Leveling device and wafer alignment bonding equipment

Abstract

The utility model belongs to the technical field of semiconductor material processing equipment, and discloses a leveling device and wafer alignment bonding equipment. The first tray is arranged above the second tray at an interval and is used for respectively bearing a first wafer and a second wafer; the supporting plate is fixedly connected with the second tray; the distance sensor is arranged above the first bearing assembly and can move in the horizontal direction so as to detect the distance between the first tray and the second tray of the multiple point positions. The adjusting mechanism comprises a plurality of connecting assemblies and high-precision driving pieces, the connecting assemblies are uniformly arranged on the supporting plate at intervals in the direction of the central axis of the supporting plate, the high-precision driving pieces are arranged on the side, away from the first bearing assembly, of the supporting plate and correspond to the connecting assemblies one to one, each high-precision driving piece comprises a first end and a second end, and the first ends are hinged to the connecting assemblies; the connecting assembly can adjust the distance between the supporting plate and the first end. The high-precision driving pieces are in communication connection with the distance sensors, and each high-precision driving piece can independently stretch out and draw back in the vertical direction so as to adjust the distance between the supporting plate and the second end.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor material processing equipment technology, and in particular to a leveling device and a wafer alignment and bonding device. Background Technology

[0002] In the field of semiconductor material processing technology, the bonding of two wafers through alignment bonding processes has been widely used. Currently, the wafer alignment process relies on a dedicated wafer alignment system. This system supports the wafers to be bonded using upper and lower trays and achieves precise alignment of the upper and lower wafer alignment marks based on adjustments to the positions of markings on the wafer surface. In this process, the parallelism of the upper and lower trays is a key technical parameter that directly determines the alignment accuracy.

[0003] In existing technologies, some equipment lacks upper and lower tray leveling processes and corresponding leveling devices, resulting in ineffective control of tray parallelism. Other equipment, while equipped with leveling devices, generally employs a motor-driven structure combined with flexible hinges. Due to the mechanical limitations of this type of structure, the actual leveling process suffers from insufficient leveling accuracy and repetitive adjustments, making it difficult to meet high-precision alignment requirements and resulting in low adjustment efficiency. This ultimately negatively impacts the final wafer alignment accuracy. Utility Model Content

[0004] The purpose of this utility model is to provide a leveling device and a wafer alignment and bonding equipment to solve the problems in the prior art where some equipment does not have a leveling process for upper and lower trays and a corresponding leveling device, resulting in the inability to effectively control the parallelism of the trays; and in other equipment, although a leveling device is provided, it generally adopts a structure of motor drive combined with flexible hinge, which has problems such as insufficient leveling accuracy and repeated adjustments in the actual leveling process.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] On the one hand, a leveling device is provided, comprising:

[0007] The carrier mechanism includes a first carrier component and a second carrier component. The first carrier component includes a first tray and a second tray, with the first tray spaced above the second tray to carry a first wafer and a second wafer respectively. The second carrier component is located below the first carrier component and includes a pallet, which is fixedly connected to the second tray.

[0008] The detection component includes a distance sensor, which is positioned above the first bearing component and can move horizontally to detect the distance between the first tray and the second tray at multiple points.

[0009] An adjustment mechanism is provided, comprising connecting components and high-precision drive components. Multiple connecting components are evenly spaced on the pallet around its central axis. Each high-precision drive component is located on the side of the pallet opposite to the first supporting component and corresponds to one of the connecting components. Each high-precision drive component includes a first end and a second end. The first end is hinged to the connecting component, and the connecting component can adjust the distance between the pallet and the first end. The high-precision drive component is communicatively connected to the distance sensor, and each high-precision drive component can independently extend and retract vertically to adjust the distance between the pallet and the second end.

[0010] As an optional technical solution for the leveling device, the first end is configured as a ball head, the connecting component includes a ball socket seat, the ball socket seat includes a first connecting part and a second connecting part, the end of the second connecting part is provided with a ball socket, the ball head and the ball socket are rotatably engaged, the first connecting part is disposed through the support plate, and the ball socket seat can move relative to the support plate along the central axis direction.

