Mobile track system

Abstract

The movable rail system comprises a frame, a horizontal guide rail, a linear guide system and a fixing mechanism. The shelf has a plurality of shelves and is configured to accommodate a plurality of wafer carrying devices for a semiconductor process. The horizontal rail is adjacent to the shelf. The linear guiding system is arranged below the frame and comprises a movable rail and a positioning assembly. The mobile track is integrated with the shelf and is configured to move the shelf horizontally along a predetermined path. The positioning assembly is mechanically coupled to the horizontal guide rail and is configured to be connected to the mobile track. A securing mechanism is attached to the shelf and configured to position the shelf, the securing mechanism including a rotary actuator configured to drive an insertion element to be inserted into the alignment feature in the positioning assembly.

Description

Technical Field

[0001] This disclosure concerns a mobile track system. Background Technology

[0002] The integrated circuit (IC) industry has experienced rapid growth. Technological advancements in IC materials and design have led to the production of generation after generation of ICs, each generation being smaller and more complex than the last. However, these advancements have also increased the complexity of processing and manufacturing ICs, and similar developments in IC processing and manufacturing are necessary to realize these advancements.

[0003] In the evolution of integrated circuits, functional density (i.e., the number of interconnect components per wafer region) has typically increased, while geometry (i.e., the smallest component (or line) that can be created using manufacturing processes) has decreased. This scaling down process generally provides benefits by increasing production efficiency and reducing associated costs. This scaling down also results in relatively high power dissipation values, which can be addressed by using low-power dissipation components such as complementary metal-oxide-semiconductor (CMOS) devices. Utility Model Content

[0004] In some embodiments, the movable track system includes a frame, horizontal guide rails, a linear guide system, and a fixing mechanism. The frame has multiple shelves and accommodates multiple wafer carriers. The horizontal guide rails are adjacent to the frame. The linear guide system is disposed below the frame and includes movable tracks and positioning components. The movable tracks are integrated into the frame. The positioning components are mechanically coupled to and connected to the horizontal guide rails. The fixing mechanism is attached to the frame and includes a rotary actuator.

[0005] In some embodiments, the mobile track system includes a transfer module, a mobile rack, a linear track system, and a fixing mechanism. The mobile rack, adjacent to the transfer module, houses the wafer carrier. The linear track system includes tracks and a positioning structure. The tracks are mounted on the bottom shelf of the mobile rack. The positioning structure is coupled to the guide rails of the transfer module. The fixing mechanism is mounted on the mobile rack.

[0006] In some embodiments, the mobile track system includes a transmission module, a mobile rack, a linear track system, a fixing mechanism, and a cable management system. The mobile rack, adjacent to the transmission module, houses the wafer carrier. The linear track system includes tracks and positioning structures. The tracks are mounted on the bottom shelf of the mobile rack. The positioning structures are coupled to the guide rails of the transmission module. The fixing mechanism is mounted on the mobile rack. The cable management system includes cable chains mounted alongside the tracks of the linear track system. Attached Figure Description

[0007] When viewed in conjunction with the accompanying drawings, the best understanding of the nature of this disclosure is found in the following detailed illustrations. Note that, in accordance with standard industry practice, the various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or decreased for clarity of explanation.

[0008] Figure 1 This is a block diagram of a manufacturing facility according to some embodiments of this disclosure;

[0009] Figure 2 The illustration depicts a semiconductor manufacturing plant according to some embodiments of the present disclosure, including trolleys, production tools, storage devices, and wafer transport channels;

[0010] Figures 3 to 5 Schematic diagrams illustrating different stages of a method for moving a frame using a linear track system according to some embodiments of this disclosure;

[0011] Figures 6 to 8C A schematic diagram of a linear orbital system according to some embodiments of the present disclosure is shown;

[0012] Figure 9A and Figure 9B Schematic diagrams illustrating different stages of a method for moving a frame using a linear track system according to some embodiments of this disclosure;

[0013] Figure 10 This is a flowchart of a method for moving a frame using a linear track system according to some embodiments of this disclosure.

[0014] [Symbol Explanation]

