Circuit board solder paste printing equipment

Abstract

The utility model relates to the field of circuit board production equipment, and discloses circuit board solder paste printing equipment which comprises a positioning table, a steel mesh, a scraper mechanism and a reciprocating mechanism, the reciprocating mechanism is used for driving the scraper mechanism to reciprocate in the first direction, and the scraper mechanism comprises a first scraper, a second scraper, a rotating body and a rotating driving assembly. The first scraper and the second scraper are both fixedly installed on the rotating body, the rotating driving assembly is used for driving the rotating body to rotate so as to switch the abutting state of the first scraper and the steel mesh and the abutting state of the second scraper and the steel mesh, at most one of the first scraper and the second scraper abuts against the steel mesh at any moment in the solder paste printing process, and at most one of the first scraper and the second scraper abuts against the steel mesh. At the moment, the position where the first scraper can abut against the steel mesh and the position where the second scraper can abut against the steel mesh are staggered in the first direction, the acting objects of the first scraper and the second scraper are all the solder paste balls on the steel mesh, so that it is guaranteed that solder paste printing and covering are even, and the production quality of circuit boards is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board production equipment, specifically to a circuit board solder paste printing equipment. Background Technology

[0002] In the production of electronic circuit boards, solder paste printing is a crucial step in fixing electronic components onto the circuit board. The main function of solder paste is to firmly adhere electronic components to the circuit board, preventing them from falling off due to vibration during transport. However, existing solder paste printing processes have some technical problems that urgently need improvement.

[0003] The existing solder paste printing process steps are as follows: First, the circuit board to be processed is fixed on the positioning table, and solder paste spools are attached to the surface of the stencil (see instruction manual). Figure 1 Step I). Next, by moving a single squeegee back and forth along the surface of the stencil, solder paste is smeared onto the circuit board through the mesh of the stencil (see instruction manual). Figure 1 Steps II and III in the instruction manual can be repeated as needed. Finally, remove the printed circuit board from the stencil and positioning table (see attached instruction manual). Figure 1 Step IV in the process.

[0004] However, with existing solder paste printing processes, the squeegee leaves a large amount of solder paste residue on both sides of the printing area on the stencil during its reciprocating motion (see instruction manual). Figure 1 (The stencil in step IV). This not only leads to solder paste waste, but also, when the squeegee repeats steps II-III, it does not replenish the residual solder paste to the printed areas with mesh openings in the stencil. Therefore, existing solder paste printing processes easily result in uneven solder paste coverage on the circuit board, thereby reducing the production quality of the circuit board. Utility Model Content

[0005] The purpose of this invention is to overcome the problem of uneven solder paste coverage on circuit boards caused by existing solder paste printing processes, and to provide a circuit board solder paste printing equipment that can improve the uniformity of solder paste coverage on circuit boards and improve the production quality of circuit boards.

[0006] To achieve the above objectives, this utility model provides a circuit board solder paste printing equipment, including a positioning table, a stencil, a squeegee mechanism, and a reciprocating mechanism. The squeegee mechanism is located on the side of the stencil away from the positioning table, and the reciprocating mechanism is used to drive the squeegee mechanism to reciprocate along a first direction.

[0007] The scraper mechanism includes a first scraper, a second scraper, a rotating body, and a rotation drive assembly. The first scraper and the second scraper are both fixedly mounted on the rotating body. The rotation drive assembly is used to drive the rotating body to rotate, thereby switching the contact state between the first scraper and the steel mesh and the contact state between the second scraper and the steel mesh.

[0008] During the solder paste printing process, at any given moment, at most one of the first squeegee and the second squeegee comes into contact with the stencil, and at that moment, the positions where the first squeegee and the stencil can come into contact are offset along the first direction.

[0009] In some embodiments, the rotary drive assembly includes a stepper motor and a rotating shaft, the rotating shaft being connected between the power output end of the stepper motor and the rotating body.

[0010] In some embodiments, when the first scraper abuts against the steel mesh, the first scraper and the steel mesh form an acute angle; when the second scraper abuts against the steel mesh, the second scraper and the steel mesh form an acute angle; and the orientation of the first scraper when it abuts against the steel mesh is opposite to the orientation of the second scraper when it abuts against the steel mesh.

