Temperature control type electroplating equipment

Abstract

The utility model discloses temperature control type electroplating equipment, which relates to the technical field of electroplating, and comprises a bottom plate and an electroplating pool, a temperature alarm is arranged on the electroplating pool, a support column is arranged at the top of the bottom plate, a fixed plate is arranged at the top of the support column, the electroplating pool is arranged on the fixed plate, a fixed box is arranged at the bottom of the fixed plate, and a temperature sensor is arranged on the fixed box. The electroplating pool is arranged in the fixing box, a cooling mechanism used for cooling the electroplating pool is arranged at the top of the bottom plate, the cooling mechanism is arranged on the fixing box, a lifting mechanism used for height adjustment is arranged at the top of the fixing plate, and a rotating mechanism used for containing workpieces and rotating circumferentially is arranged on the lifting mechanism. The lifting mechanism comprises two fixing frames, and the fixing frames are fixedly mounted at the top of the fixing plate, so that the electroplating liquid can be conveniently cooled and can be stirred, the electroplating quality is improved, the operation is simple, and the practicability is high.

Description

A temperature-controlled electroplating equipment Technical Field

[0001] This utility model relates to the field of electroplating technology, specifically to a temperature-controlled electroplating device. Background Technology

[0002] Electroplating is a technique that uses electrolysis to form a metal coating on the surface of an object. Through electrolysis, a layer of metal (or other substance) is deposited on the surface of the object to be plated (cathode) to form a coating. In this process, metal ions in the electroplating solution move towards the cathode under the action of an electric field and gain electrons on the cathode surface and are deposited. Chinese Patent Publication No. CN220703829 U discloses a temperature control device for an electroplating production line, which relates to the field of electroplating production. The temperature control device for the electroplating production line includes a top plate, with support legs fixedly connected to the four corners of the lower surface of the top plate. A square groove is opened on the upper surface of the top plate, and an electroplating tank is fixedly connected above the square groove on the upper surface of the top plate. An annular groove is opened on the lower surface of the electroplating tank, and an alarm is fixedly connected to the lower surface of the electroplating tank. Limit blocks are fixedly connected to the middle of the outer surface of each support leg, and a movable plate is set above the limit blocks on the outer surface of the support leg.

[0003] In the above technical solution, although the cooling water is brought into contact with the electroplating tank to cool the electroplating solution, the heat dissipation is slow, which affects the processing efficiency. In addition, after the cooling water is used, the temperature of the cooling water will rise due to heat conduction. The equipment simply transfers and cleans the cooling water and adds it for the next use. This operation method is quite troublesome and increases the workload of the staff.

[0004] Therefore, a temperature-controlled electroplating device is proposed. Summary of the Invention

[0005] The purpose of this utility model is to provide a temperature-controlled electroplating device in order to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model specifically adopts the following technical solution:

[0007] A temperature-controlled electroplating device includes a base plate and an electroplating tank. A temperature alarm is installed on the electroplating tank. A support column is installed on the top of the base plate, and a fixed plate is installed on the top of the support column. The electroplating tank is mounted on the fixed plate. A fixed box is installed at the bottom of the fixed plate, and the electroplating tank is located inside the fixed box. A cooling mechanism for cooling the electroplating tank is installed on the top of the base plate and is mounted on the fixed box. A lifting mechanism for height adjustment is installed on the top of the fixed plate, and a rotating mechanism for placing and rotating workpieces is installed on the lifting mechanism.

[0008] Furthermore, the cooling mechanism includes two mounting plates, which are symmetrically fixedly installed at the bottom of the fixed box. Each mounting plate is equipped with a water pump, and the water pumps are connected to the fixed box by pipes. A water tank is fixedly installed on the top of the base plate, a bracket is fixedly installed on the top of the base plate, and a water tank is fixedly installed on the top of the bracket. A water outlet pipe is fixedly installed on the left side of the water tank, and the water outlet pipe corresponds to the water tank. A solenoid valve is installed on the outside of the water outlet pipe. Each of the two water pumps is equipped with a connecting pipe, and the two connecting pipes are respectively installed inside the water tank and the water tank.