[0015] 1: Manufacturing equipment

[0016] 2: Manufacturing Line

[0017] 3: Manufacturing equipment

[0018] 8: Stroller

[0019] 10: Wafer carrier device

[0020] 12: Storage device

[0021] 16: Wafer transport channel

[0022] 20: Network

[0023] 21: Loading Port

[0024] 25: Manufacturing System

[0025] 40: Measuring equipment

[0026] 55: Fault Detection and Classification System

[0027] 60: Control System

[0028] 62: Transmission Module

[0029] 62a: Wafer container fixture

[0030] 62b: Linear Actuator

[0031] 62c: Lifter

[0032] 62d: Rotor

[0033] 63b: Horizontal slide rail

[0034] 64b: Movable carrier

[0035] 75: Archived Database

[0036] 85: Entity

[0037] 100: shelf

[0038] 110: Shelves

[0039] 110a: Opening

[0040] 115: Supporting base

[0041] 200: Linear Orbit System

[0042] 210: Mobile track

[0043] 220: Positioning Structure

[0044] 222: Main Body

[0045] 222a: Plate-like structure

[0046] 222b: Connection structure

[0047] 222c: Vertical section

[0048] 222d: Horizontal section

[0049] 222e: Horizontal section

[0050] 222g: Positioning hole

[0051] 224: Casing section

[0052] 230: Electric actuator

[0053] 236: Tires

[0054] 238: Cable drag chain

[0055] 240: Visual indicator

[0056] 250: Fixture

[0057] 251: Fixed element

[0058] 251a: Fixed Body

[0059] 251b: Fixing plate

[0060] 252: Moving element

[0061] 253: Moving element

[0062] 253a: Horizontal section

[0063] 253b: Horizontal section

[0064] 253c: Horizontal section

[0065] 253d: Vertical section

[0066] 253e: Vertical section

[0067] 254: Rotating element

[0068] 255: Insertion element

[0069] 256: Positioning element

[0070] 256a: Guide opening

[0071] 256b: Receiving opening

[0072] 326: Position Detection System

[0073] 326a: Positioning sensor

[0074] 326b: Positioning sensor

[0075] 350: Electromagnetic braking system

[0076] 351: Electromagnetic coil

[0077] 352a: Brake plate

[0078] 352b: Brake plate

[0079] 353: Power Supply Unit

[0080] M: Method

[0081] S101-S105: Steps Detailed Implementation

[0082] The following disclosure provides numerous different implementations or examples for implementing various features of the provided object. Specific examples of components and configurations are illustrated below to simplify this disclosure. Of course, these are merely examples and are not intended to be limiting. For instance, in the following illustrations, the formation of a first feature above or on a second feature may include implementations where the first and second features are formed in direct contact, and may also include implementations where an additional feature may be formed between the first and second features so that the first and second features are not in direct contact. Furthermore, in various instances, references to numbers and / or letters may be repeated in this disclosure. This repetition is for simplicity and clarity and does not, in itself, define the relationships between the various implementations and / or configurations discussed.

[0083] Additionally, for ease of illustration, spatial relative terms such as “beneath,” “below,” “lower,” “above,” and “upper,” and similar terms, are used herein to illustrate the relationship between one element or feature as illustrated in the figures and another. These spatial relative terms are intended to cover different orientations of elements in use or operation, in addition to those depicted in the figures. Elements may be oriented in other ways (rotated 90 degrees or otherwise), and the spatial relative illustration terms used herein may be interpreted accordingly. As used herein, “approximately,” “probably,” “around,” or “substantially” can mean within 20%, 10%, or 5% of a given value or range. However, those skilled in the art will understand that the values ​​or ranges listed throughout the illustrations are merely examples and may decrease as integrated circuits shrink. The numerical values ​​disclosed herein are approximate, and unless explicitly stated otherwise, terms such as “approximately,” “probably,” “around,” or “substantially” can be inferred.

[0084] Unless otherwise defined, all terms used in this disclosure (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It should also be understood that terms such as those defined in common dictionaries shall be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and this disclosure, and shall not be interpreted as having an idealized or overly formal meaning, unless expressly defined herein.

[0085] In semiconductor manufacturing, racks (or shelves) used by automated robots often need to be moved to make room, but their repositioning presents challenges. Specifically, when racks are moved and then returned, a tedious recalibration is typically required to ensure correct alignment, which can take more than 12 hours. This calibration process is both time-consuming and unreliable, with uncertainties regarding the stability and accuracy of the returned position, leading to delays and additional verification procedures.

[0086] Therefore, this disclosure provides a mechanical structure in various embodiments that allows a rack to move along a track and precisely return to its original position. The mechanical structure may include a fixing device (e.g., a quick-clamp device) and a linear track system. The fixing device securely holds the rack in place before and after movement, ensuring stable and precise repositioning. The rack can be mounted on the track for smooth horizontal movement. This disclosure may also introduce a cable drag chain to manage cables during movement, reducing the risk of entanglement and ensuring safe and orderly operation. Therefore, this disclosure allows the rack to move along the track after the fixing device is released, and to re-engage the fixing device to secure the rack in place upon reaching the target position, without requiring cumbersome recalibration.

[0087] refer to Figure 1 . Figure 1 This is a block diagram of a manufacturing facility according to some embodiments of the present disclosure. Manufacturing facility 1 implements integrated circuit manufacturing processes to manufacture integrated circuit devices. For example, manufacturing facility 1 can implement semiconductor manufacturing processes for manufacturing semiconductor wafers. It should be noted that... Figure 1For clarity of understanding of the concepts disclosed herein, the manufacturing equipment 1 has been simplified. Manufacturing equipment 1 may have additional functionality added, or certain described functions may be replaced or deleted in other embodiments. Manufacturing equipment 1 may include multiple copies of each entity. In some embodiments, other entities not shown in the figures may also be included. Manufacturing equipment 1 may include a network 20 enabling communication between entities (e.g., manufacturing system 25, metrology device 40, fault detection and classification (FDC) system 55, control system 60 60, archive database 75, and other entities 85). Network 20 may be a single network or a combination of multiple different networks, such as an intranet, the Internet, or other networks. Network 20 may include wired communication channels, wireless communication channels, or a combination of both.

[0088] refer to Figure 2 . Figure 2 Manufacturing line 2 is shown, used to implement integrated circuit manufacturing processes to manufacture integrated circuit devices. For example, manufacturing line 2 can implement semiconductor manufacturing processes used to manufacture semiconductor wafers. It is important to note that... Figure 2 In order to clearly understand the concepts disclosed herein, manufacturing line 2 has been simplified. For example... Figure 2As shown, manufacturing line 2 may include manufacturing equipment 3. Manufacturing line 2 may also include a trolley 8, a stocker 12, and a wafer transport channel 16. The trolley 8 and wafer transport channel 16 are used to transport wafer carriers 10. In some embodiments, wafer carriers 10 may be made of quartz and / or polypropylene (PP). In some embodiments, wafer carriers 10 may be alternately referred to as wafer jigs, cassettes, or front-opening unified pods (FOUPs). In some manufacturing processes, wafers need to pass through one or more of the aforementioned tools. For example, wafer carriers 10 may be configured to accommodate wafers. Wafer carriers 10 may be transported by trolley 8 to a stocker 12 that has wafer storage functionality. Wafer carriers 10 may also be transported to load ports 21, which load wafers into or remove wafers from manufacturing equipment 3. Manufacturing station 3 can perform manufacturing steps on wafers. Transport between manufacturing stations 3 can be carried out using trolley 8 or automated wafer transport channel 16. In some embodiments, tools may be alternately referred to as devices.

[0089] refer to Figures 3 to 8C . Figures 3 to 5 According to some embodiments of this disclosure, schematic diagrams are shown of different stages in a method for moving a rack 100 using a linear track system 200. In some embodiments, the rack 100 may be alternately referred to as a wafer carrier, and the linear track system 200 may be alternately referred to as a linear guidance system. Figures 6 to 8C Schematic diagrams of a linear track system 200 and a fixing device 250 according to some embodiments of this disclosure are shown. In some embodiments, the fixing device 250 may be alternately referred to as a fixing mechanism.

