Heat dissipation structure and packaging body

Abstract

The utility model provides a heat dissipation structure and a packaging body, and the heat dissipation structure comprises a cover plate and a substrate. The cover plate is arranged on the base plate, and the cover plate and the base plate jointly define a cavity used for receiving a heat exchange medium; the to-be-cooled device arrangement area on the substrate is used for arranging a to-be-cooled device, and the to-be-cooled device arrangement area is located in the cavity; the cover plate comprises a heat dissipation top plate located above an area where a device to be subjected to heat dissipation is arranged, and heat dissipation side plates surrounding the area where the device to be subjected to heat dissipation is arranged. And one surface, close to the arrangement area of the device to be radiated, of one or more of the radiating top plate and the radiating side plate is a rough surface. According to the embodiment of the invention, the surface, close to the to-be-radiated device, of one or more of the radiating top plate and the radiating side plate is the rough surface, so that the thermal resistance can be reduced, and the heat exchange efficiency is improved. In addition, the cover plate is used for replacing a warping control ring, warping control over the substrate is better achieved, and the warping control effect is improved.

Description

Technical Field

[0001] This application relates to the field of chip packaging, and more specifically, to a heat dissipation structure and a package. Background Technology

[0002] With the rapid development of electronic information technology, semiconductor devices (such as CPUs, GPUs, AI chips, and power devices) are evolving towards higher integration, higher operating frequencies, and greater power densities. This trend has led to a sharp increase in heat flux density per unit area, making device-level thermal management increasingly challenging and a key bottleneck restricting system performance, reliability, and lifespan. However, current methods for heat dissipation efficiency and structural deformation (warpage) control at the device level are generally ineffective, facing multiple challenges.

[0003] In terms of heat dissipation, traditional solutions such as air cooling and heat pipes / vapor chambers are gradually approaching their physical limits in high heat flux density scenarios, making it difficult to quickly and evenly conduct the huge amount of heat generated inside the chip to the external heat sink.

[0004] More challenging is the fact that drastic temperature changes and thermal stress can cause severe warping between the chip, packaging substrate, thermal interface material, and heat sink due to mismatches in their coefficients of thermal expansion. This warping occurs dynamically during device operation, degrading the thermal interface (e.g., causing uneven TIM layer thickness, voids, or even separation), further increasing thermal resistance and creating a vicious cycle of reduced heat dissipation efficiency. On the other hand, excessive mechanical stress can directly damage fragile silicon chips, solder joints, or the underlying filler, significantly reducing product reliability and lifespan. Utility Model Content

[0005] In view of this, the purpose of the embodiments of this application is to provide a heat dissipation structure and package that can improve heat exchange efficiency while improving warpage control effect.

[0006] In a first aspect, embodiments of this application provide a heat dissipation structure, including: a cover plate and a substrate; the cover plate is disposed on the substrate, and the cover plate and the substrate together enclose a chamber for receiving a heat exchange medium; a device to be cooled is disposed in a region on the substrate for disposing of a device to be cooled, and the device to be cooled is disposed in the chamber; wherein, the cover plate includes a heat dissipation top plate located above the device to be cooled and a heat dissipation side plate surrounding the device to be cooled; one or more of the heat dissipation top plate and the heat dissipation side plate have a rough surface on the side closest to the device to be cooled.

[0007] In the above implementation process, by setting a cover plate on the substrate, and the cover plate and the substrate together enclosing a chamber for receiving the heat exchange medium, the heat exchange medium can be directly filled into the chamber, allowing the heat exchange device placed in the chamber to directly contact the heat exchange medium, thereby improving heat dissipation efficiency and effect. Furthermore, one or more of the heat dissipation top plate and heat dissipation side plate are roughened on the side closest to the heat exchange device. The protrusions and depressions on the rough surface disrupt the continuity of the boundary layer. When the heat exchange medium flows over the rough surface, the boundary layer is torn and reformed at the protrusions, reducing the boundary layer thickness and thermal resistance, thereby further improving heat exchange efficiency. In addition, since the cover plate surrounds the heat exchange device on the substrate, it effectively forms a warpage suppression ring around the heat exchange device, suppressing substrate deformation and reducing the magnitude of warpage deformation after temperature changes. Moreover, because the structure formed by the cover plate is larger than a conventional warpage control ring, it allows for better warpage control, resulting in a better warpage control effect.

[0008] In one embodiment, the device further includes a porous medium heat exchange element; the porous medium heat exchange element is disposed on the side of the device to be cooled away from the substrate and is fixedly connected to the side of the device to be cooled away from the substrate.

[0009] In the above implementation process, by setting a porous medium heat exchange element on the side of the device to be cooled away from the substrate, the contact area between the heat exchange medium and the porous medium heat exchange element is greatly increased due to the large specific surface area of ​​the porous medium. The heat exchange medium can exchange heat with more solid surfaces, thereby further improving the heat exchange efficiency between the heat exchange medium and the device to be cooled.

[0010] In one embodiment, the porous medium heat exchange element is spaced apart from the heat dissipation top plate; and the porous medium heat exchange element is spaced apart from the heat dissipation side plate.

[0011] In the above implementation process, by setting intervals between the porous medium heat exchange element and the heat dissipation top plate, and between the porous medium heat exchange element and the heat dissipation side plate, it is possible to accommodate the heat exchange medium and its boiling space, providing heat exchange space for the heat exchange medium and helping to improve heat exchange efficiency. On the other hand, because the porous medium heat exchange element is spaced apart from the heat dissipation top plate, and also spaced apart from the heat dissipation side plate, the cover plate composed of the heat dissipation top plate and the heat dissipation side plate can also have a larger size, thereby increasing the strength of the cover plate and improving the warpage control effect of the cover plate.

[0012] In one embodiment, the cover plate has an inlet and an outlet that communicate with the chamber; wherein the inlet is configured to receive the heat exchange medium, and the outlet is configured to discharge the heat exchange medium; the heat exchange medium is used for heat exchange within the chamber.

[0013] In the above implementation process, by opening the inlet and outlet of the liquid inlet on the cover plate to connect the chamber, the heat exchange medium in the chamber can circulate with the heat exchange medium outside, thereby cooling the heat exchange medium after heat exchange in a timely manner, so that the heat exchange medium flowing into the chamber is always at a low temperature, thereby improving the heat dissipation efficiency and effect of the heat exchange medium.