[0011] In some embodiments, a side plate is fixedly installed on the steel mesh, a base is slidably installed on the side plate, the rotary drive assembly is installed on the base, and the base is driven to slide by the reciprocating mechanism.

[0012] In some embodiments, the reciprocating mechanism includes a drive source and a feed screw, the feed screw being connected to the power output end of the drive source and threadedly connected to the machine base.

[0013] In some embodiments, the axis of the feed screw is parallel to the surface of the steel mesh.

[0014] In some embodiments, there are two or more feed screws and all of the feed screws are parallel.

[0015] In some embodiments, the circuit board solder paste printing equipment further includes a monitoring mechanism for monitoring the surface of the stencil.

[0016] In some embodiments, the monitoring mechanism includes a monitor, which is fixedly mounted on both the first scraper and the second scraper; when the first scraper abuts against the steel mesh, the monitoring direction of the monitor on the first scraper points towards the steel mesh, and when the second scraper abuts against the steel mesh, the monitoring direction of the monitor on the second scraper points towards the steel mesh.

[0017] In some embodiments, along the second direction, the monitoring range of the monitoring mechanism is not less than the width of the first scraper and the second scraper, and the second direction is perpendicular to the first direction and parallel to the mesh surface of the steel mesh.

[0018] The circuit board solder paste printing equipment using the above-mentioned technical solution of this utility model has the following effects:

[0019] First, the first squeegee on the squeegee mechanism comes into contact with the stencil. The solder paste for printing is located on the positive side of the first squeegee along the first direction. The reciprocating mechanism drives the squeegee mechanism to move in the positive direction of the first direction. The solder paste is printed onto the circuit board of the positioning stage through the mesh of the stencil by the first squeegee along the positive direction of the first direction.

[0020] After the solder paste is printed onto the circuit board in the first direction, the rotating body is driven to rotate by the rotary drive assembly and the second squeegee is brought into contact with the stencil. At this time, the solder paste remaining on the stencil is located on the opposite side of the second squeegee in the first direction. The reciprocating mechanism drives the squeegee mechanism to move in the opposite direction of the first direction. The second squeegee then prints the solder paste onto the circuit board of the positioning stage through the mesh of the stencil in the opposite direction of the first direction.

[0021] After the solder paste is printed onto the circuit board in the reverse direction along the first direction, the rotating body is driven to rotate by the rotary drive assembly and the first squeegee is brought into contact with the stencil again. At this time, the solder paste remaining on the stencil is located on the positive side of the first squeegee along the first direction. The reciprocating mechanism drives the squeegee mechanism to move in the positive direction along the first direction again. The solder paste is then printed onto the circuit board of the positioning stage through the mesh of the stencil again by the first squeegee in the positive direction along the first direction.

[0022] The first and second scrapers are applied to all solder paste clumps on the stencil to ensure uniform solder paste coverage and improve the quality of circuit board production.

[0023] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0024] Figure 1 This is a diagram of the solder paste printing process for circuit boards in the existing technology;

[0025] Figure 2 This is a three-dimensional structural schematic diagram of a circuit board solder paste printing equipment according to one embodiment of the present invention;

[0026] Figure 3 This is a cross-sectional view of a circuit board solder paste printing device according to one embodiment of the present invention along a first direction.

[0027] Figure 4This is a cross-sectional view of a circuit board solder paste printing equipment according to one embodiment of the present invention, perpendicular to the first direction.

[0028] Figure 5 This is a schematic diagram comparing the states of the first squeegee and the stencil in contact with each other and the second squeegee and the stencil at any point during the printing process of the circuit board solder paste printing equipment according to one embodiment of this utility model.

[0029] Figure 6 This is a circuit board solder paste printing process diagram of a circuit board solder paste printing equipment according to one embodiment of this utility model.

[0030] Explanation of reference numerals in the attached figures

[0031] 1. Positioning table; 2. Stencil; 3. Scraper mechanism; 4. Reciprocating mechanism; 5. First scraper; 6. Second scraper; 7. Rotating body; 8. Rotary drive assembly; 9. Stepper motor; 10. Shaft; 11. Side plate; 12. Machine base; 13. Drive source; 14. Feed screw; 15. Monitoring mechanism; 16. Monitor; 17. Circuit board to be processed; 18. Solder paste lump. Detailed Implementation

[0032] The specific embodiments of this utility model are described in detail below. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of this utility model.

