Burning device for on-line detection

Abstract

The utility model discloses a burning device for on-line detection, which comprises a burning substrate, a three-axis driving assembly, a burning unit and a pickup unit, the three-axis driving assembly and the burning unit are respectively arranged on the upper surface of the burning substrate, the pickup unit is arranged on the three-axis driving assembly, the unit is used for carrying a chip into the burning unit, a substrate is arranged on the outer side of the burning substrate, and the three-axis driving assembly is arranged on the upper surface of the burning substrate. A test unit and a three-axis driving unit are installed on the substrate, at least two vacuum suction nozzles arranged at intervals are installed on a Z-axis movable block of the three-axis driving unit, a horizontal carrying module is further installed on the upper surface of the substrate, and the pickup unit is further used for carrying chips in the burning unit to a material carrying platform. And the vacuum suction nozzle is used for carrying the to-be-tested chip on the material carrying platform into the test unit. According to the burning device for online detection, the production efficiency can be improved, the yield in the whole burning process can be guaranteed, and damage to the test seat and the chip in the test seat is avoided.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a programming device for online testing. Background Technology

[0002] Chips are a general term for semiconductor components. Chip programming is the process of writing programs, parameters, and files into a microcontroller or ARM controller to achieve the product's functions and effects. Random sampling during programming can prevent chip defects caused by human error, computer viruses, software mutations, or other abnormalities. However, in current technology, chip sampling is mainly done manually. The machine is stopped manually, the sample is reset after sampling, and then the machine is restarted. This reduces the automation level of the entire chip programming process and leads to low production efficiency. Secondly, during manual sampling, chips may come into contact with testing equipment and other components, causing chip damage and reducing the stability of the sampled product's performance. Utility Model Content

[0003] The purpose of this invention is to provide an online testing and programming device that can improve production efficiency, avoid damage to the test socket and the chip inside the test socket, and ensure the stability of the performance of the sampled and qualified products.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: an online testing programming device, comprising: a programming substrate, a three-axis drive assembly respectively mounted on the upper surface of the programming substrate, a programming unit, and a pickup unit mounted on the three-axis drive assembly. The unit is used to transport chips into the programming unit. A substrate is disposed on the outer side of the programming substrate. A test unit and a three-axis drive unit are respectively mounted on the substrate. At least two spaced vacuum nozzles are mounted on the Z-axis movable block of the three-axis drive unit. A horizontal transport module is also mounted on the upper surface of the substrate. The other end of the horizontal transport module, which is connected to the upper surface of the substrate, extends above the programming substrate and is connected to the programming substrate. A material transport platform is mounted on the movable part of the horizontal transport module, so that the material transport platform can move between the programming substrate and the substrate with the movable part of the horizontal transport module. The pickup unit is also used to transport chips in the programming unit to the material transport platform. The vacuum nozzle is used to transport chips to be tested on the material transport platform to the test unit.

[0005] The test unit further includes: a test carrier plate mounted on a substrate, several test seats spaced apart on the test carrier plate, and a movable cover plate movably disposed above the test carrier plate for cooperating with the test seats. A movable plate corresponding to the movable cover plate and located below the substrate is connected to the movable cover plate by at least two vertically arranged connecting columns. A bottom substrate connected to the substrate is disposed below the movable plate. A cylinder with a piston rod connected to the movable plate is mounted on the upper surface of the bottom substrate. A guide post is disposed on the lower surface of the movable plate on both sides of the cylinder. The other end of the guide post connected to the movable plate is slidably passed through the bottom substrate. A spring is fitted on the outer side of each guide post between the movable plate and the bottom substrate.

[0006] The following are further improvements to the above technical solution:

[0007] 1. In the above scheme, the upper surface of the material handling platform is provided with at least two carrier slots for chip embedding.

[0008] 2. In the above scheme, there are four vacuum suction nozzles and four bearing grooves opened on the upper surface of the material conveying platform.

[0009] 3. In the above scheme, the vacuum nozzle is also used to transport the chip that has completed testing in the test unit to the material handling platform.

[0010] 4. In the above scheme, a material box is installed on the upper surface of the substrate, and the vacuum nozzle is also used to transport the chip that has completed testing in the test unit into the material box.

