Multi-module case with different test modes

Abstract

The utility model discloses a multi-module case with different test modes, which is divided into a front panel end and a rear panel end, a full-exchange unit panel is arranged at the lower part of the front panel end, a plurality of equipment interfaces are integrated, and multi-path signal input and output are supported. The interior of the case is divided into multiple layers of spaces through partition plates and an inner cover plate, and the switch module box, the two-way switch assembly, the single-pole multi-throw assembly and the power component are installed in the spaces respectively, so that a complete signal link is formed. The switch module can be quickly plugged, and the power divider is matched with a switch module connecting hole, so that independent distribution of signals is ensured. The circuit board assembly is suspended and is matched with the lateral fan to form a directional air channel with the air outlet, so that effective heat dissipation is realized. And the rear panel of the case adopts a detachable design, integrates a power socket, a network port and a grounding pole, and is convenient to maintain and expand. The overall design realizes parallel processing of multiple test modes, high-precision signal control and long-term stable operation, and is suitable for complex scenes such as communication equipment and radio frequency test.

Description

Technical Field

[0001] This utility model relates to the field of electronic testing equipment, and in particular to a multi-module chassis with different testing modes. Background Technology

[0002] With the rapid development of communication equipment, RF testing, and other fields, the demand for multi-module parallel testing is increasing, placing higher demands on the signal processing capabilities, heat dissipation performance, and expandability of test chassis. Traditional test chassis often suffer from the following shortcomings in structural design: long signal transmission paths, which easily introduce electromagnetic interference and lead to a decrease in test accuracy; low modularity, with scattered layout of functional components, making it difficult to achieve rapid switching and independent allocation of multiple signals; unreasonable heat dissipation system design, which can easily lead to performance degradation or even failure of electronic components due to long-term high-temperature operation; in addition, poor interface expandability and inconvenient maintenance also limit the improvement of test efficiency.

[0003] In existing technologies, while some chassis employ modular designs, the coordination between modules is insufficient, and the signal switching and distribution mechanisms lack optimization, making it difficult to meet the demands of parallel processing of multiple test modes. Furthermore, cooling solutions often rely on overall air cooling, making it difficult to target high-heat areas with specific cooling methods, leading to excessively high localized temperatures. The integration of power and communication interfaces is low, making subsequent maintenance and functional expansion cumbersome. Therefore, a new chassis structure is urgently needed, which, through optimized space layout, modular collaborative design, and a high-efficiency cooling system, can achieve the shortest signal path, minimize electromagnetic interference, target heat dissipation, and facilitate maintenance, thus adapting to the high standards required by complex testing scenarios. Utility Model Content

[0004] The purpose of this invention is to provide a multi-module chassis with different testing modes, which solves the problems described in the background section.

[0005] This utility model is achieved through the following technical solution:

[0006] A multi-module chassis with different testing modes includes a chassis divided into a front panel and a rear panel. The front panel is divided into upper and lower parts. The lower part is equipped with a full switching unit panel. A partition and an inner cover are vertically installed at the bottom and top of the full switching unit panel, respectively. A switch module box is installed on the upper surface of the inner cover. Two switch modules are installed in the switch module box via two-stage slide rails. A two-way switch assembly is installed on the upper surface of the partition covering the inner cover, near the front panel of the chassis. A single-pole multi-throw (SPMW) assembly is installed opposite the SPMW assembly, away from the front panel of the chassis. A power splitter assembly is installed on the partition next to the SPMW assembly. A circuit board assembly is installed on the partition, near the rear panel of the chassis.

[0007] Furthermore,

[0008] The full-switch unit panel has multiple device interfaces.

[0009] Furthermore,

[0010] The two-way switch assembly includes a two-way switch bracket and a DB communication 2T switch. The two-way switch bracket is vertically mounted on the partition and located below the inner cover plate. The DB communication 2T switch is mounted on the branch switch bracket and its output terminal faces the full switching unit panel.