[0090] In some embodiments, after the wafer has been processed by the manufacturing machine 3, it can be moved to the wafer carrier 10 on the loading port 21 (see...). Figure 2 Subsequently, the wafer can be moved to the rack 100 using the wafer carrier 10 (see...). Figure 4This facilitates the next stage of processing. The wafer carrier 10 may include multiple slots / fixtures for accommodating multiple wafers and separating them from each other. In some embodiments, the wafer carrier 10 forms an angle with the horizontal plane, such that the wafers can be placed on their rear surface while the front or top surface of the wafers does not contact any object.

[0091] The rack 100 can be positioned on one side of the manufacturing machine 3. A transfer module 62 can be installed between the rack 100 and the manufacturing machine 3 to facilitate the movement of the wafer carrier 10. The transfer module 62 allows the wafer carrier 10 to be smoothly transported along a path between the rack 100 and the manufacturing machine 3, ensuring efficient and precise handling during semiconductor manufacturing.

[0092] Specifically, the transfer module 62 is integrated within the manufacturing machine 3 and rack 100 and may include elements for coordinated operation to manipulate and transport the wafer carrier 10 with high precision. In some embodiments, the transfer module 62 may include a wafer container gripper 62a for securely gripping the wafer carrier 10 during transport. The wafer container gripper 62a may be available in various shapes and sizes to accommodate different container specifications, ensuring a secure grip without damaging the contents. In some embodiments, the transfer module 62 may also include a linear actuator 62b, which includes a horizontal slide rail 63b and a movable carrier 64b. The linear actuator facilitates smooth horizontal movement along the slide rail and provides power for these movements, allowing for precise positioning in the X-axis direction within the facility. In some embodiments, the horizontal slide rail 63b may be alternately referred to as a horizontal sliding track. In some embodiments, the transfer module 62 may further include a lifter 62c equipped with a vertical rail and a movable carrier operated by an actuator. The lifter 62c enables vertical movement, allowing the transfer module 62 to adjust the height of the wafer carrier 10 to accommodate different layers of the rack 100 or to align with devices of different heights. In some embodiments, the transfer module 62 may further include a rotor 62d for controlling the rotational movement of the transfer module 62, enhancing the ability of the wafer container fixture 62a to adjust its orientation.

[0093] Therefore, the wafer container fixture 62a can move seamlessly in three directions (e.g., horizontally along the X and Y axes and vertically along the Z axis). This multi-directional capability can be used for navigating the layout of semiconductor manufacturing facilities. On the other hand, the transfer module 62 can achieve omnidirectional motion, providing a high degree of freedom in operating the wafer carrier 10. In some embodiments, each element in the transfer module 62, such as the linear actuator 62b, the lifter 62c, and the rotor 62d, can be independently controlled and finely adjusted for smooth acceleration or deceleration. This precise control helps prevent positional displacement of the wafer container during rapid movement or transitions, thereby protecting the integrity of the wafer. In some embodiments, the transfer module 62 may include a robot.

[0094] The rack 100 can be equipped with multiple shelves 110 at different heights. Each shelf 110 can accommodate at least one wafer carrier 10, thereby allowing the wafers in the wafer carrier 10 to be properly arranged for the next process step. The wafer carrier 10 can be placed on a carrier support base 115 on the rack 100 (see...). Figure 3 and Figure 4 This configuration ensures that the wafer carrier and support device are securely positioned, ready for subsequent automated processing or process stages. The length of the middle shelf 110 of the rack 100 can extend along the horizontal slide rail 63b, creating a spatial relationship aligned with the movement path of the wafer carrier 10, ensuring efficient transport and positioning of the wafer carrier 10 at different stages of the semiconductor process.

[0095] The carrier bases 115 can be arranged in a matrix configuration on the rack 100. Specifically, the carrier bases 115 can be distributed at different locations on each rack 110, allowing for flexible placement options and promoting efficient utilization of rack capacity. For example, two carrier bases can be installed side by side along the length of the horizontal slide rail 63b. Four carrier bases 115 may be arranged in the direction perpendicular to the horizontal slide rail 63b. This matrix arrangement allows each rack 110 to accommodate up to eight cells, optimizing space utilization and improving accessibility for automated wafer processing.

[0096] After the wafer has been processed by the manufacturing machine 3, the wafer container jig 62a of the transfer module 62 can pick up the wafer carrier 10 from the manufacturing machine 3. Subsequently, the linear actuator 62b can move the wafer carrier 10 to the appropriate position, while the lifter 62c can assist in aligning the wafer carrier 10 with the corresponding carrier base 115 on the rack 100. Once aligned, the wafer container jig 62a can place the wafer carrier 10 onto the corresponding carrier base 115. This process ensures the precise handling and positioning of the wafer carrier 10, promotes a smooth transition of the wafer through different stages of semiconductor manufacturing, and minimizes the risk of misalignment or damage.

[0097] refer to Figure 3 and Figure 4 . Figure 3 and Figure 4 The diagram illustrates the positional relationship between the frame 100 and the manufacturing machine 3, showing the different positions of the frame 100 before and after being moved using the linear track system 200. Figure 3 The image shows the initial position of rack 100, for example, in a scenario where it is used in conjunction with manufacturing equipment 3. This configuration is suitable for situations requiring wafer processing, storage, or arrangement, with rack 100 positioned to support production activities. In some implementations, such as Figure 4 As shown, the linear track system 200 can be used to move the shelf 100 to different positions. This movement allows... Figure 3 The space originally occupied by the mid-rack 100 has been repurposed. For example, the space can be used for the operation of automated robots, temporary access to other production equipment, or simply to facilitate personnel movement in confined working environments. This relocation not only ensures efficient space utilization but also provides flexibility in managing the layout of semiconductor manufacturing facilities.

