Simple and compact multi-wafer feeding device
By setting up a tray module and a rotating power component on the wafer fixing device, and combining it with a vision module to adjust the chip position, the problem of needing multiple ejector pin modules for picking up multiple wafer chips is solved, achieving the effect of compact equipment and reduced cost.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 中科光智(重庆)科技有限公司
- Filing Date
- 2025-05-12
- Publication Date
- 2026-05-05
AI Technical Summary
In existing technologies, picking up multiple wafer chips requires multiple ejector pin modules, which results in large equipment space occupation, high cost, and high mechanical complexity.
A simple and compact multi-wafer loading device is adopted. By setting a tray module on the wafer fixing device, the rotation of the tray is used to make the wafers at different positions correspond to the ejector pin module. Combined with the rotation power component and vision module to adjust the chip position, the ejector pin module can complete the loading of multiple wafers.
It enables the loading of multiple wafers using a single ejector module, reducing equipment manufacturing costs and the space occupied by mechanical structures, and simplifying mechanical assembly.
Smart Images
Figure CN224205606U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip mounting technology, specifically to a simple and compact multi-wafer loading device. Background Technology
[0002] A pick-and-place machine is a high-precision automated device used in electronic manufacturing. The frame of a pick-and-place machine is generally equipped with a wafer module, a pin module, and a chip pick-up head. The wafer module is used to place the chip, and then the pin module lifts the chip so that it can be picked up by the chip pick-up head. After the chip pick-up head picks up the chip, it is further bonded to the substrate to complete the chip bonding process.
[0003] Existing wafer modules typically feature a wafer stage, where chips are usually secured to the stage using wafer mounting devices such as blue film, trays, tape and reel, and waffle cassettes. Chips are then picked up from the wafer by a lifting mechanism from a bottom-mounted ejector pin module in conjunction with a chip pick-up head. However, current chip pick-up heads only support picking up chips from a single wafer, or, to support picking up chips from multiple wafers, each wafer is equipped with its own ejector pin module. This results in redundant loading mechanisms and occupies excessive internal space, leading to a larger overall machine size. Utility Model Content
[0004] In view of the above-mentioned shortcomings of the existing technology, the technical problem to be solved by this utility model is: how to provide a simple and compact multi-wafer loading device that can realize the chip picking function on multiple wafers with only one set of ejector pin modules.
[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:
[0006] A simple and compact multi-wafer loading device includes a wafer module and a ejector pin module. The wafer module includes a wafer stage with a wafer fixing device on the wafer stage, and a tray module. The tray module includes a tray and a rotational power component. Multiple wafer placement holes are evenly distributed circumferentially on the tray for placing wafers. A tray rotation shaft is connected to the center of the tray. The rotational power component is mounted on the wafer fixing device, and its power output end is connected to the tray rotation shaft, so that the rotational power component can drive the tray to rotate through the tray rotation shaft. The rotation of the tray causes the wafer placement stages at different positions to rotate to the ejector pin module.
[0007] The working principle of this solution is as follows: The multi-wafer loading device is installed on the rack of the pick-and-place machine. During operation, wafers are placed at each wafer placement hole. When a chip needs to be picked up from a wafer in one placement hole, a rotary power component drives the tray rotation shaft to rotate, causing the tray to rotate. This rotation, in turn, causes the wafers in each placement hole to rotate until the wafer requiring chip pickup is above the ejector pin module. At this point, the ejector pin module moves the corresponding chip upwards to be picked up by the chip pickup head. Once all chips on one wafer have been picked up, the rotary power component again drives the tray rotation shaft to rotate, causing the chip on the next wafer placement hole to rotate above the ejector pin module. The ejector pin module then moves the chip upwards to be picked up by the chip pickup head. This process is repeated to achieve the goal of loading multiple wafers using a single ejector pin module.