[0014] In one embodiment, the device further includes: a first connector and a second connector; a first end of the first connector is sealed to the inlet, and a second end of the first connector is connected to one side of an external heat exchange medium container; a first end of the second connector is sealed to the outlet, and a second end of the second connector is connected to the other side of the external heat exchange medium container; wherein the first connector is configured to receive the heat exchange medium, and the second connector is configured to discharge the heat exchange medium.

[0015] In the above implementation process, a first connector and a second connector are provided, with the first connector sealingly connected to the liquid inlet and the second connector connected to the liquid outlet. On one hand, because the first and second connectors are easy to plug and unplug and install flexibly, connecting the liquid inlet and outlet respectively via these connectors allows for flexible connection between the interior and exterior of the chamber, reducing the processing difficulty of the heat dissipation structure. On the other hand, since both the first and second connectors are equipped with corresponding sealing structures, connecting the liquid inlet and outlet respectively via these connectors ensures good sealing performance of the inlet and outlet, preventing the heat exchange medium inside the chamber from leaking outside and improving the safety of the heat dissipation structure.

[0016] In one embodiment, the heat dissipation side plate is positioned at a distance from the outer edge of the substrate.

[0017] In the above implementation process, by setting a distance between the heat dissipation side plate and the outer edge of the substrate, it is possible to avoid the heat dissipation side plate affecting the original components on the substrate when it is placed on the substrate, thereby improving the structural safety of the substrate.

[0018] In one embodiment, the end face of the heat dissipation side plate near the substrate is sealed to the substrate.

[0019] In the above implementation process, by setting the end face of the heat dissipation side plate close to the substrate and sealing it with the substrate, gaps between the heat dissipation side plate and the substrate can be avoided, which would cause the heat exchange medium in the cavity to leak to the outside of the cavity, thereby improving the sealing performance of the heat dissipation structure and thus improving the safety of the heat dissipation structure.

[0020] Secondly, embodiments of this application also provide a package, including: a device to be cooled and a heat dissipation structure as described in the first aspect or any one of the first aspects; the device to be cooled is disposed on a substrate of the heat dissipation structure, and the device to be cooled is located in a cavity formed by the cover plate of the heat dissipation structure and the substrate; wherein, the cavity is filled with a heat exchange medium, and the heat exchange medium is used to exchange heat with the device to be cooled.

[0021] In the above implementation process, by setting a substrate and a cover plate to form a cavity, and accommodating the device to be cooled and the heat exchange medium within the cavity, direct contact between the heat exchange medium and the device to be cooled can be achieved without the need for additional thermal interface materials. This effectively avoids the heat dissipation deterioration problem caused by the performance loss of the thermal interface material due to warping during the use of the package, thereby improving the heat dissipation efficiency and effect of the package. Furthermore, by setting one or more of the heat dissipation top plate and heat dissipation side plate with a rough surface on the side closest to the device to be cooled, the protrusions and depressions on the rough surface disrupt the continuity of the boundary layer. When the heat exchange medium flows over the rough surface, the boundary layer is torn and reformed at the protrusions, reducing the boundary layer thickness and thermal resistance, thereby further improving the heat transfer efficiency.

[0022] In one embodiment, the heat exchange medium is a liquid insulating medium; the liquid insulating medium is in direct contact with the device to be cooled.

[0023] In the above implementation process, because the liquid insulating medium has functions such as electrical insulation and heat dissipation, it can directly contact the device to be cooled without corroding the surface of the device, cover plate, and substrate, and without causing short circuits or other faults. This greatly improves the safety of the package and extends its service life. Furthermore, if the heat exchange medium is a liquid insulating medium, there is no need to perform anti-corrosion treatment on the surfaces of the substrate and the device to be cooled, the surface of the device to be cooled, and the surface of the cover plate near the device to be cooled. This simplifies the packaging process and improves the packaging efficiency.

[0024] In one embodiment, the liquid insulating medium is a fluorinated liquid.

[0025] Because fluorinated liquids have excellent insulating properties, using fluorinated liquids as the liquid insulating medium ensures that when the liquid insulating medium exchanges heat with the device to be cooled, it will not corrode the surfaces of the substrate and the device to be cooled, the surface of the device to be cooled, or the surface of the cover plate near the device to be cooled, and will not cause short circuits or other faults, thus improving the safety of the package and extending its service life.

[0026] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A schematic diagram of the heat dissipation structure provided in the embodiments of this application;

[0029] Figure 2 A schematic diagram of a heat dissipation structure with porous medium heat exchange elements provided in an embodiment of this application;

[0030] Figure 3 A schematic diagram showing the boiling of the heat exchange medium on the surface of a porous medium heat exchange element, as provided in the embodiments of this application;

[0031] Figure 4 A schematic diagram of a heat dissipation structure including a first connector and a second connector provided for an embodiment of this application;

[0032] Figure 5 This is a top view of the package provided in an embodiment of this application.

[0033] Figure description: 100-cover plate, 110-heat dissipation top plate, 120-heat dissipation side plate, 200-substrate, 300-porous medium heat exchange element, 400-liquid inlet, 500-liquid outlet, 610-first connector, 620-second connector, 20-device to be cooled. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0036] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0037] In the description of this application, it should be noted that the terms "upper", "lower", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product is usually placed when in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations of this application.

[0038] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set," "install," and "connect" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0039] With the accelerated global digitalization process and the rapid development and deep application of cutting-edge technologies such as the Internet of Things (IoT) and artificial intelligence (AI), the demand for real-time transmission and processing of massive amounts of data has surged dramatically, posing unprecedented challenges to chip packaging technology. High-performance computing chips utilize advanced packaging methods such as 2.5D / 3D to meet their characteristics of high integration, high performance, and versatility across multiple application scenarios. The high power density corresponding to high performance brings a series of heat dissipation challenges, making heat dissipation a crucial factor limiting chip design and performance. Simultaneously, high integration leads to increasingly larger chip package sizes, and the resulting warpage and stress issues significantly impact chip reliability and lifespan.

[0040] For high-power chips, the current mainstream heat dissipation methods are system-level air cooling and liquid cooling. System-level air cooling primarily uses advanced thermal interface materials such as liquid metal, phase change thermal conductive sheets, and graphite heat sinks, as well as vapor chambers and heat pipes, to transfer heat from the chip to the heatsink, and then uses high-volume fans to ensure adequate cooling. System-level liquid cooling mainly addresses the chip's thermal issues through methods such as cold plate liquid cooling, immersion liquid cooling, and spray liquid cooling.

