminum plate with single-sided composite insulation material. Typically, the aluminum substrate is made of 5000 series aluminum alloy. Aluminum substrates have low thermal conductivity and generally poor temperature uniformity, which is detrimental to heat dissipation from the heating elements and affects the improvement of the power density of the heating elements.
[0049] For this purpose, please refer to Figures 1 to 3 This application provides a novel power unit 100. Figure 1 This is a schematic diagram of a power unit 100 according to an embodiment of this application. Figure 2 for Figure 1 The top view of the power unit 100 shown. Figure 3 for Figure 1 The diagram shows an exploded view of the power unit 100.
[0050] The power unit 100 is used in electrical equipment 10. The power unit 100 is a frequency converter component that uses power electronic devices for rectification, filtering and inversion. It can convert AC power into DC power and convert it into the required AC power output through an inverter. In this process, the power unit 100 also provides filtering and protection functions to ensure the stable and safe operation of the power system.
[0051] For example, the electrical device 10 is an on-board charger, that is, the power unit 100 is applied in the on-board charger to realize operations such as rectification and filtering. Of course, in other embodiments of this application, the power unit 100 can also be applied to industrial control equipment such as frequency converters, servo drives, motor controllers, or other types of electrical devices 10.
[0052] To better illustrate the structure of the power unit 100, the structure of the electrical device 10 will be briefly introduced here. (See attached document.) Figures 1 to 3 The electrical equipment 10 includes at least a heat dissipation component 200 and the power unit 100 of this application. The heat dissipation component 200 is disposed on one surface of the power unit 100. Simultaneously, the heat dissipation component 200 also serves as a support for mounting, and the power unit 100 is mounted in the electrical equipment 10 via the heat dissipation component 200. Figure 1 and Figure 3 As shown, the heat dissipation component 200 is disposed on the lower surface of the power unit 100.
[0053] The heat dissipation component 200 has good heat dissipation performance. The power unit 100 of this application can utilize the heat dissipation performance of the heat dissipation component 200. The heat generated by the power unit 100 during operation can be conducted to the heat dissipation component 200 and dissipated through the heat dissipation component 200 to reduce the temperature of the power unit 100 and ensure the performance of the power unit 100.
[0054] Understandably, in addition to the power unit 100, the electrical equipment 10 also includes other functional components to enable it to perform its corresponding functions. However, these functional components also generate heat during operation. This heat can affect the performance of the functional components and, in severe cases, shorten their lifespan.
[0055] The heat generated during the operation of the functional components can also be transferred to the heat dissipation component 200, which dissipates the heat generated during the operation of the functional components. Of course, the heat dissipation component 200 can also be an independent component in the electrical equipment 10, which only dissipates heat from the power unit 100.
[0056] In one embodiment, the heat dissipation component 200 is a liquid-cooled plate or other type of cold plate, as long as it can dissipate heat. Of course, in other embodiments of this application, the heat dissipation component 200 may also be a heat sink or other structural form capable of heat dissipation. Optionally, the surface of the heat dissipation component 200 facing away from the power unit 100 has heat dissipation fins to improve the heat dissipation effect of the heat dissipation component 200.
[0057] The power unit 100 of this application can evenly distribute the temperature across the heating element 130, preventing heat concentration at any one point on the heating element 130, reducing the power consumption of the heating element 130, thereby increasing the power of the heating element 130 and thus increasing the power density of the power unit 100. Furthermore, it can reduce the thermal resistance of the heat transfer path, thereby reducing the size of the heat dissipation components, the overall size of the device, and its weight. The specific structures of the power unit 100 in some embodiments are described below.
[0058] See Figures 1 to 4 In one embodiment, the power unit 100 includes a first plate 111, a second plate 112, a circuit component 120, a plurality of heating elements 130, and an insulating layer 140. A heat dissipation channel 113 is formed between the first plate 111 and the second plate 112. The insulating layer 140 is disposed on the first plate 111, and the circuit component 120 is disposed on the side of the insulating layer 140 away from the first plate 111. The heating elements 130 are disposed on the side of the circuit component 120 away from the insulating layer 140 and are electrically connected to the circuit component 120. Figure 4 for Figure 2 The power unit 100 shown is a cross-sectional view at AA.
