LED packaging structure and lamp bead

Abstract

The utility model provides an LED packaging structure and a lamp bead, the LED packaging structure comprises a bowl cup support, the bowl cup support is internally provided with a light-emitting chip, a reflection part and at least two fluorescent layers, the light-emitting chip is located on the bottom wall of the bowl cup support, the at least two fluorescent layers sequentially cover the side, away from the bowl cup support, of the light-emitting chip, and the reflection part is located on the bottom wall of the bowl cup support. The excitation wavelengths are sequentially decreased along the direction far away from the light-emitting chip; the reflecting part is at least arranged on the inner side wall of the bowl-cup support, and the reflectivity of the reflecting part is larger than that of the bowl-cup support. Therefore, through the high reflectivity of the reflecting part, the light absorption of the bowl cup support can be reduced, the light emitting loss is reduced, the lighting effect is further improved, and the lighting effect of the LED product can be further improved through the sequential excitation of the plurality of fluorescent layers.

Description

Technical Field

[0001] This application relates to the field of LED product technology, specifically to an LED packaging structure and LED beads. Background Technology

[0002] In the LED chip packaging process, the LED chip is typically covered inside a cup using an adhesive dispensing method. During use, some of the light emitted by the LED chip is first reflected onto the bottom wall of the cup, then onto the side wall, and finally out of the cup. Because the cup material has low reflectivity and high light absorption, the light emitted by the LED undergoes multiple reflections, resulting in significant light loss and low luminous efficiency. Utility Model Content

[0003] In view of this, this application provides an LED packaging structure and LED chip that can reduce the absorption of light by the cup, reduce light loss, and improve luminous efficiency.

[0004] To achieve the above objectives, this application provides the following technical solution:

[0005] An LED packaging structure includes a bowl-shaped bracket. Inside the bowl-shaped bracket are disposed a light-emitting chip, a reflective element, and at least two phosphor layers. The light-emitting chip is located on the bottom wall of the bowl-shaped bracket. The at least two phosphor layers sequentially cover the side of the light-emitting chip away from the bowl-shaped bracket, and the excitation wavelength decreases sequentially along the direction away from the light-emitting chip. The reflective element is at least disposed on the inner sidewall of the bowl-shaped bracket, and the reflectivity of the reflective element is greater than the reflectivity of the bowl-shaped bracket.

[0006] Optionally, the bottom wall of the bowl and cup holder is provided with a blocking part, the blocking part is disposed around the outer periphery of the light-emitting chip, and the reflective part is located between the blocking part and the inner side wall of the bowl and cup holder.

[0007] Optionally, the height of the blocking portion is set to 0.04-0.08 mm.

[0008] Optionally, the angle between the side of the reflective part away from the bottom wall of the bowl and cup holder and the bottom wall of the bowl and cup holder is 110-160 degrees.

[0009] Optionally, the light-emitting chip (2) is electrically connected to the bowl and cup holder (1) via a bonding wire (7), and a fluorescent layer near the light-emitting chip (2) covers the bottom wall of the bowl and cup holder (1) and the bonding wire (7).

[0010] Optionally, the reflective portion is disposed on the bottom wall and inner side wall of the bowl / cup holder, and the reflective portion surrounds the outer periphery of the light-emitting chip.

[0011] Optionally, a portion of the reflective portion is covered by a fluorescent layer near the light-emitting chip, and the reflective layer is wrapped around the outer periphery of the light-emitting chip;

[0012] Alternatively, one of the fluorescent layers near the light-emitting chip is attached to the side of the light-emitting chip away from the bowl / cup holder.

[0013] Optionally, the reflective part is made of white glue.

[0014] Optionally, the at least two fluorescent layers include a red fluorescent layer and a green fluorescent layer, the green fluorescent layer covering the side of the red fluorescent layer away from the light-emitting chip, and the excitation wavelength of the red fluorescent layer being greater than the excitation wavelength of the green fluorescent layer.

[0015] Optionally, the thickness of the red fluorescent layer is 150-400 micrometers.

[0016] An LED chip includes an LED packaging structure as described in any of the preceding claims.

[0017] The LED packaging structure and LED chips provided in this application, because the reflective part covers the inner wall of the cup-shaped bracket, can reflect the light emitted by the light-emitting chip to the outer side of the cup-shaped bracket through the high reflectivity of the reflective part. This increases the light output and reduces the light absorption by the cup-shaped bracket, thereby reducing light loss and improving luminous efficiency. Moreover, the excitation wavelength of the phosphor layer decreases sequentially away from the light-emitting chip. The light emitted by the high-excitation wavelength phosphor excited by the chip will not be absorbed by the low-excitation wavelength phosphor. This allows multiple phosphor layers to be excited sequentially without secondary absorption by the phosphor, further improving the luminous efficiency of the LED product. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0019] Figure 1 This is a top view of the bowl and cup holder shown in the first embodiment;

[0020] Figure 2 This is a cross-sectional view of the LED packaging structure shown in the first embodiment;

[0021] Figure 3 The top view of the bowl and cup holder shown in the second embodiment;

[0022] Figure 4 A cross-section of the LED packaging structure shown in the second embodiment Figure 1 ;

[0023] Figure 5 A cross-section of the LED packaging structure shown in the second embodiment Figure 2 .