[0098] In addition, shelf 100 can be returned to, for example Figure 3 The rack 100 is positioned back to its original location, allowing it to resume its function in production without requiring cumbersome recalibration. This ability to move back and forth between positions makes the rack 100 highly flexible when frequent reconfiguration is required during production. The fixture 250 and linear track system 200 ensure accurate return on every trip, minimizing production downtime and maintaining the precision required for semiconductor manufacturing.

[0099] Furthermore, in some implementations, when the shelf 100 moves... Figure 4 After reaching the indicated position, the device can remain at this new position for subsequent operational phases. This, in turn, allows for a dynamic production environment where the locations of tools, materials, and storage must frequently adapt to changing needs. In some implementations, movement can be automated, for example using a control system 60 integrated into the linear track system 200 (see...). Figure 1 The placement of the shelves 100 is determined according to the production plan. In some embodiments, accurate and efficient repositioning of the shelves 100 can also reduce additional storage space requirements. Instead of placing multiple fixed shelves in the facility, several mobile shelves with adjustable positions can serve various roles, from storage to temporary arrangements for different production steps, thereby enhancing the flexibility of the production environment, improving space utilization, and minimizing redundant storage units.

[0100] To move the rack 100 quickly and accurately, while reducing or eliminating lengthy calibrations, this paper discloses the introduction of a linear track system 200 to precisely guide the rack 100 to its designated position, such as... Figure 3 and Figure 4 As shown. By ensuring smooth and precise movement, calibration time can be minimized or even eliminated entirely. Specifically, the linear orbit system 200 may include a movable rail 210 (see...). Figure 7 ) and positioning structure 220. In some embodiments, the movable track 210 may be alternately referred to as a movable guide rail.

[0101] like Figure 7 As shown, the movable track 210 can be installed at the bottom of the shelf 110 of the rack 100. The movable track 210 can move along the horizontal slide rail 63b of the transfer module 62 (see...). Figure 3 and Figure 4 The extension allows the rack 100 to move smoothly along a well-defined path, guided by a track system for precise positioning. In some embodiments, integrating the movable track 210 with the horizontal slide rail 63b enables coordinated movement between multiple racks 100 and manufacturing machines 3, thereby supporting the overall efficiency of automated production workflows.

[0102] The positioning structure 220 enhances stability and control during the movement of the frame 100. For example... Figure 6 As shown, the positioning structure 220 may include a body portion 222 and a sleeve portion 224. The body portion 222 may be fixed to the horizontal slide rail 63b of the transmission module 62 (see...). Figure 3 and Figure 4The main body 222 may include a plate-shaped structure 222a and a connecting structure 222b. The plate-shaped structure 222a forms the base of the positioning structure 220 and extends from the horizontal slide rail 63b, providing base support. The connecting structure 222b may be T-shaped, including a vertical portion 222c extending upward from the plate-shaped structure 222a, and two lateral portions 222d and 222e extending horizontally from both sides of the vertical portion 222c. The connecting structure 222b ensures the alignment of the shelf 100 during movement.

[0103] The sleeve portion 224 of the positioning structure 220 can be mounted on the transverse portion 222d of the connecting structure 222b. The position of the sleeve portion 224 can correspond to the movable track 210. The movable track 210 can be movably inserted into the sleeve portion 224, forming a tight-fitting yet flexible connection, allowing the movable track 210 to move freely while maintaining stability. When the frame 100 is moved, the linear track system 200 can operate with high precision. As the movable track 210 moves relative to the sleeve portion 224, it drives the frame 100, allowing the frame 100 to move along the path defined by the horizontal slide rail 63b of the transfer module 62. The combination of these components allows the frame 100 to move smoothly between different positions relative to the manufacturing machine 3.

[0104] Therefore, the positioning structure 220, through its T-shaped connecting element and tightly fitting sleeve portion 224, ensures that the shelf 100 moves along a predetermined path without deviation. Since the shelf 100 moves along a well-defined and controlled path, calibration time can be reduced or even eliminated entirely. The movement accuracy provided by the linear track system 200 ensures that the shelf 100 returns to its original position with high precision, thus eliminating the need for lengthy calibration processes.

[0105] In some embodiments, the movement of the movable track 210 can be operated manually or automatically. In manual mode, the operator can physically adjust the position of the frame 100 along the horizontal slide rail 63b. In automatic mode, the movement of the movable track 210 can be controlled by the electric actuator 230 (see [link to manual mode]). Figure 7 Power is provided, for example, by a linear actuator integrated with the mobile track 210. The automated process can be controlled by a control system 60, which can be pre-programmed with specific movement commands. Sensors on the track provide real-time feedback, allowing the control system (see...) Figure 1 Monitor the progress of the track and adjust the speed or position.

[0106] In some implementations, the linear track system 200 may be equipped with an adjustable speed setting to optimize the movement of the shelf 100. A motion profile may include three-stage speed control, where movement begins at a slow speed, transitions to a fast speed, and finally decelerates again before stopping. This slow-fast-slow speed profile ensures both efficiency and accuracy. Specifically, the movement of the shelf 100 can begin at a slow speed, allowing the linear track system 200 to initiate movement gradually, avoiding any sudden vibrations or shocks that could disturb sensitive components (e.g., semiconductor wafers). The slow start ensures that the shelf 100 accelerates smoothly, providing time for monitoring and adjusting the shelf's position. Once the shelf 100 has cleared any sensitive areas and is securely positioned on the track, the system can accelerate to a fast speed. At this stage, rapid movement can improve the overall efficiency of the system by reducing transport time. As the shelf 100 approaches the target position, the system can gradually reduce its speed to a slow pace. This deceleration phase ensures that the shelf 100 can be precisely aligned with the target position without overshooting or causing any mechanical stress. The final slow approach allows the system to make fine adjustments.

