Anti-splashing tin plating device for copper conductor processing

Abstract

The utility model relates to the technical field of copper conductor processing, and discloses an anti-splashing tinning device for copper conductor processing, which comprises a bottom plate, an electrotinning box is fixedly mounted on the upper surface of the bottom plate, movable grooves are formed in the upper surfaces of the two sides of the electrotinning box, and the movable grooves are formed in the upper surfaces of the two sides of the electrotinning box. Blocking covers are slidably mounted in the two movable grooves. Fixing plates are fixedly connected to the two side faces of the electrotinning box correspondingly, a supporting frame is fixedly connected between the upper surfaces of the two fixing plates, a threaded hole is formed in the upper surface of the supporting frame, a threaded rod is connected into the threaded hole in a threaded and sleeved mode, and the bottom end of the threaded rod is rotationally connected with the blocking cover. When the device is used, a plating solution in the electrotinning box can be prevented from splashing out in the tinning process through the blocking cover, meanwhile, the height of the blocking cover can be adjusted, the applicability is higher, and the anti-splashing effect is better.

Description

Technical Field

[0001] This utility model relates to the field of copper conductor processing technology, specifically to an anti-splash tin plating device for copper conductor processing. Background Technology

[0002] Tin plating is a crucial process in copper conductor processing, aiming to improve the solderability and corrosion resistance of copper conductors, and is widely used in many fields such as electronics and electrical engineering. However, traditional copper conductor tin plating equipment has many problems in actual operation.

[0003] During tin electroplating, the electrode reaction generates gases that agitate the plating bath, causing it to splash out of the plating tank. Furthermore, the impact of copper conductors entering and exiting the plating bath further exacerbates the splashing. This splashing not only wastes plating solution and increases production costs but can also pollute the working environment and corrode surrounding equipment. If operators do not take proper precautions, the splashed plating solution can cause skin and eye injuries, posing a significant safety hazard. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides an anti-splatter tin plating device for copper conductor processing. This device solves the problem that during the tin plating process, the electrode reaction generates gases that agitate the plating solution, causing it to easily splash out of the plating tank. Furthermore, the impact of copper conductors entering and exiting the plating solution further exacerbates the splashing phenomenon. Plating solution splashing not only wastes plating solution and increases production costs, but also potentially pollutes the working environment and corrodes surrounding equipment. If operators do not take proper precautions, the splashed plating solution can also cause skin and eye injuries, posing a significant safety hazard.

[0005] This utility model provides the following technical solution: a splash-proof tin plating device for copper conductor processing, including a base plate, an electroplating tin box fixedly installed on the upper surface of the base plate, movable grooves opened on both sides of the upper surface of the electroplating tin box, and baffles slidably installed inside the two movable grooves;

[0006] Both sides of the tin plating box are fixedly connected to a fixing plate, and a support frame is fixedly connected between the upper surfaces of the two fixing plates. The upper surface of the support frame is provided with a threaded hole, and a screw is threaded into the inside of the threaded hole. The bottom end of the screw is rotatably connected to the cover.

[0007] Preferred technical solution 1: Two limiting holes are provided on the upper surface of the support frame, and a limiting rod is slidably sleeved inside each of the two limiting holes. The bottom ends of the two limiting rods are fixedly connected to the baffle.

[0008] Preferred technical solution 2: A set of connecting plates is fixedly connected to the upper surfaces of both ends of the tin plating box, and a rotating rod is rotatably connected between each set of connecting plates. A limiting plate is fixedly sleeved on the surface of each of the two rotating rods, and a groove is formed on the surface of each limiting plate.

[0009] Preferred technical solution 3: A pressure roller is rotatably connected between the two inner side walls of the tin plating box, and the pressure roller is located in the middle of the tin plating box.

[0010] Preferred technical solution four: The two limiting rods and the two limiting holes are symmetrically distributed on both sides of the screw, and the top of each of the two limiting rods is fixedly connected to a limiting block, and the top of the screw is fixedly connected to an operating disc.

[0011] Preferred technical solution five: Both ends of the baffle are fixedly connected to baffles, and both baffles are inclined.

[0012] Compared with the prior art, this utility model provides an anti-splash tin plating device for copper conductor processing, which has the following beneficial effects: When in use, multiple copper conductors to be tinned pass through the limiting plate on one side of the rotating rod, then pass under the pressure roller, and then pass through the limiting plate on the other side of the rotating rod, so that tin plating can be completed inside the tin plating box. At the same time, the baffle can prevent splashing during the tin plating process. By rotating the screw, the baffle can be driven to rise or fall under the restriction of the limiting rod, thereby adjusting the height of the baffle. It is suitable for anti-splashing in various situations. When in use, the baffle can prevent the plating solution inside the tin plating box from splashing out during the tin plating process, and the height of the baffle can be adjusted, making it more applicable and with better anti-splashing effect. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model;

[0014] Figure 2 This is a schematic diagram of the internal structure of the tin plating box of this utility model;

[0015] Figure 3 This is an exploded view of the support frame structure of this utility model.