[0033] This utility model provides a circuit board solder paste printing equipment, combined with the attached... Figure 1 and attached Figure 2 As shown, the circuit board solder paste printing equipment includes a positioning table 1, a stencil 2, a squeegee mechanism 3, and a reciprocating mechanism 4. The squeegee mechanism 3 is located on the side of the stencil 2 away from the positioning table 1, and the reciprocating mechanism 4 is used to drive the squeegee mechanism 3 to move back and forth in a first direction.

[0034] Before solder paste printing on the circuit board, the circuit board 17 to be processed is fixedly mounted on the positioning stage 1, positioning it between the positioning stage 1 and the stencil 2. After the circuit board 17 is fixed, solder paste slurry 18 is applied to the printing area of ​​the stencil 2. The squeegee mechanism 3 is driven to move back and forth by the reciprocating mechanism 4. The squeegee mechanism 3 moves against the surface of the stencil 2 and prints the solder paste through the mesh of the stencil 2 onto the circuit board 17. The mesh distribution pattern on the printing area of ​​the stencil 2 must correspond to the solder paste printing position on the circuit board 17, and the solder paste printing position is generally different for different circuit boards 17. In addition, the fixed position of the circuit board 17 on the positioning stage 1 needs to be precisely controlled so that after the circuit board 17 is fixed on the positioning stage 1, the solder paste printing position on the circuit board 17 corresponds to the mesh distribution position on the printing area of ​​the stencil 2. Specifically, a positioning structure (not shown) can be provided on the positioning table 1 to clamp or hold the circuit board 17 to be processed, so as to achieve precise control over the fixed position of the circuit board 17 on the positioning table 1. The specific form of the positioning structure can adopt the existing structure used for fixing and positioning circuit boards. For example, a groove (not shown) for fixing the circuit board 17 can be opened on the positioning table 1. The circuit board 17 can be inserted into the groove to complete the fixing and positioning. Other specific forms of positioning structures will not be described in detail here.

[0035] In the circuit board solder paste printing equipment provided by this utility model, combined with the attached... Figure 2 Appendix Figure 3 and appendix Figure 4 As shown, the scraper mechanism 3 includes a first scraper 5, a second scraper 6, a rotating body 7, and a rotation drive assembly 8. Both the first scraper 5 and the second scraper 6 are fixedly mounted on the rotating body 7. The rotation drive assembly 8 drives the rotating body 7 to rotate, thereby switching the contact state between the first scraper 5 and the steel mesh 2 and the contact state between the second scraper 6 and the steel mesh 2. In this embodiment, the first direction is specifically in the attached... Figure 2 This is reflected in the XX direction, in the appendix Figure 3 The middle is manifested in the front and back direction, in the appendix Figure 4 and attached Figure 5 The direction is indicated by left and right. The reciprocating mechanism 4 drives the squeegee mechanism 3 to move back and forth, and the first squeegee 5 and the second squeegee 6 on the squeegee mechanism 3 reciprocate to push the solder paste ball 18, so that the solder paste ball 18 is reciprocated through the mesh of the printing area of ​​the stencil 2 and printed onto the circuit board 17 to be processed, so as to realize solder paste printing. In this design, the first squeegee 5 and the second squeegee 6 are both fixed on the rotating body 7. The rotating body 7 is driven by the rotation drive assembly 8 to realize the synchronous switching of the first squeegee 5 and the second squeegee 6 with the stencil 2, so as to ensure the synchronicity of the switching state of the first squeegee 5 and the second squeegee 6.

