Chip carrier

Abstract

The utility model discloses a chip carrier, and belongs to the technical field of semiconductors. The chip carrier comprises an angle adjusting module, a tray fixing module and a rotary driving module, the angle adjusting module comprises a first plate with a first avoiding through hole and a second plate with a second avoiding through hole, the first avoiding through hole is communicated with the second avoiding through hole, and the first plate is rotationally connected with the second plate; the tray fixing module is arranged on one side, opposite to the second plate, of the first plate, and a bearing tray with a chip position can be fixed on the tray fixing module; the rotation driving module is used for driving the first plate to rotate relative to the second plate, the fixed end of the rotation driving module is connected with the second plate, and the output end of the rotation driving module is in transmission connection with the first plate. And when an angle difference exists between the chip and the clamping mechanism, the angle of the chip on the bearing tray can be adjusted, and the transfer efficiency of the chip is improved.

Description

Chip platform Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a chip carrier. Background Technology

[0002] Chip-wafer bonding is a key technology for achieving 3D integrated packaging, effectively increasing interconnect density between chips, reducing signal transmission latency, and significantly reducing the overall size of devices. This technology has not only driven innovation in consumer electronics such as high-end smartphones and high-performance computing chips, but also demonstrated enormous application potential in cutting-edge fields such as artificial intelligence, the Internet of Things, and 5G communications. In recent years, with the continuous advancement of materials science, micro-nano fabrication technology, and advanced packaging processes, chip-wafer bonding technology is rapidly developing towards higher precision, higher reliability, lower cost, and large-scale mass production.

[0003] During the chip transfer process, after the chip is lifted by a pin, the robotic arm uses a gripping mechanism to pick up the chip from the carrying tray.

[0004] In the prior art, the chip is placed on a carrier tray, which is placed on a chip stage. Since the chip stage cannot rotate, when there is an angle difference between the chip and the gripping mechanism, the chip cannot be picked up directly, which reduces the chip transfer efficiency and the subsequent chip-wafer bonding efficiency.

[0005] This section provides background information related to this application, which is not necessarily prior art. Summary of the Invention

[0006] The purpose of this invention is to provide a chip carrier that can adjust the angle of the chip on the carrier tray when there is an angle difference between the chip and the clamping mechanism, thereby improving the chip transfer efficiency and the subsequent bonding efficiency between the chip and the wafer.

[0007] To achieve the above objectives, the following technical solution is provided:

[0008] Chip platform, including:

[0009] An angle adjustment module includes a first plate having a first clearance through hole and a second plate having a second clearance through hole, wherein the first clearance through hole and the second clearance through hole are connected, and the first plate and the second plate are rotatably connected.

[0010] A tray fixing module is disposed on the side of the first plate facing away from the second plate, and a carrier tray with chip positions can be fixed on the tray fixing module;

[0011] A rotation drive module is used to drive the first plate to rotate relative to the second plate. The fixed end of the rotation drive module is connected to the second plate, and the output end of the rotation drive module is connected to the first plate for transmission.

[0012] As an optional solution for the chip stage, the tray fixing module includes:

[0013] Pallet racks, at least two of which are circumferentially spaced on the first plate, and the carrying pallet overlaps the at least two of which are pallet racks.

[0014] As an optional solution for the chip stage, the tray frame is provided with multiple positioning protrusions, and the multiple positioning protrusions are configured to be spaced apart along the outer contour of the orthographic projection of the carrier tray on the tray frame, and all the positioning protrusions surround to form the positioning range of the carrier tray.

[0015] As an optional solution for the chip carrier, the tray frame is provided with a vacuum air passage and an adsorption air channel on the tray frame. The adsorption air channel is connected to the vacuum air passage, and the carrier tray can be adsorbed by the adsorption air channel.

[0016] As an optional solution for the chip stage, the tray frame is equipped with a tray detection sensor, which is used to detect whether the carrying tray is in place.

[0017] As an optional solution for the chip stage, the tray detection sensor includes a transmitter and a receiver of a through-beam sensor. The transmitter and the receiver are respectively disposed on the corresponding tray frame, and the transmitting end of the transmitter faces the receiving end of the receiver.