[0011] Furthermore,

[0012] The single-pole multi-throw assembly includes multiple single-pole multi-throw switches and mounting brackets. The two mounting brackets are mounted vertically opposite each other on the partition plate. The upper surface of the mounting brackets also contacts the lower surface of the inner cover plate. The single-pole multi-throw switches are mounted opposite each other on the two mounting brackets.

[0013] Furthermore,

[0014] The switch module box is mounted on the inner cover plate. Multiple rows of connection holes are opened on the side away from the front panel of the chassis, corresponding to two switch modules respectively. The switch module includes a shell, a two-way switch bracket, and a DB communication 2T switch. Connection holes are opened on both sides of the shell that are parallel to the front panel of the chassis. An adapter is installed in the connection hole near the front panel of the chassis. The two-way switch bracket is vertically installed at the bottom of the shell. The DB communication 2T switch is mounted on the two-way switch bracket with its output end facing the adapter.

[0015] Furthermore,

[0016] The power divider assembly includes a power divider and a power divider mounting bracket. The power divider mounting bracket is vertically mounted on the surface of the partition. The power divider is mounted on the power divider mounting bracket, and the number of power dividers installed in each row of the power divider mounting bracket is the same as the number of connection holes in each row on the switch module box. The installation of each row of power dividers causes the output and input ends of the power divider to alternate on one side.

[0017] Furthermore,

[0018] The circuit board assembly includes a support column and a circuit board. The support column is vertically mounted on the partition, and the circuit board is laid on the support column.

[0019] Furthermore,

[0020] Air vents were opened on the sides of the two parallel chassis at the same height as the circuit board, and fans were installed on the inner wall of the chassis at the air vents.

[0021] Furthermore,

[0022] The rear panel of the chassis is divided into a functional area panel and a power module cover, and a grounding post is provided. Both the functional area panel and the power module cover are removable. The power module cover is also equipped with a power socket and a network port.

[0023] The beneficial effects of this utility model are:

[0024] 1. The coordinated layout of the two-way switch assembly (DB communication 2T switch) and the single-pole multi-throw assembly shortens the signal transmission path and reduces electromagnetic interference; the alternating arrangement of the power divider input and output terminals and the matching design of the switch module connection holes ensure independent signal distribution and support multi-channel parallel testing.

[0025] 2. The circuit board assembly is suspended by support columns, and combined with the side fan and air outlet to form a directional air duct, which effectively reduces the temperature of electronic components and ensures long-term stable operation of the equipment.

[0026] 3. The rear panel of the chassis integrates a power socket, network port and grounding post, supporting power management, network communication and safety grounding. The detachable design facilitates future maintenance and expansion. Attached Figure Description

[0027] The accompanying drawings, which are included to provide a further understanding of the embodiments of the present invention and form part of this application, do not constitute a limitation thereof. In the drawings:

[0028] Figure 1 This is a schematic diagram of the structure of this utility model;

[0029] Figure 2 This is a side perspective view of the present invention;

[0030] Figure 3 This is a schematic diagram of the rear panel of the chassis of this utility model;

[0031] Figure 4 This is a schematic diagram of the front panel of the chassis of this utility model;

[0032] Figure 5 This is a front view of the power distribution component;

[0033] Figure 6 Top view of the power distribution component;

[0034] Figure 7 Perspective view of the switch module box;

[0035] Figure 8 This is a side perspective view of the switch module.