[0107] Once the shelf 100 is moved to the predetermined position, it can be locked in place by the fixing device 250 to maintain stability and ensure accurate alignment for subsequent operations. The fixing device 250 can be installed on the bottom shelf 110 of the shelf 100, providing safety and ease of operation. In some embodiments, the fixing device 250 may also be referred to as a quick clamping device. Figures 6 to 8C As shown, the fixing device 250 may include several components that cooperate to stabilize the frame 100: fixing component 251, moving components 252 and 253, rotating component 254, insertion component 255, and positioning component 256. In some embodiments, the rotating component 254 may be alternately referred to as a rotary actuator.

[0108] like Figures 8A to 8CAs shown, the fixing element 251 serves as the foundation of the fixing device 250, providing a stable connection point for the entire mechanism. Specifically, the fixing element 251 can be fixed to the shelf 110, and its design includes an opening 110a. The fixing element 251 may include a fixing body 251a and a fixing plate 251b. The fixing body 251a can be firmly attached to the top surface of the shelf 110 and located at the edge of the opening 110a, serving as an anchor point for the fixing device 250 and ensuring that all components can maintain a stable position. The fixing plate 251b can extend horizontally from the fixing body 251a, located above the opening 110a, providing guidance and support for moving elements, ensuring consistent position and alignment during movement.

[0109] like Figures 8A to 8C As shown, the movable element 252 can be a rod-shaped structure, serving as an intermediate element connecting the rotating element 254 and the movable element 253. The movable element 252 can pass through the fixing plate 251b of the fixed element 251, allowing it to rotate and effectively transmit force. The movable element 252 is capable of transmitting the rotational force generated by the rotating element 254 to the rest of the fixed mechanism.

[0110] Furthermore, the movable element 253 can be used to guide the movement of the insertion element 255, thereby achieving precise positioning of the shelf 100. The movable element 253 can be a plate-like structure and is connected to the other end of the movable element 252, opposite to the rotating element 254. The movable element 253 is located between the movable element 252 and the insertion element 255, ensuring that the force applied by the rotating element can be accurately converted into vertical motion. In some embodiments, the movable element 253 can be configured as a multi-bend structure, comprising three horizontal sections 253a, 253b, and 253c and two vertical sections 253d and 253e. The vertical section 253d connects the horizontal sections 253a and 253b, while the vertical section 253e connects the horizontal sections 253b and 253c. The horizontal section 253b is located between the horizontal sections 253a and 253c and can be pushed by the movable element 252. Insertion element 255 can be installed on the horizontal portions 253a and 253c respectively. Insertion element 255 is a downwardly extending rod-shaped structure.

[0111] Insertion element 255 is used to secure shelf 100 in place. It is a rod-like structure extending downward from the horizontal portions 253a and 253c of movable element 253. When the fixing device 250 is engaged, insertion element 255 enters the designated positioning hole, thereby locking shelf 100 in place. Insertion element 255 ensures that shelf 100 is securely fixed, thereby minimizing movement or vibration that may affect subsequent operation.

[0112] Positioning element 256 can be fixed to shelf 110 and extend into opening 110a. Positioning element 256 may have guide opening 256a and receiving opening 256b. Guide opening 256a guides the insertion element 255 along the correct path during vertical movement, while receiving opening 256b accommodates the moving element 253 during operation, preventing positioning element 256 from obstructing its movement. Positioning element 256 ensures that all moving parts are accurately guided and that the insertion element 255 effectively engages with the designated locking point. In some embodiments, guide opening 256a may be alternately referred to as an alignment feature.

[0113] like Figure 8C As shown, once the shelf 100 has moved to its predetermined position, it must be stabilized to ensure it remains secure during subsequent operations. For this purpose, the rotating element 254 of the fixing device 250 can be activated. Through the rotating element 254, force is applied to the moving elements 253 and 252. This force can be transmitted through the moving elements 252 and 253, causing the insertion element 255 to move downwards. As the insertion element 255 moves downwards, it can align with the positioning hole 222g on the lateral portion 222e of the connecting structure 222b of the positioning structure 220. The insertion element 255 continues to move downwards until it is fully inserted into the positioning hole 222g, thereby locking the shelf 100 onto the positioning structure 220, ensuring the shelf 100 is securely fixed in place and preventing any accidental movement or misalignment.

[0114] In some embodiments, the fixing device 250 may be a manual quick-release clamping device. In some embodiments, the fixing device 250 may be an automatic quick-release clamping system that is electronically controlled, allowing for faster and more consistent clamp activation and release.

[0115] In some embodiments, the rack 100 may be equipped with tires 236 or other elements to facilitate its movement along the linear track system 200, ensuring smooth and efficient transport of the rack 100 within the semiconductor manufacturing facility. Specifically, tires 236 may be mounted on the bottom of the rack 100. Tires 236 may be made of durable materials such as rubber or polyurethane, providing excellent abrasion resistance and supporting the weight of the rack and its contents, such as wafer carriers. Tires 236 enable the rack 100 to move easily along the linear track system 200, reducing friction and minimizing the physical effort required to reposition the rack. In some embodiments, tires 236 may be fixed tires, providing stable linear movement and ensuring the rack 100 moves along a straight path. In some embodiments, tires 236 may be omnidirectional tires, providing multi-directional movement and allowing the rack 100 to turn and maneuver in confined spaces. In some embodiments, tires 236 may be replaced by sliding pads or ball bearings.

[0116] In some implementations, the linear track system 200 may include visual and audible indicators. Specifically, the process of activating or deactivating the anchor 250 may be accompanied by a visual indicator 240 (such as a screen, LED light) and an audible alarm (not displayed) to notify the operator that the rack 100 has been anchored or released, enhancing operational safety and ensuring that personnel are always aware of the rack's status. During movement, the linear track system 200 may also record diagnostic data, such as movement duration, locking (e.g., clamp activation) status, and sensor data, and record this data to an archived database 75 (see [link to documentation]). Figure 1 This information can be analyzed to improve the movement process, identify bottlenecks, and increase overall efficiency, and this information can be displayed on a visual indicator 240. For example, the visual indicator 240 can be activated to provide a visual signal when the fixture 250 is engaged or disengaged.