[0009] Furthermore, a U-shaped plate is fixedly installed on the top of the water tank 2, and a motor 1 is provided on the top of the U-shaped plate. The output end of the motor 1 is provided with connecting fan blades.

[0010] Furthermore, a stirring rod is fixedly installed at the bottom of the connecting fan blade, and the stirring rod is located inside the water tank.

[0011] Furthermore, the lifting mechanism includes two fixed frames, which are fixedly installed on the top of the fixed plate. A one-way screw is rotatably installed inside the left fixed frame, and a cylinder is fixedly installed inside the right fixed frame. A lifting plate is threaded onto the outer wall of the one-way screw, and the lifting plate is slidably installed on the outer wall of the cylinder. A second motor is provided at the top of the left fixed frame, and the one-way screw is located at the output end of the second motor.

[0012] Furthermore, the rotating mechanism includes a third motor, which is located on the top of the lifting plate. The output end of the third motor is provided with a connecting rod, and a sieve frame is fixedly provided at the bottom of the connecting rod. Four connecting plates are fixedly installed on the sieve frame.

[0013] The beneficial effects of this utility model are as follows:

[0014] This invention, through the arrangement of a cooling mechanism, a lifting mechanism, and a rotating mechanism, addresses the issue that during use, the temperature of the electroplating solution rises due to prolonged exposure to current. At this point, a temperature alarm sounds. The cooling mechanism then delivers cooling water to a fixed tank, bringing the water into contact with the electroplating bath for water cooling and lowering the solution's temperature. The lifting mechanism adjusts the height of the rotating mechanism to stir the electrolyte, accelerating the temperature reduction process. After the electrolyte temperature has decreased, the cooling water in the fixed tank is extracted and collected by the cooling mechanism, then further cooled by stirring and blowing air for future use. The lifting mechanism... Reset the rotating mechanism, place the workpiece inside, and then adjust the height of the rotating mechanism using the lifting mechanism to bring the workpiece into contact with the electroplating solution. At this point, the rotating mechanism drives the workpiece to rotate and stirs the electroplating solution, ensuring that the copper ions and additives in the solution are evenly distributed. This prevents uneven plating caused by local concentration differences. During the electroplating process, the electrode reaction will generate gas. Stirring can help these bubbles quickly detach from the surface of the workpiece, avoiding plating defects or pinholes caused by bubbles, thus improving the plating quality. This allows for easy cooling of the electroplating solution and stirring of the solution, improving electroplating quality. The operation is simple and highly practical. Attached Figure Description

[0015] Figure 1 is a three-dimensional structural diagram of this utility model;

[0016] Figure 2 is a partial cross-sectional view of the present invention;

[0017] Figure 3 is a schematic diagram of the unidirectional lead screw of this utility model.

[0018] Reference numerals: 1. Base plate; 2. Support column; 3. Fixing plate; 4. Electroplating tank; 5. Fixing box; 6. Cooling mechanism; 601. Mounting plate; 602. Water pump; 603. Connecting pipe; 604. Water tank one; 605. Bracket; 606. Water tank two; 607. Water outlet pipe; 608. Solenoid valve; 609. U-shaped plate; 610. Motor one; 611. Connecting fan blade; 612. Stirring rod; 7. Lifting mechanism; 701. Fixing frame; 702. One-way lead screw; 703. Cylinder; 704. Lifting plate; 705. Motor two; 8. Rotating mechanism; 801. Motor three; 802. Connecting rod; 803. Slotted frame; 804. Connecting plate. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0021] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0022] The electrical components mentioned in this article are all connected to an external main controller and 220V AC mains power, and the main controller can be a conventional known device such as a computer that can be used for control.

