Plastic package integrated power module with composite heat dissipation of cooling water and cooling oil

Abstract

The utility model discloses a plastic package integrated power module with composite heat dissipation of cooling water and cooling oil. The plastic package integrated power module comprises a heat dissipation bottom plate, a heat dissipation base and a chip, the heat dissipation base comprises a body, a cavity, an oil inlet, an oil outlet, a water inlet and a water outlet. And the heat dissipation bottom plate is embedded in the cavity in the heat dissipation base so as to divide the cavity into an upper sub-cavity and a lower sub-cavity. According to the plastic package integrated power module with composite heat dissipation of the cooling water and the cooling oil, the turbulent flow capability of the cooling liquid is improved through the wave-shaped heat dissipation fins, so that the heat dissipation effect is enhanced. And the module is in direct contact with the chip and other electric device modules by virtue of the insulation characteristic of the cooling oil, so that the heat dissipation effect of the module is further improved. The flow directions of liquid in the upper sub-chamber and the lower sub-chamber are opposite, so that the heat dissipation capability of the module can be improved by adopting the mode that the upper inlet and the lower outlet are staggered, the temperature difference between the chips can be greatly reduced, and the temperature uniformity of the module is ensured.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology of IGBTs, and in particular to a plastic-encapsulated integrated power module with composite heat dissipation of cooling water and cooling oil. Background Technology

[0002] A power module is a power electronic device that is combined and encapsulated into a module according to a certain functional combination. With the rapid development of modern technology, the market demand for power modules is increasing day by day. The heat dissipation effect of the power module will affect the use of the module. Therefore, the heat dissipation problem of power modules has become a top priority. For example, Chinese patent CN201721513164.X discloses an IGBT power module and a power module containing the same, which includes multiple IGBT power module sub-modules and two cooling substrates. The multiple IGBT power module sub-modules are arranged at predetermined intervals along the length of the cooling substrates and are encapsulated between the two cooling substrates by a package. The cooling substrates include a first cooling substrate and a second cooling substrate. The first cooling substrate and the second cooling substrate have cooling parts composed of multiple protrusions on their surfaces that do not contact the IGBT power module sub-modules. The first cooling substrate and the second cooling substrate have openings at both ends that are interconnected to form a first water inlet and a second water inlet, respectively. This module reduces the risk of overheating failure and improves the output electrical performance of the power module through uniform contact between the coolant and the pins. However, due to the large distance between the coolant inlet and outlet, the temperature of the coolant rises near the outlet after heat exchange, resulting in a decrease in heat dissipation at that point. This leads to a large temperature difference between the chips, making it impossible to guarantee their temperature uniformity. Utility Model Content

[0003] In view of this, the present invention provides a plastic-encapsulated integrated power module with combined cooling water and cooling oil heat dissipation to solve the above problems.

[0004] A plastic-encapsulated integrated power module with combined cooling water and cooling oil heat dissipation includes a heat dissipation base plate, a heat dissipation base disposed on one side of the heat dissipation base plate, and a plurality of chips soldered onto the heat dissipation base plate. The heat dissipation base plate has a plurality of heat dissipation fins spaced apart on the side away from the chips and corresponding to the chip areas. The heat dissipation base includes a body, a chamber formed within the body, an oil inlet on one side of the body near its end, an oil outlet on the body away from the oil inlet, a water inlet on the body away from the oil outlet, and a water outlet on the body away from the oil inlet. The heat dissipation base plate is embedded in the chamber within the heat dissipation base to divide the chamber into an upper sub-chamber and a lower sub-chamber. The oil inlet and oil outlet are located on opposite sides of the body, and the water inlet and water outlet are also located on opposite sides of the body. The oil inlet and the water outlet are vertically aligned, and the oil outlet and the water inlet are vertically aligned. The liquids in the upper and lower sub-chambers flow in opposite directions.

[0005] Furthermore, the heat dissipation fins are wavy, and the spacing between two adjacent heat dissipation fins follows the flow direction of the coolant.

[0006] Furthermore, the two ends of the upper sub-chamber are respectively connected to the oil inlet and outlet ports, and the chip is located in the upper sub-chamber.

[0007] Furthermore, the two ends of the lower sub-chamber are respectively connected to the inlet and outlet water ports, and the heat dissipation fins are located inside the lower sub-chamber.

[0008] Furthermore, cooling oil is introduced into the oil inlet.

[0009] Furthermore, an aqueous solution of ethylene glycol is introduced into the water inlet.