[0117] like Figure 7As shown, the cable management system may include a cable drag chain 238 mounted on the bottom shelf 110 of the rack 100. The cable drag chain 238 is designed to manage and protect cables during the movement of the rack 100, ensuring they remain tangle-free and securely positioned as the rack 100 moves along the path. The cable drag chain 238 may be mounted alongside the moving track 210, extending the same length as the moving track 210. This parallel configuration ensures that the cable drag chain 238 moves synchronously with the moving track 210, effectively guiding and securing cables to accommodate the transport of the rack. In some embodiments, the cable drag chain 238 may be mounted with its bottom higher than the bottom of the positioning structure 220. In some embodiments, by placing the cable drag chain 238 at a higher position, the linear track system 200 can minimize the risk of interference or entanglement between cables and the positioning structure 220, ensuring smooth and unobstructed movement of the rack and cables.

[0118] In some implementations, the transmission module 62 integrates a position detection system 326, which enhances the accuracy and stability of rack movement during semiconductor manufacturing. The position detection system 326 may be equipped with positioning sensors 326a and 326b to monitor the rack's position on the horizontal and vertical axes, ensuring proper alignment and reducing operational risks.

[0119] like Figures 3 to 5 As shown, the positioning sensor 326a can be mounted on the horizontal slide rail 63b of the transfer module 62. By being arranged along the length of the slide rail, the positioning sensor 326a can continuously track the horizontal movement of the rack 100, confirming that it remains on the predetermined path during transport, thus allowing for checking the rack's position during movement and upon reaching a stopping point. This real-time monitoring ensures accurate alignment of the rack with the manufacturing machine 3 and minimizes the risk of alignment errors.

[0120] Positioning sensor 326b can be mounted on the lifter 62c of the transmission module 62. Positioning sensor 326b can provide feedback on the vertical position of the shelf 100. In some embodiments, positioning sensor 326b can be mounted on the top and bottom portions of the lifter 62c. By attaching to the lifter 62c, positioning sensor 326b can move with the shelf 100 along the horizontal guide rail 63b, providing real-time height updates and confirming the correct position at different processing stages. In some embodiments, positioning sensors 326a and 326b can operate together, continuously collecting position information, alignment, and stability data of the shelf 100 during various movement stages.

[0121] When an abnormal situation occurs (such as deviation from the predetermined path, incorrect height, or incorrect alignment), positioning sensors 326a and 326b can send a signal to the control system 60 (see...). Figure 1 The system sends an immediate signal to initiate the process to correct errors or halt further movement until the problem is resolved, thus ensuring that any potential issues are proactively managed. In some embodiments, the control system 60 can trigger an emergency stop function. This can bring all movement of the rack 100, the lift 62c, and the horizontal rail 63b to a stop, preventing any possible collisions or further misalignment. This function is crucial for protecting machinery and wafers from potential damage. In some embodiments, the positioning sensors 326a and 326b can be proximity sensors. In some embodiments, the position detection system 326 can also be equipped with vibration sensors to detect any unexpected movement or vibration of the rack during transport.

[0122] refer to Figure 9A and Figure 9B . Figure 9A and Figure 9B According to some embodiments disclosed herein, schematic diagrams illustrating different stages of a method for moving a frame 100 using a linear track system 200 are provided. In some embodiments, an electromagnetic brake system 350 may be used as an alternative to the fixing device 250. In some embodiments, the electromagnetic brake system 350 may include an electromagnetic coil 351, brake plates 352a and 352b, a power supply unit 353, and a control system 60 (see [link to relevant documentation]). Figure 1 ) and positioning sensor 326a (see Figures 3 to 5 ).

[0123] like Figure 9A and Figure 9BAs shown, the electromagnetic coil 351 can generate a magnetic force to hold the shelf 100 in place. In some embodiments, the electromagnetic coil 351 can be mounted (or installed) on the positioning structure 220 near the stopping position of the shelf 100. When current flows through the electromagnetic coil 351, it can create a magnetic field, generating a holding force. Brake plates 352a and 352b can be attached to the shelf 100. Brake plates 352a and 352b can be aligned with the electromagnetic coil 351 respectively and serve as surfaces for magnetic field attachment. The brake plates can be made of a ferromagnetic material compatible with the electromagnetic coil 351 to ensure a secure hold. When the electromagnetic coil 351 is energized, the brake plates 352a and 352b are attracted, effectively securing the shelf 100. The power supply unit 353 can provide power to the electromagnetic coil 351. The control system 60 can determine when to activate or deactivate the electromagnetic braking system 350, ensuring that the braking mechanism is activated when the shelf 100 needs to be moved.

[0124] As the shelf 100 moves along its designated path, the positioning sensor 326a detects whether it has reached the target position. Once this position is confirmed, the control system 60 can send a signal to activate the electromagnetic coil 351. Once energized, the electromagnetic coil 351 generates a magnetic field that attracts either the brake plate 352a or 352b to the electromagnetic coil 351. The strong magnetic force firmly holds the shelf 100 in place, preventing any accidental movement. The mechanism of the electromagnetic braking system 350 is similar to that of the fixing device 250, functioning by ensuring that the shelf 100 is locked in a stable position. When it is necessary to move the shelf 100 again, the control system 60 can deactivate the electromagnetic coil 351 by cutting off the power supply, thereby eliminating the magnetic field and allowing the shelf 100 to move freely along the track to the next position. In some embodiments, the electromagnetic braking system 350 has no physical contact parts that slide or rub during normal operation, thus reducing mechanical wear and tear.

[0125] refer to Figure 10 , Figure 10 A flowchart illustrating a method for moving a frame 100 using a linear track system 200 according to some embodiments of this disclosure is shown. This method M outlines the steps of the moving process. It should be understood that, in Figures 3 to 9B Other operations may be performed before, during, or after the steps shown, and some described steps may be replaced or omitted in other implementations. Furthermore, the order of these operations or processes can be interchanged, providing flexibility according to specific requirements.

