Support plate storage device
By designing a carrier-based storage device, the problem of silicon wafers becoming hazy and blackened due to prolonged exposure of the carrier was solved by using protective gas and heating devices, thus achieving long-term caching and heat preservation of the carrier.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TONGWEI SOLAR ENERGY (CHENGDU) CO LID
- Filing Date
- 2025-04-07
- Publication Date
- 2026-05-05
AI Technical Summary
During the solar cell production process, prolonged exposure of the carrier plate containing the silicon wafer to the air can cause the silicon wafer to develop a hazy, blackened appearance.
Design a carrier plate storage device, including a machine, an air intake device and a carrier device. The carrier plate is moved to a chamber filled with protective gas for buffering by an opening and closing device, and is kept warm by a heating device to prevent the silicon wafer from being exposed to air for a long time.
It effectively reduces or avoids the problem of hazy blackening of silicon wafers caused by prolonged exposure to air, achieving a long-term caching effect.
Smart Images
Figure CN224205601U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of photovoltaic technology, and in particular to a substrate storage device. Background Technology
[0002] In the production process of solar cells, automated equipment is typically used to feed carriers carrying silicon wafers into coating equipment for coating. When equipment malfunctions and requires a lengthy resolution, the carriers carrying silicon wafers need to be buffered. However, in traditional coating equipment, the carrier buffer area exposes the silicon wafers to air for extended periods during this buffering process, leading to problems such as a hazy, blackened appearance on the silicon wafers. Utility Model Content
[0003] Therefore, it is necessary to provide a carrier storage device that can cache the carrier containing silicon wafers for a long time and reduce or avoid the problem of silicon wafers becoming hazy and black due to prolonged exposure to air.
[0004] This application provides a carrier plate storage device, including a machine base, an air intake device, and a carrier device;
[0005] The machine tool is provided with a first chamber and a second chamber adjacent to the first chamber. The first chamber is connected to a first channel for the entry and exit of the carrier plate. An opening and closing device is provided between the second chamber and the first chamber. The opening and closing device can be opened and closed to separate and connect the first chamber and the second chamber.
[0006] The air intake device is disposed on the machine base, and the air intake device is used to introduce gas into the second chamber.
[0007] The supporting device is used to support the carrier plate, and the supporting device is movable between the first chamber and the second chamber.
[0008] In some embodiments, the carrier storage device further includes a gas distribution device disposed in the second chamber; the outlet end of the air inlet device is connected to the gas distribution device; the gas distribution device has a plurality of air outlets arranged at intervals on the gas distribution device.
[0009] In some embodiments, the gas distribution device is disposed on the inner wall of the second chamber on the side away from the first chamber.
[0010] In some embodiments, the carrier storage device further includes a heating device disposed within the second chamber.
[0011] In some embodiments, there are multiple heating devices, which are spaced apart on the sidewall of the second chamber.
[0012] In some embodiments, a plurality of the heating devices are arranged around the sidewall of the second chamber.
[0013] In some embodiments, the opening and closing device includes a first moving member and a second moving member; the first moving member and the second moving member are disposed in the same plane and are movable in the plane; when the first moving member and the second moving member move towards each other until they come into contact, the opening and closing device separates the first chamber and the second chamber; the first moving member and the second moving member are capable of moving away from each other until the first chamber and the second chamber communicate, so that the supporting device can move between the first chamber and the second chamber.
[0014] In some embodiments, the carrier storage device further includes a control device disposed on the machine base; the control device is electrically connected to the opening and closing device and the carrying device; the control device is used to control the opening and closing device and the carrying device.
[0015] In some embodiments, the carrier storage device further includes a third chamber, with the first chamber and the second chamber being spaced apart from the third chamber; the third chamber is connected to a second channel for the carrier to enter and exit the third chamber.
[0016] In some embodiments, the third chamber is located on the side of the first chamber away from the second chamber.
[0017] The aforementioned carrier plate storage device can be used for buffering carrier plates, especially carrier plates carrying silicon wafers. The first chamber of the machine is used to buffer the carrier plate carrying silicon wafers, and a support device holds the carrier plate. When long-term buffering of the carrier plate carrying silicon wafers is required, the opening and closing device can be opened to connect the first and second chambers, and the carrier plate can then be moved from the first chamber to the second chamber via the support device. After the carrier plate carrying silicon wafers is moved into the second chamber, closing the opening and closing device separates the first and second chambers, and a protective gas is introduced into the second chamber through an air intake device, thus buffering the carrier plate carrying silicon wafers in the second chamber filled with protective gas. The carrier plate storage device of this application can buffer carrier plates carrying silicon wafers for extended periods and can reduce or avoid the problem of silicon wafers developing a hazy blackening due to prolonged exposure to air. Attached Figure Description
[0018] Figure 1This is a schematic diagram of the structure of a carrier-based storage device provided in one embodiment of this application;
[0019] Figure 2 This is a schematic diagram of the planar structure of a carrier storage device provided in one embodiment of this application.