[0016] In the diagram: 1. Base plate; 2. Tin plating box; 3. Movable groove; 4. Baffle; 5. Fixing plate; 6. Support frame; 7. Threaded hole; 8. Screw; 9. Limiting hole; 10. Limiting rod; 11. Connecting plate; 12. Rotating rod; 13. Limiting disc; 14. Pressure roller; 15. Limiting block; 16. Operating panel; 17. Baffle. Detailed Implementation

[0017] Please see Figure 1-3 ,

[0018] Example 1: A splash-proof tin plating device for copper conductor processing includes a base plate 1, a tin plating box 2 fixedly installed on the upper surface of the base plate 1, and movable grooves 3 on both sides of the upper surface of the tin plating box 2, with baffles 4 slidably installed inside the two movable grooves 3.

[0019] The two sides of the tin plating box 2 are fixedly connected to the fixing plates 5. The upper surfaces of the two fixing plates 5 are fixedly connected to the support frame 6. The upper surface of the support frame 6 is provided with a threaded hole 7. The threaded hole 7 is threaded with a screw 8. The bottom end of the screw 8 is rotatably connected to the cover 4.

[0020] Example 2: The difference between this example and Example 1 is that the upper surface of the support frame 6 has two limiting holes 9, and a limiting rod 10 is slidably sleeved inside each of the two limiting holes 9. The bottom ends of the two limiting rods 10 are fixedly connected to the baffle 4. The rising and falling of the baffle 4 can be restricted by the limiting rods 10 and the limiting holes 9, so that its rising and falling is more stable.

[0021] Example 3: The difference between this example and Example 1 is that a set of connecting plates 11 are fixedly connected to the upper surfaces of both ends of the tin plating box 2. A rotating rod 12 is rotatably connected between each set of connecting plates 11. A limiting plate 13 is fixedly sleeved on the surface of each of the two rotating rods 12. A groove is opened on the surface of each limiting plate 13 to facilitate the limiting of the copper conductor transportation, so that it is neat and orderly and avoids scattering and tangling.

[0022] Example 4: The difference between this example and Example 1 is that a pressure roller 14 is rotatably connected between the two inner side walls of the tin plating box 2. The pressure roller 14 is located in the middle of the tin plating box 2, so that the copper conductor can penetrate deep into the plating solution inside the tin plating box 2, and the copper conductor can be fully tin-plated.

[0023] Example 5: The difference between this example and Example 1 is that two limiting rods 10 and two limiting holes 9 are symmetrically distributed on both sides of the screw 8. The top of each of the two limiting rods 10 is fixedly connected to a limiting block 15, and the top of the screw 8 is fixedly connected to an operating disc 16 for easy operation by the user.

[0024] Example 6: The difference between this example and Example 1 is that both ends of the cover 4 are fixedly connected to baffles 17, and both baffles 17 are inclined.

[0025] In summary, this anti-splatter tin plating device for copper conductor processing allows multiple copper conductors to be tinned to pass through the limiting plate 13 on one side of the rotating rod 12, then through the bottom of the pressure roller 14, and then through the limiting plate 12 on the other side of the rotating rod 12, thus completing the tin plating inside the tin plating box 2. Simultaneously, the baffle 4 prevents splashing during the tin plating process. Furthermore, rotating the screw 8 allows the baffle 4 to rise or fall under the constraint of the limiting rod 10, thereby adjusting the height of the baffle 4 to suit various anti-splatter situations. This device, through the baffle 4, prevents the plating solution inside the tin plating box 2 from splashing out during the tin plating process, and the adjustable height of the baffle 4 enhances its applicability and provides better anti-splatter effect.

Claims

1. A splash-proof tin plating apparatus for processing copper conductors, comprising a base plate (1), characterized in that: The upper surface of the base plate (1) is fixedly installed with an electroplating tin box (2). Movable grooves (3) are opened on both sides of the upper surface of the electroplating tin box (2). A baffle (4) is slidably installed inside the two movable grooves (3). The two sides of the tin plating box (2) are fixedly connected to a fixing plate (5), and a support frame (6) is fixedly connected between the upper surfaces of the two fixing plates (5). The upper surface of the support frame (6) is provided with a threaded hole (7), and a screw (8) is threaded inside the threaded hole (7). The bottom end of the screw (8) is rotatably connected to the cover (4).

2. The anti-splatter tin plating device for copper conductor processing according to claim 1, characterized in that: The upper surface of the support frame (6) has two limiting holes (9), and a limiting rod (10) is slidably sleeved inside each of the two limiting holes (9). The bottom ends of the two limiting rods (10) are fixedly connected to the cover (4).

3. The anti-splatter tin plating device for copper conductor processing according to claim 2, characterized in that: The upper surfaces of both ends of the tin plating box (2) are fixedly connected to a set of connecting plates (11), and a rotating rod (12) is rotatably connected between each set of connecting plates (11). The surfaces of the two rotating rods (12) are fixedly fitted with limit plates (13), and a groove is opened on the surface of each limit plate (13).

4. The anti-splatter tin plating device for copper conductor processing according to claim 3, characterized in that: A pressure roller (14) is rotatably connected between the two inner side walls of the tin plating box (2), and the pressure roller (14) is located in the middle of the tin plating box (2).

5. The anti-splatter tin plating device for copper conductor processing according to claim 4, characterized in that: Two limiting rods (10) and two limiting holes (9) are symmetrically distributed on both sides of the screw (8). The top ends of the two limiting rods (10) are fixedly connected to limiting blocks (15), and the top end of the screw (8) is fixedly connected to an operating disc (16).

6. The anti-splatter tin plating device for copper conductor processing according to claim 5, characterized in that: Both ends of the cover (4) are fixedly connected to baffles (17), and both baffles (17) are inclined.

Images