[0018] As an optional solution for the chip stage, at least one of the trays is provided with weight reduction holes.

[0019] As an optional solution for the chip stage, the rotation drive module includes:

[0020] An active moving member is disposed on the second plate, and the active moving member is capable of sliding along the tangential direction of the first clearance through hole;

[0021] A driven moving member is disposed on the active moving member, and the driven moving member is capable of sliding along the radial direction of the first clearance through hole;

[0022] An adapter is provided, one end of which is fixedly connected to the first plate, and the other end of which is hinged to the driven moving member.

[0023] As an optional solution for the chip stage, the rotation drive module further includes:

[0024] An adapter base, one end of which is fixedly connected to the side of the second plate;

[0025] A linear motion module is mounted on the adapter base, and the active moving component is connected to the slider of the linear motion module.

[0026] As an optional solution for the chip stage, the outer edge of the first plate is provided with transmission teeth in the circumferential direction, and the rotation drive module includes:

[0027] A movable rack is slidably disposed on the second plate. The movable rack is capable of moving along the tangential direction of the first clearance through hole, and the movable rack meshes with the transmission gear.

[0028] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0029] The chip carrier provided by this utility model has a tray fixing module mounted on a first plate, which fixes the carrier tray with chip positions to the tray fixing module. An angle adjustment module is rotatably mounted on a second plate. Since the first and second clearance through holes are connected, it is convenient for the ejector pin to sequentially pass through the second clearance through hole, the first clearance through hole, and the through hole of the chip position on the carrier tray to lift the chip. The output end of the rotation drive module is connected to the first plate for transmission. When there is an angular difference between the chip and the clamping mechanism, the rotation drive module can adjust the angle of the chip on the carrier tray by rotating the first plate, adapting to the clamping mechanism's gripping, improving the chip transfer efficiency and the subsequent chip-wafer bonding efficiency. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0031] Figure 1 is a top view of the chip stage in an embodiment of this utility model;

[0032] Figure 2 is a schematic diagram of the chip carrier assembly in an embodiment of this utility model.

[0033] Figure label:

[0034] 1. Angle adjustment module; 2. Tray fixing module; 3. Rotation drive module;

[0035] 11. First plate; 111. First clearance through hole; 12. Second plate; 121. Second clearance through hole;

[0036] 21. Tray frame; 211. Positioning protrusions; 212. Adsorption air passage; 213. Weight reduction hole; 22. Tray detection sensor;

[0037] 31. Active moving part; 32. Driven moving part; 33. Adapter part; 34. Adapter base; 35. Linear motion module; 351. Slider. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0039] In the description of this utility model, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0040] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0041] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0042] When there is an angular difference between the chip and the gripping mechanism, in order to adjust the angle of the chip on the carrier tray and improve the chip transfer efficiency and subsequent chip-wafer bonding efficiency, this embodiment provides a chip stage. The specific details of this embodiment are described below with reference to Figures 1 and 2. The carrier tray has several chip positions, each with a through hole, which serves as a channel for a push pin to lift the chip. It should be noted that in this embodiment, the height and vertical directions of the chip stage are the Z-direction shown in Figure 2.

[0043] Example 1

[0044] As shown in Figure 1 and Figure 2, the chip stage in this embodiment mainly includes three key functional modules: angle adjustment module 1, tray fixing module 2, and rotation drive module 3. These three modules will be described in detail below.

[0045] The angle adjustment module 1 is the core structure for achieving precise angle adjustment of the chip stage. It mainly consists of two parts: a first plate 11 with a first clearance through-hole 111 and a second plate 12 with a second clearance through-hole 121. In design, the first clearance through-hole 111 and the second clearance through-hole 121 are vertically connected, ensuring smooth operation during subsequent processes, such as the ejector pin lifting the chip vertically. The first plate 11 and the second plate 12 are rotatably connected, allowing the first plate 11 to rotate flexibly relative to the second plate 12, thus providing a structural basis for subsequent chip angle adjustment. In this embodiment, the first clearance through-hole 111 and the second clearance through-hole 121 have the same diameter. In other embodiments, the diameter of the second clearance through-hole 121 is larger than that of the first clearance through-hole 111, eliminating the need to consider ejector pin interference and reducing manufacturing precision.