[0020] Explanation of reference numerals in the attached figures
[0021] 10. Machine base; 20. First chamber; 30. First channel; 40. Bearing device; 50. Second chamber; 60. Opening and closing device; 70. Air intake device; 80. Heating device; 90. Gas distribution device; 100. Third chamber; 110. Second channel. Detailed Implementation
[0022] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0024] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0026] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0027] Reference Figures 1-2 As shown, this application provides a carrier plate storage device, including a machine base 10, an air intake device 70, and a carrier device 40. The machine base 10 is provided with a first chamber 20 and a second chamber 50 adjacent to the first chamber 20. The first chamber 20 is connected to a first channel 30 for the carrier plate to enter and exit. An opening and closing device 60 is provided between the second chamber 50 and the first chamber 20, and the opening and closing device 60 can be opened and closed to separate and connect the first chamber 20 and the second chamber 50. The air intake device 70 is disposed on the machine base 10 and is used to introduce gas into the second chamber 50. The carrier device 40 is used to receive the carrier plate and is movable between the first chamber 20 and the second chamber 50.
[0028] The aforementioned carrier storage device can be used for buffering carriers, especially carriers carrying silicon wafers. Specifically, the first chamber 20 in the machine 10 can be used to buffer the carrier carrying silicon wafers, and the carrier is supported by the carrying device 40. When long-term buffering of the carrier carrying silicon wafers is required, the opening and closing device 60 can be opened to connect the first chamber 20 and the second chamber 50, and then the carrier is moved from the first chamber 20 to the second chamber 50 via the carrying device 40. After the carrier carrying silicon wafers has moved into the second chamber 50, closing the opening and closing device 60 separates the first chamber 20 and the second chamber 50, and a protective gas is introduced into the second chamber 50 through the air intake device 70, so that the carrier carrying silicon wafers is buffered in the second chamber 50 filled with protective gas. The carrier storage device of this application can buffer carriers carrying silicon wafers for a long time and can reduce or avoid the problem of silicon wafers becoming hazy and blackened due to prolonged exposure to air.
[0029] Understandably, the carrier plate storage device can be used in conjunction with automated transfer equipment. The automated transfer equipment can transport the loaded carrier plates through the first channel 30 to the first chamber 20 for buffering. If only a short-term buffering period is required, the automated transfer equipment can then remove the carrier plates from the first chamber 20 and transfer them to subsequent equipment for processing. If long-term buffering of the carrier plates is required, the carrier plates are transferred from the first chamber 20 to the second chamber 50 for extended buffering.
[0030] In some embodiments, the carrier plate storage device further includes a gas distribution device 90 disposed within the second chamber 50. The outlet end of the air inlet device 70 is connected to the gas distribution device 90. The gas distribution device 90 has a plurality of air outlets arranged at intervals on the gas distribution device 90.
[0031] By using a gas distribution device 90 with multiple air outlets installed in the second chamber 50, the distribution of the protective gas introduced into the second chamber 50 by the air inlet device 70 can be made more uniform.
[0032] For example, the protective gas includes nitrogen.
[0033] In some embodiments, the gas distribution device 90 is disposed on the inner wall of the second chamber 50 on the side away from the first chamber 20.
[0034] In some embodiments, the carrier storage device further includes a heating device 80 disposed within the second chamber 50.
[0035] The heating device 80 installed in the second chamber 50 can keep the silicon wafers that are cached in the second chamber 50 warm for a long time, reducing the problem of hazy blackening of the silicon wafers due to cooling.
[0036] In some embodiments, the heating device 80 is a heating lamp.
[0037] In some embodiments, there are multiple heating devices 80, which are spaced apart on the side wall of the second chamber 50.
[0038] Multiple heating devices 80 are spaced apart on the side wall of the second chamber 50, which effectively maintains the temperature of the silicon wafers that are cached in the second chamber 50 for a long time.
[0039] In some embodiments, a plurality of heating devices 80 are arranged around the sidewall of the second chamber 50.
[0040] A heating device 80 is arranged around the side wall of the second chamber 50, which effectively keeps the silicon wafers that are cached in the second chamber 50 for a long time warm.
[0041] Refer again Figure 1 , Figure 2 As shown, in some embodiments, the opening / closing device 60 includes a first movable member and a second movable member. The first movable member and the second movable member are disposed in the same plane and are movable within their respective planes. When the first movable member and the second movable member move toward each other until they come into contact, the opening / closing device 60 spaces the first chamber 20 and the second chamber 50. The first movable member and the second movable member can move in opposite directions until the first chamber 20 and the second chamber 50 communicate, allowing the supporting device 40 to move between the first chamber 20 and the second chamber 50.