[0036] The attached diagram shows the markings and corresponding component names:

[0037] 1-Chassis, 2-Front panel of chassis, 20-Full switching unit panel, 21-Switch module box, 210-Two-stage slide rail, 211-Switch module, 2110-Housing shell, 2111-Adapter, 3-Block, 4-Two-way switch assembly, 40-Two-way switch bracket, 41-DB communication 2T switch, 5-Single-pole multi-throw assembly, 51-Single-pole multi-throw switch, 52-Mounting bracket, 6-Power divider assembly, 60-Power divider, 61-Power divider mounting bracket, 7-Inner cover, 8-Circuit board assembly, 80-Support column, 81-Circuit board, 10-Fan, 11-Rear panel of chassis, 110-Functional area panel, 111-Power module baffle, 1110-Power socket, 1111-Network port, 112-Grounding post. Detailed Implementation

[0038] The present invention will be further described in detail below with reference to the embodiments and accompanying drawings, but the implementation of the present invention is not limited thereto.

[0039] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "longitudinal", "lateral", "horizontal", "inner", "outer", "front", "rear", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0040] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "have," "install," "connect," and "connect" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0041] Example

[0042] See Figures 1 to 8 :

[0043] A multi-module chassis with different testing modes includes a chassis 1, which is divided into a front panel 2 and a rear panel 11. The front panel 2 is divided into upper and lower parts. The lower part is provided with a full switching unit panel 20. A partition 3 and an inner cover 7 are vertically installed at the bottom and top of the full switching unit panel 20, respectively. A switch module box 21 is installed on the upper surface of the inner cover 7. Two switch modules 211 are installed in the switch module box 21 via two-stage slide rails 210. A two-way switch assembly 4 is provided on the upper surface of the partition 3 covering the inner cover 7 near the front panel 2. A single-pole multi-throw assembly 5 is installed opposite the two-way switch assembly 4 away from the front panel 2. A power splitting assembly 6 is provided on the partition 3 next to the single-pole multi-throw assembly 5. A circuit board assembly 8 is installed on the partition 3 near the rear panel 11.

[0044] Furthermore,

[0045] The full-switch unit panel 20 has multiple device interfaces.

[0046] The chassis 1 features multiple device interfaces, enhancing its expandability. Users can flexibly configure input / output channels according to different testing needs, avoiding frequent interface module replacements and improving testing efficiency. It is particularly suitable for multi-module testing scenarios, such as communication equipment or RF signal testing, and can process multiple signals in parallel.

[0047] Furthermore,

[0048] The two-way switch assembly 4 includes a two-way switch bracket 40 and a DB communication 2T switch. The two-way switch bracket 40 is vertically mounted on the partition 3 and located below the inner cover plate 7. The DB communication 2T switch is mounted on the branch switch bracket and its output end faces the full switching unit panel 20.

[0049] The DB communication 2T switch is a high-speed signal switching element. Vertical mounting and fixation by the two-way switch bracket 40 ensures alignment with the interface of the full switching unit panel 20, shortening the signal transmission distance. Furthermore, the output end of the DB communication 2T switch faces the full switching unit panel 20, which simplifies the wiring complexity, reduces electromagnetic interference, and forms a signal transmission channel with the multiple device interfaces of the full switching unit panel 20.

[0050] Furthermore,

[0051] The single-pole multi-throw assembly 5 includes multiple single-pole multi-throw switches 51 and mounting brackets 52. The two mounting brackets 52 are mounted vertically opposite each other on the partition 3. The upper surface of the mounting brackets 52 is also in contact with the lower surface of the inner cover plate 7. The single-pole multi-throw switches 51 are mounted opposite each other on the two mounting brackets 52.

[0052] The symmetrical mounting structure (two brackets facing each other) of the single-pole multi-throw switch 51 balances mechanical stress and prevents poor contact due to vibration. The contact between the bracket and the inner cover plate 7 enhances the overall structural stability and provides physical support for multi-channel signal distribution. It complements the two-way switch assembly 4. The single-pole multi-throw switch 51 enables the selection of signal input and output, while the two-way switch assembly 4 selects the signal path.