[0023] In the description of the embodiments of this utility model, it should be noted that the terms "inner", "outer", "upper", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that the utility model product is usually placed in during use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] As shown in Figures 1-2, a temperature-controlled electroplating device includes a base plate 1 and an electroplating tank 4. A temperature alarm is installed on the electroplating tank 4. A support column 2 is installed on the top of the base plate 1, and a fixing plate 3 is installed on the top of the support column 2. The electroplating tank 4 is mounted on the fixing plate 3. A fixing box 5 is installed at the bottom of the fixing plate 3, and the electroplating tank 4 is located inside the fixing box 5. A cooling mechanism 6 for cooling the electroplating tank 4 is installed on the top of the base plate 1, and the cooling mechanism 6 is mounted on the fixing box 5. A lifting mechanism 7 for height adjustment is installed on the top of the fixing plate 3. A rotating mechanism 8 for placing and rotating workpieces is installed on the lifting mechanism 7. In this embodiment, the temperature alarm is a device for monitoring temperature changes. Its core function is to issue an alarm by detecting changes in ambient temperature. When the ambient temperature exceeds or falls below a preset safety range, the temperature alarm will automatically activate. This is existing technology. During use, the temperature of the electroplating solution will rise due to prolonged exposure to current, at which point the temperature alarm will sound. The cooling mechanism 6 can then cool the solution. Water is delivered to the fixed tank 5, bringing the cooling water into contact with the electroplating tank 4 to cool the electroplating solution. At this time, the height of the rotating mechanism 8 can be adjusted via the lifting mechanism 7 to stir the electrolyte, accelerating its temperature drop. After the electrolyte temperature drops, the cooling water in the fixed tank 5 is extracted and collected via the cooling mechanism 6, then stirred and blown to cool it rapidly for future use. The rotating mechanism 8 is then reset via the lifting mechanism 7, and the workpiece is placed inside it. The height of the rotating mechanism 8 is adjusted again via the lifting mechanism 7 to bring the workpiece into contact with the electroplating solution. The rotating mechanism 8 then rotates the workpiece and stirs the electroplating solution, ensuring a uniform distribution of copper ions and additives, preventing uneven plating caused by localized concentration differences. Furthermore, during electroplating, the electrode reaction generates gas; stirring helps these bubbles quickly detach from the surface of the workpiece, preventing plating defects or pinholes caused by bubbles, thus improving plating quality. This method facilitates cooling and stirring of the electroplating solution, improving electroplating quality. It is simple to operate and highly practical.

[0025] As shown in Figure 1-2, the cooling mechanism 6 includes two mounting plates 601, which are symmetrically fixedly installed at the bottom of the fixed box 5. Each mounting plate 601 is equipped with a water pump 602, and the water pumps 602 are connected to the fixed box 5 via pipes. A water tank 1 604 is fixedly installed on the top of the base plate 1, a bracket 605 is fixedly installed on the top of the base plate 1, and a water tank 2 606 is fixedly installed on the top of the bracket 605. A water outlet pipe 607 is fixedly installed on the left side of the water tank 2 606, corresponding to the water tank 1 604. A solenoid valve 608 is installed on the outside of the water outlet pipe 607. Each water pump 602 is equipped with a connecting pipe 603, and the two connecting pipes 603 are respectively located inside the first water tank 604 and the second water tank 606. In this embodiment, the left water pump 602 is started to draw the cooling water inside the first water tank 604 into the fixed tank 5, so that the cooling water comes into contact with the electroplating bath 4 to cool the electroplating solution. After the temperature drops, the cooling water in the fixed tank 5 can be drawn into the second water tank 606 by the right water pump 602 for the next use. The outlet pipe 607 and the solenoid valve 608 can facilitate the delivery of the cooling water in the second water tank 606 to the first water tank 604.

[0026] As shown in Figure 2, a U-shaped plate 609 is fixedly installed on the top of the second water tank 606. A motor 610 is installed on the top of the U-shaped plate 609. A connecting fan blade 611 is installed at the output end of the motor 610. In this embodiment, by starting the motor 610, the connecting fan blade 611 is driven to rotate, blowing air into the cooling water in the second water tank 606 to accelerate the efficiency of natural cooling.