[0046] The tray fixing module 2 plays a crucial role in securing the carrier tray, and it is mounted on the first plate 11. The carrier tray has dedicated chip slots for placing chips, and the tray fixing module 2 secures the carrier tray firmly to the first plate 11. Specifically, the tray fixing module 2 includes tray frames 21, with at least two tray frames 21 circumferentially spaced on the first plate 11. This circumferentially spaced arrangement has several advantages. Firstly, when the carrier tray overlaps with at least two tray frames 21, it effectively raises the height of the carrier tray, placing it in a suitable working position. Secondly, the space between the two tray frames 21 facilitates subsequent ejector pin operations, allowing the ejector pin to pass sequentially through the second clearance through-hole 121, the first clearance through-hole 111, and the through-hole of the chip slot on the carrier tray to lift the chip, ensuring that the chip can be smoothly lifted from the carrier tray and preparing for subsequent chip transfer operations.

[0047] The main function of the rotary drive module 3 is to drive the first board 11 to rotate relative to the second board 12. The fixed end of the rotary drive module 3 is connected to the second board 12 to ensure that the rotary drive module 3 can be stably mounted on the chip carrier; while the output end of the rotary drive module 3 is connected to the first board 11 through a transmission connection. Through this transmission connection, when the rotary drive module 3 is working, it can transmit its power to the first board 11, causing the first board 11 to rotate according to the set requirements.

[0048] In summary, the chip carrier provided by this utility model achieves stable placement of the chip in a specific position by setting the tray fixing module 2 on the first plate 11 and fixing the carrier tray with chip positions on the tray fixing module 2. In the angle adjustment module 1, the first plate 11 is rotatably mounted on the second plate 12, and the first clearance through hole 111 is connected to the second clearance through hole 121. This design facilitates the operation of the ejector pins. When there is an angular difference between the chip and the clamping mechanism, the rotation drive module 3 plays a crucial role. It adjusts the angle of the chip on the carrier tray by rotating the first plate 11, allowing the chip to perfectly match the clamping mechanism, thereby greatly improving the chip transfer efficiency. Simultaneously, accurate chip angle matching also facilitates subsequent chip-wafer bonding operations, improving bonding efficiency and thus enhancing the overall quality and efficiency of the entire chip manufacturing process.

[0049] Furthermore, regarding the design of the tray frame 21 in the tray fixing module 2, by adding the tray frame 21, not only is the function of raising the height of the supporting tray and facilitating the passage of the ejector pins realized, but this structural design also has a certain degree of versatility and flexibility, and can adapt to supporting trays of different specifications and sizes, providing strong support for the widespread application of the chip stage. As shown in Figure 2, from the perspective of overall structural layout and functional implementation, the reasonable setting of the tray frame 21 is an important component for the efficient and stable operation of the chip stage.

