Heating element, atomizer and electronic atomization device

Abstract

The utility model provides a heating element, an atomizer and an electronic atomization device.The heating element is applied to the electronic atomization device and used for heating atomized aerosol to form a substrate, and the heating element comprises a base body and a heating film; the base body is provided with a liquid absorbing surface and an atomizing surface which are oppositely arranged; the heating film is arranged on the atomizing surface; wherein a plurality of capillary grooves are formed in the liquid absorption face, a plurality of first micro holes distributed in an array mode are formed in the base body, the width of the capillary grooves is larger than or equal to the diameter of the first micro holes, and the first micro holes at least exist in the capillary grooves so that the first micro holes can penetrate through the atomization face and can be communicated with the capillary grooves. Therefore, the phenomenon that bubbles block liquid inlet can be avoided, the capillary grooves have the capillary effect and can adsorb liquid, store the liquid, increase the liquid storage amount of the base body and improve the liquid storage capacity and the liquid guide capacity of the heating body, and the situation that the liquid base body cannot be supplemented to the heating body in time is avoided; the problems that in the prior art, a heating body of an electronic atomization device is small in liquid storage amount, and a core is prone to being burnt due to dry burning are solved.

Description

Heating element, atomizer and electronic atomization device Technical Field

[0001] This application relates to the field of electronic atomization device technology, specifically to a heating element, an atomizer, and an electronic atomization device. Background Technology

[0002] Electronic atomizing devices are a common type of electronic product. Their atomizers can heat and atomize liquid aerosol matrix to form aerosols.

[0003] Generally, atomizers require porous materials to transport liquid aerosols to form a matrix, and currently, most use cotton wicks or ceramic wicks as heating elements. However, the pore structures of cotton and ceramic wicks are often disordered and difficult to customize, resulting in poor consistency in liquid delivery and difficulty in ensuring consistent flavor. With the development of technology, thin-film heating elements with fully customizable pore structures have been developed. These have vertically oriented arrays of micropores, which improve liquid delivery capacity. However, these thin-film heating elements are prone to forming air bubbles on the side absorbing the liquid matrix, blocking the liquid inlet. In addition, the thin substrate results in a smaller liquid storage capacity, which can further lead to the problem of dry burning and scorching of the heating element. Summary of the Invention

[0004] In view of this, this application provides a heating element, an atomizer, and an electronic atomizing device to solve the problem that the heating element of the electronic atomizing device in the prior art has a small liquid storage capacity and is prone to dry burning and scorching.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] A heating element, comprising components used in an electronic atomizing device and for heating an atomized aerosol forming matrix, the heating element comprising:

[0007] The substrate has an absorbing surface and an atomizing surface that are arranged opposite to each other;

[0008] A heating film is disposed on the atomizing surface;

[0009] The liquid-absorbing surface is provided with multiple capillary grooves, and the substrate is provided with multiple first micropores arranged in an array. The width of the capillary grooves is greater than or equal to the diameter of the first micropores. The first micropores exist at least in the capillary grooves, so that the first micropores penetrate the atomizing surface and communicate with the capillary grooves.

[0010] Optionally, the width of the capillary groove is 0.05mm-5mm, and the diameter of the first micropore is 0.005mm-0.05mm; or,

[0011] The width of the capillary groove is 0.5mm-5mm, and the diameter of the first micropore is 0.005mm-0.5mm.

[0012] Optionally, the substrate is a sheet-like body, wherein:

[0013] All the capillary grooves are arranged side-by-side and spaced apart, and the capillary grooves extend along the length of the substrate; or...

[0014] All the capillary grooves are arranged side-by-side and spaced apart, and the capillary grooves extend along the width direction of the substrate; or...

[0015] All the capillary grooves are distributed in a rectangular array along the length and width directions of the substrate.

[0016] Optionally, the heating film includes a heating element, which includes multiple heating sub-units connected in parallel, and the distribution area of ​​the first micropores on the atomizing surface is consistent with that of the heating sub-units.