[0042] It is understood that the first and second moving parts can move towards each other or away from each other to achieve separation or connection between the first chamber 20 and the second chamber 50. When the first chamber 20 and the second chamber 50 are connected, it facilitates the carrier device 40 to move the carrier plate from the first chamber 20 to the second chamber 50. When the first chamber 20 and the second chamber 50 are separated, the second chamber 50 can form a relatively independent space to buffer the silicon wafer for a longer period of time under a protective gas.
[0043] In some embodiments, the carrier storage device further includes a control device. The control device is mounted on the machine base 10. The control device is electrically connected to the opening / closing device 60 and the carrying device 40. The control device is used to control the opening / closing device 60 and the carrying device 40.
[0044] In some embodiments, the carrier storage device further includes a third chamber 100. The first chamber 20 and the second chamber 50 are both spaced apart from the third chamber 100. The third chamber 100 is connected to a second channel 110 for allowing the carrier to enter and exit the third chamber 100.
[0045] The third chamber 100 can also buffer empty carrier boards that do not carry silicon wafers. After the automated transfer equipment sends the carrier board carrying silicon wafers to the subsequent equipment for processing and removes the silicon wafers from the carrier board, the empty carrier board can be transferred by the automated transfer equipment and transported to the third chamber 100 for buffering through the second channel 110 for convenient use.
[0046] In some embodiments, the third chamber 100 is located on the side of the first chamber 20 away from the second chamber 50.
[0047] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0048] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims, and the specification and drawings can be used to interpret the content of the claims.
Claims
1. A carrier-based storage device, characterized in that, Includes a machine base (10), an air intake device (70), and a load-bearing device (40); The machine base (10) is provided with a first chamber (20) and a second chamber (50) adjacent to the first chamber (20). The first chamber (20) is connected to a first channel (30) for the entry and exit of the carrier plate. An opening and closing device (60) is provided between the second chamber (50) and the first chamber (20). The opening and closing device (60) can be opened and closed to separate and connect the first chamber (20) and the second chamber (50). The air intake device (70) is disposed on the machine base (10), and the air intake device (70) is used to introduce gas into the second chamber (50); The support device (40) is used to support the carrier plate and is movable between the first chamber (20) and the second chamber (50).
2. The carrier-based storage device according to claim 1, characterized in that, The carrier plate storage device further includes a gas distribution device (90), which is disposed in the second chamber (50); the discharge end of the air inlet device (70) is connected to the gas distribution device (90); the gas distribution device (90) has multiple air outlets, which are arranged at intervals on the gas distribution device (90).
3. The carrier-based storage device according to claim 2, characterized in that, The gas distribution device (90) is disposed on the inner wall of the second chamber (50) on the side away from the first chamber (20).
4. The carrier-based storage device according to claim 1, characterized in that, The carrier plate storage device further includes a heating device (80) disposed in the second chamber (50).
5. The carrier-based storage device according to claim 4, characterized in that, There are multiple heating devices (80), and the multiple heating devices (80) are spaced apart on the side wall of the second chamber (50).
6. The carrier-based storage device according to claim 5, characterized in that, Multiple heating devices (80) are arranged around the sidewall of the second chamber (50).
7. The carrier-based storage device according to any one of claims 1 to 6, characterized in that, The opening and closing device (60) includes a first moving member and a second moving member; the first moving member and the second moving member are disposed in the same plane and are capable of moving in the plane in which they are located; when the first moving member and the second moving member move towards each other until they come into contact, the opening and closing device (60) separates the first chamber (20) and the second chamber (50); the first moving member and the second moving member are capable of moving away from each other until the first chamber (20) and the second chamber (50) are connected, so that the bearing device (40) can move between the first chamber (20) and the second chamber (50).
8. The carrier-based storage device according to any one of claims 1 to 6, characterized in that, The carrier plate storage device further includes a control device disposed on the machine base (10); the control device is electrically connected to the opening and closing device (60) and the carrying device (40); the control device is used to control the opening and closing device (60) and the carrying device (40).
9. The carrier-based storage device according to any one of claims 1 to 6, characterized in that, The carrier plate storage device further includes a third chamber (100), wherein the first chamber (20) and the second chamber (50) are spaced apart from the third chamber (100); the third chamber (100) is connected to a second channel (110), which is used for the carrier plate to enter and exit the third chamber (100).
10. The carrier-based storage device according to claim 9, characterized in that, The third chamber (100) is located on the side of the first chamber (20) away from the second chamber (50).