Paster lamp bead packaging structure

Abstract

The utility model discloses a surface-mounted lamp bead packaging structure, and relates to the technical field of lamp beads. Comprising a ceramic substrate, a heat dissipation mechanism is fixedly installed in the middle of the ceramic substrate, the heat dissipation mechanism comprises a rectangular opening, heat conduction silica gel, a heat dissipation copper pipe and a metal shielding net, an LED chip is fixedly installed on the upper surface of the heat dissipation mechanism, and connecting mechanisms are arranged on the left and right positions, corresponding to the LED chip, of the lower surface of the ceramic substrate. The upper surface of the ceramic substrate corresponding to the LED chip is fixedly provided with a reflection mechanism, the reflection mechanism comprises a reflection cup and a reflection coating, the upper surface of the reflection mechanism is fixedly provided with a scattering mechanism, and the outer surface of the ceramic substrate corresponding to the scattering mechanism is packaged with a lens layer. According to the utility model, the heat dissipation function of the LED chip is added through the heat dissipation mechanism, so that the LED chip is not easy to damage due to high temperature, the service life of the LED chip is greatly prolonged, and the reflection and scattering functions of the light source of the LED chip are added, so that the light source is more uniform and brighter, and the use is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of LED technology, specifically to a surface mount LED chip packaging structure. Background Technology

[0002] Light-emitting diodes, or LEDs for short, are commonly used light-emitting devices. They emit light by releasing energy through the recombination of electrons and holes. They are widely used in the lighting field, and surface-mount LED chips are an important component of LED lights. LEDs can efficiently convert electrical energy into light energy and have a wide range of applications in modern society, such as lighting, flat panel displays, and medical devices.

[0003] In the existing technology, the conventional surface mount LED chip packaging structure lacks heat dissipation function for LED chips, which causes LED chips to be used at high temperatures for a long time, greatly reducing the lifespan of LED chips. In addition, the lack of reflection and heat dissipation function on the upper side of the LED chip results in insufficient light brightness of the LED chip, which is not conducive to use. Utility Model Content

[0004] This invention provides a surface-mount LED chip packaging structure to solve the problems in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a surface mount LED chip packaging structure, comprising a ceramic substrate, a heat dissipation mechanism fixedly mounted in the middle of the ceramic substrate, an LED chip fixedly mounted on the upper surface of the heat dissipation mechanism, connecting mechanisms provided on the left and right sides of the lower surface of the ceramic substrate corresponding to the LED chip, a reflection mechanism fixedly mounted on the upper surface of the ceramic substrate corresponding to the LED chip, a scattering mechanism fixedly mounted on the upper surface of the reflection mechanism, and a lens layer encapsulated on the outer surface of the ceramic substrate corresponding to the scattering mechanism.

[0006] Furthermore, the heat dissipation mechanism includes a rectangular opening, thermally conductive silicone, a heat dissipation copper pipe, and a metal shielding mesh. A rectangular opening is provided in the middle of the ceramic substrate. Thermally conductive silicone is fixedly installed on the upper surface of the rectangular opening, and the thermally conductive silicone has an inverted T-shaped structure. A heat dissipation copper pipe is provided inside the thermally conductive silicone, and a metal shielding mesh is fixedly installed on the lower surface of the thermally conductive silicone.

[0007] Furthermore, notches are left on the front and rear sidewalls of the ceramic substrate corresponding to the rectangular opening, and the lower surface of the metal shielding mesh is 1.5mm away from the lower surface of the ceramic substrate.

[0008] Furthermore, the front and rear sides of the heat dissipation copper pipe are both open structures, and the front and rear sides of the heat dissipation copper pipe are perpendicular and flush with the front and rear sides of the ceramic substrate.

[0009] Furthermore, the connection mechanism includes gold wires and metal pins. Gold wires are provided on the lower surface of the LED chip near the left and right sides, and the gold wires are connected to the metal pins. The metal pins are fixedly embedded on the lower surface of the ceramic substrate.

[0010] Furthermore, the reflective mechanism includes a reflector cup and a reflective coating. The reflector cup is fixedly installed on the upper surface of the ceramic substrate, and the inner wall of the reflector cup and the edge of the upper surface of the LED chip are coated with a reflective coating.

[0011] Furthermore, the reflective coating is applied using aluminum paint.

[0012] Furthermore, the scattering mechanism includes a highly transparent silicone layer and heat dissipation particles. The highly transparent silicone layer is encapsulated on the upper surface of the reflector, and heat dissipation particles are disposed within the highly transparent silicone layer.

[0013] Compared with the prior art, the present invention provides a surface-mount LED chip packaging structure, which has the following advantages:

[0014] 1. This surface-mount LED chip packaging structure enhances the heat dissipation function of the LED chip by setting a heat dissipation mechanism, making the LED chip less susceptible to high-temperature damage and greatly extending the life of the LED chip.