[0050] Furthermore, to improve the stability and positioning accuracy of the carrier tray on the chip stage, the tray frame 21 is provided with multiple positioning bumps 211, which are spaced apart along the outer contour of the carrier tray's orthographic projection on the tray frame 21. The distribution of these positioning bumps 211 is not arbitrary but precisely calculated and designed; their spacing, height, shape, and other parameters are optimized based on the size and shape of the carrier tray and the overall structure of the chip stage. All the positioning bumps 211 enclose a positioning area for the carrier tray. This unique positioning area acts like a "custom-made space" for the carrier tray. When the carrier tray is placed on the tray frame 21, its outer contour precisely matches the positioning area enclosed by the positioning bumps 211. The positioning bumps 211 contact the outer edge of the carrier tray, generating friction and a limiting effect. This force effectively prevents the carrier tray from shifting horizontally, ensuring that the carrier tray maintains a stable position on the chip stage. From an effectiveness standpoint, this design offers several significant advantages. Firstly, during chip transport, the precisely positioned carrier tray ensures a relatively fixed chip position, preventing shifting due to tray movement or displacement. This greatly improves the accuracy and reliability of chip transport, reducing the risk of transport failure or chip damage caused by positional deviations. Secondly, in the subsequent chip-wafer bonding process, the precisely positioned carrier tray ensures the chip is gripped and placed on the wafer at the correct angle and position, improving bonding quality and efficiency, reducing bonding failure rates, and providing strong support for the stable operation of the entire chip manufacturing process. Furthermore, the multiple positioning bumps 211 offer a degree of fault tolerance. Even with minor angular or positional deviations during placement, the positioning bumps 211 can guide the carrier tray into the correct positioning range through contact and adjustment with the tray's edge, achieving automatic correction. This fault tolerance makes the chip stage more adaptable and stable in practical applications, capable of handling various complex production environments and operating conditions. In summary, by setting multiple positioning protrusions 211 at intervals along the outer contour of the carrier tray on each tray frame 21 and forming a positioning range, not only is the fixing stability and positioning accuracy of the carrier tray effectively improved, but it also provides a reliable foundation for subsequent operations such as chip transfer and bonding, significantly improving the efficiency and quality of the entire chip production process.

[0051] Furthermore, to comprehensively improve the fixation effect of the carrier tray on the chip carrier, the tray frame 21 is equipped with a vacuum circuit and an adsorption air channel 212. The adsorption air channel 212 is connected to the vacuum pump through an air pipe to ensure that the tray frame 21 has a good and stable negative pressure supply capability. The adsorption air channel 212 is tightly connected with the vacuum circuit, forming a complete adsorption system, and the carrier tray can be sucked by the adsorption air channel 212. When it is necessary to fix the carrier tray, simply activate the vacuum circuit, and negative pressure is quickly generated inside the vacuum circuit. At this time, the adsorption air channel 212 is like a series of tiny "suction cups", which can firmly hold the carrier tray by means of the strong adsorption force generated by the negative pressure. This adsorption fixation method has many significant effects and advantages. In terms of fixation effect, compared with traditional mechanical fixation methods, such as screw fixation or clamp fixation, adsorption fixation is more secure and reliable. Mechanical fixing methods may fail due to loose screws or worn clamps, while adsorption fixing methods, as long as the vacuum circuit remains operational, the adsorption air channel 212 can continuously generate a stable adsorption force, ensuring that the carrier tray is always firmly fixed on the tray frame 21, preventing displacement or shaking due to external vibrations or impacts. Stable carrier tray fixation is crucial during chip transport. Because the carrier tray is firmly held by the adsorption air channel 212, the chip's position on the carrier tray remains highly stable, preventing displacement due to tray movement. This significantly improves the accuracy and reliability of chip transport, reducing the risk of transport failure or chip damage due to chip position deviation. For example, in high-speed automated chip transport equipment, even slight vibrations can cause chip position changes; adsorption fixing effectively avoids this, ensuring the chip is accurately transported to the designated position. In the subsequent chip-wafer bonding process, a precisely positioned carrier tray is one of the key factors ensuring bonding quality. The adsorption-fixing method ensures that the carrier tray maintains a stable position and angle throughout the bonding process, allowing the chip to be gripped and placed onto the wafer at the correct angle and position. This helps improve bonding quality and efficiency, and reduce bonding defect rates. For example, in micron- or even nanometer-scale chip bonding processes, any minute positional deviation can lead to bonding failure, while the adsorption-fixing method provides reliable assurance for chip bonding, ensuring precise bonding between the chip and the wafer. Furthermore, this adsorption-fixing method is easy to operate and highly flexible. When changing the carrier tray, simply close the vacuum circuit; the adsorption force of the adsorption channel 212 disappears, and the carrier tray can be easily removed. When installing a new carrier tray, simply restart the vacuum circuit, and the carrier tray will be quickly adsorbed and fixed. This convenient operation method can greatly improve production efficiency, reduce equipment downtime, and lower production costs. At the same time, the design of the vacuum circuit and the adsorption channel 212 also offers a degree of adjustability.The adsorption force of the adsorption channel 212 can be controlled by adjusting the negative pressure of the vacuum path according to actual production needs. For example, the adsorption force can be adjusted for carrier trays of different weights and materials to achieve the best fixing effect. This adjustability allows the chip stage to adapt to a variety of carrier trays of different specifications and types, improving the versatility and adaptability of the equipment. In summary, by setting a vacuum path in each tray frame 21 and setting an adsorption channel 212 connected to the vacuum path on the tray frame 21, the carrier tray can be adsorbed by the adsorption channel 212. This not only effectively improves the fixing stability and reliability of the carrier tray, but also provides a reliable foundation for subsequent operations such as chip transfer and bonding, significantly improving the efficiency and quality of the entire chip production process. It also has the advantages of simple operation, high flexibility, and strong adjustability.