[0041] Liquid cooling, as a highly efficient heat dissipation technology, mainly utilizes the high specific heat and high latent heat characteristics of liquid working fluid to replace air as the heat transfer medium, and features low power consumption, high heat dissipation, and low noise.

[0042] Through long-term research, the inventors of this application have discovered that factors such as the flow characteristics of the coolant in a liquid cooling system and its contact method with the device surface affect the heat dissipation effect. If the coolant flow is uneven or its contact with the device surface is insufficient, it will lead to poor localized heat dissipation, forming hot spots, accelerating device aging and damage, and resulting in poor heat dissipation. Furthermore, an unreasonable heat dissipation method may cause uneven temperature distribution within the device, further exacerbating warping problems, and consequently affecting the product's reliability and lifespan.

[0043] In view of this, the heat dissipation structure proposed in this application embodiment involves setting a cover plate on the substrate, with the cover plate and the substrate together enclosing a chamber for receiving the heat exchange medium. The heat exchange medium can be directly filled into this chamber, allowing the device to be cooled within the chamber to directly contact the heat exchange medium, thus improving heat dissipation efficiency and effect. Furthermore, one or more of the heat dissipation top plate and heat dissipation side plate have a rough surface near the device to be cooled. The protrusions and depressions on the rough surface disrupt the continuity of the boundary layer. When the heat exchange medium flows over the rough surface, the boundary layer is torn and reformed at the protrusions, reducing the boundary layer thickness and thermal resistance, thereby further improving heat exchange efficiency. Additionally, since the cover plate surrounds the device to be cooled on the substrate, it effectively forms a warpage suppression ring around the device, suppressing substrate deformation and reducing the magnitude of warpage deformation after temperature changes. Moreover, the structure formed by the cover plate is larger than a conventional warpage control ring, allowing for better warpage control and a more effective warpage control effect.

[0044] like Figure 1 The diagram shown is a schematic of a heat dissipation structure provided in an embodiment of this application, including: a cover plate 100 and a substrate 200.

[0045] The cover plate 100 is disposed on the substrate 200, and the cover plate 100 and the substrate 200 together enclose a chamber for receiving heat exchange medium.

[0046] The heat exchange medium here can be a liquid medium.

[0047] The substrate 200 has a heat dissipation device 20 setting area, which is used to set the heat dissipation device 20, and the heat dissipation device 20 setting area is located in the cavity.

[0048] Understandably, the chamber can be used to contain the heat exchange medium, and the heat dissipation device 20 is also disposed in the chamber. The heat dissipation device 20 is exposed in the chamber, and the heat exchange medium is in direct contact with the heat dissipation device 20, so that the heat exchange medium can directly exchange heat with the heat dissipation device 20 to dissipate heat from the heat dissipation device 20.

[0049] The cover plate 100 here is mainly used to be set above the area where the heat dissipation device 20 is set, so as to physically encapsulate the heat dissipation device 20 set on the area where the heat dissipation device 20 is set, thereby providing physical protection for the heat dissipation device 20 and preventing the heat dissipation device 20 from being damaged.

[0050] The shape of the cover plate 100 can be adapted to the structure of the heat dissipation device 20 that needs to be encapsulated. For example, it can be a cuboid, a cube, or a cylinder. The shape of the cover plate 100 can be set according to the actual situation.

[0051] Optionally, the cover plate 100 can be made of copper, aluminum alloy, copper alloy, aluminum, etc., and the material of the cover plate 100 can be selected according to the actual situation.

[0052] In this embodiment, the heat dissipation device 20 can refer to the overall structure of the packaged chip, or it can refer to multiple independent chip cores (die, i.e., a single chip unit after the original wafer of the chip is cut) integrated within a single chip package. Of course, it can also refer to the overall structure of the electronic components containing the chip. The heat dissipation device 20 can be set according to the actual situation.

[0053] The heat dissipation structure may vary depending on the different heat dissipation devices 20. The following examples illustrate the specific application scenarios of the heat dissipation structures for different heat dissipation devices 20:

[0054] Structure 1: If the heat dissipation device 20 is a packaged chip structure, the substrate 200 can be a ceramic substrate 200, a printed circuit board substrate 200, etc. The heat dissipation structure is as follows: the substrate 200 has a chip mounting area, the cover plate 100 is disposed on the substrate 200, and the cover plate 100 and the substrate 200 together enclose a chamber for receiving the heat exchange medium.

[0055] The working principle of this heat dissipation structure is as follows: the chip is placed in the chip placement area on the substrate 200, and the cover plate 100 and the substrate 200 together enclose a cavity for receiving the heat exchange medium, which is filled with the heat exchange medium. The heat exchange medium directly contacts the chip, exchanges heat with the chip, and dissipates heat from the chip.

[0056] Structure 2: If the device to be cooled 20 is a chip core, then the substrate 200 can be a ceramic substrate 200, a silicon substrate 200, an organic substrate 200, a lead frame, etc. Specifically, the heat dissipation structure is as follows: the substrate 200 has a chip core area where the chip core is located; a cover plate 100 is disposed on the substrate 200, and the cover plate 100 and the substrate 200 together enclose a chamber for receiving the heat exchange medium.

[0057] The working principle of this heat dissipation structure is as follows: the chip core is located in the chip core area on the substrate 200, and the cover plate 100 and the substrate 200 together enclose a chamber for receiving the heat exchange medium, which is filled with the heat exchange medium. The heat exchange medium directly contacts the chip core and exchanges heat with the chip core to dissipate heat from the chip core.

[0058] Structure 3: If the heat dissipation device 20 is an integral electronic component structure, the substrate 200 can be a ceramic substrate 200, a metal substrate 200, an organic polymer substrate 200, etc. Specifically, the heat dissipation structure is as follows: the substrate 200 has an electronic component mounting area, a cover plate 100 is mounted on the substrate 200, and the cover plate 100 and the substrate 200 together enclose a chamber for receiving the heat exchange medium.

[0059] The working principle of this heat dissipation structure is as follows: electronic components are placed in the electronic component placement area on the substrate 200. The cover plate 100 and the substrate 200 together enclose a chamber for receiving the heat exchange medium, which is filled with the heat exchange medium. The heat exchange medium comes into direct contact with the electronic components, exchanging heat with them to dissipate heat from the electronic components.

[0060] The application scenarios of the heat dissipation structure described above are merely illustrative, and the application scenarios of the heat dissipation structure can be selected according to the actual situation.

