Silicon wafer cleaning equipment

Abstract

The utility model provides silicon wafer cleaning equipment which comprises a cleaning tank assembly, the cleaning tank assembly comprises a first tank body structure and a second tank body structure, the second tank body structure is connected with the first tank body structure, and the second tank body structure is arranged on the circumferential outer side of the first tank body structure; the pipeline assembly is communicated with the cleaning tank assembly; and the liquid storage assembly is communicated with the pipeline assembly. According to the technical scheme provided by the invention, the problem of liquid medicine waste in the HTJ battery cleaning and texturing process in the prior art is effectively solved.

Description

Technical Field

[0001] This application relates to the field of solar cell processing technology, and in particular to a silicon wafer cleaning device. Background Technology

[0002] The manufacturing process of HJT (Heterojunction with Intrinsic Thin-layer) batteries differs significantly from other battery processes, mainly including four steps: cleaning and texturing, amorphous silicon thin film deposition, transparent conductive film deposition, and screen printing.

[0003] Texturing is the first step in HJT cell production, primarily removing oil, impurities, and mechanical damage layers from the silicon wafer surface. N-type monocrystalline silicon wafers are immersed in an alkaline solution of a specific concentration. Through process control, fine, uniform pyramidal patterns are etched along specific crystal orientations to form a textured surface on the silicon wafer. This reduces light reflection; when light is incident on one slope, it is reflected to another, resulting in secondary or multiple absorption, thus increasing the absorption rate.

[0004] Currently, when HJT cleaning and texturing equipment malfunctions, it is necessary to separate the silicon wafers from the cleaning solution in a timely manner to avoid excessive corrosion of the silicon wafers due to prolonged immersion in the solution, which would affect the quality of the silicon wafers. The usual methods are to directly discharge the solution or retrieve the silicon wafers. However, these methods result in waste of the solution and high production costs. Utility Model Content

[0005] One of the technical problems this application aims to solve is the waste of chemical solution during the cleaning and texturing process of HTJ batteries.

[0006] To address the aforementioned technical problems, this application provides a silicon wafer cleaning device.

[0007] A silicon wafer cleaning device according to this application includes: a cleaning tank assembly, the cleaning tank assembly including a first tank structure and a second tank structure, the second tank structure being connected to the first tank structure and disposed on the circumferential outer side of the first tank structure; a pipeline assembly, the pipeline assembly being connected to the cleaning tank assembly; and a liquid storage assembly, the liquid storage assembly being connected to the pipeline assembly.

[0008] In some embodiments, the piping assembly includes a liquid pump structure, a first piping structure, and a second piping structure. A first end of the first piping structure is connected to the liquid pump structure, a second end of the first piping structure is connected to the first tank structure, a first end of the second piping structure is connected to the liquid storage assembly, and a second end of the second piping structure is connected to the liquid pump structure.

[0009] In some embodiments, the first trough structure includes a first receiving section and a second receiving section, the first receiving section being connected to the second receiving section, and the projection of the second receiving section in the vertical direction being located inside the projection of the first receiving section in the vertical direction.

[0010] In some embodiments, the first pipeline structure includes a first pipe segment and a second pipe segment. The first pipe segment is connected to the liquid pump structure. The first pipe segment is partially located within the second receiving section. The second pipe segment is connected to the first pipe segment and is connected to the inner wall of the first receiving section. The second pipe segment is arranged in a vertical direction.

[0011] In some embodiments, the height of the second trough structure in the vertical direction is higher than the height of the first trough structure in the vertical direction.

[0012] In some embodiments, the piping assembly further includes a third piping structure, a first end of which is connected to the liquid pump structure, and a second end of which is connected to the second tank structure.

[0013] In some embodiments, the piping assembly further includes a liquid outlet piping structure, a first end of which is connected to the first tank structure, and a second end of which is connected to the liquid storage assembly.

[0014] In some embodiments, the pipeline assembly further includes a liquid inlet pipeline structure, a first end of which is connected to the liquid storage assembly, and a second end of which has a first branch and a second branch, the first branch being connected to a water source and the second branch being connected to a drug storage device.

[0015] In some embodiments, the piping assembly further includes a drain pipe structure, the first end of which has a third branch and a fourth branch, the third branch being connected to the first tank structure and the fourth branch being connected to the liquid storage assembly.

[0016] In some embodiments, the liquid storage assembly includes a liquid storage structure and a heating element, wherein the heating element is connected to the liquid storage structure.