[0052] Furthermore, a pallet detection sensor 22 is installed on the pallet rack 21 to detect whether the carrier pallet is in place. The pallet detection sensor 22 is a high-precision detection device cleverly mounted on the pallet rack 21, its position precisely calculated and adjusted to ensure accurate and reliable detection of the carrier pallet's position. When the carrier pallet is placed on the pallet rack 21, the pallet detection sensor 22 can quickly sense its presence and feed this signal back to the chip stage's control system in real time. In terms of effectiveness, the installation of the pallet detection sensor 22 brings several significant advantages. At the initial stage of the production process, i.e., the carrier pallet placement stage, the pallet detection sensor 22 can promptly and accurately detect whether the carrier pallet has been correctly placed on the pallet rack 21. If the carrier pallet is not placed correctly, the control system can immediately issue an alarm, reminding operators to check and adjust, avoiding subsequent production failures due to improper carrier pallet placement, such as chip transfer failure or bonding position deviation. This not only improves the stability of the production process but also reduces production accidents caused by human negligence or improper operation, ensuring the safety of production personnel and the normal operation of equipment. During chip transport, the tray detection sensor 22 continuously monitors the process. It provides real-time feedback on the status of the carrier tray. If the carrier tray accidentally falls off or shifts, the tray detection sensor 22 quickly detects this anomaly and promptly notifies the control system to take appropriate measures, such as stopping the transport equipment or adjusting equipment operating parameters, to avoid damage to the chip. This real-time monitoring and feedback mechanism significantly improves the safety and reliability of chip transport, reduces the risk of chip damage, and minimizes production losses. The tray detection sensor 22 is equally crucial in the chip-wafer bonding process. It ensures that the carrier tray remains in the correct position throughout the bonding process, providing strong support for precise chip bonding. If the carrier tray changes position during bonding, the tray detection sensor 22 immediately detects this and notifies the control system to make corresponding adjustments, ensuring that the chip and wafer are precisely bonded according to preset parameters and requirements. This not only improves bonding quality and efficiency but also reduces the bonding defect rate, enhancing the overall performance and reliability of the chip product. Furthermore, the tray detection sensor 22 provides important data for the automated control of the chip stage. By working closely with the chip stage control system, the tray detection sensor 22 enables automated monitoring and control of the production process. For example, after completing a chip transfer or bonding operation, the control system can automatically determine whether the next operation is needed, or whether equipment maintenance and adjustments are required, based on feedback information from the tray detection sensor 22.

[0053] Furthermore, the pallet detection sensor 22 includes a transmitter and a receiver of a through-beam sensor. The transmitter and receiver are respectively mounted on corresponding pallet racks 21, with the transmitting end of the transmitter facing the receiving end of the receiver. The core components of the pallet detection sensor 22 include the two key components of the through-beam sensor: the transmitter and the receiver. In terms of system layout, the transmitter and receiver are securely mounted on different pallet racks 21. The transmitting end of the transmitter on one pallet rack 21 is precisely facing the receiving end of the receiver on the other pallet rack 21. This orientation design is the basis for ensuring the normal operation of the through-beam sensor. When a carrying pallet enters the detection area between the two, the carrying pallet will block, reflect, or absorb the signal emitted by the transmitter, thereby changing the signal strength, frequency, or other characteristic parameters received by the receiver. By analyzing and processing these signal changes, the system can accurately determine whether the carrying pallet is in place or whether there is an abnormality. This precise orientation design of the transmitting and receiving ends greatly improves the accuracy and reliability of detection, effectively avoids misjudgment or missed judgment due to signal deviation, provides solid and reliable data support for subsequent automated operation processes, and ensures that the entire pallet handling system can operate efficiently, stably, and safely. In other embodiments, the tray detection sensor 22 can also be a pressure sensor. When the carrier tray with the chip is placed on the tray rack 21, the carrier tray will press against the surface of the pressure sensor. When the pressure sensor detects a pressure value, it indicates that the carrier tray is in place. When the pressure sensor does not detect a pressure value, it indicates that the carrier tray is not in place.