[0024] Explanation of reference numerals in the attached drawings: 1. Bowl / cup support; 2. Light-emitting chip; 3. Red fluorescent layer; 4. Green fluorescent layer; 5. Reflective part; 6. Blocking part; 7. Bonding wire. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0026] like Figures 1-5 As shown, this application embodiment provides an LED packaging structure, including a bowl-shaped bracket 1. The bowl-shaped bracket 1 has a cavity so that the shape of the bowl-shaped bracket 1 is bowl-shaped. The bottom wall and side wall of the cavity constitute the bottom wall and inner side wall of the bowl-shaped bracket 1.

[0027] The concave cavity of the cup holder 1 houses a light-emitting chip 2, a reflective portion 5, and at least two phosphor layers. The light-emitting chip 2 is disposed on the bottom wall of the cup holder 1, and the reflective portion 5 is disposed on at least the side wall of the cup holder 1. For example, the reflective portion 5 may be disposed only on the inner side wall of the cup holder 1, or it may be disposed on both the inner side wall and the bottom wall of the cup holder 1. The reflective portion 5 has a higher reflectivity than the cup holder 1. The reflective portion 5 increases the amount of light reflected, reduces light absorption by the cup holder 1, and minimizes light loss.

[0028] Here, the reflective part 5 can be set as a highly reflective colloid, which reflects light through the main body of the reflective part 5; the reflective part 5 can also be set as a fastener with a highly reflective surface, which reflects light through the highly reflective surface of the fastener. In the preferred embodiment, the reflective part 5 is set as white glue, which has a simple structure, is conducive to the molding of the reflective part 5, and is easy to process and produce.

[0029] It should be noted that there is an angle between the inner sidewall and the bottom wall of the bowl and cup support 1. The light emitted by the light-emitting chip 2 is first reflected by the bottom wall and then by the side wall, resulting in a relatively large light loss. This solution optimizes the light emission path, reduces the number of light reflections, and improves the light efficiency by setting reflective parts 5 on the side wall and the bottom wall of the bowl and cup support 1.

[0030] Multiple fluorescent layers are sequentially covered on the side of the light-emitting chip 2 away from the bowl-shaped support 1, and the excitation wavelengths of the multiple fluorescent layers decrease sequentially in the direction away from the light-emitting chip 2. Since longer wavelength light is not easily absorbed by the fluorescent layer with shorter excitation wavelength, the light emission of the light-emitting chip 2 can be sequentially excited in each fluorescent layer. Through multiple excitations, each fluorescent layer is fully excited, reducing light excitation loss and improving the luminous efficiency of the LED product.

[0031] Here, the number of fluorescent layers can be set to two, three, or more. In the preferred embodiment, there are two fluorescent layers: a red fluorescent layer 3 and a green fluorescent layer 4. The red fluorescent layer 3 covers the side of the light-emitting chip 2 away from the bottom wall of the bowl-shaped support 1, and the green fluorescent layer 4 covers the side of the red fluorescent layer 3 away from the light-emitting chip 2. This allows the light emitted by the light-emitting chip 2 to first excite the red fluorescent layer 3, and then excite the green fluorescent layer 4. The excitation wavelength of the red fluorescent layer 3 is greater than that of the green fluorescent layer 4. Light with a longer wavelength is less likely to be absorbed by the fluorescent layer with a shorter excitation wavelength, allowing the light emitted by the light-emitting chip 2 to be secondary excited within the green fluorescent layer 4, thus fully exciting the multiple fluorescent layers.

[0032] With this configuration, since the reflective part 5 covers the inner wall of the cup holder 1, the high reflectivity of the reflective part 5 allows the light emitted by the light-emitting chip 2 to be reflected to the outer side of the cup holder 1. This increases the amount of light emitted and reduces the absorption of light by the cup holder 1, thereby reducing light loss and improving luminous efficiency. Furthermore, the excitation wavelength of the phosphor layer decreases sequentially along the direction away from the light-emitting chip 2, allowing multiple phosphor layers to be excited sequentially, further improving the luminous efficiency of the LED product.

[0033] It should be noted that the LED packaging structure can be either upright or flip-chip. Based on different packaging methods, the structure of the cup holder 1 is different, and the connection method between the light-emitting chip 2 and the cup holder 1 is different.