[0011] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0012] 1. The online testing programming device of this utility model has a substrate on the outside of the programming substrate. A test unit and a three-axis drive unit are respectively installed on the substrate. At least two spaced vacuum nozzles are installed on the Z-axis movable block of the three-axis drive unit. A horizontal transport module is also installed on the upper surface of the substrate. The other end of the horizontal transport module is connected to the upper surface of the substrate and extends above the programming substrate and is connected to the programming substrate. A material transport platform is installed on the movable part of the horizontal transport module, so that the material transport platform can move between the programming substrate and the substrate with the movable part of the horizontal transport module. The pick-up unit is also used to transport the chip in the programming unit to the material transport platform. The vacuum nozzle is used to transport the chip to be tested on the material transport platform to the test unit. The device can randomly and automatically inspect the programmed chips at any time during the programming process without stopping the programming process, which can improve production efficiency and ensure the yield rate throughout the programming process.

[0013] 2. The online testing and programming device of this utility model further includes a testing unit comprising: a test carrier plate mounted on a substrate, several test seats spaced apart on the test carrier plate, and a movable cover plate movably disposed above the test carrier plate for cooperating with the test seats. A movable plate corresponding to the movable cover plate and located below the substrate is connected to the movable cover plate via at least two vertically arranged connecting posts. A bottom substrate connected to the substrate is disposed below the movable plate. A cylinder with a piston rod connected to the movable plate is mounted on the upper surface of the bottom substrate. A guide post is disposed on the lower surface of the movable plate on both sides of the cylinder. The other end of the guide post connected to the movable plate is slidably passed through the bottom substrate. A spring is fitted on the outer side of each guide post between the movable plate and the bottom substrate. During the process of pressing and releasing the test seat through the movable cover plate to realize the electrical conduction and disconnection between the test seat and the test carrier plate, the movable cover plate is ensured to elastically press the test seat, avoiding damage to the test seat and the chip inside the test seat, and ensuring the stability of the performance of the sampled qualified products. Attached Figure Description

[0014] Appendix Figure 1 This is a schematic diagram of the online detection and burning device of this utility model;

[0015] Appendix Figure 2 for Figure 1 Enlarged view of a portion of the structure;

[0016] Appendix Figure 3 This is a partial structural schematic diagram of the online detection and burning device of this utility model;

[0017] Appendix Figure 4 for Figure 3 A magnified view of the local structure of the medium from another perspective.

[0018] In the above figures: 101, programming substrate; 102, three-axis drive assembly; 103, pickup unit; 104, programming unit; 1, substrate; 2, testing unit; 3, three-axis drive unit; 31, Z-axis movable block; 4, vacuum nozzle; 5, horizontal transport module; 6, material transport platform; 61, bearing groove; 7, material box; 8, test carrier plate; 9, test seat; 10, movable cover plate; 11, movable plate; 12, connecting column; 13, bottom substrate; 14, cylinder; 15, guide column; 16, spring. Detailed Implementation

[0019] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0020] Example 1: An online testing programming device includes: a programming substrate 101, a three-axis drive assembly 102 respectively mounted on the upper surface of the programming substrate 101, a programming unit 104, and a pickup unit 103 mounted on the three-axis drive assembly 102. The unit 103 is used to transport the chip into the programming unit 104. A substrate 1 is disposed on the outer side of the programming substrate 101. A test unit 2 and a three-axis drive unit 3 are respectively mounted on the substrate 1. At least two spaced vacuum nozzles 4 are mounted on the Z-axis movable block 31 of the three-axis drive unit 3. A horizontal transport module 5 is also installed on the upper surface of the substrate 1. One end of the horizontal transport module 5 is connected to the upper surface of the substrate 1, and the other end extends to the top of the programming substrate 101 and is connected to the programming substrate 101. A material transport platform 6 is installed on the movable part of the horizontal transport module 5, so that the material transport platform 6 can move between the programming substrate 101 and the substrate 1 with the movable part of the horizontal transport module 5. The pickup unit 103 is also used to transport the chip in the programming unit 104 to the material transport platform 6. The vacuum nozzle 4 is used to transport the chip to be tested on the material transport platform 6 to the test unit 2.

[0021] The test unit 2 further includes: a test carrier plate 8 mounted on the substrate 1, a plurality of test seats 9 spaced apart on the test carrier plate 8, and a movable cover plate 10 movably disposed above the test carrier plate 8 and used to cooperate with the test seats 9. A movable plate 11 corresponding to the movable cover plate 10 and located below the substrate 1 is connected to the movable cover plate 10 by at least two vertically arranged connecting posts 12. A bottom substrate 13 connected to the substrate 1 is disposed below the movable plate 11. A cylinder 14 with a piston rod connected to the movable plate 11 is mounted on the upper surface of the bottom substrate 13. A guide post 15 is disposed on the lower surface of the movable plate 11 and on both sides of the cylinder 14. The other end of the guide post 15 connected to the movable plate 11 is slidably passed through the bottom substrate 13. A spring 16 is fitted on the outer side of each guide post 15 and between the movable plate 11 and the bottom substrate 13.