[0061] In one embodiment, the cover plate 100 includes a heat dissipation top plate 110 located above the area where the heat dissipation device 20 is located, and a heat dissipation side plate 120 surrounding the area where the heat dissipation device 20 is located; one or more of the heat dissipation top plate 110 and the heat dissipation side plate 120 have a rough surface on the side closest to the area where the heat dissipation device 20 is located.

[0062] The specific structure of the cover plate 100 may include the following:

[0063] Method 1: The side of the heat dissipation top plate 110 closest to the area where the heat dissipation device 20 is located is rough, while the side of the heat dissipation side plate 120 closest to the area where the heat dissipation device 20 is located is smooth.

[0064] Method 2: The side of the heat dissipation top plate 110 closest to the area where the heat dissipation device 20 is located is a smooth surface, and the side of the heat dissipation side plate 120 closest to the area where the heat dissipation device 20 is located is a rough surface.

[0065] Method 3: The two heat dissipation side plates 120 arranged opposite each other have rough surfaces on the side closest to the heat dissipation device 20, while the other two heat dissipation side plates 120 arranged opposite each other have smooth surfaces on the side closest to the heat dissipation device 20 and the heat dissipation top plate 110 have smooth surfaces on the side closest to the heat dissipation device 20.

[0066] Method 4: The side of any heat dissipation side plate 120 closest to the area where the heat dissipation device 20 is located is rough, while the sides of other heat dissipation side plates 120 closest to the area where the heat dissipation device 20 is located and the side of the heat dissipation top plate 110 closest to the area where the heat dissipation device 20 is located are smooth.

[0067] Method 5: The side of any heat dissipation side plate 120 that is close to the area where the heat dissipation device 20 is located is a smooth surface, while the sides of other heat dissipation side plates 120 that are close to the area where the heat dissipation device 20 is located and the side of the heat dissipation top plate 110 that is close to the area where the heat dissipation device 20 is located are rough surfaces.

[0068] Method 6: All heat dissipation side plates 120 and the side of the heat dissipation top plate 110 that are close to the area where the heat dissipation device 20 is located are rough surfaces.

[0069] The above-described cover plate 100 structure is merely exemplary, and the specific configuration of the cover plate 100 structure can be selected according to the actual situation.

[0070] The rough surface here can refer to an uneven surface or a surface that is configured as a porous medium. The form in which the rough surface exists can be selected according to the actual situation.

[0071] It should be understood that when a fluid flows over a solid surface, its velocity gradually decreases near the surface due to viscosity, reaching zero where it is directly against the surface, forming a thin layer with a large velocity gradient—the boundary layer. The presence of this boundary layer hinders heat transfer from the solid surface to the fluid because heat must be conducted within the boundary layer, where thermal resistance is relatively high, thus reducing heat exchange efficiency.

[0072] The protrusions and depressions on a rough surface disrupt the continuity of the boundary layer. When fluid flows over a rough surface, the boundary layer is torn and reformed at the protrusions, reducing the boundary layer thickness, lowering thermal resistance, and thus improving heat transfer efficiency.

[0073] In this embodiment of the application, by making one or more of the heat dissipation top plate 110 and heat dissipation side plate 120 rough on the side of the device to be dissipated 20, the heat exchange efficiency of the heat exchange medium can be improved, thereby improving the heat dissipation efficiency.

[0074] Optionally, the heat dissipation top plate 110 and the heat dissipation side plate 120 can be an integral structure or a separate structure, and the structure of the heat dissipation top plate 110 and the heat dissipation side plate 120 can be adjusted according to the actual situation.

[0075] When the heat dissipation top plate 110 and the heat dissipation side plate 120 are separate structures, the heat dissipation top plate 110 and the heat dissipation side plate 120 are fixedly connected, and the heat dissipation top plate 110 and the heat dissipation side plate 120 are sealed together. For example, bonding, welding, etc., the connection method of the heat dissipation top plate 110 and the heat dissipation side plate 120 can be selected according to the actual situation.

[0076] The cover plate 100 is fixedly connected to the substrate 200. For example, by bonding or welding, the connection method between the cover plate 100 and the substrate 200 can be selected according to the actual situation.

[0077] When connecting the cover plate 100 and the substrate 200 by adhesive bonding, a sealant layer can be applied to the surfaces of the cover plate 100 and the substrate 200 that are in contact with each other, and filled in the surfaces of the cover plate 100 and the substrate 200 that are in contact with each other, so as to achieve a sealed connection between the substrate 200 and the cover plate 100.

[0078] Optional. The sealant layer can be made of silicone, UV adhesive, epoxy adhesive, polyurethane adhesive, anaerobic adhesive, acrylic adhesive, organic ceramic coating, or polyurea, etc., and the material of the sealant layer can be selected according to the actual situation.

[0079] When connecting the cover plate 100 and the substrate 200 by welding, the molten welding material can be filled into the surfaces of the cover plate 100 and the substrate 200 that are in contact with each other to achieve a sealed connection between the substrate 200 and the cover plate 100.

[0080] It should be understood that existing chips are developing towards multi-node and multi-chip directions. Therefore, system-in-package (SIP) processes involve various heterogeneous materials with different physicochemical properties. Under external pressure and temperature changes, each material will deform according to its own characteristics, such as shrinking or expanding. However, due to the different deformation characteristics of each material, mutual compression and pulling can occur, leading to a series of stress and warping problems. When the coefficients of thermal expansion of two materials are large, the degree of deformation between them will also differ significantly. This can cause one material (e.g., substrate 200) to concave downwards to form a smiley face shape or convex upwards to form a sad face shape under the influence of temperature.

[0081] Excessive warping of the substrate 200 can lead to a series of serious consequences, including solder ball connection failure, fatigue cracking of the adapter board bumps, structural damage to the substrate 200, and even wafer silicon breakage, which directly affect the electrical performance and lifespan of the chip.

[0082] To reduce warping, a warping suppression ring can be provided on the substrate 200. The warping suppression ring is usually made of high-rigidity materials such as copper or stainless steel, and is fixed to the edge area of ​​the substrate 200. It limits the deformation of the edge of the substrate 200 by its own rigidity, thereby reducing the overall warping amplitude.

[0083] In this embodiment, by providing a cover plate 100 on the substrate 200, and the heat dissipation side plate 120 of the cover plate 100 surrounding the device 20 to be heatd (e.g., the chip core), it is equivalent to forming a warping suppression ring around the chip core, so as to suppress the deformation of the substrate 200 to a certain extent, thereby reducing the amplitude of warping deformation of the substrate 200 after temperature change.

