Liquid cooling plate of microwave module and microwave module
By using a liquid cooling plate with a serpentine flow channel and decreasing fins, the problem of RF link phase inconsistency caused by large temperature differences in microwave transistors in microwave modules is solved, and the temperature uniformity and performance stability of microwave transistors are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
- Filing Date
- 2025-03-24
- Publication Date
- 2026-04-28
AI Technical Summary
In existing microwave modules, the heat dissipation of microwave transistors during operation is transferred to the cooling medium in the flow channel, resulting in a large temperature difference between the upstream and downstream sides. This affects the phase consistency of multi-channel RF links, and some RF devices are sensitive to temperature, with performance parameters drifting at different temperatures.
A liquid-cooled cold plate with a serpentine flow channel is designed, in which the fin thickness and spacing decrease along the flow direction of the cooling medium to enhance heat exchange capacity, offset the effect of temperature rise, and ensure temperature uniformity of microwave transistors.
It effectively reduces the temperature difference of microwave transistors, reduces the phase difference of multi-channel RF links, improves the performance stability of RF devices, and reduces parameter drift.
Smart Images
Figure CN224178459U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of environmental control technology for electronic equipment, and specifically to a liquid-cooled cold plate for a microwave module and a microwave module. Background Technology
[0002] In fields such as environmental control of electronic equipment, due to high environmental protection requirements and the high heat flux density of electronic equipment, microwave modules often employ liquid cooling. Microwave modules are typically integrated on one or both sides of a liquid-cooled plate, with the main heat-generating components, microwave transistors, symmetrically distributed on both sides or one side of the liquid-cooled plate's flow channel. Because the heat dissipation of the microwave transistors during operation is transferred to the flowing liquid within the channel, a temperature difference exists between the upstream and downstream fluids. This non-uniform heat transfer leads to significant temperature differences between different microwave transistors within the same RF link, affecting the phase consistency of multi-channel RF links. Furthermore, when the temperature difference is 10°C, the phase difference of multi-channel RF links can reach 5°. In addition, some RF devices are highly sensitive to operating temperature, and their performance parameters can drift at different temperatures. Utility Model Content
[0003] The purpose of this invention is to at least solve one of the technical problems existing in the prior art, and to provide a liquid-cooled plate for a microwave module and a microwave module. The liquid-cooled plate of the microwave module can effectively reduce the temperature difference when the microwave transistor is working, thereby reducing the impact on the phase consistency of the multi-channel RF link.
[0004] To achieve the above objectives, this utility model provides a liquid-cooled cold plate for a microwave module, comprising:
[0005] substrate;
[0006] The flow channel is formed inside the substrate, and both ends of the flow channel are connected to the cooling medium circulation system. The flow channel is arranged in a serpentine shape.
[0007] Multiple sets of fins are arranged in parallel inside the flow channel, and the thickness of the multiple sets of fins and the spacing between adjacent fins are distributed in a decreasing manner along the flow direction of the cooling medium.
[0008] Optionally, the flow channel includes:
[0009] The cooling zone has a rectangular cross-section;
[0010] A cooling medium inlet is provided at one end of the sidewall of the substrate and is connected to one end of the cooling zone;
[0011] The cooling medium outlet is located at the other end of the sidewall of the substrate and is connected to the other end of the cooling zone.
[0012] Optionally, the flow channel further includes a plurality of spaced-apart baffles, which are staggered and connected to opposite sides in the width direction of the rectangle.
[0013] Optionally, the baffle divides the flow channel into multiple interconnected sub-flow channels, and multiple sets of fins are respectively disposed in multiple sub-flow channels.
[0014] Optionally, the fin height, fin thickness, and fin spacing are all the same in each of the sub-channels.
[0015] Optionally, the cross-section of the fin in the height direction is rectangular or trapezoidal.
[0016] Optionally, the substrate includes a bottom plate and a cover plate disposed opposite to each other along its thickness direction, the bottom of the fins being connected to the bottom plate, and the top of the fins being connected to the cover plate.
[0017] Optionally, the liquid cooling plate may be made of a material with high thermal conductivity.
[0018] A second aspect of this utility model provides a microwave module, including a metal base plate, a plurality of microwave transistors disposed on the metal base plate, and the aforementioned liquid cooling plate, wherein the metal base plate is disposed on the side of the liquid cooling plate in the thickness direction.
[0019] Optionally, the plurality of microwave transistors are arranged at equal intervals along the flow direction of the cooling medium, and the positions of the microwave transistors correspond to the positions of the fins.