[0034] In the first embodiment, the LED packaging structure is packaged in a standard form, such as... Figure 1-2 As shown, a blocking part 6 is provided on the bottom wall of the bowl / cup support 1. The blocking part 6 protrudes from the bottom wall of the bowl / cup support 1 and is annular, surrounding the outer periphery of the light-emitting chip 2. Here, there can be one or more light-emitting chips 2. When there are multiple light-emitting chips 2, the blocking part 6 surrounds the outer periphery of all of them. The reflective part 5 is disposed between the blocking part 6 and the inner sidewall of the bowl / cup support 1. The blocking part 6 can limit the reflective part 5, which is beneficial for the processing and shaping of the reflective part 5 and prevents the reflective part 5 from overflowing into the area of ​​the light-emitting chip 2, thereby improving the reliability of the processing.

[0035] The height of the blocking part 6 is set to 0.04-0.08 mm, meaning that the blocking part 6 protrudes from the bottom wall of the bowl-cup support 1 by 0.04-0.08 mm. In this way, it can both block the reflective part 5 and avoid blocking the light emission of the light-emitting chip 2, which helps to ensure a high light emission effect.

[0036] It should be noted that the blocking part 6 can be configured as a continuous ring or an intermittent ring, that is, the blocking part 6 can be composed of multiple protrusions arranged along the ring.

[0037] In the preferred embodiment, the angle between the side of the reflector 5 away from the bottom wall of the bowl and cup support 1 (i.e., the upper side of the reflector 5) and the bottom wall of the bowl and cup support 1 is 110-160 degrees. In this way, the light emitted by the light-emitting chip 2 can be reflected to the outside of the bowl and cup support 1 by the inclined upper side of the reflector 5. The light emission angle is better, which helps to reduce light loss and improve light efficiency.

[0038] Among the multiple phosphor layers, the one closest to the light-emitting chip 2 is a red phosphor layer 3. This red phosphor layer 3 covers the bottom wall of the cup holder 1, so that the red phosphor layer 3 surrounds the outer periphery of the light-emitting chip 2, which helps to improve the packaging strength of the light-emitting chip 2. Furthermore, the red phosphor layer 3 also covers the bonding wires 7 on the light-emitting chip 2, so that the bonding wires 7 are embedded within the red phosphor layer 3, which helps to improve the structural strength of the bonding wires 7 and improve the reliability of the electrical connection between the light-emitting chip 2 and the cup holder 1. Here, the light-emitting chip 2 is electrically connected to the cup holder 1 through the bonding wires 7.

[0039] Specifically, the thickness of the red fluorescent layer 3 is set to 150-400 micrometers, which is beneficial for the light emitted by the light-emitting chip 2 to be fully excited within the red fluorescent layer 3 and to improve the structural reliability of the light-emitting chip 2.

[0040] In the second embodiment, the LED packaging structure is a flip-chip type, such as... Figure 3-5 As shown, the reflective portion 5 is disposed on the inner sidewall and bottom wall of the cup holder 1, and surrounds the outer periphery of the light-emitting chip 2. Here, one or more light-emitting chips 2 can be disposed. When multiple light-emitting chips 2 are disposed, the reflective portion 5 surrounds the outer periphery of each light-emitting chip 2. During packaging, the reflective portion 5 is coated on the entire inner wall of the cup holder 1 except for the solder pads. Then, multiple light-emitting chips 2 are eutectic bonded, so that the light emitted from the light-emitting chip 2 can be directly reflected to the outside of the cup holder 1 through the reflective portion 5, resulting in high light emission efficiency.

[0041] Among the multiple fluorescent layers, the one closest to the light-emitting chip 2 is the red fluorescent layer 3. The red fluorescent layer 3 can be set in the form of fluorescent adhesive or fluorescent film. The structure of the red fluorescent layer 3 will be described in detail below.

[0042] like Figure 4 As shown, the red fluorescent layer 3 is made of fluorescent adhesive. During encapsulation, the red fluorescent layer 3 covers the side of the bottom wall of the light-emitting chip 2 away from the cup support 1 and covers part of the reflective part 5, so that the red fluorescent layer 3 wraps around the outer periphery of the light-emitting chip 2. The red fluorescent layer 3 strengthens the light-emitting chip 2, which is beneficial to improving the encapsulation strength and structural stability of the light-emitting chip 2.