[0084] Furthermore, since the cover plate 100 not only includes a heat dissipation side plate 120 surrounding the heat dissipation device, but also a heat dissipation top plate 110, the cover plate 100 composed of the heat dissipation side plate 120 and the heat dissipation top plate 110 has higher strength than a conventional warp control ring. Consequently, the warp control of this cover plate 100 is more pronounced and more effective.

[0085] In the above implementation process, by providing a cover plate 100 on the substrate 200, and the cover plate 100 and the substrate 200 together enclosing a chamber for receiving the heat exchange medium, the heat exchange medium can be directly filled into the chamber, allowing the heat-dissipating device 20 disposed in the chamber to directly contact the heat exchange medium, thereby improving heat dissipation efficiency and effect. Furthermore, based on this, one or more of the heat dissipation top plate 110 and heat dissipation side plate 120 are roughened on the side closest to the heat-dissipating device 20. The protrusions and depressions on the rough surface disrupt the continuity of the boundary layer. When the heat exchange medium flows over the rough surface, the boundary layer is torn and reformed at the protrusions on the rough surface, reducing the thickness of the boundary layer and lowering the thermal resistance, thereby further improving the heat exchange efficiency. In addition, since the cover plate 100 is disposed around the heat-dissipating device 20 on the substrate 200, it is equivalent to forming a warpage suppression ring around the heat-dissipating device 20, which suppresses the deformation of the substrate 200 to a certain extent, thereby reducing the amplitude of warpage deformation of the substrate 200 after temperature changes. Furthermore, since the structure formed by the cover plate 100 is larger than that of a conventional warp control ring, it can better control warp and achieve a better warp control effect.

[0086] In one possible implementation, such as Figure 2 As shown, the heat dissipation structure also includes a porous medium heat exchange element 300.

[0087] The porous medium heat exchange element 300 is disposed on the side of the heat-dissipating device 20 away from the substrate 200 and is fixedly connected to the side of the heat-dissipating device 20 away from the substrate 200.

[0088] The porous medium heat exchange element 300 described here is a device or component that utilizes a solid material with a large number of interconnected pores to achieve efficient heat exchange. This porous medium heat exchange element 300 is composed of a porous material, its interior filled with a complex, tortuous, interconnected network of channels or pores. Fluids (liquids or gases) can flow through these channels and exchange heat with the solid framework that constitutes the pore network.

[0089] Because porous media have a very large specific surface area (surface area per unit volume), the contact area between the fluid and the solid material is significantly increased. Compared with traditional smooth channels, the fluid in a porous medium can exchange heat with more solid surfaces, thereby significantly improving heat exchange efficiency. Therefore, by providing a porous medium heat exchange element 300 on one side of the principle substrate 200 of the heat dissipation device 20, the heat exchange efficiency of the heat exchange medium in the cavity can be further improved.

[0090] Optionally, the porous medium heat exchange element 300 is fixedly connected to the device 20 to be cooled, such as by bonding or welding.

[0091] In one embodiment, the heat dissipation device 20 is a chip core, and the porous dielectric heat exchange element 300 is disposed on the upper surface of the silicon wafer of the chip core.

[0092] It should be understood that by adding a porous medium heat exchange element 300 (whose structure consists of an upper porous medium and a lower metal plate) to the upper surface of the silicon wafer, the microstructure of the porous medium provides favorable conditions for the generation of heat exchange medium bubbles, increasing the number of vaporization nuclei (e.g., ...). Figure 3 As shown in the figure, this makes it easier for boiling to occur inside the chip package, thereby increasing the boiling heat transfer coefficient and greatly improving the heat exchange efficiency of the heat exchange medium.

[0093] Optionally, the porous medium heat exchange element 300 can be a structure such as sintered wire mesh or sintered capillary core, and the structure of the porous medium heat exchange element 300 can be selected according to the actual situation.

[0094] In the above implementation process, by providing a porous medium heat exchange element 300 on the side of the heat exchange device 20 away from the substrate 200, the contact area between the heat exchange medium and the porous medium heat exchange element 300 is greatly increased due to the large specific surface area of ​​the porous medium. The heat exchange medium can exchange heat with more solid surfaces, thereby further improving the heat exchange efficiency between the heat exchange medium and the heat exchange device 20.

[0095] In one possible implementation, the porous medium heat exchange element 300 is spaced apart from the heat dissipation top plate 110; and the porous medium heat exchange element 300 is spaced apart from the heat dissipation side plate 120.

[0096] The space between the porous medium heat exchange element 300 and the heat dissipation top plate 110, as well as the space between the medium heat exchange element and the heat dissipation side plate 120, are all part of the chamber. The space between the porous medium heat exchange element 300 and the heat dissipation top plate 110, as well as the space between the medium heat exchange element and the heat dissipation side plate 120, are all configured to accommodate the heat exchange medium.

[0097] The spacing between the porous medium heat exchange element 300 and the heat dissipation top plate 110 is configured to accommodate the heat exchange medium, the boiling space, and the porous medium heat exchange element 300. The spacing between the porous medium heat exchange element 300 and the heat dissipation side plate 120 is also configured to accommodate the heat exchange medium, the boiling space, and the porous medium heat exchange element 300.

[0098] Understandably, since the porous medium heat exchange element 300 is spaced apart from the heat dissipation top plate 110, and the porous medium heat exchange element 300 is also spaced apart from the heat dissipation side plate 120, the heat dissipation top plate 110 and the heat dissipation side plate 120 of the cover plate 100 are both of a large size. Consequently, the cover plate 100 composed of the heat dissipation top plate 110 and the heat dissipation side plate 120 is also of a large size, thereby increasing the strength of the cover plate 100 and improving the warping control effect of the cover plate 100.

[0099] In the above implementation process, by setting a gap between the porous medium heat exchange element 300 and the heat dissipation top plate 110, and a gap between the porous medium heat exchange element 300 and the heat dissipation side plate 120, on the one hand, the heat exchange medium and the boiling space of the heat exchange medium can be accommodated, providing heat exchange space for the heat exchange medium and helping to improve heat exchange efficiency. On the other hand, since the porous medium heat exchange element 300 is spaced apart from the heat dissipation top plate 110 and the heat dissipation side plate 120, the cover plate 100 composed of the heat dissipation top plate 110 and the heat dissipation side plate 120 can also have a larger size, thereby increasing the strength of the cover plate 100 and improving the warpage control effect of the cover plate 100.