[0017] Through the above technical solution, the silicon wafer cleaning equipment provided in this application, when a problem occurs in the cleaning and texturing process within the first tank structure, the chemical solution within the first tank structure enters the storage component through the pipeline assembly. The storage component temporarily stores the chemical solution, preventing the silicon wafers from becoming too thin due to prolonged immersion in the chemical solution. Once the problem in the cleaning and texturing process is resolved, the temporarily stored chemical solution in the storage component returns to the cleaning tank assembly through the pipeline assembly to continue the cleaning and texturing process, preventing chemical waste. Simultaneously, a second tank structure is provided outside the first tank structure to prevent the chemical solution within the first tank structure from overflowing to the outside of the equipment, further avoiding chemical waste. The technical solution of this application effectively solves the problem of chemical waste in the prior art during the cleaning and texturing process of HTJ batteries. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of the silicon wafer cleaning equipment disclosed in Embodiment 1 of this application is shown;

[0020] Figure 2 It shows Figure 1 A schematic diagram of the main structure of a silicon wafer cleaning equipment;

[0021] Figure 3 It shows Figure 1 A top view of the silicon wafer cleaning equipment;

[0022] Figure 4 It shows Figure 1 A schematic diagram of the left-hand structure of a silicon wafer cleaning equipment;

[0023] Figure 5 It shows Figure 1 A schematic diagram of the piping components of a silicon wafer cleaning equipment;

[0024] Figure 6 It shows Figure 1 A schematic diagram of the liquid inlet pipeline structure of a silicon wafer cleaning equipment;

[0025] Figure 7 It shows Figure 1 A cross-sectional view of the liquid storage component of a silicon wafer cleaning equipment;

[0026] Figure 8 It shows Figure 1A cross-sectional view of the cleaning tank assembly of a silicon wafer cleaning equipment.

[0027] Explanation of reference numerals in the attached figures:

[0028] 10. Cleaning tank assembly; 11. First tank structure; 111. First receiving section; 112. Second receiving section; 12. Second tank structure; 20. Piping assembly; 21. Liquid pump structure; 22. First piping structure; 221. First pipe section; 222. Second pipe section; 23. Second piping structure; 24. Third piping structure; 25. Liquid outlet piping structure; 26. Liquid inlet piping structure; 261. First branch; 262. Second branch; 27. Liquid draining piping structure; 271. Third branch; 272. Fourth branch; 30. Liquid storage assembly; 31. Liquid storage structure; 32. Heating unit. Detailed Implementation

[0029] The embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of this application by way of example, but should not be used to limit the scope of this application. This application can be implemented in many different forms and is not limited to the specific embodiments of the application herein, but includes all technical solutions falling within the scope of the claims.

[0030] These embodiments are provided to make the application thorough and complete, and to fully express the scope of the application to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​illustrated in these embodiments should be interpreted as merely exemplary and not as limiting.

[0031] It should be noted that, in the description of this application, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0032] Furthermore, the terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after it, and do not exclude the possibility of encompassing other elements as well.

[0033] It should also be noted that, in the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application depending on the specific circumstances. When a specific device is described as being located between a first device and a second device, an intermediary device may or may not be present between the specific device and the first or second device.

[0034] All terms used in this application have the same meaning as understood by one of ordinary skill in the art to which this application pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0035] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0036] like Figures 1 to 8 As shown, the silicon wafer cleaning equipment disclosed in Embodiment 1 of this application includes: a cleaning tank assembly 10, a pipeline assembly 20, and a liquid storage assembly 30. The cleaning tank assembly 10 includes a first tank structure 11 and a second tank structure 12. The second tank structure 12 is connected to the first tank structure 11 and is disposed on the circumferential outer side of the first tank structure 11. The pipeline assembly 20 is connected to the cleaning tank assembly 10, and the liquid storage assembly 30 is connected to the pipeline assembly 20.

[0037] Applying the technical solution of Embodiment 1, when a problem occurs in the cleaning and texturing process within the first tank structure 11, the chemical solution within the first tank structure 11 flows through the pipeline assembly 20 into the storage assembly 30. The storage assembly 30 temporarily stores the chemical solution to prevent the silicon wafers from becoming too thin due to prolonged immersion in the chemical solution. Once the problem in the cleaning and texturing process is resolved, the chemical solution temporarily stored in the storage assembly 30 returns to the cleaning tank assembly 10 through the pipeline assembly 20 to continue the cleaning and texturing process, thus preventing waste of the chemical solution. Simultaneously, a second tank structure 12 is provided outside the first tank structure 11 to prevent the chemical solution within the first tank structure 11 from overflowing to the outside of the equipment, further avoiding waste. The technical solution of Embodiment 1 effectively solves the problem of chemical solution waste in the prior art during the cleaning and texturing process of HTJ batteries.