[0043] like Figure 5 As shown, the red fluorescent layer 3 is a fluorescent film, which is attached to the side of the bottom wall of the light-emitting chip 2 away from the bowl-shaped support 1. For example, the size of the red fluorescent layer 3 is adapted to the size of the light-emitting chip 2. Here, there can be one or multiple light-emitting chips 2. When there are multiple light-emitting chips 2, there are multiple red fluorescent layers 3, which are attached one-to-one to each of the multiple light-emitting chips 2. During encapsulation, the green fluorescent layer 4 can be a fluorescent adhesive, which is filled into the bowl-shaped support 1 so that the green fluorescent layer 4 covers the red fluorescent layer 3 and the reflective part 5, while also wrapping around the outer periphery of the light-emitting chip 2. In this way, the red fluorescent layer 3 takes the form of a fluorescent film, which is convenient for processing and manufacturing and helps to improve work efficiency.

[0044] Specifically, the thickness of the red fluorescent layer 3 is set to 150-400 micrometers, which is beneficial for the light emitted by the light-emitting chip 2 to be fully excited within the red fluorescent layer 3 and to improve the structural reliability of the light-emitting chip 2.

[0045] This application provides a lamp bead, including the LED packaging structure described in the above embodiments. With this configuration, since the reflective portion 5 covers the inner wall of the cup-shaped support 1, the high reflectivity of the reflective portion 5 allows the light emitted by the light-emitting chip 2 to be reflected to the outer side of the cup-shaped support 1. This increases the light output while reducing light absorption by the cup-shaped support 1, thus reducing light loss and improving luminous efficiency. Furthermore, the excitation wavelength of the phosphor layers decreases sequentially along the direction away from the light-emitting chip 2, allowing multiple phosphor layers to be excited sequentially, further enhancing the luminous efficiency of the LED product.

[0046] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0047] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0048] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0049] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0050] It should be understood that the qualifiers “first,” “second,” “third,” “fourth,” “fifth,” and “sixth” used in the description of the embodiments of this application are only used to more clearly illustrate the technical solutions and are not intended to limit the scope of protection of this application.

[0051] The above description has been given for illustrative and descriptive purposes. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. An LED packaging structure, characterized in that, The cup holder includes a bowl and cup support (1), which has a light-emitting chip (2), a reflective part (5), and at least two fluorescent layers inside. The light-emitting chip (2) is located on the bottom wall of the cup holder (1). The at least two fluorescent layers cover the side of the light-emitting chip (2) away from the cup holder (1) in sequence, and the excitation wavelength decreases in sequence along the direction away from the light-emitting chip (2). The reflective part (5) is at least disposed on the inner side wall of the cup holder (1), and the reflectivity of the reflective part (5) is greater than the reflectivity of the cup holder (1).

2. The LED packaging structure according to claim 1, characterized in that, The bottom wall of the bowl and cup holder (1) is provided with a blocking part (6), which is arranged around the outer periphery of the light-emitting chip (2), and the reflective part (5) is located between the blocking part (6) and the inner side wall of the bowl and cup holder (1).

3. The LED packaging structure according to claim 2, characterized in that, The height of the blocking part (6) is set to 0.04-0.08 mm.

4. The LED packaging structure according to claim 2, characterized in that, The angle between the side of the reflective part (5) away from the bottom wall of the bowl and cup holder (1) and the bottom wall of the bowl and cup holder (1) is 110-160 degrees.

5. The LED packaging structure according to claim 2, characterized in that, The light-emitting chip (2) is electrically connected to the bowl and cup holder (1) via a bonding wire (7), and a fluorescent layer near the light-emitting chip (2) covers the bottom wall of the bowl and cup holder (1) and the bonding wire (7).

6. The LED packaging structure according to claim 1, characterized in that, The reflective part (5) is disposed on the bottom wall and inner side wall of the bowl and cup support (1), and the reflective part (5) surrounds the outer periphery of the light-emitting chip (2).

7. The LED packaging structure according to claim 6, characterized in that, A portion of the reflective portion (5) is covered by a fluorescent layer near the light-emitting chip (2) and is wrapped around the outer periphery of the light-emitting chip (2); Alternatively, one of the fluorescent layers near the light-emitting chip (2) is attached to the side of the light-emitting chip (2) away from the bowl and cup holder (1).

8. The LED packaging structure according to claim 1, characterized in that, The reflective part (5) is made of white glue.

9. The LED packaging structure according to claim 1, characterized in that, The at least two fluorescent layers include a red fluorescent layer (3) and a green fluorescent layer (4), the green fluorescent layer (4) covering the side of the red fluorescent layer (3) away from the light-emitting chip (2), and the excitation wavelength of the red fluorescent layer (3) is greater than the excitation wavelength of the green fluorescent layer (4).

10. The LED packaging structure according to claim 9, characterized in that, The thickness of the red fluorescent layer (3) is 150-400 micrometers.

11. A type of LED bead, characterized in that, It includes the LED packaging structure as described in any one of claims 1-10.

Images