[0010] Compared with existing technologies, the integrated plastic-encapsulated power module with combined cooling water and cooling oil heat dissipation provided by this utility model enhances the heat dissipation effect by improving the turbulence of the coolant through the wave-shaped heat dissipation fins. Furthermore, relying on the insulating properties of the cooling oil, the module allows it to directly contact the chips and other electrical components, further improving the heat dissipation effect. The liquid flows in opposite directions in the upper and lower sub-chambers; this staggered inlet and outlet arrangement not only improves the module's heat dissipation capacity and reduces the overall junction temperature, but also significantly reduces the temperature difference between the individual chips, ensuring the module's temperature uniformity. Attached Figure Description

[0011] Figure 1A schematic diagram of the integrated plastic-encapsulated power module for combined cooling water and cooling oil heat dissipation provided by this utility model.

[0012] Figure 2 for Figure 1 A schematic diagram of the heat dissipation base plate and chip structure of a plastic-encapsulated integrated power module with combined cooling water and cooling oil heat dissipation.

[0013] Figure 3 for Figure 1 A second-view structural diagram of the heat dissipation base plate of a plastic-encapsulated integrated power module with combined cooling water and cooling oil heat dissipation.

[0014] Figure 4 for Figure 1 A cross-sectional schematic diagram of the heat sink base of a plastic-encapsulated integrated power module that uses a combination of cooling water and cooling oil for heat dissipation. Detailed Implementation

[0015] The specific embodiments of this utility model are described in further detail below. It should be understood that the description of the embodiments of this utility model herein is not intended to limit the scope of protection of this utility model.

[0016] like Figure 1 The diagram shows a structural schematic of the integrated plastic-encapsulated power module with combined cooling water and cooling oil heat dissipation provided by this utility model. The integrated plastic-encapsulated power module with combined cooling water and cooling oil heat dissipation includes a heat dissipation base plate 10, a heat dissipation base 20 surrounding the heat dissipation base plate 10, and a plurality of chips 30 soldered onto the heat dissipation base plate 10. It is conceivable that the integrated plastic-encapsulated power module with combined cooling water and cooling oil heat dissipation also includes other functional modules, such as electrical component modules, power supply modules, etc., which are technologies known to those skilled in the art and will not be described in detail here.

[0017] Please refer to the following: Figures 2 to 4 The heat dissipation base plate 10 has a plurality of heat dissipation fins 11 spaced apart on the side away from the chip 30 and corresponding to the area of ​​the chip 30. The heat dissipation fins 11 are wavy, and the spacing between two adjacent heat dissipation fins 11 follows the flow direction of the coolant to ensure that the coolant is not obstructed. The wavy heat dissipation fins 11 can improve the turbulence of the coolant and enhance the heat dissipation effect.

[0018] The heat dissipation base 20 includes a body 21, a chamber 22 opened in the body 21, an oil inlet 23 opened on one side of the body 21 and near the end of the body 21, an oil outlet 24 opened on the body 21 away from the oil inlet 23, a water inlet 25 opened on the body 21 away from the oil outlet 24, and a water outlet 26 opened on the body 21 away from the oil inlet 23.

[0019] The heat dissipation base plate 10 is fixedly embedded in the chamber 22 within the heat dissipation base 20, thereby dividing the chamber 22 into an upper sub-chamber 221 and a lower sub-chamber 222.

[0020] The upper sub-chamber 221 is connected at both ends to the oil inlet and outlet ports 23 and 24, respectively, and the chip 30 is located inside the upper sub-chamber 221. Cooling oil is introduced into the oil inlet port 23, which directly contacts the chip 30 and other electrical components. The cooled oil, after heat exchange, is then discharged through the oil outlet port 24, thereby enhancing the heat dissipation effect of the module and improving its outflow capacity. It should be noted that the cooling oil used in this invention is synthesized from a mineral oil or vegetable oil, is completely water-free, and is synthesized from pure additives. Therefore, it has insulating properties and is superior in terms of thermal conductivity and thermal balance.

[0021] The lower sub-chamber 222 is connected to the inlet and outlet ports 25 and 26 respectively at both ends, and the heat dissipation fins 11 are located inside the lower sub-chamber 222. An ethylene glycol aqueous solution is introduced into the inlet port 25, flows between several heat dissipation fins 11, and the heat-exchanged ethylene glycol aqueous solution is discharged through the outlet port 26. It should be noted that the ethylene glycol aqueous solution used in this invention is mainly composed of ethylene glycol and soft water. The addition of ethylene glycol can lower the freezing point of the coolant and raise its boiling point, thus giving it excellent high and low temperature adaptability and a large heat capacity, effectively absorbing and transferring heat, thereby improving the heat dissipation capacity of the module.

[0022] The oil inlet 23 and the oil outlet 24 are located on opposite sides of the main body 21, and the water inlet 25 and the water outlet 26 are located on opposite sides of the main body 21. The oil inlet 23 and the water outlet 26 correspond vertically to each other, and the oil outlet 24 and the water inlet 25 correspond vertically to each other. Therefore, the staggered inlet and outlet arrangement causes the liquid in the upper and lower sub-chambers 221 and 222 to flow in opposite directions, and new coolant or cooling oil flows into both ends. This avoids the problem of the coolant or cooling oil temperature rising due to long-distance flow, which would lead to a decrease in cooling efficiency and an excessive temperature difference between the inlet and outlet. This staggered inlet and outlet arrangement not only improves the heat dissipation capacity of the module and reduces the overall junction temperature, but also greatly reduces the temperature difference between the individual chips 30.