[0022] The upper surface of the aforementioned material handling platform 6 is provided with at least two carrier slots 61 for chip embedding.

[0023] The aforementioned vacuum nozzle 4 and the bearing groove 61 opened on the upper surface of the material conveying platform 6 are both provided with 4.

[0024] Example 2: An online testing programming device, comprising: a programming substrate 101, a three-axis drive assembly 102 respectively mounted on the upper surface of the programming substrate 101, a programming unit 104, and a pickup unit 103 mounted on the three-axis drive assembly 102. The unit 103 is used to transport the chip into the programming unit 104. A substrate 1 is disposed on the outer side of the programming substrate 101. A test unit 2 and a three-axis drive unit 3 are respectively mounted on the substrate 1. At least two spaced vacuum nozzles 4 are mounted on the Z-axis movable block 31 of the three-axis drive unit 3. A horizontal transport module 5 is also installed on the upper surface of the substrate 1. One end of the horizontal transport module 5 is connected to the upper surface of the substrate 1, and the other end extends to the top of the programming substrate 101 and is connected to the programming substrate 101. A material transport platform 6 is installed on the movable part of the horizontal transport module 5, so that the material transport platform 6 can move between the programming substrate 101 and the substrate 1 with the movable part of the horizontal transport module 5. The pickup unit 103 is also used to transport the chip in the programming unit 104 to the material transport platform 6. The vacuum nozzle 4 is used to transport the chip to be tested on the material transport platform 6 to the test unit 2.

[0025] The test unit 2 further includes: a test carrier plate 8 mounted on the substrate 1, a plurality of test seats 9 spaced apart on the test carrier plate 8, and a movable cover plate 10 movably disposed above the test carrier plate 8 and used to cooperate with the test seats 9. A movable plate 11 corresponding to the movable cover plate 10 and located below the substrate 1 is connected to the movable cover plate 10 by at least two vertically arranged connecting posts 12. A bottom substrate 13 connected to the substrate 1 is disposed below the movable plate 11. A cylinder 14 with a piston rod connected to the movable plate 11 is mounted on the upper surface of the bottom substrate 13. A guide post 15 is disposed on the lower surface of the movable plate 11 and on both sides of the cylinder 14. The other end of the guide post 15 connected to the movable plate 11 is slidably passed through the bottom substrate 13. A spring 16 is fitted on the outer side of each guide post 15 and between the movable plate 11 and the bottom substrate 13.

[0026] The upper surface of the aforementioned material handling platform 6 is provided with at least two carrier slots 61 for chip embedding.

[0027] The aforementioned vacuum nozzle 4 is also used to transport the tested chips in the test unit 2 to the material handling platform 6.

[0028] A material box 7 is mounted on the upper surface of the substrate 1, and the vacuum nozzle 4 is also used to transport the chip that has completed testing in the test unit 2 into the material box 7.

[0029] Working principle:

[0030] The pick-up unit on the three-axis drive assembly sequentially transports the chips to be programmed from the tray or tape to the programming unit on the upper surface of the programming substrate for programming. After programming, the pick-up unit sequentially transports the programmed chips in the programming unit to the empty tray or tape for subsequent unloading operations.

[0031] The programming units mentioned above all fall within the existing basic scope, and the applicant's prior applications have provided specific technical solutions, which will not be repeated in this patent.

[0032] Importantly, during the chip programming process, a random inspection of the programmed chips is necessary to check the accuracy of the programmed information and prevent errors caused by human error, computer viruses, software mutations, or other factors. The specific process is as follows:

[0033] During the normal burning process, perform the following operations at regular intervals (e.g., every hour):

[0034] The horizontal transport module moves the material transport platform to the side of the programming unit. The picking unit on the three-axis drive component randomly selects the chip that has been programmed in the programming unit and transports it to the material transport platform.

[0035] The horizontal transport module then moves the transport platform carrying the programmed chip to above the substrate. Next, the vacuum nozzle driven by the three-axis drive unit moves the programmed chip on the transport platform to the test unit for testing. Based on the test results, the tested chip is moved to a specific location (such as a qualified product box, an NG product box, or a discharge tray). The test unit and test process described above are all within the scope of existing technology and will not be elaborated here.

