Stacked mainboard heat dissipation structure of smart watch

Abstract

The utility model relates to the technical field of heat dissipation structures, in particular to a laminated mainboard heat dissipation structure of an intelligent watch, which comprises a watchcase, a main PCB (printed circuit board) arranged in the watchcase, an auxiliary PCB arranged in the watchcase and a substrate arranged in the watchcase and positioned between the main PCB and the auxiliary PCB. Liquid metal heat conduction layers are arranged on the contact faces of the base plate and the main PCB and the contact faces of the base plate and the auxiliary PCB respectively, the main PCB is electrically connected with the auxiliary PCB, a battery bin is arranged in the watchcase, the battery bin is arranged on the side of the main PCB and electrically connected with the main PCB, a mounting plate is fixedly connected into the watchcase, and the mounting plate is fixedly connected with the base plate. The utility model aims to provide the laminated mainboard heat dissipation structure of the intelligent watch, so as to solve the problem that the longitudinal space is not fully excavated due to the plane layout of a single-sided PCB (Printed Circuit Board).

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structure technology, specifically to a stacked motherboard heat dissipation structure for smartwatches. Background Technology

[0002] Smartwatches are electronic devices that combine fashion and technology. They not only function as a clock but also offer some of the communication capabilities of a smartphone. Connecting to a phone via a built-in eSIM or Bluetooth, users can make and receive calls and send and receive text messages without taking out their phones. Message notifications from social media apps like WeChat and QQ are also synchronized in real time, ensuring important information is never missed. This has made them popular. The realization of these rich functions is thanks to the sophisticated hardware architecture within the smartwatch. The motherboard, as the core of the device, connects various functional chips and electronic components in an orderly manner. The communication chip on the motherboard supports multiple network standards, ensuring stable data transmission in 4G, Wi-Fi, Bluetooth, and other network environments. The storage chip provides secure and stable storage space for system operation and user data. It is the collaborative operation of these functional chips on the motherboard that makes smartwatches a powerful assistant for modern people's efficient living and health management, continuously leading technological innovation and application changes in wearable devices.

[0003] Publication number CN219997488U discloses a circular smartwatch motherboard with high space utilization, relating to the field of smartwatch technology. It includes a double-sided circular PCB motherboard with a rectangular battery placement area on its back. The four corners of the battery placement area are close to the edges of the PCB, and the outer part of the battery placement area's border is the component soldering area. By setting the PCB motherboard to a circular structure, the battery space is maximized, resulting in a larger battery capacity. The component soldering arrangement does not overlap with the battery placement position, leading to better heat dissipation, high space utilization, and effectively reducing the thickness of the components after installation. This allows for a thinner and more aesthetically pleasing overall smartwatch design.

[0004] In the above design, the smartwatch motherboard relies on a planar layout of a single-sided PCB, which results in the vertical space not being fully utilized. This layout concentrates all functional modules such as batteries, chips, and sensors on both sides of the PCB and lays them flat. The distribution of components is limited to the same projected area, and the three-dimensional space inside the watch body is not effectively utilized. Utility Model Content

[0005] The purpose of this invention is to provide a stacked motherboard heat dissipation structure for smartwatches, in order to solve the problem that the vertical space is not fully utilized due to the planar layout of a single-sided PCB.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A stacked motherboard heat dissipation structure for a smartwatch includes a watch case, a main PCB board inside the watch case, a secondary PCB board inside the watch case, and a substrate inside the watch case. The substrate is located between the main PCB board and the secondary PCB board. Liquid metal thermal conductive layers are respectively provided on the contact surfaces of the substrate with the main PCB board and the secondary PCB board. The main PCB board and the secondary PCB board are electrically connected.

[0008] Preferably, a battery compartment is provided inside the watch case, the battery compartment is located on the side of the main PCB board, and the battery compartment is electrically connected to the main PCB board.

[0009] Preferably, a mounting plate is fixedly connected to the inside of the watch case, and the battery compartment is mounted on the surface of the mounting plate.

[0010] Preferably, heat dissipation fins are connected between the bottom of the main PCB board and the casing.

[0011] Preferably, the heat dissipation fins are multiple thin sheet-like structures arranged in parallel.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. By setting up a layered main and secondary PCB board, the three-dimensional stacking design breaks through the limitations of planar layout. It transfers the batteries and components that originally competed for planar space to different three-dimensional areas, significantly improving the vertical space utilization. This not only provides a more flexible layout for the battery, but also allows the main and secondary boards to carry different functional modules. For example, the main board integrates high-frequency components, while the secondary board is used to arrange low-power sensors. Combined with the liquid metal heat-conducting layer, efficient heat dissipation is achieved, fundamentally solving the spatial conflict problem between batteries, components, and heat dissipation in planar layout.

[0014] 2. The side-mounted battery compartment is isolated from the motherboard area through an independent cavity, reducing the stress impact of battery expansion on the PCB. The graphene composite substrate serves as a rigid support layer, combined with the flexible filling of liquid metal, effectively alleviating vibration stress and thermal expansion deformation during the stacking of main and auxiliary boards. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the internal structure of the watch case of this utility model;

[0016] Figure 2 This is a front view of the internal structure of the watch case of this utility model.

[0017] In the diagram: 1. Case; 2. Main PCB board; 3. Substrate; 4. Secondary PCB board; 5. Heat sink fins; 6. Mounting plate; 7. Battery compartment; 8. Liquid metal thermal conductive layer. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figures 1 to 2 This utility model provides a technical solution.