[0038] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 8 As shown, in the technical solution of Embodiment 1, the pipeline assembly 20 includes a liquid pump structure 21, a first pipeline structure 22, and a second pipeline structure 23. The first end of the first pipeline structure 22 is connected to the liquid pump structure 21, and the second end of the first pipeline structure 22 is connected to the first tank structure 11. The first end of the second pipeline structure 23 is connected to the liquid storage assembly 30, and the second end of the second pipeline structure 23 is connected to the liquid pump structure 21. Under the action of the liquid pump structure 21, the liquid located in the liquid storage assembly 30 enters the liquid pump structure 21 through the second pipeline structure 23, and then enters the first tank structure 11 through the first pipeline structure 22. The first pipeline structure 22, the second pipeline structure 23, and the liquid pump structure 21 together transport the temporarily stored medicine in the liquid storage assembly 30 back to the first tank structure 11 for continued use, avoiding waste of the medicine.

[0039] like Figure 1 , Figure 3 , Figure 4 , Figure 6 and Figure 8 As shown, in the technical solution of Embodiment 1, the first tank structure 11 includes a first receiving section 111 and a second receiving section 112. The first receiving section 111 and the second receiving section 112 are connected. The vertical projection of the second receiving section 112 is located inside the vertical projection of the first receiving section 111. The vertical height of the first receiving section 111 is higher than that of the second receiving section 112. Since the vertical projection of the second receiving section 112 is located inside the vertical projection of the first receiving section 111, a stepped structure is formed. When the silicon wafer basket is placed in the first tank structure 11, the stepped structure limits the silicon wafer basket, ensuring that the silicon wafer basket is located in the first receiving section 111 and that the silicon wafer basket does not enter the second receiving section 112 and come into contact with the first pipeline structure 22 located below, thus preventing the silicon wafer basket from being placed at an angle. In the technical solution of Embodiment 1, the cross-sectional area of ​​the second receiving section 112 gradually decreases along the direction from approaching to moving away from the first receiving section 111, that is, the internal capacity of the second receiving section 112 decreases. Since the silicon wafer basket is not set in the second receiving section 112, reducing the volume of liquid medicine that the second receiving section 112 can hold is beneficial to reducing the waste of liquid medicine and has better economic benefits.

[0040] like Figure 3 and Figure 8As shown, in the technical solution of Embodiment 1, the first pipeline structure 22 includes a first pipe section 221 and a second pipe section 222. The first pipe section 221 is connected to the liquid pump structure 21. The first pipe section 221 is partially located in the second receiving section 112. The second pipe section 222 is connected to the first pipe section 221. The second pipe section 222 is connected to the inner wall of the first receiving section 111. The second pipe section 222 is arranged in the vertical direction. The first pipe segment 221 is disposed within the second receiving section 112, without interfering with the placement of the silicon wafer basket. The second pipe segment 222 is disposed vertically, with the end of the second pipe segment 222 furthest from the first pipe segment 221 having a vertical height lower than the vertical height of the liquid level in the first tank structure 11. Furthermore, when the silicon wafer basket is located within the first receiving section 111, the end of the second pipe segment 222 furthest from the first pipe segment 221 has a vertical height higher than the vertical height of the silicon wafer basket. This arrangement of the second pipe segment 222 results in a slower liquid outflow rate and less impact on liquid fluctuations within the first tank structure 11, reducing the influence on the silicon wafer cleaning and texturing process and resulting in better silicon wafer surface quality. In the technical solution of Embodiment 1, both the first pipe segment 221 and the second pipe segment 222 are included in pairs to increase the flow rate of the liquid into the first tank structure 11.

[0041] like Figure 1 , Figure 3 and Figure 8 As shown, in the technical solution of Embodiment 1, the vertical height of the second tank structure 12 is higher than that of the first tank structure 11. During the cleaning process, the cleaning solution fluctuates. When there is too much cleaning solution in the first tank structure 11, the solution may overflow. The highly alkaline solution can cause corrosion to the outside of the equipment and the ground, and is difficult to clean. It also poses a certain health hazard to the workers. The design of the second tank structure 12 prevents the cleaning solution from flowing directly outside the equipment and allows for the recovery of the solution, thus avoiding the above problems and reducing the waste of the cleaning solution.