[0036] In addition, combined with the appendix Figure 4 and attached Figure 5 As shown, at any given moment during the solder paste printing process, at most one of the first squeegee 5 and the second squeegee 6 is in contact with the stencil 2. That is, at any given moment, only the first squeegee 5 is in contact with the stencil 2, only the second squeegee 6 is in contact with the stencil 2, or neither the first squeegee 5 nor the second squeegee 6 is in contact with the stencil 2. Furthermore, at that moment, the positions where the first squeegee 5 and the stencil 2 can contact each other and the positions where the second squeegee 6 and the stencil 2 can contact each other are offset along a first direction. Specifically, when the squeegee mechanism 3 is in the attached... Figure 5 As shown in the diagram, the position where the first squeegee 5 can contact the stencil 2 is located to the left of the position where the second squeegee 6 can contact the stencil 2. When switching the contact state of the first squeegee 5 and the second squeegee 6, a space is left between the contact positions of the first squeegee 5 and the second squeegee 6 to allow the solder paste spool 18 to remain in place. This, combined with the reciprocating mechanism 4 driving the reciprocating motion of the squeegee mechanism 3, ensures that when the first squeegee 5 and the second squeegee 6 push the solder paste spool 18 for coating and printing, both squeegees push the entire solder paste spool 18 for coating and printing. This ensures uniform solder paste coverage, improves the quality of circuit board production, and also avoids excessive solder paste residue on both sides of the printing area of ​​the stencil 2 (as shown in the attached diagram). Figure 1 (In the case of this), reduce solder paste waste.

[0037] Combined with appendix Figure 6 As shown, the printing process steps for solder paste printing using the circuit board solder paste printing equipment provided by this utility model are as follows.

[0038] Step 1: Place the solder paste ball 18 on the printing area of ​​the stencil 2. Drive the rotating body 7 to rotate via the rotary drive assembly 8, which in turn drives the first squeegee 5 and the second squeegee 6 to rotate. First, make the first squeegee 5 contact the stencil 2. At this time, the solder paste ball 18 is located to the right of the first squeegee 5, as shown in the attached figure. Figure 6 As shown in ①.

[0039] Step 2: The reciprocating mechanism 4 drives the squeegee mechanism 3 to move to the right, causing the first squeegee 5 to push the entire solder paste spool 18 to the right to coat the printing area of ​​the stencil 2 and print solder paste onto the circuit board 17 to be processed through the mesh, as shown in the attached figure. Figure 6 As shown in ②.

[0040] Step 3: The rotating body 7 is rotated by the rotary drive assembly 8 to switch the state of the scraper mechanism 3, causing the first scraper 5 to disengage from the stencil 2 and the second scraper 6 to engage with the stencil 2. At this time, the solder paste spool 18 is located to the left of the second scraper 6, as shown in the attached figure. Figure 6 As shown in ③.

[0041] Step 4: The reciprocating mechanism 4 drives the squeegee mechanism 3 to move to the left, causing the second squeegee 6 to push the entire solder paste spool 18 to the left, coating the printing area of ​​the stencil 2 and printing solder paste again onto the circuit board 17 to be processed through the mesh, as shown in the attached diagram. Figure 6 As shown in ④.

[0042] Step 5: The rotating body 7 is rotated again by the rotary drive assembly 8 to switch the state of the scraper mechanism 3, causing the second scraper 6 to disengage from the stencil 2 and the first scraper 5 to re-engage with the stencil 2. At this time, the solder paste spool 18 is located to the right of the first scraper 5, as shown in the attached figure. Figure 6 As shown in ⑤.

[0043] Step 6: The reciprocating mechanism 4 drives the squeegee mechanism 3 to move to the right again, causing the first squeegee 5 to push the entire solder paste spool 18 toward the printing area of ​​the movable coating stencil 2 and print solder paste onto the circuit board 17 to be processed through the mesh, as shown in the attached diagram. Figure 6 As shown in ⑥.

[0044] Step 7: The rotating body 7 is rotated again by the rotary drive assembly 8 to switch the state of the scraper mechanism 3, causing the first scraper 5 to disengage from the stencil 2 and the second scraper 6 to re-engage with the stencil 2. At this time, the solder paste spool 18 is located to the left of the second scraper 6, as shown in the attached figure. Figure 6 As shown in ⑦.

[0045] Step 8: The reciprocating mechanism 4 drives the squeegee mechanism 3 to move to the left again, causing the second squeegee 6 to push the entire solder paste spool 18 to the left, coating the printing area of ​​the stencil 2 and printing solder paste again onto the circuit board 17 to be processed through the mesh, as shown in the attached diagram. Figure 6 As shown in ⑧.