[0023] The chip 30 is a combination of semiconductor materials and microcircuits. It uses the characteristics of semiconductors to control electricity, complete data processing and signal transmission, etc. The chip 30 itself is existing technology and will not be described in detail here.

[0024] Several of the chips 30 are soldered at intervals on three sets of DBC substrates by reflow on one side, and then the three sets of DBC substrates are reflow soldered to the side of the heat sink 10 away from the heat sink fins 11 by a second reflow.

[0025] The following describes the manufacturing method of the plastic-encapsulated integrated power module with combined cooling water and cooling oil heat dissipation:

[0026] Several chips 30 are soldered at intervals onto three sets of DBC substrates via a one-sided reflow process. The three sets of DBC substrates are then reflow soldered onto the side of the heat sink 10 away from the heat sink fins 11 via a second reflow process. Simultaneously, signal pins and power terminals, along with other electrical components, are reflow soldered onto the DBC substrates. The heat sink 10 is then placed in a specially designed injection mold and filled with paraffin wax. The paraffin wax covers the flow channels for cooling oil and coolant. The mold is then fixed in place, and liquid epoxy resin is added. After the liquid epoxy resin has solidified, the internal paraffin wax is removed by heating, yielding the final module product.

[0027] Compared with existing technologies, the integrated plastic-encapsulated power module with combined cooling water and cooling oil heat dissipation provided by this utility model enhances the heat dissipation effect by improving the turbulence of the coolant through the wave-shaped heat dissipation fins 11. Furthermore, relying on the insulating properties of the cooling oil, the module allows it to directly contact the chip 30 and other electrical components, further improving the module's heat dissipation performance. The liquids in the upper and lower sub-chambers 221 and 222 flow in opposite directions; this staggered inlet and outlet arrangement not only improves the module's heat dissipation capacity and reduces the overall junction temperature but also significantly reduces the temperature difference between the individual chips 30, ensuring the module's temperature uniformity.

[0028] The above are merely preferred embodiments of the present utility model and are not intended to limit the scope of protection of the present utility model. Any modifications, equivalent substitutions or improvements within the spirit of the present utility model are covered within the scope of the claims of the present utility model.

Claims

1. A plastic-encapsulated integrated power module with combined cooling water and cooling oil heat dissipation, characterized in that: The integrated plastic-encapsulated power module with combined cooling water and cooling oil heat dissipation includes a heat dissipation base plate, a heat dissipation base disposed on one side of the heat dissipation base plate, and a plurality of chips soldered onto the heat dissipation base plate. The heat dissipation base plate has a plurality of heat dissipation fins spaced apart on the side away from the chips and corresponding to the chip area. The heat dissipation base includes a body, a chamber formed within the body, an oil inlet formed on one side of the body near its end, an oil outlet formed on the end of the body away from the oil inlet, and an oil outlet formed on the side of the body away from the oil inlet. The body has an inlet on the side away from the oil outlet and an outlet on the side away from the oil inlet. The heat dissipation base plate is embedded in the chamber within the heat dissipation base to divide the chamber into an upper sub-chamber and a lower sub-chamber. The oil inlet and the oil outlet are located on opposite sides of the body, and the water inlet and the water outlet are located on opposite sides of the body. The oil inlet and the water outlet correspond vertically to each other, and the oil outlet and the water inlet correspond vertically to each other. The liquid flows in opposite directions in the upper and lower sub-chambers.

2. The integrated plastic-encapsulated power module with combined cooling water and cooling oil heat dissipation according to claim 1, characterized in that: The heat dissipation fins are wavy, and the spacing between two adjacent heat dissipation fins follows the flow direction of the coolant.

3. The integrated plastic-encapsulated power module with combined cooling water and cooling oil heat dissipation according to claim 1, characterized in that: The two ends of the upper sub-chamber are respectively connected to the oil inlet and outlet ports, and the chip is located in the upper sub-chamber.

4. The integrated plastic-encapsulated power module with combined cooling water and cooling oil heat dissipation according to claim 1, characterized in that: The two ends of the lower sub-chamber are respectively connected to the inlet and outlet water ports, and the heat dissipation fins are located inside the lower sub-chamber.

5. The integrated plastic-encapsulated power module with combined cooling water and cooling oil heat dissipation according to claim 1, characterized in that: Cooling oil is introduced into the oil inlet.

6. The integrated plastic-encapsulated power module with combined cooling water and cooling oil heat dissipation according to claim 1, characterized in that: An aqueous solution of ethylene glycol is introduced into the inlet.

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