Accurate DAF adhesive film laminating device

Abstract

The utility model discloses a DAF adhesive film accurate laminating device relates to DAF adhesive film laminating field, including the work bench, the upper surface of work bench is equipped with the retractable subassembly, the outer surface of retractable subassembly is equipped with the auxiliary subassembly and the pasting subassembly, the auxiliary subassembly is located the left side of pasting subassembly, the bottom surface of work bench is equipped with the support subassembly, and the support subassembly is equipped with the support subassembly. The winding and unwinding assembly comprises an unwinding roller and a winding roller. According to the device, a DAF adhesive film can be integrally pasted on the upper surface of a chip through a first electric push rod and two second electric push rods arranged in the pasting assembly under the cooperation of a pressing block, and the DAF adhesive film pasted on the outer surface of the chip can be cut under the cooperation of a cutting knife and a cutting groove installed on the outer ring of the chip, so that the DAF adhesive film can be conveniently pasted on the outer surface of the chip. Therefore, the DAF adhesive film is cut after being pasted, so that the DAF adhesive film can cover the pasting position of the chip, the redundant part is cut, and the problem of deviation of the DAF adhesive film in the pasting process can be solved.

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