[0011] As an optional technical solution for the leveling device, the pallet is provided with a first adjustment hole, the connecting assembly further includes an adjusting member, the adjusting member is rotatably disposed in the first adjustment hole, the adjusting member has a first threaded hole through it along the extension direction, the first connecting part is provided with a first thread, and the first connecting part is screwed to the first threaded hole.

[0012] As an optional technical solution for the leveling device, the first adjusting hole is a second threaded hole, the adjusting member is provided with a second thread, the second thread has the same rotation direction as the first threaded hole, the adjusting member is screwed to the second threaded hole, the outer diameter of the second connecting part is larger than the outer diameter of the first connecting part, the second connecting part is provided with a first plane, the connecting assembly also includes a rotation limiting member, the rotation limiting member is fixed to the side of the support plate away from the first bearing assembly, the rotation limiting member includes a second plane, the first plane abuts against the second plane to limit the rotation of the ball socket seat, and the first plane can slide relative to the second plane.

[0013] As an optional technical solution for the leveling device, the second bearing component further includes a base plate, which is located on the side of the tray opposite to the first bearing component and is spaced apart from the tray, and the second end is connected to the base plate.

[0014] As an optional technical solution for the leveling device, the adjustment mechanism further includes a tension spring, one end of which is connected to the support plate and the other end of which is connected to the base plate. There are multiple tension springs, which are evenly distributed around each of the high-precision drive components.

[0015] As an optional technical solution for the leveling device, the detection component further includes a pressure sensor, wherein there are multiple pressure sensors and they are disposed between the first support component and the second support component to detect the bonding force between the first wafer and the second wafer at multiple points.

[0016] As an optional technical solution for the leveling device, the pressure sensor corresponds one-to-one with the high-precision drive component, and the pressure sensor and the high-precision drive component are distributed in the same orientation around the central axis of the pallet.

[0017] As an optional technical solution for the leveling device, the high-precision driving component includes a piezoelectric actuator, and the material of the piezoelectric actuator is piezoelectric ceramic.

[0018] On the other hand, a wafer alignment and bonding apparatus is provided, including the leveling device described above.

[0019] The beneficial effects of this utility model are:

[0020] This application discloses a leveling device and a wafer alignment and bonding equipment. A first tray is spaced above a second tray and carries a first wafer and a second wafer, respectively. A tray plate is fixedly connected to the second tray. A distance sensor is located above a first support component and can move horizontally to detect the distance between the first tray and the second tray at multiple points. The adjustment mechanism includes a connecting component and a high-precision drive component. There are multiple connecting components, which are evenly spaced around the central axis of the tray plate. The high-precision drive component is located on the side of the tray plate away from the first support component and corresponds to the connecting components one by one. The high-precision drive component includes a first end and a second end. The first end is hinged to the connecting component, and the connecting component can adjust the distance between the tray plate and the first end. The high-precision drive component is communicatively connected to the distance sensor. Each high-precision drive component can independently extend and retract vertically to adjust the distance between the tray plate and the second end. The distance detection sensor is used to detect the distance between the first and second trays at multiple points, and fits the angle between the first and second trays based on the specific values ​​at multiple points. The high-precision drive unit communicates with the distance detection sensor. Based on the fitted angle, the angle of the second tray can be quickly adjusted by the connecting component, and then the angle of the second tray can be finely adjusted by the high-precision drive unit. The distance sensor, combined with the quick adjustment steps and the fine adjustment steps, increases the accuracy of leveling the first bearing component, avoids the process of repeated adjustment due to low adjustment accuracy, and improves the leveling efficiency. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0022] Figure 1 This is one of the partial structural schematic diagrams of the leveling device provided in this embodiment of the utility model;

[0023] Figure 2 This is a partial structural cross-sectional view of the leveling device provided in this embodiment of the utility model;

[0024] Figure 3 This is a second partial structural schematic diagram of the leveling device provided in this embodiment of the utility model;

[0025] Figure 4 This is the third partial structural schematic diagram of the leveling device provided in this embodiment of the utility model;

[0026] Figure 5 This is the fourth partial structural schematic diagram of the leveling device provided in this embodiment of the utility model.