[0126] Method M begins at step S101, in which the fixing device 250 (e.g., a quick clamping device) is released to allow the shelf 100 to move along a track (e.g., positioning structure 220). Specifically, the process first releases the fixing device 250 that secures the shelf 100 in its current position. The fixing device 250 ensures that the shelf 100 remains stable during idle periods, and after release, the shelf 100 can move freely.

[0127] Method M then proceeds to step S102, moving rack 100 to the target location and ensuring cable management via cable drag chain. Specifically, once the securing device 250 is released, rack 100 can move along the tracks of linear track system 200, allowing it to slide horizontally to the desired position. During this process, cable management is handled by cable drag chain 238, which keeps all cables in order, prevents tangling, and ensures smooth and safe movement of rack 100. Cable drag chain 238 extends along the movable track 210 of rack 100 and linear track system 200, ensuring that power and data cables are not overstretched or damaged.

[0128] Method M then proceeds to step S103, where the rack 100 is locked at the target position using the fixing device 250 to ensure stability. After the rack 100 reaches the desired position, the fixing device 250 can be reactivated to secure the rack 100 in place. By locking (e.g., rotating, pressing, or performing an operation) the fixing device 250, this device (e.g., a clamp) can lock the track, ensuring the rack remains in the predetermined position, thereby allowing the stability and precise alignment of the rack to be maintained. A verification process is performed at this stage to ensure that the fixing device 250 is fully activated and that the rack 100 has been accurately positioned. The fixing device 250 not only locks the rack 100 in place but also acts as a stabilizing element, reducing vibrations that may affect ongoing operations and ensuring that wafers are not disturbed during storage or handling within the rack.

[0129] Method M then proceeds to step S104, whereby the shelf is moved back to its original position if necessary. Specifically, when needed, the fixing device 250 can be released again, allowing the shelf 100 to slide back to its original position along the track.

[0130] Shelf 100 can be returned to its original position using linear track system 200, and similar to the initial movement process, cable chain 238 ensures that all cables remain orderly, tangle-free, and protected from damage. This step allows shelf 100 to be repositioned quickly and accurately, eliminating the need for cumbersome recalibration and minimizing production line downtime.

[0131] Method M then proceeds to step S105, locking the shelf 100 and verifying that all fasteners 250 are fully engaged to confirm accurate repositioning. Specifically, after the shelf 100 reaches its original or predetermined position, the fasteners 250 can be re-engaged to lock it in place. This step includes rotating (e.g., pressing or manipulating) the fasteners 250 to confirm that all clamps are properly locked and that the shelf 100 is secure. A verification process is then performed to ensure that the fasteners 250 are fully engaged and to confirm that the shelf 100 has been accurately repositioned. At this stage, the precise alignment of the shelf is confirmed, ensuring that it has returned to its original configuration without any deviation.

[0132] Throughout the movement, positioning sensors 326a and 326b (see...) Figures 3 to 5 It can be integrated into the linear track system 200. Positioning sensors 326a and 326b can monitor the movement of the frame, ensuring it is on the correct path. Positioning sensors 326a and 326b can provide real-time feedback to the control system 60.

[0133] Therefore, as can be seen from the above discussion, this disclosure offers numerous advantages. However, it should be understood that other embodiments may offer additional advantages; not all advantages are disclosed here, and not all embodiments necessarily possess specific advantages. This disclosure provides a mechanical structure in various embodiments that allows a rack to move along a track and precisely return to its original position. The mechanical structure may include a fixing device (e.g., a manual quick-clamp device) and a linear track system. The fixing device can securely hold the rack in place before and after movement, ensuring the rack remains stable and is accurately repositioned. The rack can be mounted on a track that facilitates smooth horizontal movement. This disclosure can also integrate a cable chain to manage cables during movement, reducing the risk of entanglement and ensuring safe and orderly operation. Therefore, this disclosure allows the rack to move, release the fixing device, move along the track, and reactivate the fixing device upon reaching the target position to secure the rack in the desired location without cumbersome recalibration.

[0134] In some embodiments, the method of operating the mobile track system includes releasing a fixing device to allow a frame to move in a first position using a mobile track of a linear track system; moving the frame from the first position to a second position using the mobile track; activating the fixing device to secure the frame in the second position; releasing the fixing device to allow the frame to return to the first position using the mobile track; and activating the fixing device to lock the frame in the first position.

[0135] In some embodiments, the rack is configured to accommodate multiple wafer carriers, which are loaded and unloaded via a transfer module for transporting multiple semiconductor wafers. In some embodiments, the step of moving the rack from a first position to a second position using a moving track is performed via a moving track of a linear track system mounted on a bottom shelf of the rack. In some embodiments, the moving track is operatively associated with a positioning structure mounted on a horizontal slide rail of the transfer module. In some embodiments, the method of operating the moving track system further includes adjusting a moving speed of the rack to reduce rack vibration. In some embodiments, a fixing device is mounted on a bottom shelf of the rack. In some embodiments, the fixing device is a quick-clamp device. In some embodiments, the linear track system further includes a cable chain for managing multiple cables connected to the rack as the rack moves along the moving track. In some embodiments, the cable chain is arranged along the moving track. In some embodiments, the method of operating the moving track system further includes activating an indicator to provide a visual signal when the fixing device is activated or released.

[0136] In some embodiments, the movable track system includes a shelf, a horizontal guide rail, a linear guide system, and a fixing mechanism. The shelf has multiple shelves and is configured to accommodate multiple wafer carriers for semiconductor processes. The horizontal guide rail is adjacent to the shelf. The linear guide system is disposed below the shelf and includes a movable track and a positioning assembly. The movable track is integrated into the shelf and configured to move the shelf horizontally along a predetermined path. The positioning assembly is mechanically coupled to the horizontal guide rail and configured to be connected to the movable track. The fixing mechanism is attached to the shelf and configured to position the shelf; the fixing mechanism includes a rotary actuator configured to drive an insertion element into an alignment feature in the positioning assembly.