[0059] The first plate 111 and the second plate 112 serve as the substrate of the power unit 100. All components of the power unit 100 are mounted on the first plate 111, allowing the power unit 100 to be integrated into a single structure, facilitating its assembly. For example... Figures 1 to 3 As shown, the first plate 111 is located above the second plate 112.
[0060] like Figure 1 and Figure 3 As shown, the left-right direction represents the length of the first plate 111 and the second plate 112, the front-back direction represents the width of the first plate 111 and the second plate 112, and the up-down direction represents the thickness, top-bottom, and height of the first plate 111 and the second plate 112. These length, width, and thickness directions also apply to other components of the power unit 100, and will not be elaborated upon further below.
[0061] The circuit component 120 is the circuit of the power unit 100. The circuit component 120 is disposed on the first plate 111. Further, the circuit component 120 is disposed on the surface of the first plate 111 facing away from the second plate 112. The insulating layer 140 is disposed between the first plate 111 and the circuit component 120.
[0062] That is, the insulating layer 140 is disposed above the first plate 111, and the circuit component 120 is disposed above the insulating layer 140. The insulating layer 140 can achieve electrical isolation between the first plate 111 and the circuit component 120, prevent the first plate 111 from becoming energized, and ensure safety.
[0063] The heating element 130 is the core component of the power unit 100. In a specific embodiment, multiple heating elements 130 are disposed on the side of the circuit component 120 away from the insulating layer 140 and are electrically connected to the circuit component 120. The power unit 100 performs rectification, filtering, inversion and other operations through the cooperation of multiple heating elements 130 so that the power unit 100 can realize the corresponding functions.
[0064] When the heating element 130 is working, it generates heat. In one embodiment, the heating element 130 is a power transistor, such as a bipolar transistor, a metal-oxide-semiconductor field-effect transistor, an insulated-gate bipolar transistor, a thyristor, a wide bandgap semiconductor power device, etc. In other embodiments, the type of heating element 130 is not limited. If the heat of the heating element 130 is not dissipated, or if the temperature of a certain heating element 130 is too high, it will affect the output power of the heating element 130, resulting in increased power consumption and affecting the power density of the power unit 100.
[0065] Therefore, this application uses a first plate 111 and a second plate 112 as the substrate of the power unit 100, and the first plate 111 and the second plate 112 have good thermal conductivity. The circuit component 120 and multiple heating elements 130 are all disposed on the first plate 111. When the power unit 100 is working, the heat generated by the multiple heating elements 130 can be transferred to the first plate 111.
[0066] A heat dissipation channel 113 is formed between the first plate 111 and the second plate 112. In this way, the heat on the first plate 111 can be transferred to the second plate 112 through the heat dissipation channel 113, and the heat is dissipated by the second plate 112 to dissipate heat from the heating element 130 and reduce the temperature of the heating element 130.
[0067] Moreover, the first plate 111 and the second plate 112 can balance the heat of multiple heating elements 130, so that the temperature of each part of the first plate 111 is basically the same, thereby making the temperature of each heating element 130 basically the same, so as to improve the output power of each heating element 130, improve the power density of the power unit 100, and increase the application range of the power unit 100.
[0068] The power unit 100 in the above embodiment uses a first plate 111 and a second plate 112 as the substrate of the power unit 100. After the first plate 111 and the second plate 112 absorb the heat of the heating element 130, they have uniform temperature characteristics, which can balance the temperature of the heating element 130, avoid heat concentration at a certain heating element 130, reduce the power consumption of the heating element 130, improve the output power of the heating element 130, and thus improve the power density of the power unit 100.
