Semiconductor lead corner cutting device

The design of the sliding mounting base and adjustable cutting blade solves the problem of the existing device's inability to adjust, improves cutting efficiency and waste collection efficiency, and enhances the practicality of the semiconductor lead cutting device.

CN224181964UActive Publication Date: 2026-05-01SHENZHEN YUYU TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN YUYU TECHNOLOGY CO LTD
Filing Date
2025-06-04
Publication Date
2026-05-01

AI Technical Summary

Technical Problem

The mounting position of existing semiconductor lead cutting devices is fixed and cannot be adjusted to meet the needs of different cutting lengths. Furthermore, the cutting efficiency is low and there is a lack of efficient waste collection mechanisms.

Method used

The design incorporates a sliding mounting base, an adjustable cutting blade, and a waste collection trough. The positions of the mounting base and cutting blade are adjusted via an electric push rod and a hydraulic cylinder. Combined with a discharge trough and a collection box, efficient waste collection is achieved.

Benefits of technology

The device allows for flexible adjustment of the mounting position, improving cutting efficiency and enabling rapid waste collection, thus enhancing its practicality and ease of operation.

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Abstract

The utility model discloses a semiconductor lead corner cutting device which comprises a working table, the left side and the right side of the upper end face of the working table are each provided with an installation base in a sliding mode, the upper ends of the two installation bases are each provided with a cutting groove, the rear sides of the upper end faces of the two installation bases are each provided with a pressing base in a hinged mode, and the left side and the right side of the upper end face of the working table are each provided with a fixing plate. Supporting legs are arranged at the four corners of the upper end face of the workbench, a top plate is arranged on the upper end faces of the multiple supporting legs, a hydraulic cylinder is arranged at the bottom end of the top plate, a fixing base is connected to the bottom end of the hydraulic cylinder, and cutting knives are slidably arranged on the left side and the right side of the lower end face of the fixing base. Through the design of the mounting seat, the mounting seat is slidably arranged relative to the workbench, so that the position of the mounting seat is convenient to adjust, semiconductor leads with different lengths are convenient to mount and adjust, the operation of cutting corners with different lengths is convenient, and the practicability is improved.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor lead technology, and more specifically, to a semiconductor lead cutting device. Background Technology

[0002] Semiconductor leads, as the main connectors for circuit connections, play an important role in the equipment manufacturing process. Before use, semiconductor leads need to be chamfered. Existing chamfering devices have fixed mounting positions for lead cutting, which are inconvenient to adjust. They are also inconvenient to adjust for different cutting lengths, and their practicality needs to be improved. In addition, the cutting head is set up separately during use, resulting in low chamfering efficiency. There is a lack of suitable high-efficiency chamfering mechanisms. Furthermore, the waste generated during processing accumulates on the worktable, and there is a lack of suitable waste collection mechanisms. Utility Model Content

[0003] (a) Technical problems to be solved

[0004] To address the problems existing in the prior art, this utility model provides a semiconductor lead cutting device to solve the technical problems mentioned in the background art, such as the fixed position of the lead cutting mounting base, which is inconvenient to adjust and cannot be adjusted for different cutting lengths, thus requiring improved practicality.

[0005] (II) Technical Solution

[0006] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor lead cutting device, comprising a worktable, on both sides of the upper surface of the worktable are slidably provided mounting seats, each mounting seat has a cutting groove at its upper end, and each mounting seat has a clamping seat hinged to its rear side. Fixing plates are provided on both sides of the upper surface of the worktable, and electric push rods are connected between the fixing plates and mounting seats on the same side. Support legs are provided at the four corners of the upper surface of the worktable, and top plates are provided on the upper surfaces of multiple support legs. A hydraulic cylinder is provided at the bottom of the top plate, and a fixing seat is connected to the bottom of the hydraulic cylinder. Cutting blades are slidably provided on both sides of the lower surface of the fixing seat, and each cutting blade is positioned corresponding to the cutting groove.

[0007] The present invention is further provided that the upper end face of both cutting blades is provided with an adjustment plate, and the bottom end of the fixing base is provided with an adjustment groove corresponding to the two adjustment plates, so as to facilitate the adjustment of the cutting blade position.