[0100] In one possible implementation, the cover plate 100 has an inlet 400 and an outlet 500 that communicate with the chamber.

[0101] The inlet 400 is configured to receive the heat exchange medium, and the outlet 500 is configured to discharge the heat exchange medium; the heat exchange medium is used for heat exchange within the chamber.

[0102] Optionally, the liquid inlet 400 and the liquid outlet 500 can both be located on the heat dissipation cover plate 100, both on the heat dissipation side plate 120, or partially on the heat dissipation cover plate 100 and partially on the heat dissipation side plate 120. The specific locations of the liquid inlet 400 and the liquid outlet 500 can be selected according to the actual situation.

[0103] For example, such as Figure 2 As shown, the liquid inlet 400 and the liquid outlet 500 can both be provided on the heat dissipation cover plate 100, and the liquid inlet 400 and the liquid outlet 500 are located on opposite sides of the heat dissipation cover plate 100.

[0104] Understandably, the inlet 400 and outlet 500 are connected to an external heat exchange medium container. When the device to be cooled 20 is being cooled, the heat exchange medium in the external heat exchange medium container enters the chamber through the inlet 400 and exchanges heat with the device to be cooled 20 in the chamber. After the heat exchange, the heat exchange medium flows out of the chamber through the outlet 500 and enters the external heat exchange medium container.

[0105] The external heat exchange medium container can be used for heat exchange, thereby cooling the heat exchange medium. The cooled heat exchange medium continues to enter the chamber through the liquid inlet 400 and continues to exchange heat with the heat dissipation device 20 in the chamber. The above steps are repeated until the temperature of the heat dissipation device 20 reaches the set temperature range.

[0106] A connecting pipe is provided at the liquid inlet 400 and the liquid outlet 500, and the connecting pipe is sealed to the liquid inlet 400 and the liquid outlet 500.

[0107] Optionally, the connection between the connecting pipe and the inlet 400 and outlet 500 can be sealed with a sealing layer or a sealing ring, etc. The sealing method between the connecting pipe and the inlet 400 and outlet 500 can be selected according to the actual situation.

[0108] In the above implementation process, by opening the inlet 400 and outlet 500 on the cover plate 100 to connect the chamber, the heat exchange medium in the chamber can circulate with the heat exchange medium outside, thereby cooling the heat exchange medium after heat exchange in a timely manner, so that the heat exchange medium flowing into the chamber is always at a low temperature, thereby improving the heat dissipation efficiency and effect of the heat exchange medium.

[0109] In one possible implementation, such as Figure 4 As shown, the heat dissipation structure also includes a first connector 610 and a second connector 620.

[0110] The first end of the first connector 610 is sealed to the liquid inlet 400, and the second end of the first connector 610 is connected to one side of the external heat exchange medium container; the first end of the second connector 620 is sealed to the liquid outlet 500, and the second end of the second connector 620 is connected to the other side of the external heat exchange medium container.

[0111] The first connector 610 is configured to receive the heat exchange medium, and the second connector 620 is configured to discharge the heat exchange medium.

[0112] Optionally, the first connector 610 and the second connector 620 may have the same structure or different structures, and the specific structure of the first connector 610 and the second connector 620 may be selected according to the actual situation.

[0113] In one embodiment, the first connector 610 may be a ball-locking through-hole liquid-cooled connector, a blind-mating liquid-cooled connector, etc. The second connector 620 may be a ball-locking through-hole liquid-cooled connector, a blind-mating liquid-cooled connector, etc.

[0114] Among them, the ball-locking through-hole liquid-cooled connector is a highly reliable and fast connection device that can be applied to scenarios requiring efficient heat dissipation (such as servers, high-power electronic devices, electric vehicle battery packs, energy storage systems, chip packaging, etc.). Its core feature is that it uses a ball-locking mechanism to achieve "through-hole" fast connection and disconnection, while ensuring the sealing of the heat exchange medium under high pressure.

[0115] The ball-locking liquid-cooled connector features multiple precision stainless steel balls embedded inside the plug. A spring preload maintains radial movement, and the socket's outer wall has an annular locking groove. The connector operates as follows: when the plug is inserted into the liquid inlet (400°) or outlet (500°), the steel balls are compressed inwards, the spring is compressed, and once the plug is in place, the steel balls align with the socket groove. The spring releases pressure, pushing the steel balls into the groove, creating a mechanical interlock. To remove the connector, press the unlocking sleeve on the plug housing to disengage the steel balls from the groove, allowing the plug to be pulled out.

[0116] Blind-fit liquid cooling connectors are quick-connect devices designed for high-density, easy-to-maintain liquid cooling systems. Their core feature is that they enable quick insertion and removal of cooling pipes and reliable sealing without the need for precise alignment or visual assistance.

[0117] Blind-mating liquid-cooled connectors are designed to achieve coaxial connection by sliding or pushing in two compatible connectors, typically without the need for tools. During mating, a fast and accurate connection is achieved through the cooperation of external structures and positioning guidance mechanisms.

[0118] For example, this blind-mating liquid-cooled connector can achieve automatic alignment through guiding structures (such as convex and concave guide posts, bevel designs), eliminating the need for visual aiming during mating and reducing operational difficulty. Alternatively, it can employ steel balls, snap-fit ​​mechanisms, or threaded structures to automatically lock after mating, preventing accidental disengagement. Furthermore, integrating O-rings, gaskets, or elastic sealing materials ensures no leakage of the heat exchange medium.

[0119] The structure and working principle of the ball-locking straight-insertion liquid-cooled connector and the blind-insertion liquid-cooled connector described above are merely exemplary. The first connector 610 and the second connector 620 can also be connectors with other structures. The specific structure of the first connector 610 and the second connector 620 can be adjusted according to the actual situation.

[0120] In the above implementation process, a first connector 610 and a second connector 620 are provided, with the first connector 610 sealed to the inlet 400 and the second connector 620 connected to the outlet 500. On one hand, because the first connector 610 and the second connector 620 are easy to plug and unplug and are flexible to install, connecting the inlet 400 and the outlet 500 respectively via the first connector 610 and the second connector 620 allows for flexible connection between the interior and exterior of the chamber, reducing the processing difficulty of the heat dissipation structure. On the other hand, since both the first connector 610 and the second connector 620 are provided with corresponding sealing structures, connecting the inlet 400 and the outlet 500 respectively via the first connector 610 and the second connector 620 ensures good sealing performance of the inlet 400 and the outlet 500, preventing the heat exchange medium inside the chamber from leaking outside and improving the safety of the heat dissipation structure.