[0069] Meanwhile, since the first plate 111 and the second plate 112 have good thermal conductivity, the thermal resistance of the heat transfer path can be reduced. As a result, the thickness of the first plate 111 and the second plate 112 can be appropriately reduced without affecting their structural strength, so as to reduce the thickness of the entire power unit 100 and thus reduce the overall size of the power unit 100, which is conducive to the lightweight design of the power unit 100.
[0070] In one embodiment, the first plate 111 and the second plate 112 form a heat spreader 110. The heat spreader 110 is a high-efficiency heat dissipation device based on the principle of phase change heat transfer. The heat spreader 110 has good thermal conductivity. Through the evaporation and condensation cycle of the internal working fluid, the heat spreader 110 can quickly diffuse the heat from the local heat source to the entire plane, achieving uniform temperature distribution so that the temperature at all parts of the heat spreader 110 is basically the same.
[0071] Optionally, the circuit component 120 is made of copper foil. In the fabrication of the power unit 100 of this application, the heat spreader 110, the insulating layer 140, and the copper foil are formed using a high-temperature lamination process to create a substrate. Subsequently, the copper foil is etched into the circuit component 120 using an etching process, and the heating element 130 is then mounted onto the circuit component 120 using surface mount technology (SMT) or wave soldering processes.
[0072] Optionally, the heating element 130 is a power transistor, such as a bipolar transistor, a metal-oxide-semiconductor field-effect transistor, an insulated-gate bipolar transistor, a thyristor, a wide bandgap semiconductor power device, etc.
[0073] See Figures 1 to 3 In one embodiment, a plurality of heating elements 130 are spaced apart on the heat spreader 110 along the length and / or width directions. It is understood that the number of heating elements 130 is not limited in principle, as long as the cooperation between the heating elements 130 enables the function of the power unit 100.
[0074] In this embodiment, multiple heating elements 130 extend along the length direction and are arranged in two columns, with the two columns of heating elements 130 arranged symmetrically. Of course, in other embodiments of this application, multiple heating elements 130 may also extend along the length direction and be arranged in one or more columns.
[0075] See Figures 1 to 3 In one embodiment, the heat dissipation component 200 is disposed on the heat spreader 110. Thus, the heat generated by the heating element 130 during operation can be transferred to the heat spreader 110, and then to the heat dissipation component 200. The heat dissipation component 200 can dissipate the heat from the heating element 130, thereby reducing the temperature of the heating element 130, reducing its power consumption, and increasing the power density of the power unit 100.
[0076] See Figures 5 to 8 In one embodiment, the heat dissipation channel 113 is filled with a thermally conductive working fluid. Figure 5 for Figure 3 A schematic diagram of the heat spreader 110 in the power unit 100 is shown. Figure 6 for Figure 5 The perspective view of the heat spreader 110 shown. Figure 7 for Figure 6 The top view of the heat spreader 110 shown is shown. Figure 8 for Figure 7 The cross-sectional view of the heat spreader 110 shown along the BB direction.
[0077] The heat dissipation channel 113 inside the heat dissipation plate 110 is evacuated, and a portion of the heat dissipation channel 113 is filled with a heat-conducting working fluid. Under the action of surface tension and gravity, the heat-conducting working fluid is separated in the heat dissipation channel 113, forming a gas column and a heat-conducting working fluid column (i.e., a liquid column), and the gas column and the heat-conducting working fluid column are staggered from the heating end to the cooling end.
[0078] At the heating end, the gas column expands due to heating. Simultaneously, some of the heat-conducting medium boils, generating bubbles that propel the heat-conducting medium and gas column from the high-temperature heating end to the low-temperature cooling end. Because the temperature at the cooling end is lower, the bubbles contract and burst, causing a pressure drop.
[0079] Because there is a pressure difference between the heating end and the cooling end of the heat spreader 110, and the pressure is unbalanced between adjacent branch channels 1131, the heat transfer medium oscillates and flows between the heating end and the cooling end. During the pulsation process, the gas column will crack, merge and liquefy, and the heat transfer medium will also separate, merge and vaporize.