[0008] The present invention is further configured such that an adjusting rod is rotatably provided inside the adjusting groove, the adjusting rod is threadedly connected to the adjusting plate, the two adjusting plates have reversed internal threads, one side of the adjusting rod extends outward through the fixed base, and an adjusting motor is connected to the outer end of the adjusting rod to drive the position adjustment.

[0009] The present invention is further configured such that guide rods are symmetrically arranged inside the adjustment groove, and guide holes are opened on both adjustment plates corresponding to multiple guide rods to guide the sliding.

[0010] The present invention is further provided that a discharge trough is provided on the rear side of the upper surface of the workbench, the discharge trough extends rearward through the workbench, and a collection box is detachably provided on the rear end face of the workbench for convenient waste collection.

[0011] The present invention is further configured such that positioning rods are provided at the four corners of the lower end face of the collection box, and a positioning plate is provided at the bottom of the rear end face of the workbench. Positioning holes are provided on the positioning plate corresponding to the multiple positioning rods to achieve positioning of the collection box during installation.

[0012] The present invention is further configured such that each of the two clamping seats has a locking plate on its front end face, each of the two locking plates has a locking hole, a locking rod is provided inside the locking hole, the locking rod is threadedly connected to the locking hole, and each of the two mounting seats has a locking hole corresponding to the locking rod on its front end face, so as to facilitate the clamping seat locking.

[0013] (III) Beneficial Effects

[0014] Compared with the prior art, the present invention provides a semiconductor lead cutting device, which has the following advantages:

[0015] 1. The mounting base is designed to slide relative to the worktable, and the electric push rod drives the sliding motion, which facilitates the adjustment of the mounting base position, the installation and adjustment of semiconductor leads of different lengths, and the cutting of different lengths, thus improving practicality.

[0016] 2. Through the design of the cutting blade, the upper end adjustment plate of the cutting blade slides relative to the adjustment groove for adjustment. The adjustment motor drives the adjustment rod to rotate. The adjustment rod and the adjustment plate are threaded together, and the guide rod and the guide hole cooperate to guide, which facilitates the adjustment of the position of the cutting blades on both sides and facilitates efficient cutting.

[0017] 3. Through the design of the discharge chute and the collection box, the discharge chute guides the waste material piled on the workbench, and the collection box collects the waste material, which is convenient for quick collection. The collection box with positioning rod is installed and positioned according to the positioning hole of the positioning plate, which is convenient for quick assembly and disassembly of the collection box and convenient for waste dumping. Attached Figure Description

[0018] Figure 1 A schematic diagram of the preferred overall structure of a semiconductor lead cutting device;

[0019] Figure 2 A schematic diagram of the preferred worktable and positioning plate assembly structure for a semiconductor lead cutting device;

[0020] Figure 3 A schematic diagram of the preferred mounting base and clamping base mating structure for a semiconductor lead cutting device;

[0021] Figure 4 A schematic diagram of the overall structure of the preferred mounting base for a semiconductor lead cutting device;

[0022] Figure 5 A schematic diagram of the preferred assembly structure of the adjustment plate and the cutting blade for a semiconductor lead cutting device;

[0023] Figure 6 A schematic diagram of the preferred structure of the collection box and positioning rod for a semiconductor lead cutting device.

[0024] In the diagram: 1. Workbench; 2. Mounting base; 3. Cutting groove; 4. Clamping base; 5. Fixing plate; 6. Electric push rod; 7. Support leg; 8. Top plate; 9. Hydraulic cylinder; 10. Fixing base; 11. Cutting blade; 12. Adjusting plate; 13. Adjusting groove; 14. Adjusting rod; 15. Adjusting motor; 16. Guide rod; 17. Guide hole; 18. Discharge chute; 19. Collection box; 20. Positioning rod; 21. Positioning plate; 22. Positioning hole; 23. Locking plate; 24. Locking hole; 25. Locking rod; 26. Locking hole. Detailed Implementation

[0025] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0026] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0027] In this utility model, unless otherwise stated, the orientations used, such as "up" and "down", usually refer to the direction shown in the accompanying drawings, or to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" usually refer to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0028] Please see Figures 1-5A semiconductor lead cutting device includes a worktable 1. Mounting seats 2 are slidably provided on both the left and right sides of the upper surface of the worktable 1. Each of the two mounting seats 2 has a cutting groove 3 on its upper end. A clamping seat 4 is hinged to the rear side of the upper surface of each of the two mounting seats 2. Fixing plates 5 are provided on both the left and right sides of the upper surface of the worktable 1. Electric push rods 6 are connected between the fixing plates 5 and the mounting seats 2 on the same side. Support legs 7 are provided at the four corners of the upper surface of the worktable 1. A top plate 8 is provided on the upper surface of the multiple support legs 7. A hydraulic cylinder 9 is provided at the bottom of the top plate 8. A fixing seat 10 is connected to the bottom of the hydraulic cylinder 9. Cutting blades 11 are slidably provided on both the left and right sides of the lower surface of the fixing seat 10. Each cutting blade 11 is set corresponding to the cutting groove 3.

