Blowing device for improving edge bubbles after film pasting of silicon wafer
By using an air blowing device to blow air onto the silicon wafer during the wafer lamination process, the problem of air bubbles at the edge of the silicon wafer was solved, improving product quality and yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WAFER WORKS ZHENGZHOU CORP
- Filing Date
- 2025-06-06
- Publication Date
- 2026-05-05
AI Technical Summary
The presence of air bubbles at the edge of silicon wafers in existing film lamination processes affects product quality, and existing improvement methods are either costly or ineffective.
Design an air blowing device to improve edge air bubbles after silicon wafer film application, including a support mechanism and an air blowing mechanism. By blowing air onto the silicon wafer during the film application process, the blue film is prevented from prematurely contacting the silicon wafer.
It effectively reduced the bubble rate during the film application process, improved the product yield, and reduced the defect rate by approximately 0.28%.
Smart Images
Figure CN224205589U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor manufacturing technology, specifically relating to an air blowing device for improving edge air bubbles after silicon wafer film is applied. Background Technology
[0002] In today's rapidly developing information technology industry, silicon wafer manufacturing is a crucial component, and every step of its manufacturing process is vital, directly impacting the performance and reliability of the final product. The film lamination process, a key step in silicon wafer manufacturing, primarily protects the oxide layer on the wafer surface, preventing damage during subsequent ring etching processes that remove the chamfered oxide layer. However, the presence of edge bubbles after film lamination has long been a pressing technical challenge in this process.
[0003] The current mainstream film bonding process mainly relies on mechanical roller pressing to attach a layer of blue film (such as...) to the surface of the silicon wafer oxide layer. Figure 1 (As shown). Although this method is relatively simple to operate, it inevitably generates edge bubbles during the bonding process. Edge bubbles not only affect the appearance of the laminated film but may also cause the oxide layer at the edge of the silicon wafer to be damaged in subsequent ring etching processes, affecting the quality of the epitaxial product, such as leading to defects like silicon nodules. To solve this problem, the industry has tried methods such as vacuum bonding and high-temperature, high-pressure bonding. However, these methods either suffer from high costs, complex processes, and difficulty in large-scale application, or they are not very effective with certain materials or structures. Therefore, how to effectively eliminate bubbles after lamination has become a key problem that urgently needs to be solved in the silicon wafer manufacturing industry. Summary of the Invention
[0004] The purpose of this invention is to provide an air blowing device to improve the air bubbles at the edge of silicon wafers after film application, in order to overcome the shortcomings of the existing technology.
[0005] The objective of this utility model is achieved through the following technical solution:
[0006] An air blowing device for improving edge air bubbles after silicon wafer lamination includes a support mechanism and an air blowing mechanism located on the support mechanism;
[0007] The air blowing mechanism is used to blow air into the silicon wafer bonding device;
[0008] The support mechanism is used to support the air blowing mechanism.
[0009] Preferably, the support mechanism includes a support base and a support column located on the support base;
[0010] The air blowing mechanism is located on the support column.
[0011] Preferably, the support base includes a lower support plate, an upper support plate, and a vertical support plate located between the lower support plate and the upper support plate;
[0012] The area of the lower support plate is larger than that of the upper support plate.
[0013] Preferably, the lower support base plate is provided with mounting holes.
[0014] Preferably, the lower support base plate has openings.
[0015] Preferably, the blowing mechanism includes a blowing pipe and blowing holes distributed on the blowing pipe.
[0016] Preferably, the air blowing pipe is further provided with an auxiliary air hole; the air blowing direction of the auxiliary air hole is different from that of the air blowing hole.
[0017] Preferably, the air blowing pipe is connected to an air source.
[0018] Preferably, the air blowing pipe is connected to the air source via an air source pipe.
[0019] Preferably, the air blowing device further includes a control system;
[0020] The control system is electrically connected to the air blowing mechanism.
[0021] The air blowing device provided in this application blows air into the silicon wafer bonding device during the bonding process. The blue film is blown up during the bonding process, which effectively avoids premature contact between the blue film and the silicon wafer, thereby reducing the occurrence rate of air bubbles and improving the product yield. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the silicon wafer lamination process in the existing technology;
[0023] Figure 2 These are images showing edge bubbles and the OM (Original Metallization) appearance after edge etching following the application of the film.
[0024] Figure 3 This is a schematic diagram of the air blowing device provided in this application;
[0025] Figure 4 This is a schematic diagram of the film application process after installing the air blowing device (the arrow indicates the direction of air blowing).
[0026] Figure 5 This is a graph showing the change in the rate of defective bubbles before and after the installation of the air blowing device.
[0027] Explanation of reference numerals in the attached figures:
[0028] 1-Silicon wafer; 2-Roller; 3-Blue film; 4-Release film; 5-Machine base; 6-Support base; 61-Lower support plate; 62-Upper support plate; 63-Vertical support plate; 64-Mounting hole; 65-Opening; 7-Support column; 8-Air blowing mechanism; 81-Air blowing pipe; 82-Air blowing hole; 83-Air source pipe; 84-Auxiliary air hole. Detailed Implementation
[0029] like Figure 1 As shown, in the prior art, during the film application process, if the roller does not press over the blue film, the blue film may prematurely contact the silicon wafer, creating edge bubbles. This causes the etching reagent HF to seep into the oxide layer from the bubble location during subsequent edge etching, resulting in damage to the oxide layer at the edge of the silicon wafer (e.g., ...). Figure 2 As shown in the figure, it affects the quality of the epitaxial product.