[0053] Furthermore,

[0054] The switch module box 21 is mounted on the inner cover plate 7. Multiple rows of connection holes are opened on the side away from the front panel end 2 of the chassis, corresponding to two switch modules 211 respectively. The switch module 211 includes a housing 2110, a two-way switch bracket 40, and a DB communication 2T switch. Connection holes are opened on both sides of the housing 2110 that are parallel to the front panel end 2 of the chassis. An adapter 2111 is installed in the connection hole near the front panel end 2 of the chassis. The two-way switch bracket 40 is vertically mounted on the bottom of the housing 2110. The DB communication 2T switch is mounted on the two-way switch bracket 40 with its output end facing the adapter 2111.

[0055] Furthermore,

[0056] The power divider assembly 6 includes a power divider 60 and a power divider mounting bracket 61. The power divider mounting bracket is vertically mounted on the surface of the partition 3. The power divider 60 is mounted on the power divider mounting bracket 61. The number of power dividers 60 installed in each row of the power divider mounting bracket 61 is the same as the number of connection holes in each row on the switch module box 21. The installation of each row of power dividers 60 makes the output and input ends of the power divider 60 alternate on one side.

[0057] The alternating arrangement of the input and output terminals of the power divider 60 optimizes the wiring path and avoids cross interference; the number of connection holes matches that of the switch module 211, ensuring that each signal is allocated independently and improving the parallel processing capability of the chassis 1.

[0058] Furthermore,

[0059] The circuit board assembly 8 includes a support column 80 and a circuit board 81. The support column 80 is vertically arranged on the partition 3, and the circuit board 81 is laid on the support column 80.

[0060] Furthermore,

[0061] Air vents are provided on the sides of the two parallel chassis 1 at the same height as the circuit board 81, and fans 10 are installed on the inner wall of the chassis 1 at the air vents.

[0062] The support column 80 separates the circuit board 81 from the partition 3 to form an air circulation layer; the side air outlet combined with the fan 10 can form a directional air duct, which can quickly remove the heat from the circuit board 81, improve heat dissipation efficiency, and ensure the long-term stable operation of electronic components.

[0063] Furthermore,

[0064] The rear panel 11 of the chassis is divided into a functional area panel 110 and a power module baffle 111, and a grounding post 112 is provided. Both the functional area panel 110 and the power module baffle 111 are detachable. The power module baffle 111 is also provided with a power socket 1110 and a network port 1111.

[0065] Both the function panel 110 and the power module cover 111 can be removed to provide users with access for back-end maintenance of components such as the circuit board 81 and the fan 10 inside the chassis 1. The power socket 1110 is equipped with a safety switch.

[0066] The principle of this utility model is as follows:

[0067] This utility model achieves efficient testing functions through modular layered layout and collaborative design. The full-switching unit panel 20 on the front panel 2 of the chassis integrates multiple device interfaces, supporting multiple signal inputs and outputs; behind it, a partition 3 and an inner cover 7 separate multiple layers of space, where a switch module box 21 (including a two-stage slide rail 210 type switch module 211), a two-way switch assembly 4 (including a DB communication 2T switch), a single-pole multi-throw assembly 5 (symmetrically installed multi-way switches), and a power divider assembly 6 (power dividers 60 with alternating input and output terminals) are installed, forming a complete link from signal access, switching, distribution to processing. The switch module 211 is quickly plugged in and out via a slide rail, and the power divider 60 matches the connection holes of the switch module 211 one by one to ensure independent signal distribution. The circuit board assembly 8 is suspended by the support column 80, and together with the side fan 10 and the air outlet, it forms a directional air duct for effective heat dissipation. The rear panel of the chassis 1 adopts a detachable functional area panel 110 and a power module baffle 111, integrating a power socket 1110, a network port 1111, and a grounding post 112 for easy maintenance and expansion. The overall design, through space optimization, modular installation, and heat dissipation coordination, enables parallel processing of multiple test modes, high-precision signal control, and long-term stable operation. It is suitable for complex scenarios such as communication equipment and RF testing. The side of the chassis 1 is also equipped with a handle for easy carrying and transportation of the test chassis 1.