[0027] As shown in Figure 2, a stirring rod 612 is fixedly installed at the bottom of the connecting fan blade 611, and the stirring rod 612 is installed inside the water tank 606. In this embodiment, when the connecting fan blade 611 rotates, the stirring rod 612 rotates accordingly to stir the cooling water and improve heat dissipation.

[0028] As shown in Figures 1-3, the lifting mechanism 7 includes two fixed frames 701. The fixed frames 701 are fixedly installed on the top of the fixed plate 3. A one-way screw 702 is rotatably installed inside the left fixed frame 701, and a cylinder 703 is fixedly installed inside the right fixed frame 701. A lifting plate 704 is threaded onto the outer wall of the one-way screw 702, and the lifting plate 704 is slidably installed on the outer wall of the cylinder 703. A second motor 705 is provided on the top of the left fixed frame 701, and the one-way screw 702 is located on the output end of the second motor 705. In this embodiment, the second motor 705 is started, which drives the one-way screw 702 to rotate, so that the lifting plate 704 moves longitudinally with the cooperation of the cylinder 703, thereby adjusting the height of the lifting plate 704.

[0029] As shown in Figures 1-3, the rotating mechanism 8 includes a motor 801, which is located on top of the lifting plate 704. A connecting rod 802 is provided at the output end of the motor 801, and a sieve 803 is fixedly provided at the bottom of the connecting rod 802. Four connecting plates 804 are fixedly installed on the sieve 803. In this embodiment, when the lifting plate 704 moves downward, the motor 801, connecting rod 802, sieve 803, and connecting plates 804 move accordingly, immersing the sieve 803 and connecting plates 804 into the electroplating solution. When the motor 801 is started, it drives the connecting rod 802, sieve 803, and connecting plates 804 to rotate. The sieve 803 and connecting plates 804 will stir the electroplating solution and drive the workpiece to rotate, thereby improving the electroplating quality.

[0030] In summary, during use, the temperature of the electroplating solution will rise due to prolonged exposure to current. At this point, the temperature alarm will sound. Cooling water can then be supplied to the fixed tank 5 via the cooling mechanism 6, bringing it into contact with the electroplating tank 4 for water cooling. The height of the rotating mechanism 8 can be adjusted via the lifting mechanism 7 to agitate the electrolyte, accelerating the temperature drop. After the electrolyte temperature has decreased, the cooling water in the fixed tank 5 is extracted and collected by the cooling mechanism 6, then agitated and cooled rapidly for future use. Finally, the rotating mechanism 8 is reset via the lifting mechanism 7, and the workpiece is placed... Inside the rotating mechanism 8, the height of the rotating mechanism 8 is adjusted by the lifting mechanism 7 to bring the workpiece into contact with the electroplating solution. At this time, the rotating mechanism 8 drives the workpiece to rotate and stirs the electroplating solution, ensuring a uniform distribution of copper ions and additives, preventing uneven plating caused by localized concentration differences. Furthermore, during the electroplating process, the electrode reaction generates gas; stirring helps these bubbles quickly detach from the workpiece surface, avoiding plating defects or pinholes caused by bubbles, thus improving plating quality. This allows for easy cooling of the electroplating solution and stirring, improving electroplating quality. The operation is simple and highly practical. Start the left water pump 602. The cooling water inside water tank 604 is pumped into fixed tank 5, bringing it into contact with the electroplating bath 4 to cool the electroplating solution. Once the temperature drops, the cooling water in fixed tank 5 can be pumped into water tank 606 by water pump 602 on the right for future use. The outlet pipe 607 and solenoid valve 608 facilitate the transfer of cooling water from water tank 606 to water tank 604. By starting motor 610, the connecting fan blade 611 is rotated to blow air onto the cooling water in water tank 606, accelerating the natural cooling process. When the connecting fan blade 611 rotates, the stirring rod 612 also rotates, further agitating the cooling water. Stirring improves heat dissipation. Starting motor 2 705 drives the one-way lead screw 702 to rotate, causing the lifting plate 704 to move longitudinally with the help of the cylinder 703, thereby adjusting the height of the lifting plate 704. When the lifting plate 704 moves downward, motor 3 801, connecting rod 802, stencil 803, and connecting plate 804 move accordingly, immersing the stencil 803 and connecting plate 804 in the electroplating solution. Starting motor 3 801 drives the connecting rod 802, stencil 803, and connecting plate 804 to rotate. The stencil 803 and connecting plate 804 stir the electroplating solution and can also rotate the workpiece, improving the electroplating quality.