[0080] At the cooling end, the gas column and the heat-conducting working fluid release heat. The gas column decreases or disappears during pulsation, further inducing pulsation, thereby achieving heat transfer. During the heat transfer process, no external mechanical or electrical work is required; it is entirely a self-oscillation driven by heat.
[0081] Thus, the heat generated by the heating element 130 during operation can be transferred to the first plate 111. The heat-conducting working fluid in the heat spreader 110 rapidly absorbs heat and vaporizes in a vacuum environment, turning into steam. At the same time, the steam rapidly diffuses from the heating end to the cooling end due to the pressure difference, carrying a large amount of latent heat (phase change heat).
[0082] When the steam comes into contact with the cooler second plate 112, it releases latent heat and condenses into a liquid. The heat-conducting working fluid of the condensed liquid returns to the heating end, completing the cycle. At the same time, the heat released by condensation is transferred to the heat dissipation component 200 through the second plate 112, so that the heat dissipation component 200 can dissipate the heat.
[0083] In one embodiment, the heat exchanger 110 is a pulsating heat exchanger. In a pulsating heat exchanger, the heat-conducting working fluid undergoes both phase change heat transfer and oscillating flow heat transfer simultaneously during the heat transfer process, resulting in higher heat transfer efficiency. Of course, in other embodiments of this application, the heat exchanger 110 may also be a phase change superconducting heat exchanger or a VC heat exchanger.
[0084] In one embodiment, the heat transfer medium is at least one of water, ethanol, acetone, chloroform, or tetrafluoroethane (R134a). The type of heat transfer medium is not limited in principle, as long as it can undergo a phase change. The heat transfer medium is in a two-phase state within the heat dissipation channel 113, utilizing the latent heat of vaporization of the heat transfer medium to achieve rapid heat transfer.
[0085] See Figures 5 to 8 In one embodiment, the heat dissipation channel 113 includes multiple bent branch channels 1131, with a first spacing between adjacent branch channels 1131, and the ratio of the equivalent diameter of the heat dissipation channel 113 to the first spacing is in the range of 0.5-2.
[0086] Multiple branch channels 1131, when connected, can form a loop, which is the heat dissipation channel 113. The heat-conducting medium can flow in each branch channel 1131 to realize the circulation of the heat-conducting medium in the loop, and can oscillate for heat transfer, thus achieving heat transfer.
[0087] In one embodiment, the equivalent diameter of the heat dissipation channel 113 is less than or equal to 2 mm. In another embodiment, the first spacing is less than or equal to 2 mm.
[0088] See Figures 3 to 10 In one embodiment, the surface of the first plate 111 facing the second plate 112 has a plurality of first channel grooves 1111, and the surface of the second plate 112 facing the first plate 111 has a plurality of second channel grooves 1121. The first plate 111 is disposed on the second plate 112, and each first channel groove 1111 and each second channel groove 1121 surrounds a branch channel 1131. Figure 9 for Figure 5 The diagram shown is an exploded view of the heat spreader 110 from one perspective. Figure 10 for Figure 9 An exploded view of the heat spreader 110 shown from another perspective.
[0089] The lower surface of the first plate 111 has a plurality of recessed first channel grooves 1111, and the upper surface of the second plate 112 has a plurality of recessed second channel grooves 1121. The plurality of first channel grooves 1111 and the plurality of second channel grooves 1121 are arranged in a one-to-one correspondence. After the first plate 111 is placed on the second plate 112, each first channel groove 1111 can form a branch channel 1131 with the corresponding second channel groove 1121. In this way, the plurality of first channel grooves 1111 and the plurality of second channel grooves 1121 can form a heat dissipation channel 113 for the flow of heat-conducting working fluid.
[0090] Of course, in other embodiments of this application, a plurality of first channel grooves 1111 may be provided only on the surface of the first plate 111 facing the second plate 112, and the first channel grooves 1111 and the second plate 112 may form a branch channel 1131. Alternatively, the surface of the second plate 112 facing the first plate 111 may have a plurality of second channel grooves 1121, and the first plate 111 and the second channel grooves 1121 may form a branch channel 1131.