[0054] Furthermore, at least one pallet rack 21 is provided with weight-reduction holes 213. As a crucial component for bearing and supporting pallets and their contents, reducing the weight of the pallet rack 21 while maintaining its structural strength and stability has several significant benefits. First, during transportation, the pallet rack 21 with weight-reduction holes 213 reduces the overall transport weight. Lighter weight means reduced energy consumption and lower transportation costs. During warehousing, the lighter pallet rack 21 facilitates manual handling, allowing workers to move it more easily, reducing physical exertion and improving work efficiency. From a material utilization perspective, the weight-reduction holes 213 reduce material usage and lower raw material costs while maintaining the structural performance of the pallet rack 21. The weight-reduction holes 213 also improve the heat dissipation performance of the pallet rack 21 to some extent, increasing airflow channels, promoting heat dissipation, and lowering the temperature of the pallet rack 21 and the contents.

[0055] For example, the rotary drive module 3 includes an active moving part 31, a driven moving part 32, and a connecting part 33. The active moving part 31 is disposed on the second plate 12 and can slide along the tangential direction of the first clearance through hole 111. The driven moving part 32 is disposed on the active moving part 31 and can slide along the radial direction of the first clearance through hole 111. One end of the connecting part 33 is fixedly connected to the first plate 11, and the other end of the connecting part 33 is hinged to the driven moving part 32. The active moving part 31, as the power input end and initial motion actuator of the rotary drive module 3, is cleverly disposed on the second plate 12. The structural characteristics and spatial position of the second plate 12 are fully utilized to provide a stable mounting base for the active moving part 31. The driven moving part 32 can slide along the radial direction of the first clearance through hole 111, and the driven moving part 32 is disposed on the active moving part 31, forming a close linkage relationship between the two. While the active moving member 31 drives the driven moving member 32 to slide tangentially, the radial sliding of the driven moving member 32 generates a composite motion effect, providing flexible and varied motion output for the entire rotary drive module 3. This output drives the first plate 11 to rotate relative to the second plate 12, adjusting the angle of the chip on the carrier tray to facilitate gripping by the clamping mechanism, improving chip transfer efficiency and subsequent chip-wafer bonding efficiency. The adapter 33 serves as a crucial bridge connecting the first plate 11 and the driven moving member 32 in the rotary drive module 3, with its other end hinged to the driven moving member 32. The hinge structure offers significant flexibility and freedom. When the driven moving member 32 moves under the drive of the active moving member 31, the hinge structure adapts to the movement trajectory and posture changes of the driven moving member 32, achieving a smooth transition and power transmission between the two. Simultaneously, the hinge structure can also buffer and absorb impacts and vibrations generated during movement to a certain extent, reducing damage and wear to other components and improving the reliability and service life of the entire rotary drive module 3. For example, the driven moving part 32 is a pin, the lower end of which is slidably connected to the guide rail on the driving moving part 31, the inner ring of the bearing is sleeved on the upper end of the pin, and the outer ring of the bearing is embedded in the other end of the adapter 33.

[0056] Furthermore, the rotary drive module 3 also includes an adapter base 34 and a linear motion module 35. One end of the adapter base 34 is fixedly connected to the side of the second plate 12. The linear motion module 35 is disposed on the adapter base 34, and the active moving member 31 is connected to the slider 351 of the linear motion module 35 and can move along the X direction. The linear motion module 35 can be a lead screw slide module, which is connected to a servo motor to improve the rotational accuracy of the first plate 11.