[0121] In one possible implementation, the heat dissipation side plate 120 is positioned at a distance from the outer edge of the substrate 200.

[0122] Understandably, in order to avoid components such as capacitors on the substrate 200, the heat dissipation side plate 120 is located near the outer edge of the substrate 200.

[0123] The set distance here can be adjusted according to the actual situation of the substrate 200. For example, 200 micrometers, 100 micrometers, 300 micrometers, etc., this set distance can be selected according to the actual situation.

[0124] In one embodiment, the heat dissipation side plate 120 is 200 micrometers away from the outer edge of the substrate 200.

[0125] Optionally, the distances between each heat dissipation side plate 120 on the same cover plate 100 and the outer edge of the substrate 200 can be the same or different. The distances between each heat dissipation side plate 120 on the same cover plate 100 and the outer edge of the substrate 200 can be selected according to the actual situation.

[0126] In the above implementation process, by setting a distance between the heat dissipation side plate 120 and the outer edge of the substrate 200, it is possible to avoid the heat dissipation side plate 120 affecting the original components on the substrate 200 when it is set on the substrate 200, thereby improving the structural safety of the substrate 200.

[0127] In one possible implementation, the end face of the heat dissipation side plate 120 near the substrate 200 is sealed to the substrate 200.

[0128] The heat dissipation side plate 120 is fixedly connected to the substrate 200 at the end face near the substrate 200.

[0129] Optionally, the end face of the heat dissipation side plate 120 near the substrate 200 can be connected to the substrate 200 by means of bonding, welding, or other methods. The connection method between the heat dissipation side plate 120 and the substrate 200 can be selected according to the actual situation.

[0130] It should be understood that when the heat dissipation side plate 120 is bonded to the substrate 200 near its end face, the seal between the heat dissipation side plate 120 and the substrate 200 can be achieved using adhesive. When the heat dissipation side plate 120 is soldered to the substrate 200 near its end face, the seal between the heat dissipation side plate 120 and the substrate 200 can be achieved using solder. The sealing method between the heat dissipation side plate 120 and the substrate 200 can be selected according to the actual situation.

[0131] Understandably, the mismatch in the coefficients of thermal expansion between the substrate 200 and materials such as the silicon interposer, silicon wafer, and molding compound, as well as the different Young's moduli of various materials, may cause the substrate 200 to warp in different temperature ranges during the packaging process and mounting process, resulting in a "crying face," "smiling face," or wavy shape. Excessive warping of the substrate 200 can lead to chip failure or a significant reduction in reliability.

[0132] The heat dissipation side plate 120 is sealed to the substrate 200. The heat dissipation side plate 120 can replace the warpage control ring to control the warpage of the substrate 200, thereby avoiding phenomena such as the substrate 200 warping with a sad face, a smiling face, or a wavy shape, and improving chip reliability.

[0133] In the above implementation process, by setting the end face of the heat dissipation side plate 120 close to the substrate 200 to be sealed and connected to the substrate 200, it is possible to avoid gaps between the heat dissipation side plate 120 and the substrate 200, which would cause the heat exchange medium in the cavity to leak to the outside of the cavity, thereby improving the sealing performance of the heat dissipation structure and thus improving the safety of the heat dissipation structure.

[0134] like Figure 1 and Figure 5 The diagram shown is a schematic of the package provided in the embodiment of this application, including: the heat dissipation device 20 and the heat dissipation structure in the above embodiment.

[0135] The heat dissipation device 20 is disposed on the substrate 200 of the heat dissipation structure, and the heat dissipation device 20 is located in the cavity formed by the cover plate 100 and the substrate 200 of the heat dissipation structure.

[0136] Optionally, the heat dissipation device 20 can be the packaged chip structure, or it can refer to multiple independent chip cores (dies, i.e., individual chip units after the original wafer of the chip is cut) integrated within a single chip package. Of course, it can also refer to the overall structure of the electronic components containing the chip. The heat dissipation device 20 can be set according to the actual situation.

[0137] In one embodiment, the heat dissipation device 20 is fixedly connected to the substrate 200. For example, by bonding or welding. The connection method between the heat dissipation device and the substrate 200 can be selected according to the actual situation.

[0138] The aforementioned chamber is filled with a heat exchange medium, which is used to exchange heat with the device 20 to be cooled.

[0139] In one embodiment, before encapsulating the cover plate 100, the surface of the substrate 200 connected to the heat dissipation device 20, the surface of the heat dissipation device 20, and the surface of the cover plate 100 near the heat dissipation device 20 can be subjected to anti-corrosion treatment.

[0140] By employing anti-corrosion treatment, the materials on the surface where the heat exchange medium connects the substrate 200 and the heat dissipation device 20, the surface of the heat dissipation device 20, and the surface of the cover plate 100 near the heat dissipation device 20 can be prevented from being corroded, thereby improving the safety of the package and extending its service life.

[0141] The anti-corrosion treatment here can be achieved by applying an insulating sealant layer to the surface where the substrate 200 connects to the heat-dissipating device 20, the surface of the heat-dissipating device 20, and the surface of the cover plate 100 near the heat-dissipating device 20. This insulating sealant layer can not only prevent the heat exchange medium from corroding the surface where the substrate 200 connects to the heat-dissipating device 20, the surface of the heat-dissipating device 20, and the surface of the cover plate 100 near the heat-dissipating device 20, but also prevent the heat exchange medium from seeping into the electrical connection parts of the heat-dissipating device 20, causing faults such as short circuits.

[0142] Optionally, the insulating sealant layer can be made of materials such as polyurea, silicone, epoxy, or acrylic adhesive, and the specific material of the insulating sealant layer can be selected according to the actual situation.

[0143] In the above implementation process, by setting the substrate 200 and the cover plate 100 to form a cavity, and accommodating the heat-dissipating device 20 and the heat exchange medium within the cavity, the heat exchange medium and the heat-dissipating device 20 can be in direct contact without the need for additional thermal interface material. This effectively avoids the heat dissipation deterioration problem caused by the performance loss of the thermal interface material due to warping during the use of the package, thereby improving the heat dissipation efficiency and effect of the package. In addition, one or more of the heat dissipation top plate 110 and heat dissipation side plate 120 are set with a rough surface on the side closest to the heat-dissipating device 20. The protrusions and depressions on the rough surface will disrupt the continuity of the boundary layer. When the heat exchange medium flows over the rough surface, the boundary layer will be torn and reformed at the protrusions on the rough surface, reducing the thickness of the boundary layer and lowering the thermal resistance, thereby further improving the heat exchange efficiency.