[0017] Optionally, the heating film includes a heating element, which includes multiple heating components connected in series, and the heating components correspond to the distribution area of ​​the first micropores on the atomizing surface.

[0018] Optionally, the heating film includes a heating element, which includes multiple heating components. The heating components are distributed in the same area as the first micropores on the atomizing surface. The heating components arranged along the length of the substrate are connected in series and electrically to form a group of heating components. All the heating component groups are connected in parallel.

[0019] Optionally, a plurality of second micropores are arranged in an array in the region between any two adjacent capillary grooves, and the second micropores penetrate the liquid absorption surface and the atomizing surface.

[0020] Optionally, a plurality of second micropores are arranged in an array in the region between any two adjacent capillary grooves, and the second micropores penetrate the liquid absorption surface and the atomizing surface;

[0021] On the atomizing surface, the heating part of the heating film is a single piece, and the distribution area of ​​the heating part is consistent with the distribution area of ​​the first micropore and the second micropore.

[0022] Optionally, the liquid-absorbing surface has a plurality of third micropores arranged in an array in the strip-shaped region along the edge, the third micropores penetrating the liquid-absorbing surface and the atomizing surface.

[0023] An atomizer, comprising:

[0024] The liquid storage chamber is used to store the aerosol formation matrix;

[0025] A heating element is in fluid communication with the liquid storage cavity, and the heating element is any of the heating elements mentioned above.

[0026] An electronic atomizing device, comprising:

[0027] The atomizer is the one described above;

[0028] A power supply device is used to provide electrical energy for the operation of the atomizer.

[0029] The heating element provided in this application is used in an electronic atomizing device and is used to heat the atomized aerosol forming matrix. The heating element includes a substrate and a heating film. The substrate has a liquid-absorbing surface and an atomizing surface arranged opposite to each other. The heating film is disposed on the atomizing surface. The liquid-absorbing surface is provided with a plurality of capillary grooves, and the substrate is provided with a plurality of first micropores arranged in an array. The width of the capillary grooves is greater than or equal to the diameter of the first micropores. The first micropores exist at least in the capillary grooves so that the first micropores penetrate the atomizing surface and communicate with the capillary grooves. This design, with its numerous micropores, creates a porous and dense structure, enabling the substrate to store and conduct liquid. The micropores transfer the liquid matrix from the absorption surface to the atomizing surface for atomization, resulting in fast transmission speed and high atomization efficiency. Furthermore, the capillary grooves on the absorption surface, being larger than the micropores, prevent air bubbles from clogging the liquid inlet. The small size of the capillary grooves also allows for capillary action, absorbing and storing liquid. This increases the substrate's liquid storage capacity and enhances the heating element's storage and conduction capabilities. Even when the electronic atomizing device is placed flat, upside down, or at other angles, the capillary grooves continue to absorb liquid due to capillary action, preventing the liquid matrix from failing to replenish the heating element in time. This multi-faceted approach prevents the heating element from dry-burning, solving the problems of insufficient liquid storage and easy dry-burning / burning of the heating element in existing electronic atomizing devices. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0031] Figure 1 is a first-view structural schematic diagram of the heating element provided in Embodiment A of this application;

[0032] Figure 2 is a second-view structural schematic diagram of the heating element provided in embodiment A of this application;

[0033] Figure 3 is a first-view structural schematic diagram of the heating element provided in embodiment B of this application;

[0034] Figure 4 is a second-view structural schematic diagram of the heating element provided in embodiment B of this application;

[0035] Figure 5 is a first-view structural schematic diagram of the heating element provided in embodiment C of this application;

[0036] Figure 6 is a second-view structural schematic diagram of the heating element provided in embodiment C of this application;

[0037] Figure 7 is a first-view structural schematic diagram of the heating element provided in embodiments D and E of this application;

[0038] Figure 8 is a second-view structural schematic diagram of the heating element provided in embodiment D of this application;

[0039] Figure 9 is a second-view structural schematic diagram of the heating element provided in embodiment E of this application;

[0040] Figure 10 is a first-view structural schematic diagram of the heating element provided in embodiment F of this application;

[0041] Figure 11 is a second-view structural schematic diagram of the heating element provided in embodiment F of this application.