[0029] In this embodiment, the control device has its own control system. When the electric push rod 6 is activated, the electric push rod 6 drives the mounting base 2 to slide and adjust. After the mounting base 2 is adjusted to a suitable position, the semiconductor lead to be cut is installed on the mounting base 2. The clamping seat 4 is hinged and closed to clamp the semiconductor lead. The hydraulic cylinder 9 drives the bottom fixed seat 10 and the cutting blade 11 to lift and adjust as a whole. The cutting blade 11 and the cutting groove 3 cooperate to realize the corner cutting operation.

[0030] Please see Figure 1 , Figure 4 and Figure 5 As one embodiment of the cutting blade 11: both cutting blades 11 are provided with adjusting plates 12 on their upper surfaces. The bottom end of the fixed base 10 is provided with adjusting grooves 13 corresponding to the two adjusting plates 12. Adjusting rods 14 are rotatably provided inside the adjusting grooves 13. The adjusting rods 14 and adjusting plates 12 are threadedly connected. The internal threads of the two adjusting plates 12 are arranged in opposite directions. One side of the adjusting rod 14 extends outward and passes through the fixed base 10. An adjusting motor 15 is connected to the outer end of the adjusting rod 14. Guide rods 16 are symmetrically provided inside the adjusting grooves 13. Guide holes 17 are provided on both adjusting plates 12 corresponding to multiple guide rods 16.

[0031] Specifically, the control device has its own control system. When the adjustment motor 15 is started, the adjustment motor 15 drives the adjustment rod 14 to rotate. The adjustment rod 14 and the adjustment plate 12 are threaded together. The guide rod 16 and the guide hole 17 cooperate to guide. The adjustment plate 12 drives the positions of the cutting blades 11 on both sides to be adjusted synchronously, which facilitates cutting operations of different lengths.

[0032] Please see Figure 2 and Figure 6 As one method of waste collection: a discharge trough 18 is provided on the rear side of the upper end face of the workbench 1. The discharge trough 18 extends rearward and penetrates the workbench 1. A collection box 19 is detachably provided on the rear end face of the workbench 1. Positioning rods 20 are provided at the four corners of the lower end face of the collection box 19. A positioning plate 21 is provided at the bottom of the rear end face of the workbench 1. Positioning holes 22 are provided on the positioning plate 21 corresponding to the multiple positioning rods 20.

[0033] Specifically, the waste generated from the corner cutting falls into the collection box 19 through the discharge chute 18. After a long period of use, once a certain amount of waste has been collected in the collection box 19, the collection box 19 is disassembled and the waste is dumped. The dumped collection box 19 is then installed in accordance with the positioning plate 21, and the positioning rod 20 and the positioning hole 22 are used to install and position it.

[0034] Please see Figure 1 and Figure 3 As one embodiment of the clamping seat 4: both clamping seats 4 have a locking plate 23 on their front end face, both locking plates 23 have a locking hole 24, the locking hole 24 has a locking rod 25 inside, the locking rod 25 and the locking hole 24 are threadedly connected, and both mounting seats 2 have a locking hole 26 on their front end face corresponding to the locking rod 25.

[0035] Specifically, after the clamping seat 4 is hinged and closed relative to the mounting seat 2, the locking rod 25 is rotated, and the locking rod 25 and the locking hole 24 are threaded together. The locking rod 25 is inserted into the corresponding locking hole 26, thereby achieving the locking state.