[0091] In one embodiment, the first plate 111 and the second plate 112 are welded together. That is, the first plate 111 and the second plate 112 are connected by welding. Welding ensures a reliable connection between the first plate 111 and the second plate 112 and guarantees the sealing of the connection, preventing the heat-conducting medium in the heat dissipation channel 113 from leaking through the gap between the first plate 111 and the second plate 112.
[0092] Of course, in other embodiments of this application, the first plate 111 and the second plate 112 are formed by extrusion molding. Pressure is applied to the material through a mold, causing it to continuously pass through a die hole with a specific cross-sectional shape, thereby obtaining a profile with the desired cross-sectional shape, so that a heat dissipation channel 113 is formed between the first plate 111 and the second plate 112.
[0093] See Figures 1 to 8 In one embodiment, the heat spreader 110 includes a first connecting plate and a second connecting plate that are connected to each other. The angle between the first connecting plate and the second connecting plate is in the range of 0-180 degrees. The heat dissipation component 200 is disposed on the first connecting plate, and the insulating layer 140, the circuit component 120 and the heating element 130 are disposed on the second connecting plate.
[0094] When the included angle between the first connecting plate and the second connecting plate is within the above-mentioned range, the heat exchange plate 110 can present a predetermined shape so that the heat exchange plate 110 can be adapted to the installation space of the electrical equipment 10, making it convenient for the power unit 100 to be installed in the designated position.
[0095] In this way, because the heat spreader 110 has good thermal conductivity, and with the flow of the heat-conducting working fluid in the heat spreader 110, the heat-conducting working fluid can realize the transfer of heat, so as to transfer heat from the heating element 130 to the heat dissipation component 200, thereby realizing the heat dissipation of the heating element 130, reducing the temperature of the heating element 130, reducing the power consumption of the heating element 130, and increasing the density of the power unit 100.
[0096] See Figures 1 to 8 In one embodiment of this application, the angle between the first connecting plate and the second connecting plate is 180°. That is, the heat spreader 110 is flat and supports the insulating layer 140, the circuit component 120, and the heating element 130. Of course, in other embodiments of this application, the first connecting plate may also be bent relative to the second connecting plate.
[0097] See Figures 1 to 3 , Figure 11 In the first embodiment of this application, the heat dissipation component 200 is disposed on the second plate 112, and the projections of the heat-generating element 130 and the heat dissipation component 200 in the thickness direction of the first plate 111 and the second plate 112 overlap. Figure 11 for Figure 1 The front view of the power unit 100 shown.
[0098] The heating element 130 is located on the first plate 111, and the heat dissipation component 200 is located on the second plate 112. That is, the heating element 130 and the heat dissipation component 200 are located on both sides of the heat spreader 110, and the projection of the heating element 130 in the thickness direction is located within the range of the heat dissipation component 200.
[0099] Thus, the heating element 130, the heat spreader 110, and the heat dissipation component 200 are stacked vertically along the thickness direction. In this way, the heat generated by the heating element 130 during operation is directly transferred to the heat dissipation component 200 through the first plate 111, the heat dissipation channel 113 (i.e., the second plate 112). The heat dissipation component 200 can dissipate the heat from the heating element 130, thereby reducing the temperature of the heating element 130, reducing its power consumption, and increasing the power density of the power unit 100.
[0100] See Figure 12 In the second embodiment of this application, the heat dissipation component 200 is disposed on the second plate 112, and the projections of the heating element 130 and the heat dissipation component 200 in the thickness direction of the first plate 111 and the second plate 112 do not overlap. Figure 12 This is a schematic diagram of the power unit 100 in the second embodiment of this application.
[0101] In this embodiment, the heating element 130 is located on the first plate 111, and the heat dissipation component 200 is located on the second plate 112 of the heat spreader 110, and the heating element 130 and the heat dissipation component 200 are offset in the length or width direction. Figure 12 As shown, the heat dissipation component 200 is located on the left edge of the second plate 112, and the heat generation element 130 is located on the right edge of the first plate 111.