[0020] Through the above technical solution, the liquid cooling plate of the microwave module provided by this utility model has its flow channel arranged in a serpentine shape. The thickness of multiple sets of fins and the spacing between adjacent fins are distributed in a decreasing manner along the flow direction of the cooling medium, so that the downstream local liquid cooling plate has a greater heat exchange capacity, which can offset the effect of the temperature rise of the cooling medium in the flow channel, and make the microwave transistor installed on the liquid cooling plate have a smaller temperature difference. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the overall structure of a microwave module provided by this utility model;
[0022] Figure 2 yes Figure 1 Schematic diagram of the BB section;
[0023] Figure 3 yes Figure 1 Schematic diagram of section AA;
[0024] Figure 4 yes Figure 2 A schematic diagram of the CC section.
[0025] Explanation of reference numerals in the attached figures
[0026] 1. Substrate; 11. Base plate; 12. Cover plate; 2. Flow channel; 21. Cooling zone; 22. Cooling medium inlet; 23. Cooling medium outlet; 24. Partition; 3. Fin; 100. Metal base plate; 200. Microwave transistor. Detailed Implementation
[0027] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of this utility model.
[0028] according to Figure 1 , Figure 2 , Figure 3 as well as Figure 4 This invention provides a detailed description of a liquid-cooled plate and a microwave module having the liquid-cooled plate.
[0029] The microwave module of this utility model includes a metal base plate 100 and a microwave transistor 200. Typically, the microwave module is symmetrically mounted on both sides or one side of a liquid cooling plate. The microwave transistor 200, which is the main heat-generating device in the microwave module, is symmetrically mounted on both sides or one side of the flow channel 2 in the liquid cooling plate. The metal base plate 100 of the microwave module transfers the heat dissipation during operation to the cooling medium flowing in the flow channel 2, so that the operating temperature of the microwave transistor 200 is kept within the allowable range.
[0030] The heat dissipation of microwave transistor 200 during operation is transferred to the cooling medium flowing in channel 2. There is a temperature difference between the cooling medium upstream and downstream of channel 2, which will cause a large temperature difference in the operating temperature of microwave transistor 200, thus affecting the phase consistency of multi-channel RF links. Moreover, some RF devices are very sensitive to temperature, and the parameters will drift under different temperatures.
[0031] Based on this, please refer to Figure 1 , 2 As shown in Figures 3 and 4, this utility model provides a liquid-cooled cold plate for a microwave module, comprising a substrate 1, a flow channel 2, and multiple sets of fins 3. The flow channel 2 is formed inside the substrate 1, and both ends of the flow channel 2 are connected to a cooling medium circulation system. The flow channel 2 is arranged in a serpentine shape. Multiple sets of fins 3 are arranged in parallel inside the flow channel 2. The thickness of the multiple sets of fins 3 and the spacing between adjacent fins 3 are both distributed in a decreasing manner along the flow direction of the cooling medium.
[0032] In this invention, the cooling medium enters from one end of the flow channel 2 under the drive of the circulation system, flows along the serpentine flow channel 2, exchanges heat with the substrate 1 and fins 3, and absorbs the heat generated by the microwave module.
[0033] It is understood that the cooling medium can be any liquid with high thermal conductivity known to those skilled in the art, preferably deionized water, distilled water or an aqueous solution of ethylene glycol.
[0034] In this invention, the substrate 1 serves as the carrier of the flow channel 2. To ensure thermal conductivity and mechanical strength, it is typically made of high thermal conductivity materials or metal composite materials, such as aluminum alloy.
[0035] The flow channel 2 is formed inside the substrate 1 and is arranged in a serpentine shape, which can extend the flow path of the cooling medium, increase the heat exchange time, and thus improve the heat dissipation efficiency.
[0036] Multiple sets of fins 3 are arranged in parallel inside the flow channel 2 to increase the heat exchange area and improve heat dissipation performance. The thickness of the fins 3 and the spacing between adjacent fins 3 are both distributed in a decreasing manner along the flow direction of the cooling medium. As the cooling medium flows from the inlet (low temperature zone) to the outlet (high temperature zone), due to the decreasing thickness and spacing of the fins 3, the density of the fins 3 in the downstream region increases. The high-density fins 3 provide a larger heat conduction path in the high-temperature zone, offsetting the decrease in heat transfer efficiency caused by the temperature rise of the cooling medium. This allows the local liquid cooling plate corresponding to the downstream microwave transistor 200 to have a greater heat exchange capacity, which can offset the effect of the temperature rise of the cooling medium in the flow channel 2, resulting in a smaller temperature difference for the microwave transistor 200 mounted on the liquid cooling plate.