[0042] In Figures 1-11:

[0043] 1. Substrate; 2. Heating film;

[0044] 11. Liquid absorption surface; 12. Atomizing surface;

[0045] 101. First micropore; 102. Second micropore; 103. Third micropore; 104. Capillary groove;

[0046] 21. Heating element; 22. Electrode element;

[0047] 211. Heating components. Detailed Implementation

[0048] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0049] As shown in Figures 1-11, this application provides a heating element for use in an electronic atomizing device and for heating the matrix of atomized aerosol. The heating element includes a substrate 1 and a heating film 2. The substrate 1 has a liquid-absorbing surface 11 and an atomizing surface 12 disposed opposite to each other. The heating film 2 is disposed on the atomizing surface 12. The liquid-absorbing surface 11 has a plurality of capillary grooves 104 extending along the surface direction of the liquid-absorbing surface 11. The substrate 1 has a plurality of first micropores 101 arranged in an array. The width of the capillary grooves 104 is greater than or equal to the diameter of the first micropores 101. The first micropores 101 are present at least in the capillary grooves 104, so that the first micropores 101 penetrate the atomizing surface 12 and communicate with the capillary grooves 104. The extending direction of the first micropores 101 can be consistent with the thickness direction of the substrate 1, or the extending direction of the first micropores 101 can have an angle of inclination with the thickness direction of the substrate 1. It should be noted that, on the liquid absorption surface 11, the smaller of the two dimensions of the capillary groove 104 is the width of the capillary groove 104.

[0050] With this configuration, the substrate 1, due to the presence of numerous micropores, acts as a porous and dense structure, enabling it to store and conduct liquid. The first micropore 101 transports the liquid matrix from the absorption surface 11 to the atomizing surface 12 for atomization, resulting in fast transmission speed and high atomization efficiency. Furthermore, the capillary groove 104 on the absorption surface 11, being larger than the micropores, prevents air bubbles from clogging the liquid inlet. Moreover, the small size and shape of the capillary groove 104 allow for capillary action, enabling it to adsorb and store liquid. This increases the liquid storage capacity of the substrate 1 and enhances the liquid storage and conduction capabilities of the heating element. Simultaneously, even if the electronic atomizing device is placed flat, upside down, or at other angles, the capillary groove 104 can continuously absorb liquid due to capillary action, preventing the liquid matrix from failing to replenish the heating element in a timely manner. This multi-faceted approach prevents the heating element from dry-burning, solving the problem of insufficient liquid storage and easy dry-burning / burning of the heating element in existing electronic atomizing devices.

[0051] The applicant also discovered that, in order to solve the problem of dry burning and scorching of the core in thin-film heating elements, related technologies include a technical solution of padding the oil-conducting surface of the thin-film heating element with thin-film cotton. Although this can reduce the size of air bubbles and increase the liquid storage capacity, it introduces the problem of natural cotton with non-artificially defined pores, and also requires the addition of corresponding support structures for the cotton, resulting in increased costs. Compared with the known existing technical solutions, the heating element provided in this application does not require additional support structures or additional costs.

[0052] In some alternative embodiments, the capillary groove 104 is designed with a non-through edge on the liquid absorption surface 11, that is, the capillary groove 104 does not penetrate the edge of the substrate 1, but is inside the edge of the substrate 1.