[0030] To address the aforementioned problems, this application provides an air blowing device for improving edge air bubbles after silicon wafer film lamination, such as... Figure 3 As shown, it includes a support mechanism and an air blowing mechanism 8 located on the support mechanism; the support mechanism is used to support the air blowing mechanism. The air blowing mechanism can align the silicon wafer bonding device with air during the bonding process.
[0031] When using this device, if Figure 4 As shown, the support mechanism is set above the machine chuck, so that the air blowing mechanism is aligned with the film application position. The air blowing action is started when the silicon wafer is adsorbed onto the machine and stops when the roller finishes pressing down. The blue film is blown up during the application process, and the blue film will only contact the silicon wafer when the roller passes over it (avoiding premature contact between the blue film and the silicon wafer), thus reducing the occurrence rate of bubbles and improving the product yield.
[0032] Before installing the air blowing device, the product defect rate was approximately 0.41%. After installing the air blowing device, the film-forming bubble defect rate was 0.13%, a decrease of 0.28% compared to before installation. Figure 5 As shown in the figure, this demonstrates that the air blowing device provided in this application can effectively reduce the bubble generation rate during the film application process.
[0033] Preferably, the support mechanism includes a support base 6 and a support column 7 located on the support base 6; the air blowing mechanism is located on the support column 7. The support base 6 can provide stable support, and the support column 7 can position the air blowing mechanism in a certain position, which is convenient for aligning with the film application device.
[0034] Preferably, the support base 6 includes a lower support base plate 61, an upper support plate 62, and a vertical support plate 63 located between the lower support base plate 61 and the upper support plate 62; the area of the lower support base plate 61 is larger than that of the upper support plate 62, which can provide stable support.
[0035] Preferably, the lower support base plate 61 is provided with mounting holes 64, and the entire device can be installed in a suitable position by screws.
[0036] Preferably, the lower support base plate 61 is provided with an opening 65 to avoid the structure on the machine platform and facilitate installation.
[0037] Preferably, such as Figure 3 As shown, the air blowing mechanism includes an air blowing pipe 81 and air blowing holes 82 evenly distributed on the air blowing pipe. The air blowing holes 82 are aligned with the blue film, and the gas is blown evenly onto the blue film through the air blowing holes. Preferably, the gas is dry compressed air (CDA). In use, the air blowing pipe 81 is connected to the CDA air source through the air source pipe 83. More preferably, the air source pipe 83 can be equipped with a quick connector, which can be quickly connected or disconnected from the air source, facilitating the movement of the air blowing pipe.
[0038] Preferably, the air blowing pipe 81 is also provided with an auxiliary air hole 84; the air blowing direction of the auxiliary air hole 84 is different from that of the air blowing hole 82. By setting the auxiliary air hole 84, on the one hand, it can prevent the air pressure in the air pipe from being too high and forming a negative pressure at the air blowing hole, thus affecting the air blowing; on the other hand, it can prevent the air blowing pressure from being unstable due to sudden changes in the pressure of the air source, and the auxiliary air hole can balance the pressure.
[0039] Preferably, the air blowing device further includes a control system; the control system is electrically connected to the air blowing mechanism 8. The control system is used to automatically control the operation of the air blowing mechanism.
[0040] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the present invention. Clearly, those skilled in the art can make various alterations and modifications to the present invention without departing from its spirit and scope. Thus, if such modifications and modifications fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include such modifications and modifications.
Claims
1. An air blowing device for improving edge air bubbles after silicon wafer film lamination, characterized in that, Includes a support mechanism and an air blowing mechanism located on the support mechanism; The air blowing mechanism is used to blow air into the silicon wafer bonding device; The support mechanism is used to support the air blowing mechanism.
2. The air blowing device for improving edge air bubbles after silicon wafer film application as described in claim 1, characterized in that, The support mechanism includes a support base and a support column located on the support base; The air blowing mechanism is located on the support column.
3. The air blowing device for improving edge air bubbles after silicon wafer film application as described in claim 2, characterized in that, The support base includes a lower support plate, an upper support plate, and a vertical support plate located between the lower support plate and the upper support plate; The area of the lower support plate is larger than that of the upper support plate.
4. The air blowing device for improving edge air bubbles after silicon wafer film application as described in claim 3, characterized in that, The lower support base plate is provided with mounting holes.
5. The air blowing device for improving edge air bubbles after silicon wafer film application as described in claim 3, characterized in that, The lower support base plate has openings.
6. The air blowing device for improving edge air bubbles after silicon wafer film application as described in claim 1, characterized in that, The blowing mechanism includes a blowing pipe and blowing holes distributed on the blowing pipe.
7. The air blowing device for improving edge air bubbles after silicon wafer film application as described in claim 6, characterized in that, The air blowing pipe is also provided with auxiliary air holes; the air blowing direction of the auxiliary air holes is different from that of the air blowing holes.
8. The air blowing device for improving edge air bubbles after silicon wafer film application as described in claim 6, characterized in that, The air blowing pipe is connected to an air source.
9. The air blowing device for improving edge air bubbles after silicon wafer film application as described in claim 8, characterized in that, The air blowing pipe is connected to the air source through an air source pipe.
10. The air blowing device for improving edge air bubbles after silicon wafer film application as described in claim 1, characterized in that, It also includes the control system; The control system is electrically connected to the air blowing mechanism.