[0042] like Figures 1 to 5As shown, in the technical solution of Embodiment 1, the pipeline assembly 20 further includes a third pipeline structure 24. The first end of the third pipeline structure 24 is connected to the liquid pump structure 21, and the second end of the third pipeline structure 24 is connected to the second tank structure 12. Under the action of the liquid pump structure 21, the liquid medicine in the second tank structure 12 enters the liquid pump structure 21 along the third pipeline structure 24, and then returns to the first tank structure 11 through the first pipeline structure 22, realizing the recovery of overflow liquid medicine, avoiding waste of liquid medicine, and reducing production costs. A first valve is installed on the first pipeline structure 22, a second valve is installed on the second pipeline structure 23, and a third valve is installed on the third pipeline structure 24. Opening the first and second valves and closing the third valve activates the liquid pump structure 21, allowing the liquid to enter the first tank structure 11 from the storage component 30. Opening the first and third valves and closing the second valve activates the liquid pump structure 21, allowing the liquid to enter the first tank structure 11 from the second tank structure 12. By controlling the opening and closing of the valves, the flow of liquid in the second tank structure 12 and the storage component 30 can be controlled by a single liquid pump, simplifying the overall equipment structure, reducing operational and control difficulties, and lowering equipment costs.

[0043] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 7 and Figure 8 As shown, in the technical solution of Embodiment 1, the pipeline assembly 20 further includes a liquid outlet pipeline structure 25. The first end of the liquid outlet pipeline structure 25 is connected to the first tank structure 11, and the second end of the liquid outlet pipeline structure 25 is connected to the liquid storage assembly 30. The vertical height of the cleaning tank assembly 10 is higher than that of the liquid storage assembly 30, and the cleaning tank assembly 10 is located directly above the liquid storage assembly 30. The liquid outlet pipeline structure 25 is arranged vertically, and a fourth valve is provided on the liquid outlet pipeline structure 25. When the fourth valve is opened, under the action of gravity, the liquid medicine in the first tank structure 11 flows directly into the liquid storage assembly 30 along the liquid outlet pipeline structure 25. When a problem occurs in the cleaning and texturing process in the first tank structure 11, opening the fourth valve can quickly discharge the liquid medicine in the first tank structure 11. The liquid outlet pipe structure 25 includes multiple structures, and the arrangement of multiple liquid outlet pipe structures 25 further improves the liquid discharge efficiency in the first tank structure 11; and when some of the fourth valves malfunction, it does not affect the normal discharge of the liquid, thus avoiding the problem of silicon wafers being immersed in the liquid for a long time.

[0044] like Figure 2 , Figure 3 and Figure 6As shown, in the technical solution of Embodiment 1, the pipeline assembly 20 further includes a liquid inlet pipeline structure 26. The first end of the liquid inlet pipeline structure 26 is connected to the liquid storage assembly 30, and the second end of the liquid inlet pipeline structure 26 has a first branch 261 and a second branch 262. The first branch 261 is connected to a water source, and the second branch 262 is connected to a chemical storage device. The chemical storage device contains a concentrated chemical solution. The concentrated chemical solution enters the liquid storage assembly 30 through the second branch 262, and water enters the liquid storage assembly 30 through the first branch 261. The water and the concentrated chemical solution mix in the liquid storage assembly 30 to form a chemical solution suitable for the silicon wafer texturing process, which is then pumped into the first tank structure 11 under the action of the liquid pump structure 21. A fifth valve is provided on the first branch 261, and a sixth valve is provided on the second branch 262. By controlling the opening time or the opening degree of the fifth and sixth valves, the volume of liquid entering the liquid storage assembly 30 can be controlled, thereby controlling the concentration of the chemical solution to meet the requirements of the cleaning and texturing process. The liquid storage component 30 is equipped with a liquid level detection structure. The liquid level detection structure detects the liquid level in the liquid storage component 30. If the liquid level is too low, water and concentrated liquid need to be introduced into the liquid storage component 30 through the liquid inlet pipe structure 26 until the liquid level is normal. This avoids insufficient liquid during the cleaning and texturing process, which would prevent the silicon wafer from being completely soaked and affect the surface quality of the silicon wafer.