[0068] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A multi-module chassis with different test modes, comprising a chassis (1), characterized in that, The chassis (1) is divided into a front panel end (2) and a rear panel end (11). The front panel end (2) is divided into upper and lower parts. The lower part is provided with a full switching unit panel (20). A partition (3) and an inner cover (7) are vertically installed at the bottom and top of the full switching unit panel (20), respectively. A switch module box (21) is installed on the upper surface of the inner cover (7). Two switch modules (211) are installed in the switch module box (21) through two-stage slide rails (210). A two-way switch assembly (4) is provided on the upper surface of the partition (3) covering the inner cover (7) near the front panel end (2). A single-pole multi-throw assembly (5) is installed opposite the two-way switch assembly (4) away from the front panel end (2). A power distribution assembly (6) is provided on the partition (3) next to the single-pole multi-throw assembly (5). A circuit board assembly (8) is installed on the partition (3) and near the rear panel end (11).

2. The multi-module chassis with different test modes according to claim 1, characterized in that, The full-switch unit panel (20) has multiple device interfaces.

3. The multi-module chassis with different test modes according to claim 1, characterized in that, The two-way switch assembly (4) includes a two-way switch bracket (40) and a DB communication 2T switch. The two-way switch bracket (40) is vertically mounted on the partition (3) and located below the inner cover plate (7). The DB communication 2T switch is mounted on the branch switch bracket and its output end faces the full switching unit panel (20).

4. The multi-module chassis with different test modes according to claim 1, characterized in that, The single-pole multi-throw assembly (5) includes multiple single-pole multi-throw switches (51) and mounting brackets (52). The two mounting brackets (52) are mounted vertically opposite each other on the partition (3). The upper surface of the mounting brackets (52) is also in contact with the lower surface of the inner cover plate (7). The single-pole multi-throw switches (51) are mounted opposite each other on the two mounting brackets (52).

5. A multi-module chassis with different test modes according to claim 1, characterized in that, The switch module box (21) is mounted on the inner cover plate (7). Multiple rows of connection holes are opened on the side away from the front panel end (2) of the chassis, corresponding to two switch modules (211). The switch module (211) includes a shell (2110), a two-way switch bracket (40), and a DB communication 2T switch. Connection holes are opened on both sides of the shell (2110) that are parallel to the front panel end (2) of the chassis. An adapter (2111) is installed in the connection hole near the front panel end (2) of the chassis. The two-way switch bracket (40) is vertically mounted on the bottom of the shell (2110). The DB communication 2T switch is mounted on the two-way switch bracket (40) with its output end facing the adapter (2111).

6. A multi-module chassis with different test modes according to claim 5, characterized in that, The power divider assembly (6) includes a power divider (60) and a power divider mounting bracket (61). The power divider mounting bracket (61) is vertically mounted on the surface of the partition (3). The power divider (60) is mounted on the power divider mounting bracket (61). The number of power dividers (60) installed in each row of the power divider mounting bracket (61) is the same as the number of connection holes in each row on the switch module box (21). The installation of each row of power dividers (60) makes the output and input ends of the power divider (60) alternate on one side.

7. A multi-module chassis with different test modes according to claim 1, characterized in that, The circuit board assembly (8) includes a support column (80) and a circuit board (81). The support column (80) is vertically arranged on the partition (3), and the circuit board (81) is laid on the support column (80).

8. A multi-module chassis with different test modes according to claim 7, characterized in that, An air vent is provided on the side of the two parallel chassis (1) at the same height as the circuit board (81), and a fan (10) is provided on the inner wall of the chassis (1) at the air vent.

9. A multi-module chassis with different test modes according to claim 1, characterized in that, The rear panel (11) of the chassis is divided into a functional area panel (110) and a power module baffle (111), and a grounding post (112) is provided. Both the functional area panel (110) and the power module baffle (111) are detachable. The power module baffle (111) is also provided with a power socket (1110) and a network port (1111).

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