[0015] 2. This surface-mount LED chip packaging structure enhances the reflection and scattering functions of the LED chip light source by setting a reflection mechanism and a scattering mechanism, making the LED chip light source more uniform and brighter, which is beneficial for use. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This is a cross-sectional view of the present invention;

[0018] Figure 3 This utility model Figure 2 Enlarged cross-sectional view at point A in the middle.

[0019] In the diagram: 1. Ceramic substrate; 2. Heat dissipation mechanism; 201. Rectangular opening; 202. Thermally conductive silicone; 203. Copper heat dissipation pipe; 204. Metal shielding mesh; 3. LED chip; 4. Connection mechanism; 401. Gold wire; 402. Metal pin; 5. Reflection mechanism; 501. Reflector cup; 502. Reflective coating; 6. Scattering mechanism; 601. High-transparency silicone layer; 602. Heat dissipation particles; 7. Lens layer. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figures 1-3 This utility model discloses a surface-mount LED chip packaging structure, including a ceramic substrate 1. A heat dissipation mechanism 2 is fixedly installed in the middle of the ceramic substrate 1. An LED chip 3 is fixedly installed on the upper surface of the heat dissipation mechanism 2. A connecting mechanism 4 is provided on the left and right sides of the lower surface of the ceramic substrate 1 corresponding to the LED chip 3. A reflection mechanism 5 is fixedly installed on the upper surface of the ceramic substrate 1 corresponding to the LED chip 3. A scattering mechanism 6 is fixedly installed on the upper surface of the reflection mechanism 5. A lens layer 7 is encapsulated on the outer surface of the ceramic substrate 1 corresponding to the scattering mechanism 6.

[0022] Specifically, the heat dissipation mechanism 2 includes a rectangular opening 201, thermally conductive silicone 202, a heat dissipation copper pipe 203, and a metal shielding mesh 204. The ceramic substrate 1 has a rectangular opening 201 in the upper middle part. The thermally conductive silicone 202 is fixedly installed on the upper surface of the rectangular opening 201, and the thermally conductive silicone 202 has an inverted T-shaped structure. The heat dissipation copper pipe 203 is disposed inside the thermally conductive silicone 202, and the metal shielding mesh 204 is fixedly installed on the lower surface of the thermally conductive silicone 202.

[0023] In this embodiment, the rectangular opening 201 is used to install the thermally conductive silicone 202. The thermally conductive silicone 202 and the heat dissipation copper pipe 203 can quickly dissipate heat, increasing the heat dissipation function of the LED chip 3. The metal shielding mesh 204 prevents electromagnetic signals on the lamp board from interfering with the LED chip 3.

[0024] Specifically, the rectangular opening 201 has notches on both the front and rear sidewalls of the ceramic substrate 1, and the lower surface of the metal shielding mesh 204 is 1.5 mm away from the lower surface of the ceramic substrate 1.

[0025] In this embodiment, the front and rear notches corresponding to the rectangular opening 201 can also dissipate heat from the thermally conductive silicone 202, and the metal shielding mesh 204 does not come into contact with the lamp board, thus avoiding damage to the LED chip 3.

[0026] Specifically, the front and rear sides of the heat dissipation copper pipe 203 are open structures, and the front and rear sides of the heat dissipation copper pipe 203 are perpendicular and flush with the front and rear sides of the ceramic substrate 1.

[0027] In this embodiment, the heat dissipation copper pipe 203 can meet the gas flow requirements, resulting in better heat dissipation and a more aesthetically pleasing appearance.

[0028] Specifically, the connection mechanism 4 includes gold wires 401 and metal pins 402. Gold wires 401 are provided on the lower surface of the LED chip 3 near the left and right sides, and the gold wires 401 are connected to the metal pins 402. The metal pins 402 are fixedly embedded on the lower surface of the ceramic substrate 1.

[0029] In this embodiment, the left and right gold wires 401 connect the positive and negative terminals of the LED chip 3 to the left and right metal pins 402, and the metal pins 402 are electrically connected to the circuitry on the lamp board.

[0030] Specifically, the reflective mechanism 5 includes a reflector cup 501 and a reflective coating 502. The reflector cup 501 is fixedly installed on the upper surface of the ceramic substrate 1, and the inner wall of the reflector cup 501 and the edge of the upper surface of the LED chip 3 are coated with the reflective coating 502.

[0031] In this embodiment, the reflector cup 501 and the reflective coating 502 enable the light source emitted by the LED chip 3 to be emitted upwards.

[0032] Specifically, the reflective coating 502 is applied using aluminum paint.

[0033] In this embodiment, the reflective coating 502 has a better reflective effect.

[0034] Specifically, the scattering mechanism 6 includes a highly transparent silicone layer 601 and heat dissipation particles 602. The highly transparent silicone layer 601 is encapsulated on the upper surface of the reflector cup 501, and heat dissipation particles 602 are disposed inside the highly transparent silicone layer 601.