[0045] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 7 and Figure 8 As shown, in the technical solution of Embodiment 1, the pipeline assembly 20 further includes a drain pipeline structure 27. The first end of the drain pipeline structure 27 has a third branch 271 and a fourth branch 272. The third branch 271 is connected to the first tank structure 11, and the fourth branch 272 is connected to the storage assembly 30. After several cleaning and texturing processes, the content of effective ingredients in the liquid decreases and can no longer meet the requirements of the cleaning and texturing process. Therefore, the waste liquid needs to be discharged from the equipment. The drain pipeline structure 27 is used to discharge the waste liquid. A seventh valve is provided on the third branch 271, and an eighth valve is provided on the fourth branch 272. When the seventh valve is open, the liquid in the first tank structure 11 is discharged from the equipment. When the eighth valve is open, the liquid in the storage assembly 30 is discharged from the equipment. The drain pipeline structure 27 facilitates the discharge of the liquid in the first tank structure 11 and the storage assembly 30 together, which facilitates the centralized treatment of waste liquid.

[0046] like Figures 1 to 8As shown, in the technical solution of Embodiment 1, the liquid storage assembly 30 includes a liquid storage structure 31 and a heating part 32, which is connected to the liquid storage structure 31. The heating part 32 is used to heat the liquid in the liquid storage structure 31, ensuring that the liquid in the liquid storage structure 31 always meets the temperature required for the cleaning and texturing process. Compared with the method of heating the liquid in the first tank structure 11, this improves the efficiency of the cleaning and texturing process, thereby increasing the production capacity per unit time and improving production efficiency. In the technical solution of Embodiment 1, the liquid storage assembly 30 also includes a sealing structure. The liquid storage structure 31 has an opening, and the sealing structure is correspondingly set to the opening. The sealing structure has a partially sealed state inside the opening and a state to be sealed away from the opening. When the sealing structure is in the sealed state, the setting of the sealing structure prevents external pollutants from entering the liquid storage structure 31 through the opening and contaminating the liquid. When the sealing structure is in the state to be sealed, it is convenient for workers to clean the inside of the liquid storage structure 31 in a timely manner through the opening, avoiding excessive deposition of substances generated by internal reactions that could cause blockage of the pipeline assembly 20.

[0047] The difference between the technical solution of Embodiment 2 and the technical solution of Embodiment 1 is that the liquid storage structure 31 includes two parts. The first pipeline structure 22, the second pipeline structure 23 and the heating part 32 each include two parts that correspond one-to-one with the liquid storage structure 31. The liquid inlet pipeline structure 26 is connected to the first liquid storage structure 31, and the liquid outlet pipeline structure 25 and the liquid drain pipeline structure 27 are connected to the second liquid storage structure 31. Before the texturing and cleaning process, concentrated chemical solution and water are mixed in a predetermined ratio and introduced into the first storage structure 31 through the inlet pipe structure 26, and preheated by the heating unit 32. After preparation, the silicon wafer is placed in the first tank structure 11, and the chemical solution in the first storage structure 31 enters the first tank structure 11 to contact the silicon wafer for the texturing and cleaning process. Simultaneously, the above steps are repeated, and the chemical solution for the next batch of silicon wafers is stored in the first storage structure 31. If a problem occurs during the texturing and cleaning process, the chemical solution is temporarily stored in the second storage structure 31 through the outlet pipe structure 25 to avoid waste. The heating unit 32 keeps the chemical solution warm. After the problem is resolved, the chemical solution in the second storage structure 31 returns to the first tank structure 11 to continue the texturing and cleaning process. The technical solution of Embodiment 2 enables continuous operation of the silicon wafer texturing and cleaning process, improving processing efficiency.