[0137] In some embodiments, the linear guide system further includes a cable chain located below the rack, configured to manage and protect multiple cables during horizontal movement. In some embodiments, the fixing mechanism includes a quick-clamp device configured to repeatedly lock and unlock the rack. In some embodiments, the fixing mechanism further includes a positioning element mechanically coupled to a layer of the rack and configured to guide an insertion element of the fixing mechanism to align with an alignment feature in the positioning assembly. In some embodiments, the positioning assembly further includes a locking indicator mounted on the rack, configured to provide a signal when the rack is securely locked into position.

[0138] In some embodiments, the mobile track system includes a transfer module, a mobile rack, a linear track system, and a fixing mechanism. The transfer module is configured to transfer a wafer carrier. The mobile rack, adjacent to the transfer module, is configured to accommodate the wafer carrier and to move between a first position and a second position. The linear track system includes tracks and a positioning structure. The tracks are mounted on the bottom shelf of the mobile rack and configured to allow the mobile rack to move horizontally along a defined path. The positioning structure is coupled to the guide rails of the transfer module and is configured to guide the mobile rack using the tracks during horizontal movement, ensuring that the mobile rack is aligned with either the first or second position. The fixing mechanism is mounted on the mobile rack and is configured to selectively engage and disengage to secure the mobile rack in place at either the first or second position.

[0139] In some embodiments, the fixing mechanism includes a rotary actuator configured to drive an insertion element that extends into an alignment feature of the positioning structure, thereby mechanically locking the movable shelf in a first or second position. In some embodiments, the fixing mechanism is integrated into the bottom shelf of the movable shelf.

[0140] In some embodiments, the movable track system includes a frame, horizontal guide rails, a linear guide system, and a fixing mechanism. The frame has multiple shelves and accommodates multiple wafer carriers. The horizontal guide rails are adjacent to the frame. The linear guide system is disposed below the frame and includes movable tracks and positioning components. The movable tracks are integrated into the frame. The positioning components are mechanically coupled to and connected to the horizontal guide rails. The fixing mechanism is attached to the frame and includes a rotary actuator.

[0141] In some embodiments, the linear guide system further includes a cable chain located below the shelf. In some embodiments, the fixing mechanism includes a quick-clamp device. In some embodiments, the fixing mechanism further includes a positioning element mechanically coupled to the shelf of the shelf. In some embodiments, the positioning assembly further includes a locking indicator mounted on the shelf.

[0142] In some embodiments, the mobile track system includes a transfer module, a mobile rack, a linear track system, and a fixing mechanism. The mobile rack, adjacent to the transfer module, houses the wafer carrier. The linear track system includes tracks and a positioning structure. The tracks are mounted on the bottom shelf of the mobile rack. The positioning structure is coupled to the guide rails of the transfer module. The fixing mechanism is mounted on the mobile rack.

[0143] In some embodiments, the fixing mechanism includes a rotary actuator. In some embodiments, the fixing mechanism is integrated into the bottom shelf of the movable frame.

[0144] In some embodiments, the mobile track system includes a transmission module, a mobile rack, a linear track system, a fixing mechanism, and a cable management system. The mobile rack, adjacent to the transmission module, houses the wafer carrier. Tracks are mounted on the bottom shelf of the mobile rack. Positioning structures are coupled to the guide rails of the transmission module. The fixing mechanism is mounted on the mobile rack. The cable management system includes cable chains mounted alongside the tracks of the linear track system.

[0145] In some embodiments, the mobile track system further includes a positioning sensor assembly integrated within the transmission module, wherein the positioning sensor assembly includes one or more sensors.

[0146] The foregoing summary outlines the features of several embodiments, enabling those skilled in the art to better understand the nature of this disclosure. Those skilled in the art should understand that this disclosure can be readily used as a basis for designing or modifying other processes and structures to achieve the same purpose and / or attain the same advantages of the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of this disclosure, and that various changes, substitutions, and modifications can be made without departing from the spirit and scope of this disclosure.

Claims

1. A mobile track system, characterized in that, include: A single shelf with multiple shelves, accommodating multiple wafer carriers; A horizontal guide rail is located adjacent to the shelf; A linear guide system is arranged below the frame, the linear guide system comprising: A movable track integrated into the frame; and A positioning component, mechanically coupled to the horizontal guide rail and connected to the movable track; and A fixing mechanism is attached to the frame, the fixing mechanism including a rotary actuator.

2. The mobile track system according to claim 1, characterized in that, The linear guidance system also includes a cable drag chain located below the frame.

3. The mobile track system according to claim 1, characterized in that, The fixing mechanism includes a quick clamping device.

4. The mobile track system according to claim 1, characterized in that, The fixing mechanism also includes a positioning element that is mechanically coupled to one layer of the frame.

5. The mobile track system according to claim 1, characterized in that, The positioning component also includes a locking indicator mounted on the rack.

6. A mobile track system, characterized in that, include: One transmission module; A movable rack is located adjacent to the transmission module, wherein the movable rack houses the wafer carrier device; A linear orbital system, comprising: A track is installed on the lowest shelf of this mobile rack; as well as A positioning structure, coupled to a guide rail of the transmission module; and A fixed mechanism is installed on the mobile frame.

7. The mobile track system according to claim 6, characterized in that, The fixed mechanism includes a rotary actuator.

8. The mobile track system according to claim 6, characterized in that, The fixing mechanism is integrated into the bottom shelf of the mobile frame.

9. A mobile track system, characterized in that, include: One transmission module; A movable rack is located adjacent to the transmission module, wherein the movable rack houses the wafer carrier device; A linear orbital system, comprising: A track is installed on the lowest shelf of this mobile rack; as well as A positioning structure is coupled to a guide rail of the transmission module; A fixed mechanism is installed on the movable frame; and A cable management system, which includes a cable drag chain installed beside the track of the linear track system.

10. The mobile track system according to claim 9, characterized in that, Also includes: A positioning sensor assembly is integrated within the transmission module, wherein the positioning sensor assembly includes one or more sensors.

Images