[0027] In the picture:

[0028] 10. Bearing mechanism; 11. First bearing assembly; 111. First tray; 112. Second tray; 12. Second bearing assembly; 121. Pallet; 1211. First adjustment hole; 122. Base plate;

[0029] 20. Detection component; 21. Distance sensor; 22. Pressure sensor;

[0030] 30. Adjustment mechanism; 31. Connecting assembly; 311. Ball socket seat; 3111. First connecting part; 3112. Second connecting part; 3113. Ball socket; 3114. First plane; 312. Adjusting component; 3121. Cross groove; 313. Rotation limiter; 314. Locking nut; 32. High-precision drive component; 321. Ball head; 322. Mounting base; 33. Tension spring; 331. Connecting base. Detailed Implementation

[0031] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not the entire structure.

[0032] In this application, the terms "comprising," "including," "having," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0033] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0034] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0036] In existing technologies, some equipment lacks upper and lower tray leveling processes and corresponding leveling devices, resulting in ineffective control of tray parallelism. Other equipment, while equipped with leveling devices, generally employs a motor-driven structure combined with flexible hinges. Due to the mechanical limitations of this type of structure, the actual leveling process suffers from insufficient leveling accuracy and repetitive adjustments, making it difficult to meet high-precision alignment requirements and resulting in low adjustment efficiency. This ultimately negatively impacts the final wafer alignment accuracy.

[0037] To address the aforementioned problems, this application discloses a wafer alignment and bonding apparatus, including a leveling device. (See reference...) Figure 1 The leveling device includes a bearing mechanism 10, a detection component 20, and an adjustment mechanism 30.

[0038] Furthermore, the carrier mechanism 10 includes a first carrier component 11 and a second carrier component 12. The first carrier component 11 includes a first tray 111 and a second tray 112. The first tray 111 is spaced above the second tray 112 to carry the first wafer and the second wafer, respectively. The second carrier component 12 is located below the first carrier component 11 and includes a support plate 121, which is fixedly connected to the second tray 112. Specifically, the first tray 111 and the second tray 112 are circular disks to match the conventional shapes of the first wafer and the second wafer. The first tray 111 and the second tray 112 are coaxially arranged and are the same size.

[0039] In this embodiment, since the bearing surfaces of the first tray 111 and the second tray 112 are arranged opposite to each other, both the first tray 111 and the second tray 112 are configured as suction cups to fix the first wafer and the second wafer. Specifically, the bearing surfaces of the first tray 111 and the second tray 112 are provided with pores, which are connected to a vacuum device to generate adsorption force, thereby adsorbing the first wafer and the second wafer. There can be multiple pores, which are evenly distributed to ensure that the adsorption force on the first wafer and the second wafer is evenly distributed, avoiding affecting the bonding effect of the first wafer and the second wafer. It should be noted that vacuum adsorption technology is existing technology and will not be described in detail here.

[0040] Specifically, the tray 121 is a circular plate and is coaxially arranged with the first tray 111 and the second tray 112, which facilitates the adjustment of the angle of the second tray 112 through the tray 121. The tray 121 and the second tray 112 can be connected by bolts, connecting rods, or adhesive.

[0041] Further, the detection component 20 includes a distance sensor 21, which is positioned above the first support component 11 and can move horizontally to detect the distance between multiple points on the first tray 111 and the second tray 112. In this embodiment, the first tray 111 is made of a transparent material, such as glass, acrylic, or crystal. The distance sensor 21 is positioned above the first support component 11 and passes through the first tray 111 to detect the distance between the first tray 111 and the second tray 112. Specifically, the distance sensor 21 is positioned above the first support component 11 via a robotic arm or support frame. The robotic arm or support frame can move the distance sensor 21 horizontally to detect multiple points. Specifically, the distance sensor 21 detects at least three points, and the three points are evenly distributed on the first tray 111, which facilitates improving the accuracy of calculating and fitting the angle between the first tray 111 and the second tray 112. It should be noted that the robotic arm and support frame are existing technologies and will not be described in detail here.