[0037] In some embodiments, the flow channel 2 includes a cooling zone 21, a cooling medium inlet 22, and a cooling medium outlet 23. Since the liquid cooling plate is a rectangular plate, in order to allow the flow channel 2 to accommodate more cooling medium, the flow channel 2 is also set to be rectangular, that is, the cross-section of the cooling zone 21 is rectangular. The cooling medium inlet 22 is opened at one end of the side wall of the substrate 1 and communicates with one end of the cooling zone 21. The cooling medium outlet 23 is opened at the other end of the side wall of the substrate 1 and communicates with the other end of the cooling zone 21.
[0038] The cooling medium enters the cooling zone 21 from the cooling medium inlet 22. In the cooling zone 21, the cooling medium exchanges heat with the substrate 1 and the fins 3, absorbing the heat generated by the microwave module. As the cooling medium flows, its temperature gradually increases, but it is still within a controllable range. Finally, the cooling medium flows out from the cooling medium outlet 23 and enters the cooling medium circulation system. After being cooled by the radiator, it re-enters the cooling zone 21, forming a closed loop.
[0039] In some embodiments, in order to extend the flow time of the cooling medium in the flow channel 2, the flow channel 2 further includes a plurality of spaced baffles 24, which are staggered and connected to opposite sides in the width direction of the rectangle. The plurality of baffles 24 divide the flow channel 2 into a plurality of interconnected sub-flow channels, so that when the cooling medium passes through the flow channel 2, the baffles 24 will form a turbulence structure in the flow channel 2, so that the cooling medium can pass through the multiple sub-flow channels, thereby effectively extending the flow time of the cooling medium in the flow channel 2 and improving the heat exchange effect of the liquid cooling plate.
[0040] Furthermore, multiple sets of fins 3 of different thicknesses can be respectively arranged in multiple sub-channels. That is, a set of fins 3 can be arranged in each sub-channel, or multiple sets of fins 3 can be arranged in some sub-channels. The specific arrangement method can be selected according to the specifications of the sub-channels, as long as the arrangement density of each set of fins 3 gradually increases in the direction of cooling medium flow.
[0041] In some embodiments, in order to simplify the liquid cooling plate production process of the microwave module, improve production efficiency and facilitate subsequent use and maintenance, the fin height, fin thickness and fin spacing in each sub-channel are the same.
[0042] In some embodiments, to ensure a firm connection between the fin 3 and the substrate 1, the cross-section of the fin 3 in the height direction is rectangular or trapezoidal. Moreover, rectangular fins 3 have a simple shape and are easy to process and manufacture. Compared with rectangular fins 3, trapezoidal fins 3 can save some materials while maintaining the same heat dissipation performance.
[0043] In some embodiments, the substrate 1 includes a base plate 11 and a cover plate 12 disposed opposite to each other along its thickness direction. The bottom of the fin 3 is connected to the base plate 11, and the top of the fin 3 is connected to the cover plate 12. The connection between the fin 3 and the substrate 1 can be integral or welded.
[0044] In summary, compared with conventional liquid cooling plates, the liquid cooling plate provided by this utility model effectively reduces the temperature difference of the microwave transistor 200 on the cold plate during operation through the optimized design of the fins 3 inside the flow channel 2. This reduces the impact on the phase consistency of the multi-channel RF link. Under a temperature difference of 10°, the typical phase difference of the RF link is about 5°. If there are temperature-sensitive devices in the RF link, the phase difference may be more than 10°. When the temperature difference is reduced to 5°, the phase difference of the RF link can be reduced to half of the previous value.
[0045] Furthermore, some radio frequency (RF) devices are highly sensitive to temperature, and their parameters can drift under different temperatures. For example, the insertion loss, rectangularity coefficient, and standing wave ratio (VSWR) of filters can drift under different temperatures, while the gain, output power, and efficiency of amplifiers can drift under different temperatures. Therefore, temperature uniformity plays a crucial role in improving the capabilities and specifications of multi-channel RF systems.
[0046] This utility model also provides a microwave module, which includes a metal base plate 100, a plurality of microwave transistors 200 disposed on the metal base plate 100, and the aforementioned liquid cooling plate, wherein the metal base plate 100 is disposed on the side of the liquid cooling plate in the thickness direction.