[0144] In one possible implementation, the heat exchange medium is a liquid insulating medium.

[0145] This liquid insulating medium has functions such as electrical insulation and heat dissipation / cooling. Examples include mineral insulating oil, silicone oil, natural ester insulating oil, fluorinated liquid, chlorinated biphenyl, and polyisobutylene; the appropriate liquid insulating medium can be selected based on the specific circumstances.

[0146] The liquid insulating medium here is in direct contact with the heat dissipation device 20.

[0147] It should be understood that, due to the insulating properties of the liquid insulating medium, its contact with the surfaces of the substrate 200 and the heat-dissipating device 20, the surface of the heat-dissipating device 20, and the surface of the cover plate 100 near the heat-dissipating device 20 within the cavity will generally not corrode these surfaces, nor will it cause short circuits or other malfunctions. This can greatly improve the safety and service life of the package.

[0148] In one embodiment, if the heat exchange medium is a liquid insulating medium, then there is no need to perform anti-corrosion treatment on the surface of the substrate 200 connected to the heat dissipation device 20, the surface of the heat dissipation device 20, and the surface of the cover plate 100 near the heat dissipation device 20.

[0149] In the above implementation process, because the liquid insulating medium has functions such as electrical insulation and heat dissipation, it can directly contact the device to be cooled 20 without corroding the surfaces of the device 20, the cover plate 100, and the substrate 200, and without causing short circuits or other faults. This greatly improves the safety of the package and extends its service life. In addition, if the heat exchange medium is a liquid insulating medium, there is no need to perform anti-corrosion treatment on the surfaces of the substrate 200 connected to the device 20, the surface of the device 20, and the surface of the cover plate 100 near the device 20. This simplifies the packaging process and improves the packaging efficiency.

[0150] In one possible implementation, the liquid insulating medium is a fluorinated liquid.

[0151] The fluorinated liquid here is a perfluorinated or partially fluorinated organic compound liquid formed by replacing hydrogen atoms in hydrocarbons with fluorine atoms. This fluorinated liquid has properties such as high stability and good insulation.

[0152] Understandably, since fluorinated liquid has good insulation properties, using fluorinated liquid as the liquid insulating medium can prevent corrosion reaction between the liquid insulating medium and the surface of the substrate 200 connected to the heat dissipation device 20, the surface of the heat dissipation device 20, and the surface of the cover plate 100 near the heat dissipation device 20 when exchanging heat with the heat dissipation device 20. This will also prevent short circuits and other malfunctions, improve the safety of the package, and extend its service life.

[0153] Furthermore, by setting one or more of the heat dissipation top plate 110 and the heat dissipation side plate 120 to have a rough surface near the area where the heat-dissipating device 20 is located, and by providing a porous medium heat exchange element 300 on the side of the heat-dissipating device 20 away from the substrate 200, both the rough surface and the porous medium heat exchange element 300 can reduce thermal resistance, thereby improving heat exchange efficiency. Therefore, a relatively small amount of fluorinated liquid can be placed in the chamber to achieve a good heat dissipation effect, thus reducing the demand for fluorinated liquid and lowering costs.

[0154] In the above implementation process, since the fluorinated liquid has good insulation properties, setting the liquid insulating medium as a fluorinated liquid can prevent corrosion reaction between the liquid insulating medium and the surface of the substrate 200 connected to the heat dissipation device 20, the surface of the heat dissipation device 20, and the surface of the cover plate 100 near the heat dissipation device 20 when the liquid insulating medium exchanges heat with the heat dissipation device 20. It will also prevent short circuits and other faults, improve the safety of the package, and extend its service life.

[0155] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application. It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0156] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation structure, characterized in that, include: Cover plate and substrate; The cover plate is disposed on the substrate, and the cover plate and the substrate together enclose a chamber for receiving heat exchange medium; The heat dissipation device setting area on the substrate is used to set the heat dissipation device, and the heat dissipation device setting area is located in the cavity. The cover plate includes a heat dissipation top plate located above the area where the heat dissipation device is located, and a heat dissipation side plate surrounding the area where the heat dissipation device is located. One or more of the heat dissipation top plate and the heat dissipation side plate have a rough surface on the side closest to the area where the device to be dissipated is located.

2. The heat dissipation structure according to claim 1, characterized in that, Also includes: Porous media heat exchange elements; The porous medium heat exchange element is disposed on the side of the device to be cooled away from the substrate and is fixedly connected to the side of the device to be cooled away from the substrate.

3. The heat dissipation structure according to claim 2, characterized in that, The porous medium heat exchange element is spaced apart from the heat dissipation top plate; and the porous medium heat exchange element is spaced apart from the heat dissipation side plate.

4. The heat dissipation structure according to any one of claims 1-3, characterized in that, The cover plate has an inlet and an outlet that communicate with the chamber; The inlet is configured to receive the heat exchange medium, and the outlet is configured to discharge the heat exchange medium; the heat exchange medium is used for heat exchange within the chamber.

5. The heat dissipation structure according to claim 4, characterized in that, Also includes: First connector and second connector; The first end of the first connector is sealed to the liquid inlet, and the second end of the first connector is connected to one side of the external heat exchange medium container; The first end of the second connector is sealed to the liquid outlet, and the second end of the second connector is connected to the other side of the external heat exchange medium container. The first connector is configured to receive the heat exchange medium, and the second connector is configured to discharge the heat exchange medium.

6. The heat dissipation structure according to any one of claims 1-3, characterized in that, The heat dissipation side plate is set at a distance from the outer edge of the substrate.

7. The heat dissipation structure according to any one of claims 1-3, characterized in that, The end face of the heat dissipation side plate near the substrate is sealed to the substrate.

8. A package, characterized in that, The device to be cooled and the heat dissipation structure according to any one of claims 1-7; The device to be cooled is disposed on the substrate of the heat dissipation structure, and the device to be cooled is located in the cavity formed by the cover plate of the heat dissipation structure and the substrate. The chamber is filled with a heat exchange medium, which is used to exchange heat with the device to be cooled.

9. The package according to claim 8, characterized in that, The heat exchange medium is a liquid insulating medium; The liquid insulating medium is in direct contact with the device to be cooled.

10. The package according to claim 9, characterized in that, in, The liquid insulating medium is a fluorinated liquid.

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