[0042] Furthermore, the detection component 20 also includes multiple pressure sensors 22, which are disposed between the first support component 11 and the second support component 12, to detect the bonding force between the first wafer and the second wafer at multiple points. By setting the pressure sensors 22 to accurately reflect whether the bonding force between the first wafer and the second wafer is uniform, the detection accuracy of the bonding between the first wafer and the second wafer is increased, facilitating the verification of the leveling device's effectiveness. It should be noted that the distance sensor 21 and the pressure sensor 22 are existing technologies and will not be described in detail here.

[0043] Furthermore, the adjustment mechanism 30 includes a connecting component 31 and a high-precision drive component 32. There are multiple connecting components 31, which are evenly spaced around the central axis of the tray 121. The high-precision drive component 32 is located on the side of the tray 121 away from the first bearing component 11 and corresponds to the connecting components 31 one by one. The high-precision drive component 32 includes a first end and a second end. The first end is hinged to the connecting component 31. The connecting component 31 can adjust the distance between the tray 121 and the first end. The high-precision drive component 32 is communicatively connected to the distance sensor 21. Each high-precision drive component 32 can independently extend and retract in the vertical direction to adjust the distance between the tray 121 and the second end. The distance detection sensor 21 is used to detect the distance between the first tray 111 and the second tray 112 at multiple points, and fits the angle between the first tray 111 and the second tray 112 based on the specific values ​​of the multiple points. The high-precision drive unit 32 is connected to the distance sensor 21. Based on the fitted angle, the angle of the second tray 112 can be quickly adjusted by the connecting component 31, and the angle of the second tray 112 can be finely adjusted by the high-precision drive unit 32. The distance sensor 21, by combining the rapid adjustment step and the fine adjustment step, increases the leveling accuracy of the first bearing component 11, avoids the process of repeated adjustment due to low adjustment accuracy, and improves the leveling efficiency.

[0044] It should be noted that the leveling involved in this embodiment refers to adjusting the angle of the second tray 112 so that the first tray 111 and the second tray 112 are in a parallel state and as close to a horizontal state as possible. This parallel state will inevitably produce a certain error compared with the strictly physical horizontal state. This error does not affect the bonding between the first wafer and the second wafer.

[0045] In this embodiment, three connecting components 31 and three high-precision driving components 32 are evenly spaced around the central axis of the tray 121 to uniformly distribute the driving force on the tray 121. Furthermore, pressure sensors 22 correspond one-to-one with high-precision driving components 32, and their distribution orientation around the central axis of the tray 121 is the same. This allows the pressure sensors 22 to combine with linear matrices and algorithms to improve the sensing accuracy of the bonding force between the first and second wafers. Specifically, the high-precision driving component 32 includes a piezoelectric actuator made of piezoelectric ceramic. The piezoelectric actuator has a travel distance of 50 micrometers, enabling nanometer-level movement in a single step and nanometer-level repeatability, thus improving the parallelism adjustment accuracy of the first tray 111 and the second tray 112.

[0046] Further, see Figure 2 and Figure 3The first end of the high-precision drive component 32 is configured as a ball head 321. The connecting assembly 31 includes a ball socket 311, which includes a first connecting portion 3111 and a second connecting portion 3112. The end of the second connecting portion 3112 is provided with a ball socket 3113. The ball head 321 and the ball socket 3113 are rotatably engaged. The first connecting portion 3111 is disposed through the support plate 121, and the ball socket 311 can move relative to the support plate 121 along the central axis. In this embodiment, the first connecting portion 3111 is configured as a rod, and the second connecting portion 3112 is configured as a frustum with a smaller inner diameter on the side closer to the first connecting portion 3111.