[0046] In summary, steps five through eight are essentially repetitions of steps one through four, which together constitute one printing cycle. Repeating these printing cycles further ensures uniform solder paste coverage and improves circuit board production quality. In actual production, the number of printing cycles is determined based on production requirements.

[0047] In some preferred embodiments, for circuit board solder paste printing equipment, combined with the attached... Figure 2 and attached Figure 3 As shown, the rotary drive assembly 8 includes a stepper motor 9 and a rotating shaft 10, with the rotating shaft 10 connected between the power output end of the stepper motor 9 and the rotating body 7. The application of the stepper motor 9 allows for precise control of the rotation angle of the rotating body 7, thereby controlling the state switching of the first squeegee 5 and the second squeegee 6. This ensures that the first squeegee 5 and the second squeegee 6 can contact the stencil 2, preventing gaps that could affect the printing effect.

[0048] For the first squeegee 5 and the second squeegee 6 used in solder paste printing, they are generally made of elastic materials such as stainless steel and spring steel, giving the squeegee a certain degree of elasticity. When the first squeegee 5 and the second squeegee 6 abut against the stencil 2, in order to ensure the coating and printing effect, a certain pressure needs to be generated between the first squeegee 5 and the stencil 2, and between the second squeegee 6 and the stencil 2. The squeegee made of elastic material can overcome the stress generated by compression through its own elastic deformation, thus avoiding damage to the squeegee.

[0049] Generally, the greater the pressure generated between the first squeegee 5 and the stencil 2, and between the second squeegee 6 and the stencil 2, the better the effect of the first squeegee 5 and the second squeegee 6 in moving the solder paste spool 18 for coating and printing. Therefore, by using the drive control of the stepper motor 9, the pressure of the first squeegee 5 and the second squeegee 6 against the stencil 2 can be adjusted by adjusting the rotation angle of the rotating body 7.

[0050] In addition, in the above printing process steps, by controlling the rotation angle of the stepper motor 9, the pressure of the first squeegee 5 and the second squeegee 6 when they come into contact with the stencil 2 in the fifth and seventh steps is greater than the pressure of the first squeegee 5 and the second squeegee 6 when they come into contact with the stencil 2 in the first and third steps, so as to further ensure uniform solder paste printing coverage.

[0051] In some preferred embodiments, when the first scraper 5 abuts against the steel mesh 2, the first scraper 5 and the steel mesh 2 form an acute angle; when the second scraper 6 abuts against the steel mesh 2, the second scraper 6 and the steel mesh 2 form an acute angle; and the orientation of the first scraper 5 when it abuts against the steel mesh 2 is opposite to the orientation of the second scraper 6 when it abuts against the steel mesh 2. (See attached diagram.) Figure 5 As shown, when the first scraper 5 contacts the stencil 2, the first scraper 5 is tilted from the lower left to the upper right, and the angle between the first scraper 5 and the stencil 2 is an acute angle α. During the process of the first scraper 5 contacting the stencil 2 and pushing the solder paste spool 18 to the right (as shown in the attached diagram)... Figure 6 In the diagrams ①, ②, ⑤, and ⑥, the solder paste clumps 18 are all located on the right side of the first scraper 5 to prevent them from remaining on the right side surface of the first scraper 5 during the pushing process. Similarly, in conjunction with the attached diagram... Figure 5 As shown, when the second scraper 6 contacts the stencil 2, the second scraper 6 is tilted from the lower right to the upper left, and the angle between the second scraper 6 and the stencil 2 is an acute angle b. During the process of the second scraper 6 contacting the stencil 2 and pushing the solder paste spool 18 to the left (as shown in the attached diagram)... Figure 6 In the sections ③, ④, ⑦, and ⑧, the solder paste clump 18 is located on the left side of the second scraper 6 to prevent the solder paste clump 18 from remaining on the left side surface of the second scraper 6 during the pushing process.