[0053] In some optional embodiments, the width of the capillary groove 104 is 0.05mm-5mm, and the diameter of the first micropore 101 is 0.005mm-0.05mm; or, the width of the capillary groove 104 is 0.5mm-5mm, and the diameter of the first micropore 101 is 0.005mm-0.5mm. Preferably, the width of the capillary groove 104 is set to 0.1mm-0.8mm, and the diameter of the first micropore 101 is preferably set to 0.03mm-0.05mm. Multiple rows of first micropores 101 are formed in the capillary groove 104, thus creating a gradient porosity between the capillary groove 104 and the first micropores 101. That is, the large-sized capillary groove 104 provides the ability to store and rapidly guide liquid, while the small-sized first micropores 101 provide the ability to rapidly guide liquid and prevent leakage.

[0054] For example, a plurality of rows of first micropores 101 are formed in a single capillary groove 104, and Figures 1-11 exemplarily show five rows of first micropores 101 in a single capillary groove 104.

[0055] It should be noted that the substrate 1 may be, but is not limited to, ceramic, glass, or other materials. The heating film 2 is an electrically conductive heat-generating structure. It is known that the heating film 2 includes a heating part 21 and an electrode part 22. The electrode part 22 is located on both sides of the heating part 21. The heating film 2 is usually coated on the substrate 1 by screen printing. The heating film 2 allows the first micropore 101 and the second micropore 102 to be exposed without causing blockage.

[0056] For example, on the substrate 1, the first micropores 101 are distributed in the central region of the substrate 1, and in the length direction of the substrate 1, the electrode portion 22 of the heating film 2 is located on both sides of the heating portion 21.

[0057] The heating element provided in this application can refer to the thin-plate heating element commonly known in the art, that is, the substrate 1 is a sheet-like body. Therefore, the substrate 1 naturally has a length direction, a width direction, and a thickness direction. In some optional embodiments, the capillary grooves 104 are strip-shaped, and the arrangement design of the capillary grooves 104 has various possibilities, including:

[0058] All capillary grooves 104 are arranged side by side and spaced apart. The capillary grooves 104 extend along the length of the substrate 1. This arrangement forms dividing strips between the capillary grooves 104. The dividing strips are solid structures that extend along the length of the substrate 1, which helps the substrate 1 to better resist the bending moment caused by the electrode contact of the battery.

[0059] Alternatively, all capillary grooves 104 are arranged side by side and spaced apart, with the capillary grooves 104 extending along the width direction of the substrate 1. This arrangement forms dividing strips between the capillary grooves 104, and the dividing strips are solid structures extending along the width direction of the substrate 1. This is beneficial for better supporting the long side edge of the substrate 1, thereby improving the strength and flatness of the side of the substrate 1. Good flatness is beneficial for strengthening the sealing of the heating element during assembly and for improving the quality of the heating element.

[0060] Alternatively, all capillary grooves 104 can be arranged in a rectangular array along the length and width directions of the substrate 1. In this configuration, dividing strips are formed between the capillary grooves 104, and the dividing strips, as solid structures, provide support for the substrate 1 in both the length and width directions, thus possessing the advantages of both of the above implementation methods.

[0061] Based on the design of the capillary groove 104, the heating film 2 also has a different design.

[0062] In some optional embodiments, when all capillary grooves 104 are arranged side-by-side and spaced apart, and the capillary grooves 104 extend along the length direction of the substrate 1, the heating part 21 of the heating film 2 includes a plurality of parallel electrically connected heating elements 211. On the atomizing surface 12, the distribution area of ​​the heating elements 211 coincides with the distribution area of ​​the first micropores 101, forming scheme A. Preferably, the capillary grooves 104 and the heating elements 211 correspond one-to-one on the projection plane perpendicular to the thickness direction. In this way, the atomization area can be increased and the atomization amount can be improved. Figures 1 and 2 exemplarily show three capillary grooves 104 and three heating elements 211.