[0102] In this way, the heat generated when the heating element 130 is working is transferred through the first plate 111 to the heat-conducting working medium in the heat dissipation channel. When the heat-conducting working medium flows, it can realize the heat transfer, so as to transfer the heat to the second plate 112, and then to the heat dissipation component 200 through the second plate 112.
[0103] Thus, the staggered and opposite arrangement of the heat dissipation component 200 and the heating element 130 enables long-distance heat transfer, increases the heat transfer path, and enhances the heat dissipation effect, thereby effectively dissipating the heat of the heating element 130, reducing the temperature of the heating element 130, reducing the power consumption of the heating element 130, and increasing the density of the power unit 100.
[0104] See Figure 13In the third embodiment of this application, the heat dissipation component 200 is disposed on the first plate 111, and the heating element 130 is disposed at a distance from the heat dissipation component 200. Figure 13 This is a schematic diagram of the power unit 100 in the third embodiment of this application.
[0105] In this embodiment, both the heating element 130 and the heat dissipation component 200 are disposed on the first plate 111, and there is a certain gap between the heating element 130 and the heat dissipation component 200. Figure 13 As shown, the heat dissipation component 200 is located on the left edge of the first plate 111, and the heating element 130 is located on the right edge of the first plate 111.
[0106] In this way, the heat generated when the heating element 130 is working is transferred through the first plate 111 to the heat-conducting working medium in the heat dissipation channel. When the heat-conducting working medium flows, it can realize the heat transfer, so as to transfer the heat to the second plate 112, and then through the first plate 111 to the heat dissipation component 200.
[0107] Thus, the staggered and coplanar arrangement of the heat dissipation component 200 and the heat-generating element 130 enables long-distance heat transfer, thereby increasing the heat transfer path and enhancing the heat dissipation effect. This effectively dissipates the heat from the heat-generating element 130, thereby reducing the temperature of the heat-generating element 130, reducing the power consumption of the heat-generating element 130, and increasing the density of the power unit 100.
[0108] Meanwhile, with the heat dissipation component 200 and the heating element 130 positioned behind the first plate 111, and no other components positioned on the second plate 112, the overall height of the power unit 100 can be significantly reduced, thereby reducing the space occupied by the power unit 100 in the electrical equipment. Of course, the heating element of the electrical equipment can also be positioned on the second plate 112 to achieve heat dissipation of the heating element in the electrical equipment.
[0109] See Figure 14 In the fourth embodiment of this application, based on the third embodiment, the second plate 112 is further provided with an insulating layer 140, a circuit component 120 and a heating element 130 in sequence. Figure 14 This is a schematic diagram of the power unit 100 according to the fourth embodiment of this application.
[0110] In this embodiment, the heat dissipation component 200 is disposed on the first plate 111, and the first plate 111 is also provided with an insulating layer 140, a circuit component 120 and a heating element 130. The second plate 112 is also provided with an insulating layer 140, a circuit component 120 and a heating element 130.
[0111] That is, heating elements 130 are provided on both sides of the heat spreader 110. In this way, while meeting the heat dissipation requirements of the heating elements 130, the number of heating elements 130 can be increased to improve the power density of the power unit 100 and improve the reliability of the power unit 100.
[0112] It is worth noting that the arrangement of the heating element 130 and the heat dissipation component 200 on the heat spreader 110 is not limited to the above-mentioned arrangements, and can also be other arrangements, as long as the heat spreader 110 can play a role in heat conduction, transferring the heat from the heating element 130 to the heat dissipation component 200.
[0113] The power unit 100 of this application uses a heat spreader 110 as the substrate of the power unit 100. After the heat spreader 110 absorbs the heat of the heating element 130, the heat spreader 110 has the characteristic of uniform temperature, which balances the temperature of the heating element 130, avoids the heat concentration at a certain heating element 130, reduces the power consumption of the heating element 130, and improves the output power of the heating element 130, thereby increasing the power density of the power unit 100.