[0052] In some preferred embodiments, as shown in the appendix Figure 2 Appendix Figure 3As shown, a side plate 11 is fixedly installed on the steel mesh 2, and a base 12 is slidably installed on the side plate 11. The rotary drive assembly 8 is installed on the base 12, and the base 12 is driven to slide by the reciprocating mechanism 4. The base 12 provides an installation platform for the rotary drive assembly 8, improving the stability of the rotary body 7 when the rotary drive assembly 8 drives the rotary body 7 to rotate. The side plate 11 not only provides a certain degree of protection for the reciprocating mechanism 4 and the scraper mechanism 3, ensuring the safety of production and processing, but also, the side plate 11 and the base 12 are slidably installed, providing guidance and support for the reciprocating movement of the scraper mechanism 3, improving the stability of the scraper mechanism 3 during reciprocating movement.

[0053] In some preferred embodiments, as shown in the appendix Figure 2 Appendix Figure 3 and appendix Figure 4 As shown, the reciprocating mechanism 4 includes a drive source 13 and a feed screw 14. The feed screw 14 is connected to the power output end of the drive source 13 and is threadedly connected to the base. The reciprocating mechanism 4, using the feed screw 14, can provide stable and precise reciprocating movement drive for the scraper mechanism 3.

[0054] In some preferred embodiments, the axis of the feed screw 14 is parallel to the mesh surface of the steel mesh 2. Specifically, as shown in the attached... Figure 4 As shown, the stencil 2 is horizontally positioned, and the axis of the feed screw 14 is horizontal and parallel to the stencil 2. This prevents the squeegee mechanism 3 from shifting vertically during the reciprocating movement driven by the reciprocating mechanism 4, thereby preventing changes in pressure when the first squeegee 5 and the second squeegee 6 come into contact with the stencil 2, which would affect the solder paste printing quality.

[0055] In some preferred embodiments, two or more feed screws 14 are provided, and all feed screws 14 are parallel. The provision of two or more feed screws 14 improves the stability of the scraper mechanism 3 during reciprocating movement.

[0056] In some preferred embodiments, the circuit board solder paste printing equipment also includes a monitoring mechanism 15 for monitoring the surface of the stencil 2. During the solder paste printing process, the monitoring mechanism 15 monitors the solder paste residue on the surface of the stencil 2. If too much solder paste remains in the printing area of ​​the stencil 2, the coating and printing effect of the surface scraper mechanism 3 is not up to standard, and the scraper mechanism 3 needs to be inspected and replaced.

[0057] In some preferred embodiments, as shown in the appendix Figure 4 and attached Figure 5As shown, the monitoring mechanism 15 includes a monitor 16, which is fixedly installed on both the first scraper 5 and the second scraper 6. When the first scraper 5 comes into contact with the steel mesh 2, the monitoring direction of the monitor 16 on the first scraper 5 is pointed towards the steel mesh 2. When the second scraper 6 comes into contact with the steel mesh 2, the monitoring direction of the monitor 16 on the second scraper 6 is pointed towards the steel mesh 2.

[0058] The monitor 16 on the first squeegee 5 is used to monitor the solder paste residue on the stencil 2 printing area after the solder paste spool 18 is applied and printed by the first squeegee 5. Similarly, the monitor 16 on the second squeegee 6 is used to monitor the solder paste residue on the stencil 2 printing area after the solder paste spool 18 is applied and printed by the second squeegee 6. Generally, the solder paste residue is reflected by measuring the thickness of the solder paste in the stencil 2 printing area (excluding the mesh openings). The more obvious the solder paste residue in the stencil 2 printing area (excluding the mesh openings), the thicker the solder paste, and the worse the coating and printing effect of the first squeegee 5 and the second squeegee 6. The effects of the first squeegee 5 and the second squeegee 6 in applying and printing the solder paste spool 18 are monitored separately so that problematic squeegees can be quickly identified and the problematic parts on the squeegees can be accurately located during subsequent maintenance and repair, saving subsequent maintenance and repair costs.

[0059] In some preferred embodiments, along the second direction, the monitoring range of the monitoring mechanism 15 is not less than the width of the first scraper 5 and the second scraper 6, and the second direction is perpendicular to the first direction and parallel to the mesh surface of the steel mesh 2. Specifically, the second direction is attached... Figure 3 The middle is manifested in the left and right directions, in the appendix Figure 4 The direction is indicated by the front and back. The monitoring range of the monitoring mechanism 15 is not less than the width of the first scraper 5 and the second scraper 6, so as to ensure that the monitoring mechanism 15 can fully monitor the area where the first scraper 5 and the second scraper 6 are coated and printed.