[0063] In some optional embodiments, when all capillary grooves 104 are arranged side-by-side and spaced apart, and the capillary grooves 104 extend along the width direction of the substrate 1, the heating part 21 of the heating film 2 includes a plurality of heating elements 211 connected in series. On the atomizing surface 12, the distribution area of ​​the heating elements 211 coincides with the distribution area of ​​the first micropores 101, forming scheme B. Preferably, the capillary grooves 104 and the heating elements 211 correspond one-to-one on the projection plane perpendicular to the thickness direction. In this way, the atomization area can be increased and the atomization amount can be improved. Figures 3 and 4 exemplarily show five capillary grooves 104 and five heating elements 211.

[0064] In some optional embodiments, when all capillary grooves 104 are distributed in a rectangular array along the length and width directions of the substrate 1, the heating part 21 of the heating film 2 includes multiple heating elements 211. On the atomizing surface 12, the distribution area of ​​the heating elements 211 coincides with the distribution area of ​​the first micropores 101. The heating elements 211 arranged along the length direction of the substrate 1 are connected in series and electrically to form a group of heating elements. All heating elements groups are connected in parallel, forming scheme C. Preferably, the capillary grooves 104 and the heating elements 211 correspond one-to-one on the projection plane perpendicular to the thickness direction. In this way, the atomization area can be increased and the atomization amount can be improved. Figures 5 and 6 exemplarily show ten capillary grooves 104 and ten heating elements 211, and the ten heating elements 211 form two groups of heating elements.

[0065] In some alternative embodiments, based on scheme A, scheme B, or scheme C, a plurality of second micropores 102 are arranged in an array in the region between any two adjacent capillary grooves 104. The second micropores 102 penetrate the liquid absorption surface 11 and the atomizing surface 12. There are no heating elements 21 distributed in the region where the second micropores 102 are located, forming scheme D. Please refer to Figures 7 and 8. In this way, micropores are also provided on the dividing strips formed between the capillary grooves 104, which is beneficial to further increase the liquid storage and liquid conduction capacity of the substrate 1.

[0066] In some alternative embodiments, based on the aforementioned capillary groove 104 design, a plurality of second micropores 102 are arranged in an array in the region between any two adjacent capillary grooves 104. The second micropores 102 penetrate the liquid absorption surface 11 and the atomizing surface 12. On the atomizing surface 12, the heating part 21 of the heating film 2 is a single piece, and the distribution area of ​​the heating part 21 is consistent with the distribution area of ​​the first micropore 101 and the second micropore 102, forming scheme E, please refer to Figures 7 and 9. In this way, it is beneficial to further improve the atomization amount and atomization efficiency of the atomizer. At the same time, since the atomizing surface 12 of the heating element is not segmented, the temperature of the atomizing surface 12 is more uniform and the resistance to dry burning is stronger.

[0067] In some alternative embodiments, based on scheme A, B, C, D, or E, a plurality of third micropores 103 are arranged in an array in the strip-shaped region along the edge of the liquid-absorbing surface 11. The third micropores 103 penetrate the liquid-absorbing surface 11 and the atomizing surface 12. No heating element 21 is distributed in the region where the third micropores 103 are located, forming scheme F. Please refer to Figures 10 and 11. In this way, arranging one or more rings of micropore regions around the periphery of the heating element can reduce the thermal conductivity around the heating element, so that less heat from the heating element is dissipated to other components in the atomizer, thereby allowing more energy to be used for atomization, further improving the atomization volume and atomization efficiency of the atomizer.

[0068] Based on the aforementioned heating element, this application embodiment also provides an atomizer, which has a liquid storage chamber for storing an aerosol forming matrix, and the heating element of the atomizer is the aforementioned heating element, which is in fluid communication with the liquid storage chamber. Other structural components of the atomizer can be designed with reference to known solutions in related technologies, and will not be described in detail here.

[0069] Based on the atomizer described above, this application also provides an electronic atomizing device, which includes an atomizer and a power supply device. The atomizer is the atomizer described above, and the power supply device includes a battery to provide electrical energy for the operation of the atomizer.