[0048] In summary, the detailed description of the technical solution of this application is as follows: The tank (silicon wafer cleaning equipment) of this application has a main tank (first tank structure 11) and a secondary tank (second tank structure 12) on the upper layer, and a storage tank (storage assembly 30) on the lower layer. The main tank is used for process wafer washing, the secondary tank is used for circulation with the main tank, and the storage tank is used for pre-mixing the solution and storing and recovering the solution in case of equipment failure. This application also includes a circulation pump (liquid pump structure 21). During production, the solution overflows from the main tank to the secondary tank, and the circulation pump pumps the solution from the secondary tank to the main tank; after the solution is pre-mixed in the storage tank, the solution is pumped to the main tank; after the failure is resolved, the solution is pumped back to the main tank. This application also includes multiple valves to achieve the above functions. During normal production, the second valve is closed, and the first and third valves are open to circulate between the main and secondary tanks; after pre-mixing the solution or resolving the failure, the third pneumatic valve is closed. The first and second pneumatic valves open to pump the liquid from the storage tank to the main tank. When the pump structure 21 is damaged, the first and third valves close, and the second valve opens, eliminating the need for draining during maintenance and replacement. The fourth valve drains the liquid from the main tank to the storage tank. The main tank drain valve (seventh valve) and the storage tank drain valve (eighth valve) are used to drain waste liquid from the tank. The storage tank heater (heating unit 32) is used to heat the liquid during pre-mixing. The water inlet valve (fifth valve) and the liquid inlet valve (sixth valve) are used for pre-mixing the liquid in the storage tank. This application solves the problem of excessively long waiting time for heating after liquid change in the texturing tank, thus improving production capacity; the problem of liquid waste when draining is required due to equipment malfunction or process timeout; the problem of silicon wafers being too thin and scrapped when draining is required due to equipment malfunction or process timeout; and the safety hazard of personnel coming into contact with the liquid during emergency repairs when equipment malfunctions prevent normal draining.

[0049] The embodiments of this application have now been described in detail. To avoid obscuring the concept of this application, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions of this application based on the above description.

[0050] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any manner.

Claims

1. A silicon wafer cleaning device, characterized in that, include: A cleaning tank assembly (10) includes a first tank structure (11) and a second tank structure (12), wherein the second tank structure (12) is connected to the first tank structure (11) and is disposed on the circumferential outer side of the first tank structure (11); Piping assembly (20), which is connected to the cleaning tank assembly (10); Liquid storage assembly (30) is connected to the pipeline assembly (20).

2. The silicon wafer cleaning equipment according to claim 1, characterized in that, The pipeline assembly (20) includes a liquid pump structure (21), a first pipeline structure (22), and a second pipeline structure (23). The first end of the first pipeline structure (22) is connected to the liquid pump structure (21), and the second end of the first pipeline structure (22) is connected to the first tank structure (11). The first end of the second pipeline structure (23) is connected to the liquid storage assembly (30), and the second end of the second pipeline structure (23) is connected to the liquid pump structure (21).

3. The silicon wafer cleaning equipment according to claim 2, characterized in that, The first trough structure (11) includes a first receiving section (111) and a second receiving section (112). The first receiving section (111) is connected to the second receiving section (112), and the projection of the second receiving section (112) in the vertical direction is located inside the projection of the first receiving section (111) in the vertical direction.

4. The silicon wafer cleaning equipment according to claim 3, characterized in that, The first pipeline structure (22) includes a first pipe section (221) and a second pipe section (222). The first pipe section (221) is connected to the liquid pump structure (21). The first pipe section (221) is partially located inside the second receiving section (112). The second pipe section (222) is connected to the first pipe section (221) and is connected to the inner wall of the first receiving section (111). The second pipe section (222) is arranged in a vertical direction.

5. The silicon wafer cleaning equipment according to claim 1, characterized in that, The height of the second trough structure (12) in the vertical direction is higher than the height of the first trough structure (11) in the vertical direction.

6. The silicon wafer cleaning equipment according to claim 2, characterized in that, The pipeline assembly (20) further includes a third pipeline structure (24), the first end of which is connected to the liquid pump structure (21), and the second end of which is connected to the second tank structure (12).

7. The silicon wafer cleaning equipment according to claim 1, characterized in that, The pipeline assembly (20) further includes a liquid outlet pipeline structure (25), the first end of which is connected to the first tank structure (11), and the second end of which is connected to the liquid storage assembly (30).

8. The silicon wafer cleaning equipment according to claim 1, characterized in that, The pipeline assembly (20) further includes a liquid inlet pipeline structure (26), the first end of which is connected to the liquid storage assembly (30), and the second end of which has a first branch (261) and a second branch (262), the first branch (261) being connected to a water source and the second branch (262) being connected to a drug storage device.

9. The silicon wafer cleaning equipment according to claim 1, characterized in that, The pipeline assembly (20) further includes a drain pipeline structure (27), the first end of which has a third branch (271) and a fourth branch (272). The third branch (271) is connected to the first tank structure (11), and the fourth branch (272) is connected to the liquid storage assembly (30).

10. The silicon wafer cleaning equipment according to any one of claims 1 to 9, characterized in that, The liquid storage assembly (30) includes a liquid storage structure (31) and a heating part (32), wherein the heating part (32) is connected to the liquid storage structure (31).

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