[0047] Specifically, the ball socket 3113 is spherically concave, and the opening side of the ball socket 3113 is relatively small to limit the ball head 321 and prevent the ball head 321 from dislodging from the ball socket 3113. In this embodiment, the end of the second connecting part 3112 is also provided with a circular groove, which is located at the opening of the ball socket 3113 and has an inner diameter smaller than the size of the opening of the ball socket 3113, to limit the ball head 321. Specifically, since the ball head 321 and the ball socket 3113 will generate friction, the ball head 321 is made of a wear-resistant material, such as silicon carbide ceramic, high-chromium cast iron, or tungsten carbide. In other embodiments, the first end of the high-precision drive component 32 and the end of the second connecting part 3112 can both be set as connecting rings, and the two connecting rings are sleeved to allow free adjustment of the angle of the support plate 121.

[0048] Further, see Figure 5 The pallet 121 is provided with a first adjustment hole 1211. The connecting assembly 31 also includes an adjustment member 312. The adjustment member 312 is rotatably disposed in the first adjustment hole 1211. A first threaded hole is provided through the interior of the adjustment member 312 along the extension direction. A first connecting part 3111 is provided with a first thread. The first connecting part 3111 is screwed to the first threaded hole. In this embodiment, the first adjusting hole 1211 is a second threaded hole, the adjusting member 312 is provided with a second thread, the second thread has the same rotation direction as the first threaded hole, the adjusting member 312 is screwed to the second threaded hole, the outer diameter of the second connecting part 3112 is larger than the outer diameter of the first connecting part 3111, the second connecting part 3112 is provided with a first plane 3114, the connecting assembly 31 also includes a rotation limiting member 313, the rotation limiting member 313 is fixed to the side of the support plate 121 away from the first bearing assembly 11, the rotation limiting member 313 includes a second plane, the first plane 3114 abuts against the second plane to limit the rotation of the ball socket 311, the first plane 3114 can slide relative to the second plane.

[0049] Specifically, the adjusting member 312 is a threaded sleeve, which forms an external helical pair with the second threaded hole, and an internal helical pair with the ball socket 311. Since the ball socket 311 cannot rotate due to the influence of the rotating member 313, when the threaded sleeve is screwed into the threaded hole under external torque, its motion can be decomposed into the synchronously occurring helical motion of the threaded sleeve relative to the second threaded hole and the passive axial linear motion of the ball socket 311 relative to the threaded sleeve. Because the second thread and the first threaded hole have the same direction of rotation, the ball socket 311 and the adjusting member 312 move in opposite directions; that is, the moving distance of the ball socket 311 and the moving distance of the adjusting member 312 are superimposed.

[0050] For example, assuming the pitch of the second threaded hole is 1.25 and the pitch of the first threaded hole is 1.5, and the two threads have the same direction of rotation, then for every revolution of the adjusting member 312, the ball socket 311 moves axially a distance of 1.5mm - 1.25mm = 0.25mm. When the minimum rotation is 45° each time, the minimum adjustment amount of manual lifting can reach 30 micrometers. Therefore, the stroke of the high-precision drive member 32 only needs to be greater than 30 micrometers, which greatly reduces the stroke of the high-precision drive member 32. The high-precision drive member 32 can be selected using a small-stroke, high-precision drive device.

[0051] In this embodiment, the rotation limiting member 313 is configured as a rotation limiting plate, which is fixedly disposed on the side of the support plate 121 opposite to the first bearing assembly 11. Specifically, there are two rotation limiting plates and two first planes 3114. In other embodiments, the rotation limiting member 313 may be configured as a rotation pin or a clamping device.

[0052] Further, see Figure 4 The adjusting member 312 has a cross groove 3121 at its end near the first support component 11 to facilitate rotation of the adjusting member 312 using a Phillips head screwdriver. In other embodiments, the end of the adjusting member 312 near the first support component 11 may also be a square groove or a triangular groove, etc.

[0053] In other embodiments, the adjusting member 312 can be configured as a sleeve with an annular slider on the outside of the sleeve and an annular groove on the side wall of the first adjusting hole 1211. The annular slider cooperates with the annular groove to allow the adjusting member 312 to be rotatably disposed in the first adjusting hole 1211. The inside of the sleeve is screwed to the first connecting part 3111 of the ball socket 311. Rotating the sleeve can drive the ball socket 311 to move axially.