[0070] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0071] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0072] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0073] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0074] It should be understood that the qualifiers “first,” “second,” “third,” “fourth,” “fifth,” and “sixth” used in the description of the embodiments of this application are only used to more clearly illustrate the technical solutions and are not intended to limit the scope of protection of this application.

[0075] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A heating element, characterized in that, The heating element, which is used in electronic atomizing devices and for heating atomized aerosol forming a matrix, comprises: a substrate (1) having a liquid-absorbing surface (11) and an atomizing surface (12) disposed opposite to each other; and a heating film (2) disposed on the atomizing surface (12). The liquid-absorbing surface (11) has a plurality of capillary grooves (104), and the substrate (1) has a plurality of first micropores (101) arranged in an array. The width of the capillary grooves (104) is greater than or equal to the diameter of the first micropores (101), and the first micropores (101) are present at least in the capillary grooves (104) such that the first micropores (101) penetrate the atomizing surface (12) and communicate with the capillary grooves (104).

2. The heating element according to claim 1, characterized in that, The width of the capillary groove (104) is 0.05mm-5mm, and the diameter of the first micropore (101) is 0.005mm-0.05mm; or, the width of the capillary groove (104) is 0.5mm-5mm, and the diameter of the first micropore (101) is 0.005mm-0.5mm.

3. The heating element according to claim 1, characterized in that, The substrate (1) is a sheet-like body, wherein: all the capillary grooves (104) are arranged side by side and spaced apart, and the capillary grooves (104) extend along the length direction of the substrate (1); or, all the capillary grooves (104) are arranged side by side and spaced apart, and the capillary grooves (104) extend along the width direction of the substrate (1); or, all the capillary grooves (104) are arranged in a rectangular array along the length and width directions of the substrate (1).

4. The heating element according to claim 3, characterized in that, The heating film (2) includes a heating part (21), which includes a plurality of parallel electrically connected heating sub-units (211), and the heating sub-units (211) are consistent with the distribution area of ​​the first micropores (101) on the atomizing surface (12).

5. The heating element according to claim 3, characterized in that, The heating film (2) includes a heating part (21), which includes a plurality of heating sub-units (211) connected in series. The heating sub-units (211) are consistent with the distribution area of ​​the first micropores (101) on the atomizing surface (12).

6. The heating element according to claim 3, characterized in that, The heating film (2) includes a heating part (21), which includes a plurality of heating components (211). The heating components (211) are consistent with the distribution area of ​​the first micropores (101) on the atomizing surface (12). The heating components (211) arranged along the length direction of the substrate (1) are connected in series and form a group of heating components. All the heating components are connected in parallel.

7. The heating element according to any one of claims 3-6, characterized in that, A plurality of second micropores (102) are arranged in an array in the region between any two adjacent capillary grooves (104), and the second micropores (102) penetrate the liquid absorption surface (11) and the atomizing surface (12).

8. The heating element according to claim 3, characterized in that, Multiple second micropores (102) are arranged in an array in the region between any two adjacent capillary grooves (104). The second micropores (102) penetrate the liquid absorption surface (11) and the atomizing surface (12). On the atomizing surface (12), the heating part (21) of the heating film (2) is a whole piece, and the distribution area of ​​the heating part (21) is consistent with the distribution area of ​​the first micropore (101) and the second micropore (102).

9. The heating element according to claim 3, characterized in that, The liquid-absorbing surface (11) has a plurality of third micropores (103) arranged in an array in the strip-shaped region along the edge, and the third micropores (103) penetrate the liquid-absorbing surface (11) and the atomizing surface (12).

10. An atomizer, characterized in that, include: A liquid storage chamber for storing aerosol-forming matrix; a heating element in fluid communication with the liquid storage chamber, wherein the heating element is the heating element according to any one of claims 1-9.

11. An electronic atomizing device, characterized in that, include: The atomizer is the atomizer as described in claim 10; A power supply device is used to provide electrical energy for the operation of the atomizer.

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