[0114] Meanwhile, because the heat spreader 110 has good thermal conductivity, it can reduce the thermal resistance of the heat transfer path. As a result, the thickness of the heat spreader 110 can be appropriately reduced without affecting its structural strength, thereby reducing the thickness of the entire power unit 100 and thus reducing the overall size of the power unit 100, which is beneficial for the lightweight design of the power unit 100.
[0115] See Figures 1 to 4 This application also provides an electrical device 10, including a power unit 100 as described in any of the above embodiments. By employing the power unit 100 of the above embodiments, the electrical device 10 of this application can reduce the power consumption of the heating element 130, increase the power density of the power unit 100, and ensure the performance of the electrical device 10.
[0116] Meanwhile, the power unit 100 can be applied to different types of electrical equipment 10, such as on-board chargers, frequency converters, servo drives, motor controllers, etc. Apart from the power unit 100, other components in the electrical equipment 10 can still use the previous hardware structure without modification, reducing production costs and meeting the heat dissipation requirements of the power unit 100 in different types of electrical equipment 10.
[0117] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0118] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A power unit, characterized in that, include: A first plate and a second plate, wherein a heat dissipation channel is formed between the first plate and the second plate; An insulating layer is disposed on the first plate. Circuit components are disposed on the side of the insulating layer away from the first plate; and A heating element is disposed on the side of the circuit component away from the insulating layer and is electrically connected to the circuit component.
2. The power unit according to claim 1, characterized in that, The heat dissipation channel includes multiple bent branch channels, with a first spacing between two adjacent branch channels, and the ratio of the equivalent diameter of the heat dissipation channel to the first spacing is in the range of 0.5-2.
3. The power unit according to claim 2, characterized in that, The equivalent diameter of the heat dissipation channel is less than or equal to 2 mm.
4. The power unit according to claim 2, characterized in that, The first spacing is less than or equal to 2 mm.
5. The power unit according to claim 2, characterized in that, The heat dissipation channel is filled with a thermally conductive medium, which includes at least one of water, ethanol, acetone, chloroform, or tetrafluoroethane.
6. The power unit according to claim 2, characterized in that, The surface of the first plate facing the second plate has a plurality of first channel grooves, and / or the surface of the second plate facing the first plate has a plurality of second channel grooves; The first plate is disposed on the second plate, and each of the first channel grooves and each of the second channel grooves surrounds the branch channel, or each of the first channel grooves and the second plate surrounds the branch channel, or the first plate and each of the second channel grooves surround the branch channel.
7. The power unit according to claim 6, characterized in that, The first plate and the second plate are welded together, or the first plate and the second plate are formed by extrusion molding.
8. The power unit according to any one of claims 1 to 7, characterized in that, The first plate is provided with a heat dissipation component, and the heat-generating element is spaced apart from the heat dissipation component.
9. The power unit according to any one of claims 1 to 7, characterized in that, The second plate is equipped with heat dissipation components.
10. The power unit according to claim 9, characterized in that, The projections of the heating element and the heat dissipation component in the thickness direction of the first plate and the second plate do not overlap at least partially.
11. The power unit according to claim 8, characterized in that, The second plate is also provided with the insulating layer, the circuit components and the heating element in sequence.
12. The power unit according to any one of claims 1 to 7, characterized in that, The first plate and the second plate constitute a heat spreader. The heat spreader includes a first connecting plate and a second connecting plate that are connected to each other. The angle between the first connecting plate and the second connecting plate is in the range of 0-180 degrees. The heat dissipation component is disposed on the first connecting plate, and the insulating layer, the circuit component and the heating element are disposed on the second connecting plate.
13. An electrical device, characterized in that, Includes the power unit as described in any one of claims 1 to 12.
14. The electrical equipment according to claim 13, characterized in that, The electrical equipment also includes a heat dissipation component, which is disposed on the first plate or the second plate in the power unit, and the heat from the heating element is conducted to the heat dissipation component through a heat spreader.