[0060] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention, and these simple modifications all fall within the protection scope of the present invention.

[0061] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, this utility model will not describe the various possible combinations separately.

[0062] Furthermore, various different embodiments of this utility model can be combined in any way, as long as they do not violate the spirit of this utility model, they should also be regarded as the content disclosed by this utility model.

Claims

1. A circuit board solder paste printing equipment, comprising a positioning table (1), a stencil (2), a squeegee mechanism (3), and a reciprocating mechanism (4), wherein the squeegee mechanism (3) is located on the side of the stencil (2) away from the positioning table (1), and the reciprocating mechanism (4) is used to drive the squeegee mechanism (3) to reciprocate along a first direction, characterized in that: The scraper mechanism (3) includes a first scraper (5), a second scraper (6), a rotating body (7), and a rotation drive assembly (8). The first scraper (5) and the second scraper (6) are both fixedly mounted on the rotating body (7). The rotation drive assembly (8) is used to drive the rotating body (7) to rotate, so as to switch the contact state between the first scraper (5) and the steel mesh (2) and the contact state between the second scraper (6) and the steel mesh (2). During the solder paste printing process, at any given moment, at most one of the first squeegee (5) and the second squeegee (6) comes into contact with the stencil (2), and at that moment, the positions where the first squeegee (5) and the stencil (2) come into contact and the positions where the second squeegee (6) and the stencil (2) come into contact are offset along the first direction.

2. The circuit board solder paste printing equipment according to claim 1, characterized in that, The rotary drive assembly (8) includes a stepper motor (9) and a rotating shaft (10), the rotating shaft (10) being connected between the power output end of the stepper motor (9) and the rotating body (7).

3. The circuit board solder paste printing equipment according to claim 1, characterized in that, When the first scraper (5) abuts against the steel mesh (2), the first scraper (5) and the steel mesh (2) form an acute angle. When the second scraper (6) abuts against the steel mesh (2), the second scraper (6) and the steel mesh (2) form an acute angle. The orientation of the first scraper (5) when it abuts against the steel mesh (2) is opposite to the orientation of the second scraper (6) when it abuts against the steel mesh (2).

4. The circuit board solder paste printing equipment according to claim 1, characterized in that, A side plate (11) is fixedly installed on the steel mesh (2), and a base (12) is slidably installed on the side plate (11). The rotary drive assembly (8) is installed on the base (12), and the base (12) is driven to slide by the reciprocating mechanism (4).

5. The circuit board solder paste printing equipment according to claim 4, characterized in that, The reciprocating mechanism (4) includes a drive source (13) and a feed screw (14). The feed screw (14) is connected to the power output end of the drive source (13) and is threadedly connected to the machine base (12).

6. The circuit board solder paste printing equipment according to claim 5, characterized in that, The axis of the feed screw (14) is parallel to the mesh surface of the steel mesh (2).

7. The circuit board solder paste printing equipment according to claim 5 or 6, characterized in that, The feed screws (14) are provided in two or more, and all the feed screws (14) are parallel.

8. The circuit board solder paste printing equipment according to claim 1, characterized in that, The circuit board solder paste printing equipment also includes a monitoring mechanism (15) for monitoring the surface of the stencil (2).

9. The circuit board solder paste printing equipment according to claim 8, characterized in that, The monitoring mechanism (15) includes a monitor (16), which is fixedly installed on both the first scraper (5) and the second scraper (6). When the first scraper (5) abuts against the steel mesh (2), the monitoring direction of the monitor (16) on the first scraper (5) points towards the steel mesh (2), and when the second scraper (6) abuts against the steel mesh (2), the monitoring direction of the monitor (16) on the second scraper (6) points towards the steel mesh (2).

10. The circuit board solder paste printing equipment according to claim 8, characterized in that, Along the second direction, the monitoring range of the monitoring mechanism (15) is not less than the width of the first scraper (5) and the second scraper (6), and the second direction is perpendicular to the first direction and parallel to the mesh surface of the steel mesh (2).

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