[0036] During the aforementioned testing process, the test socket needs to be pressed and released using the movable cover plate to achieve electrical connection and disconnection between the test socket and the test carrier. The guide post and spring settings can buffer the force of the cylinder that drives the movable cover plate to move up and down, ensuring that the movable cover plate elastically presses the test socket, avoiding damage to the test socket and the chip inside the test socket, and ensuring the stability of the performance of the sampled qualified products.

[0037] When using the above-mentioned online detection programming device, it can randomly and automatically inspect the programmed chips at any time during the programming process without stopping the programming process, which can improve production efficiency and ensure the yield rate throughout the programming process. In addition, the testing unit includes: a test carrier plate mounted on a substrate, several test seats spaced apart on the test carrier plate, and a movable cover plate movably disposed above the test carrier plate for cooperating with the test seats. A movable plate corresponding to the movable cover plate and located below the substrate is connected to the movable cover plate via at least two vertically arranged connecting posts. A bottom substrate connected to the substrate is disposed below the movable plate. A cylinder with a piston rod connected to the movable plate is mounted on the upper surface of the bottom substrate. A guide post is disposed on the lower surface of the movable plate on both sides of the cylinder. The other end of the guide post connected to the movable plate can slide through the bottom substrate. A spring is fitted on the outer side of each guide post between the movable plate and the bottom substrate. During the process of pressing and releasing the test seat through the movable cover plate to realize the electrical conduction and disconnection between the test seat and the test carrier plate, the movable cover plate is ensured to elastically press the test seat, avoiding damage to the test seat and the chip inside the test seat, and ensuring the stability of the performance of the sampled qualified products.

[0038] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. An online testing programming device, comprising: The programming substrate (101), a three-axis drive assembly (102) mounted on the upper surface of the programming substrate (101), a programming unit (104), and a pickup unit (103) mounted on the three-axis drive assembly (102), wherein the pickup unit (103) is used to transport the chip into the programming unit (104), characterized in that: a substrate (1) is provided on the outer side of the programming substrate (101), a test unit (2) and a three-axis drive unit (3) are respectively mounted on the substrate (1), and at least two spaced vacuum nozzles (4) are mounted on the Z-axis movable block (31) of the three-axis drive unit (3), and the upper surface of the substrate (1) is also equipped with A horizontal transport module (5) is provided, with one end connected to the upper surface of the substrate (1) and the other end extending above the programming substrate (101) and connected to the programming substrate (101). A material transport platform (6) is installed on the movable part of the horizontal transport module (5), so that the material transport platform (6) can move between the programming substrate (101) and the substrate (1) along with the movable part of the horizontal transport module (5). The pickup unit (103) is also used to transport the chip in the programming unit (104) to the material transport platform (6). The vacuum nozzle (4) is used to transport the chip to be tested on the material transport platform (6) to the test unit (2). The test unit (2) further includes: a test carrier plate (8) mounted on the substrate (1), a plurality of test seats (9) spaced apart on the test carrier plate (8), and a movable cover plate (10) movably disposed above the test carrier plate (8) and used to cooperate with the test seats (9). A movable plate (11) corresponding to the movable cover plate (10) and located below the substrate (1) is connected to the movable cover plate (10) through at least two vertically arranged connecting posts (12). A [missing information] is disposed below the movable plate (11). A base plate (13) connected to the base plate (1) has a cylinder (14) on its upper surface that is connected to a piston rod and a movable plate (11). A guide post (15) is provided on the lower surface of the movable plate (11) and on both sides of the cylinder (14). The other end of the guide post (15) connected to the movable plate (11) can slide through the base plate (13). A spring (16) is fitted on the outer side of each guide post (15) and between the movable plate (11) and the base plate (13).

2. The online detection programming device according to claim 1, characterized in that: The upper surface of the material handling platform (6) is provided with at least two carrier slots (61) for chip embedding.

3. The online detection programming device according to claim 2, characterized in that: The vacuum nozzle (4) and the bearing groove (61) opened on the upper surface of the material conveying platform (6) are both provided with 4.

4. The online detection programming device according to claim 1, characterized in that: The vacuum nozzle (4) is also used to transport the chip that has been tested in the test unit (2) to the material handling platform (6).

5. The online detection programming device according to claim 1, characterized in that: A material box (7) is mounted on the upper surface of the substrate (1), and the vacuum nozzle (4) is also used to transport the chip that has been tested in the test unit (2) to the material box (7).

Images