[0036] In summary, the overall equipment is in use:

[0037] When in the installation and adjustment state, the control device has a built-in control system. Activating the electric push rod 6 causes it to extend and retract, which in turn drives the mounting base 2 to slide and adjust. Once the mounting base 2 is adjusted to the appropriate position, the semiconductor lead is placed on the upper end of the mounting base 2. The clamping base 4 is hinged and closed. Rotating the locking rod 25 causes the locking rod 25 to engage with the locking hole 24 through a threaded connection. The locking rod 25 is then inserted into the corresponding slot 26, thus clamping the semiconductor lead during installation.

[0038] When in the cutting adjustment state, the control device has a built-in control system. The adjustment motor 15 is started, which drives the adjustment rod 14 to rotate. The adjustment rod 14 and the adjustment plate 12 are threaded together. The guide rod 16 and the guide hole 17 cooperate to guide. The adjustment plate 12 drives the cutting blade 11 to adjust to the position corresponding to the cutting groove 3, which is convenient for adjustment and use in different cutting environments and improves practicality.

[0039] When in the cutting operation state, the control device has its own control system, which starts the hydraulic cylinder 9. The hydraulic cylinder 9 drives the bottom fixed seat 10 to lift and adjust as a whole, thereby realizing the lifting and adjustment of the cutting blade 11. The cutting blade 11 and the cutting groove 3 cooperate to realize the corner cutting operation. The waste generated by cutting is swept to the discharge groove 18, and the waste is collected by the collection box 19 after being guided by the discharge groove 18.

[0040] Of all the solutions mentioned above, those involving the connection between two components can be selected according to the actual situation, such as welding, bolt and nut connection, bolt or screw connection, or other known connection methods, which will not be elaborated here. For all the fixed connections mentioned above, welding is preferred. Although embodiments of this utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this utility model. The scope of this utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor lead cutting device, comprising a worktable (1), characterized in that: The workbench (1) has mounting seats (2) slidably provided on both sides of the upper end face. Both mounting seats (2) have cutting grooves (3) on their upper ends. Both mounting seats (2) have clamping seats (4) hinged to their rear sides. Both sides of the upper end face of the workbench (1) have fixing plates (5). Both fixing plates (5) and mounting seats (2) on the same side are connected to electric push rods (6). The workbench (1) has legs (7) at the four corners of its upper end face. The upper end face of the legs (7) has a top plate (8). The bottom end of the top plate (8) has a hydraulic cylinder (9). The bottom end of the hydraulic cylinder (9) is connected to a fixing seat (10). Both sides of the lower end face of the fixing seat (10) have cutting blades (11) slidably provided. Both cutting blades (11) are set corresponding to the cutting grooves (3).

2. The semiconductor lead chamfering device according to claim 1, characterized in that: The upper surfaces of the two cutting blades (11) are provided with adjustment plates (12), and the bottom of the fixed base (10) is provided with adjustment grooves (13) corresponding to the two adjustment plates (12).

3. The semiconductor lead chamfering device according to claim 2, characterized in that: An adjusting rod (14) is rotatably provided inside the adjusting groove (13). The adjusting rod (14) and the adjusting plate (12) are threadedly connected. The internal threads of the two adjusting plates (12) are arranged in opposite directions. One side of the adjusting rod (14) extends outward and passes through the fixed seat (10). An adjusting motor (15) is connected to the outer end of the adjusting rod (14).

4. The semiconductor lead chamfering device according to claim 2, characterized in that: The adjustment groove (13) is symmetrically provided with guide rods (16), and guide holes (17) are opened on both adjustment plates (12) corresponding to multiple guide rods (16).

5. The semiconductor lead chamfering device according to claim 1, characterized in that: The workbench (1) has a discharge trough (18) on the rear side of its upper end face. The discharge trough (18) extends rearward through the workbench (1). The workbench (1) has a collection box (19) detachably provided on its rear end face.

6. The semiconductor lead chamfering device according to claim 5, characterized in that: The collection box (19) is provided with positioning rods (20) at the four corners of its lower end face, and the workbench (1) is provided with a positioning plate (21) at the bottom of its rear end face. The positioning plate (21) is provided with positioning holes (22) corresponding to the multiple positioning rods (20).

7. The semiconductor lead chamfering device according to claim 1, characterized in that: Both clamping seats (4) have locking plates (23) on their front ends. Both locking plates (23) have locking holes (24). Locking rods (25) are provided inside the locking holes (24). The locking rods (25) and locking holes (24) are threaded together. Both mounting seats (2) have locking holes (26) on their front ends corresponding to the locking rods (25).