[0054] Furthermore, the connecting assembly 31 also includes a locking nut 314, which is sleeved on the outside of the adjusting member 312 on the side of the support plate 121 near the first bearing assembly 11 and screwed to the adjusting member 312 to limit the axial displacement of the adjusting member 312.

[0055] Furthermore, the second support component 12 also includes a substrate 122, which is located on the side of the support plate 121 opposite to the first support component 11 and spaced apart from the support plate 121, with its second end connected to the substrate 122. Specifically, the high-precision drive component 32 also includes a mounting base 322, which is located at the second end. When installing the high-precision drive component 32, it is only necessary to screw or glue the mounting base 322 to the substrate 122 to achieve efficient fixation of the high-precision drive component 32.

[0056] Further, see Figure 1 The adjustment mechanism 30 also includes tension springs 33, one end of which is connected to the support plate 121 and the other end to the base plate 122. Multiple tension springs 33 are evenly distributed around each high-precision drive component 32. In this embodiment, three high-precision drive components 32 and six tension springs 33 are provided. Tension springs 33 are provided on both sides of each high-precision drive component 32 to ensure that the ball head 321 and the ball socket 3113 are always in close contact without gaps, achieving rigid contact between the ball head 321 and the ball socket 3113, and improving the overall rigidity of the high-precision drive component 32.

[0057] Specifically, the tension spring 33 is provided with hooks at both ends, and the support plate 121 and the base plate 122 are provided with connecting seats 331. The connecting seats 331 are provided with hanging rings, and the hooks are engaged with the hanging rings to fix the tension spring 33 to the support plate 121 and the base plate 122.

[0058] The wafer alignment and bonding apparatus in this embodiment also includes a lifting device (not shown in the figure). The lifting device is located on the side of the substrate 122 away from the tray 121. The lifting device can drive the second support component 12 to rise and fall. Since the tray 121 is fixedly connected to the second tray 112, the rise and fall of the second support component 12 can drive the second tray 112 to rise and fall. When the second tray 112 approaches the first tray 111 and reaches the detection range of the distance sensor 21, the lifting device stops driving and waits for the second tray 112 to be leveled before the lifting device moves the second tray 112 closer to the first tray 111 and bonds the first wafer and the second wafer. Specifically, the lifting device can be configured as a drive motor, cylinder, or hydraulic cylinder, etc.

[0059] Furthermore, the wafer alignment and bonding equipment in this embodiment includes the following steps when in use:

[0060] Step 1: The lifting device drives the second bearing component 12 to rise, and the second bearing component 12 drives the second tray 112 to rise, so that the distance between the second tray 112 and the first tray 111 is within the detection range of the distance sensor 21.

[0061] Step 2: The distance sensor 21 moves horizontally and selects three points, detects the distance between the second tray 112 and the first tray 111 at the three points, and calculates the relative distance difference between the three points;

[0062] Step 3: Based on the relative distance difference, manually adjust the screw-in distance of each adjusting component 312;

[0063] Step 4: Repeat steps 2 and 3 until the relative distance difference between the three points is within the travel range of the high-precision drive component 32;

[0064] Step 5: The lifting device drives the second bearing component 12 to rise, and the second bearing component 12 drives the second tray 112 to rise, thereby reducing the distance between the second tray 112 and the first tray 111. For example, the distance between the second tray 112 and the first tray 111 is 30 micrometers.

[0065] Step 6: The distance sensor 21 moves horizontally and selects multiple points, detects the distance between the second tray 112 and the first tray 111 at multiple points, fits the angle of the second tray 112, calculates the movement of the three high-precision drive components 32, and drives the three high-precision drive components 32 to move.

[0066] Step 7: Move the distance sensor 21 horizontally and select multiple points to verify the leveling result of the second tray 112;

[0067] Step 8: The lifting device drives the second bearing component 12 to rise, and the second bearing component 12 drives the second tray 112 to rise, starting the bonding of the first wafer and the second wafer. After bonding, check the value of the pressure sensor 22 to verify the leveling result.