[0020] The smartwatch features a stacked motherboard heat dissipation structure, including a watch case 1, a main PCB board 2 inside the watch case 1, a secondary PCB board 4 inside the watch case 1, and a substrate 3 inside the watch case 1. The substrate 3 is located between the main PCB board 2 and the secondary PCB board 4, and the three are stacked. Liquid metal thermal conductive layers 8 are respectively provided on the contact surfaces between the substrate 3 and the main PCB board 2 and the secondary PCB board 4. The main PCB board 2 and the secondary PCB board 4 are electrically connected.

[0021] The substrate 3 is a graphene composite board. The main PCB board 2 and the secondary PCB board 4 serve as the core circuit carriers of the smartwatch and generate heat during operation. The substrate 3 is located between the main PCB board 2 and the secondary PCB board 4 and is made of graphene composite board. The graphene composite board is composed of multiple layers of graphene and high thermal conductivity insulating materials, which has both excellent thermal conductivity and insulation properties. This gives the graphene composite board both high thermal conductivity and structural strength, and can evenly diffuse heat to the metal frame of the watch body.

[0022] The liquid metal thermal conductive layer 8 utilizes the fluidity of liquid metal at room temperature to closely adhere to the surfaces of the PCB board and the substrate 3, filling in minute unevenness and eliminating air gaps, thereby greatly improving the heat conduction efficiency between the contact surfaces and quickly transferring the heat generated by the main PCB board 2 and the secondary PCB board 4 to the substrate 3.

[0023] The main PCB board 2 and the secondary PCB board 4 are electrically connected through conductive connectors. The conductive connectors can be pin headers, flexible circuit boards, etc. The appropriate connection method is selected according to the actual layout to ensure stable transmission of signals and power.

[0024] The watch case 1 contains a battery compartment 7, which is located on the side of the main PCB board 2. The battery compartment 7 is electrically connected to the main PCB board 2.

[0025] When the battery compartment 7 is placed on its side, its electrode contacts are connected to the pads of the main PCB board 2 via the FPC. The FPC can be bent into an L-shape or Z-shape and pass through the mounting plate 6 to achieve cross-space conductivity. For example, gold-plated contacts are reserved at the bottom of the battery compartment 7. One end of the FPC is soldered to the gold-plated contacts, and the other end is connected to the FPC connector soldered to the pads by plugging or soldering to form a conductive link. The FPC is made of flexible and highly conductive polyimide board with conductive copper foil covering the surface.

[0026] The watch case 1 is internally fixedly connected to a mounting plate 6, and the battery compartment 7 is mounted on the surface of the mounting plate 6. The mounting plate 6 is made of lightweight and high-strength insulating material, such as glass fiber reinforced plastic, and is fixedly connected to the inside of the watch case 1 by screws, clips and other fixing methods, providing a stable mounting position for the battery compartment 7. The battery compartment 7 is located on the side of the main PCB board 2. This side-mounted design makes reasonable use of the space inside the watch case 1 and avoids space conflicts with the motherboard stacked structure.

[0027] A heat sink 5 is connected between the bottom of the main PCB board 2 and the casing 1 for heat dissipation. The heat sink 5 is made of a metal material with good thermal conductivity, such as aluminum alloy or copper alloy. The heat sink 5 is designed as a multi-parallel thin sheet structure to increase the heat dissipation area. One end of the heat sink 5 is tightly connected to the bottom of the main PCB board 2 by means of thermal adhesive, welding or clipping, and the other end is in contact with the inner wall of the casing 1 or connected by thermally conductive material. This design allows the heat generated by the main PCB board 2 to be quickly conducted to the casing 1 through the heat sink 5, and then dissipated to the external environment by the casing 1.

[0028] Specifically, this solution involves a layered motherboard heat dissipation structure that utilizes multiple layers of thermally conductive materials and a rational layout design to create an efficient heat dissipation path. Heat generated by the main PCB board 2 and secondary PCB board 4 is first transferred to the graphene composite substrate 3 via the liquid metal thermally conductive layer 8. Leveraging the high thermal conductivity of the graphene composite board, the heat rapidly diffuses within the board. Then, some heat is transferred to the surrounding air via substrate 3, while another portion is transferred along substrate 3 to the casing 1. A further portion of the heat from the main PCB board 2 is transferred to the casing 1 via the bottom heat dissipation fins 5, ultimately dissipating into the external environment. The side-mounted design and FPC connection of the battery compartment 7 prevent the battery from interfering with the motherboard's heat dissipation path, while also making efficient use of space, resulting in a compact and orderly structure.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A stacked motherboard heat dissipation structure for a smartwatch, comprising a watch case (1), characterized in that: The watch case (1) is provided with a main PCB board (2), a secondary PCB board (4), and a substrate (3). The substrate (3) is located between the main PCB board (2) and the secondary PCB board (4). Liquid metal heat-conducting layers (8) are respectively provided on the contact surfaces of the substrate (3) with the main PCB board (2) and the secondary PCB board (4). The main PCB board (2) and the secondary PCB board (4) are electrically connected.

2. The smartwatch stacked motherboard heat dissipation structure according to claim 1, characterized in that, The watch case (1) is provided with a battery compartment (7), which is located on the side of the main PCB board (2). The battery compartment (7) is electrically connected to the main PCB board (2).

3. The smartwatch stacked motherboard heat dissipation structure according to claim 2, characterized in that, The watch case (1) is fixedly connected to the inside of the mounting plate (6), and the battery compartment (7) is mounted on the surface of the mounting plate (6).

4. The smartwatch stacked motherboard heat dissipation structure according to claim 1, characterized in that, The bottom of the main PCB board (2) is connected to the casing (1) by heat dissipation fins (5).

5. The smartwatch stacked motherboard heat dissipation structure according to claim 4, characterized in that, The heat dissipation fins (5) are multiple thin sheet-like structures arranged in parallel.

Images