[0035] In this embodiment, the highly transparent silicone layer 601 and the heat dissipation particles 602 allow light from the LED chip 3 to pass through and make the light more uniform.

[0036] In use, the positive and negative terminals of the LED chip 3 are connected to the left and right metal pins 402 via the left and right gold wires 401 in the connecting mechanism 4. The metal pins 402 are electrically connected to the circuitry on the lamp board, thus fixing the LED chip. The rectangular opening 201 in the heat dissipation mechanism 2 is used to install the thermally conductive silicone 202. The thermally conductive silicone 202 and the heat dissipation copper pipe 203 can quickly dissipate heat, increasing the heat dissipation function of the LED chip 3. The metal shielding mesh 204 prevents electromagnetic signal interference from the lamp board to the LED chip 3, making the LED chip 3 less susceptible to high-temperature damage and greatly extending its service life. The reflector cup 501 and reflective coating 502 in the reflection mechanism 5 allow the light emitted by the LED chip 3 to be emitted upwards. The highly transparent silicone layer 601 and heat dissipation particles 602 in the scattering mechanism 6 allow the light from the LED chip 3 to pass through, making the light more uniform and brighter, which is beneficial for use.

[0037] In summary, this surface-mount LED chip packaging structure enhances the heat dissipation function of the LED chip 3 through the heat dissipation mechanism 2, making the LED chip 3 less susceptible to high-temperature damage and greatly extending its service life. Furthermore, it increases the reflection and scattering functions of the LED chip 3, resulting in a more uniform and brighter light source, which is beneficial for its use.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A surface-mount LED chip packaging structure, comprising a ceramic substrate (1), characterized in that: A heat dissipation mechanism (2) is fixedly installed in the middle of the ceramic substrate (1). An LED chip (3) is fixedly installed on the upper surface of the heat dissipation mechanism (2). A connecting mechanism (4) is provided on the left and right sides of the lower surface of the ceramic substrate (1) corresponding to the LED chip (3). A reflection mechanism (5) is fixedly installed on the upper surface of the ceramic substrate (1) corresponding to the LED chip (3). A scattering mechanism (6) is fixedly installed on the upper surface of the reflection mechanism (5). A lens layer (7) is encapsulated on the outer surface of the ceramic substrate (1) corresponding to the scattering mechanism (6).

2. The surface mount LED chip packaging structure according to claim 1, characterized in that: The heat dissipation mechanism (2) includes a rectangular opening (201), thermally conductive silicone (202), a heat dissipation copper pipe (203), and a metal shielding mesh (204). A rectangular opening (201) is provided in the upper middle part of the ceramic substrate (1). Thermally conductive silicone (202) is fixedly installed on the upper surface of the rectangular opening (201), and the thermally conductive silicone (202) is an inverted T-shaped structure. A heat dissipation copper pipe (203) is provided inside the thermally conductive silicone (202), and a metal shielding mesh (204) is fixedly installed on the lower surface of the thermally conductive silicone (202).

3. The surface mount LED chip packaging structure according to claim 2, characterized in that: The rectangular opening (201) has notches on the front and rear sidewalls of the ceramic substrate (1), and the lower surface of the metal shielding mesh (204) is 1.5 mm away from the lower surface of the ceramic substrate (1).

4. The surface mount LED chip packaging structure according to claim 2, characterized in that: The front and rear sides of the heat dissipation copper pipe (203) are open, and the front and rear sides of the heat dissipation copper pipe (203) are perpendicular and flush with the front and rear sides of the ceramic substrate (1).

5. The surface mount LED chip packaging structure according to claim 1, characterized in that: The connection mechanism (4) includes a gold wire (401) and a metal pin (402). The lower surface of the LED chip (3) is provided with gold wires (401) near the left and right positions, and the gold wires (401) are connected to the metal pins (402). The metal pins (402) are fixedly embedded on the lower surface of the ceramic substrate (1).

6. The surface mount LED chip packaging structure according to claim 1, characterized in that: The reflective mechanism (5) includes a reflector cup (501) and a reflective coating (502). The reflector cup (501) is fixedly installed on the upper surface of the ceramic substrate (1). The inner wall of the reflector cup (501) and the edge of the upper surface of the LED chip (3) are coated with a reflective coating (502).

7. The surface mount LED chip packaging structure according to claim 6, characterized in that: The reflective coating (502) is applied by brushing aluminum paint.

8. The surface mount LED chip packaging structure according to claim 1, characterized in that: The scattering mechanism (6) includes a highly transparent silicone layer (601) and heat dissipation particles (602). The highly transparent silicone layer (601) is encapsulated on the upper surface of the reflector cup (501), and heat dissipation particles (602) are disposed inside the highly transparent silicone layer (601).

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