[0068] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A leveling device, characterized in that, include: The carrier mechanism (10) includes a first carrier component (11) and a second carrier component (12). The first carrier component (11) includes a first tray (111) and a second tray (112). The first tray (111) is spaced above the second tray (112) to carry the first wafer and the second wafer respectively. The second carrier component (12) is located below the first carrier component (11) and includes a pallet (121). The pallet (121) is fixedly connected to the second tray (112). The detection component (20) includes a distance sensor (21), which is located above the first bearing component (11) and can move horizontally to detect the distance between the first tray (111) and the second tray (112) at multiple points. The adjustment mechanism (30) includes a connecting component (31) and a high-precision drive component (32). The connecting component (31) is a plurality of components and is evenly spaced around the central axis of the tray (121). The high-precision drive component (32) is located on the side of the tray (121) away from the first bearing component (11) and corresponds one-to-one with the connecting component (31). The high-precision drive component (32) includes a first end and a second end. The first end is hinged to the connecting component (31). The connecting component (31) can adjust the distance between the tray (121) and the first end. The high-precision drive component (32) is communicatively connected to the distance sensor (21). Each high-precision drive component (32) can independently extend and retract in the vertical direction to adjust the distance between the tray (121) and the second end.

2. The leveling device according to claim 1, characterized in that, The first end is configured as a ball head (321), and the connecting assembly (31) includes a ball socket seat (311). The ball socket seat (311) includes a first connecting part (3111) and a second connecting part (3112). The end of the second connecting part (3112) is provided with a ball socket (3113). The ball head (321) and the ball socket (3113) are rotatably engaged. The first connecting part (3111) is disposed through the support plate (121). The ball socket seat (311) can move relative to the support plate (121) along the central axis direction.

3. The leveling device according to claim 2, characterized in that, The tray (121) is provided with a first adjustment hole (1211), and the connecting assembly (31) further includes an adjusting member (312). The adjusting member (312) is rotatably disposed in the first adjustment hole (1211). The adjusting member (312) has a first threaded hole through it along the extension direction. The first connecting part (3111) is provided with a first thread, and the first connecting part (3111) is screwed to the first threaded hole.

4. The leveling device according to claim 3, characterized in that, The first adjusting hole (1211) is a second threaded hole. The adjusting member (312) is provided with a second thread. The second thread has the same rotation direction as the first threaded hole. The adjusting member (312) is screwed to the second threaded hole. The outer diameter of the second connecting part (3112) is larger than the outer diameter of the first connecting part (3111). The second connecting part (3112) is provided with a first plane (3114). The connecting assembly (31) also includes a rotation limiting member (313). The rotation limiting member (313) is fixed to the side of the support plate (121) away from the first bearing assembly (11). The rotation limiting member (313) includes a second plane. The first plane (3114) abuts against the second plane to limit the rotation of the ball socket (311). The first plane (3114) can slide relative to the second plane.

5. The leveling device according to any one of claims 1-4, characterized in that, The second support component (12) further includes a substrate (122), which is located on the side of the tray (121) away from the first support component (11) and is spaced apart from the tray (121), and the second end is connected to the substrate (122).

6. The leveling device according to claim 5, characterized in that, The adjustment mechanism (30) further includes a tension spring (33), one end of which is connected to the support plate (121) and the other end is connected to the base plate (122). There are multiple tension springs (33) evenly distributed around each of the high-precision drive components (32).

7. The leveling device according to any one of claims 1-4, characterized in that, The detection component (20) further includes a pressure sensor (22), which is multiple and located between the first support component (11) and the second support component (12) to detect the bonding force between the first wafer and the second wafer at multiple points.

8. The leveling device according to claim 7, characterized in that, The pressure sensor (22) corresponds one-to-one with the high-precision drive component (32), and the pressure sensor (22) and the high-precision drive component (32) are distributed in the same orientation around the central axis of the pallet (121).

9. The leveling device according to any one of claims 1-4, characterized in that, The high-precision drive component (32) includes a piezoelectric actuator, which is made of piezoelectric ceramic.

10. A wafer alignment and bonding apparatus, characterized in that, Includes the leveling device as described in any one of claims 1-9.

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