[0031] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A temperature-controlled electroplating device, comprising a base plate (1) and an electroplating tank (4), wherein a temperature alarm is provided on the electroplating tank (4), characterized in that, The base plate (1) is provided with a support column (2) at the top, and a fixing plate (3) is provided at the top of the support column (2). The electroplating tank (4) is provided on the fixing plate (3). The fixing box (5) is provided at the bottom of the fixing plate (3). The electroplating tank (4) is provided inside the fixing box (5). The base plate (1) is provided with a cooling mechanism (6) for cooling the electroplating tank (4) at the top. The cooling mechanism (6) is provided on the fixing box (5). The fixing plate (3) is provided with a lifting mechanism (7) for height adjustment. The lifting mechanism (7) is provided with a rotating mechanism (8) for placing workpieces and rotating them in a circular motion.

2. The temperature-controlled electroplating equipment according to claim 1, characterized in that, The cooling mechanism (6) includes two mounting plates (601), which are symmetrically fixedly installed at the bottom of the fixed box (5). Each mounting plate (601) is equipped with a water pump (602), and the water pumps (602) are connected to the fixed box (5) via pipes. A water tank (604) is fixedly installed on the top of the base plate (1), and a bracket (605) is fixedly installed on the top of the base plate (1). A second water tank (606) is fixedly installed on the top of the water tank. A water outlet pipe (607) is fixedly installed on the left side of the second water tank (606), and the water outlet pipe (607) corresponds to the first water tank (604). A solenoid valve (608) is provided on the outside of the water outlet pipe (607). A connecting pipe (603) is provided on each of the two water pumps (602), and the two connecting pipes (603) are respectively located inside the first water tank (604) and the second water tank (606).

3. The temperature-controlled electroplating equipment according to claim 2, characterized in that, A U-shaped plate (609) is fixedly installed on the top of the second water tank (606), and a motor (610) is provided on the top of the U-shaped plate (609). A connecting fan blade (611) is provided at the output end of the motor (610).

4. The temperature-controlled electroplating equipment according to claim 3, characterized in that, A stirring rod (612) is fixedly installed at the bottom of the connecting fan blade (611), and the stirring rod (612) is installed inside the water tank (606).

5. The temperature-controlled electroplating equipment according to claim 1, characterized in that, The lifting mechanism (7) includes two fixed frames (701). The fixed frames (701) are fixedly installed on the top of the fixed plate (3). A one-way screw (702) is rotatably installed inside the left fixed frame (701). A cylinder (703) is fixedly installed inside the right fixed frame (701). A lifting plate (704) is threaded on the outer wall of the one-way screw (702), and the lifting plate (704) is slidably installed on the outer wall of the cylinder (703). A second motor (705) is provided on the top of the left fixed frame (701), and the one-way screw (702) is provided on the output end of the second motor (705).

6. The temperature-controlled electroplating equipment according to claim 5, characterized in that, The rotating mechanism (8) includes a motor three (801), which is located on the top of the lifting plate (704). A connecting rod (802) is provided at the output end of the motor three (801), and a sieve frame (803) is fixedly provided at the bottom of the connecting rod (802). Four connecting plates (804) are fixedly installed on the sieve frame (803).

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