[0047] Specifically, the multiple microwave transistors 200 are arranged at equal intervals along the flow direction of the cooling medium, and the positions of the microwave transistors 200 correspond to the positions of the fins 3.
[0048] Based on the microwave module provided by this utility model, under the same array heat source and the same liquid cooling boundary conditions (ambient temperature, inlet temperature, inlet flow rate, cooling medium), when the temperature difference of the microwave transistors 200 on the liquid cooling plate is the same, the thickness of the liquid cooling plate of this microwave module is the smallest.
[0049] In the simulation experiment of this utility model, 32 microwave transistors 200 are installed on both sides of the liquid cooling plate, symmetrically installed and equally spaced. Each transistor has a heat consumption of 70W and a heat flux density of 288W / cm2, with a total heat consumption of 2240W. The liquid supply temperature is 35℃ and the liquid supply flow rate is 7L / Min (the cooling medium is ethylene glycol aqueous solution). When the specifications of each group of fins 3 inside the flow channel 2 are the same and the spacing between the fins 3 is the same, the lowest temperature in the temperature cloud diagram after reaching thermal equilibrium is 88.3℃, the highest temperature is 98.4℃, and the temperature difference is 10.1℃.
[0050] When using a structure with multiple sets of fins of gradually decreasing thickness and spacing, while keeping other boundary conditions unchanged, the lowest temperature in the temperature cloud diagram after reaching thermal equilibrium is 93.9℃, the highest temperature is 99.2℃, and the temperature difference is 5.3℃. The temperature uniformity is significantly improved.
[0051] The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings; however, the present invention is not limited thereto. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention, including the combination of various specific technical features in any suitable manner. To avoid unnecessary repetition, the present invention will not describe the various possible combinations separately. However, these simple modifications and combinations should also be considered as the content disclosed in the present invention and are all within the protection scope of the present invention.
Claims
1. A liquid-cooled cold plate for a microwave module, characterized in that, include: base(1); The flow channel (2) is formed inside the substrate (1), and both ends of the flow channel (2) are connected to the cooling medium circulation system. The flow channel (2) is arranged in a serpentine shape. Multiple sets of fins (3) are arranged in parallel inside the flow channel (2). The thickness of the multiple sets of fins (3) and the spacing between adjacent fins (3) are distributed in a decreasing manner along the flow direction of the cooling medium.
2. The liquid-cooled cold plate of the microwave module according to claim 1, characterized in that, The flow channel (2) includes: Cooling zone (21), the cross-section of which is rectangular; A cooling medium inlet (22) is provided at one end of the side wall of the substrate (1) and is connected to one end of the cooling zone (21); The cooling medium outlet (23) is located at the other end of the side wall of the substrate (1) and is connected to the other end of the cooling zone (21).
3. The liquid-cooled cold plate of the microwave module according to claim 2, characterized in that, The flow channel (2) also includes a plurality of spaced partitions (24), which are staggered and connected to opposite sides in the width direction of the rectangle.
4. The liquid-cooled cold plate of the microwave module according to claim 3, characterized in that, The partition (24) divides the flow channel (2) into multiple interconnected sub-flow channels, and multiple sets of fins (3) are respectively disposed in multiple sub-flow channels.
5. The liquid-cooled cold plate of the microwave module according to claim 4, characterized in that, The fin (3) height, fin (3) thickness and fin (3) spacing are consistent in each of the sub-channels.
6. The liquid-cooled cold plate of the microwave module according to claim 1, characterized in that, The cross-section of the fin (3) in the height direction is rectangular or trapezoidal.
7. The liquid-cooled cold plate of the microwave module according to claim 6, characterized in that, The substrate (1) includes a bottom plate (11) and a cover plate (12) disposed opposite to each other along its thickness direction. The bottom of the fin (3) is connected to the bottom plate (11), and the top of the fin (3) is connected to the cover plate (12).
8. The liquid-cooled cold plate of the microwave module according to claim 1, characterized in that, The liquid cooling plate is made of a material with high thermal conductivity.
9. A microwave module, characterized in that, It includes a metal base plate (100), a plurality of microwave transistors (200) disposed on the metal base plate (100), and a liquid cooling plate as described in any one of claims 1-7, wherein the metal base plate (100) is disposed on the side of the liquid cooling plate in the thickness direction.
10. The microwave module according to claim 9, characterized in that, The microwave transistors (200) are arranged at equal intervals along the flow direction of the cooling medium, and the positions of the microwave transistors (200) correspond to the positions of the fins (3).