[0057] Example 2

[0058] This embodiment provides a chip stage. Compared with Embodiment 1, the basic structure of the chip stage provided in this embodiment is the same as that in Embodiment 1. Only the specific structural design of the rotation drive module 3 is different. This embodiment will not describe the structure that is the same as that in Embodiment 1 again.

[0059] For example, the outer edge of the first plate 11 is provided with transmission teeth in the circumferential direction. The rotary drive module 3 includes a movable rack, which is slidably disposed on the second plate 12. The movable rack can move along the tangential direction of the first clearance through hole 111, and the movable rack meshes with the transmission teeth. The movable rack is connected to the power mechanism for transmission, and the first plate 11 is driven to adjust its angle using a gear and rack transmission method.

[0060] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A chip carrier, characterized in that, include: Angle adjustment module (1) includes a first plate (11) with a first clearance through hole (111) and a second plate (12) with a second clearance through hole (121). The first clearance through hole (111) and the second clearance through hole (121) are connected. The first plate (11) and the second plate (12) are rotatably connected. A tray fixing module (2) is disposed on the side of the first plate (11) facing away from the second plate (12). A carrier tray with chip position can be fixed on the tray fixing module (2). A rotation drive module (3) is used to drive the first plate (11) to rotate relative to the second plate (12). The fixed end of the rotation drive module (3) is connected to the second plate (12), and the output end of the rotation drive module (3) is connected to the first plate (11) in a transmission connection.

2. The chip carrier according to claim 1, characterized in that, The pallet fixing module (2) includes: a pallet frame (21), at least two of the pallet frames (21) are circumferentially spaced on the first plate (11), and the carrying pallet overlaps on at least two of the pallet frames (21).

3. The chip carrier according to claim 2, characterized in that, The pallet frame (21) is provided with a plurality of positioning protrusions (211), and the plurality of positioning protrusions (211) are configured to be spaced apart along the outer contour of the orthographic projection of the carrying pallet on the pallet frame (21), and all the positioning protrusions (211) surround to form the positioning range of the carrying pallet.

4. The chip carrier according to claim 2, characterized in that, The tray frame (21) is provided with a vacuum air passage, and the tray frame (21) has an adsorption air channel (212). The adsorption air channel (212) is connected to the vacuum air passage, and the carrying tray can be adsorbed by the adsorption air channel (212).

5. The chip carrier according to claim 2, characterized in that, The pallet rack (21) is equipped with a pallet detection sensor (22), which is used to detect whether the carrying pallet is in place.

6. The chip carrier according to claim 5, characterized in that, The tray detection sensor (22) includes a transmitter and a receiver of a through-beam sensor. The transmitter and the receiver are respectively disposed on the corresponding tray frame (21), and the transmitting end of the transmitter faces the receiving end of the receiver.

7. The chip carrier according to claim 2, characterized in that, At least one of the pallet holders (21) is provided with weight reduction holes (213).

8. The chip carrier according to any one of claims 1-7, characterized in that, The rotation drive module (3) includes: an active moving part (31) disposed on the second plate (12), the active moving part (31) being able to slide along the tangential direction of the first clearance through hole (111); a driven moving part (32) disposed on the active moving part (31), the driven moving part (32) being able to slide along the radial direction of the first clearance through hole (111); and a connecting part (33), one end of the connecting part (33) being fixedly connected to the first plate (11), and the other end of the connecting part (33) being hinged to the driven moving part (32).

9. The chip carrier according to claim 8, characterized in that, The rotary drive module (3) further includes: a transition base (34), one end of which is fixedly connected to the side of the second plate (12); a linear motion module (35), which is disposed on the transition base (34), and the active moving member (31) is connected to the slider (351) of the linear motion module (35).

10. The chip stage according to any one of claims 1-7, characterized in that, The outer edge of the first plate (11) is provided with transmission teeth in the circumferential direction. The rotary drive module (3) includes a movable rack, which is slidably disposed on the second plate (12). The movable rack can move along the tangential direction of the first clearance through hole (111), and the movable rack meshes with the transmission teeth.

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