[0008] In summary, this solution utilizes a tray module structure on the wafer fixing device. By rotating the tray, wafers at different positions are aligned with the ejector pin module. Compared to the existing technology that directly uses the wafer fixing device to mount wafers on the wafer stage, this solution can achieve the purpose of loading multiple wafers using a single ejector pin module. This solves the problem of high cost and high mechanical complexity caused by the need for multiple ejector pin modules for chip picking on multiple wafers in the existing technology. While reducing the difficulty of mechanical assembly and the number of motion axes of the mechanical movement mechanism, it also reduces equipment manufacturing costs and the space occupied by the mechanical structure.
[0009] Preferably, the wafer module further includes a first power component, which includes a belt, a drive wheel, and a first power element. A wafer ring is rotatably connected to the wafer fixing device. The belt is wound around both the wafer ring and the drive wheel. The drive wheel is connected to the power output end of the first power element. The rotating power element is mounted on the wafer ring.
[0010] Thus, the chip placed on the wafer placement hole often has a certain angular rotation error compared to the actual required position. At this time, the position of the chip is adjusted by the cooperation of the rotating power component and the first power component. On the one hand, the rotating power component drives the tray to rotate through the tray rotation shaft. On the other hand, the first power component drives the drive wheel to rotate. The drive wheel drives the wafer ring to rotate through the belt. Since the rotating power component is mounted on the wafer ring, and the tray is connected to the rotating power component through the tray rotation shaft, the rotation of the wafer ring will also further drive the chip on the wafer placement hole to rotate. In this way, the angle of the chip on the wafer placement hole is adjusted together, so that the chip rotates to the actual required position.
[0011] Preferably, the multi-wafer loading device further includes a vision module, the image acquisition surface of which faces the tray, so as to acquire the position information of the chips on the tray.
[0012] In this way, by setting up a vision module, the vision module is used to use the position information of the chip at the wafer placement location, so as to further control the rotation of the rotating power component and the first power component based on the position information of the chip collected by the vision module, and adjust the angle of the chip.
[0013] Preferably, the wafer module further includes an axial moving component and a longitudinal moving component. The moving part of the longitudinal moving component is connected to the wafer stage, and the fixing part of the longitudinal moving component is connected to the moving part of the axial moving component. The fixing part of the axial moving component is used to connect to an external rack so that the wafer stage can be moved axially by the axial moving component, and the wafer stage can be moved longitudinally by the longitudinal moving component.
[0014] In this way, by setting up axial movement components and longitudinal movement components to drive the wafer stage to move along the axial and longitudinal directions respectively, the material loading requirements under different conditions can be better met.
[0015] Preferably, the ejector pin module includes an ejector pin head and a vertical moving component. The fixing part of the vertical moving component is used to connect with an external frame, and the moving part of the vertical moving component is connected to the ejector pin head so that the ejector pin head can be driven to move in the vertical direction by the moving part of the vertical moving component.
[0016] In this way, when the tray rotates and the chip that needs to be bonded moves directly above the ejector pin, the vertical moving component drives the ejector pin to move upward and lift the chip, so as to facilitate the chip pick-up head.
[0017] Preferably, the tray has five wafer placement holes evenly distributed along its circumference.
[0018] Preferably, the line connecting the center point of the wafer at the wafer placement hole and the rotation center point of the tray is perpendicular or parallel to the long or wide side of the chip segmented on the wafer.
[0019] In this way, the line connecting the center point of the wafer at the wafer placement hole and the center point of the tray rotation is perpendicular or parallel to the long or wide side of the chip divided on the wafer, which allows the chip to be placed in the actual required position.
[0020] Preferably, the vision module is a camera, and the image acquisition surface of the camera faces the tray. Attached Figure Description
[0021] Appendix Figure 1 This is a schematic diagram of the simple and compact multi-wafer loading structure of this utility model;
[0022] Appendix Figure 2 This is a structural schematic diagram of the wafer stage and tray module from the bottom view in the simple and compact multi-wafer loading device of this utility model;
[0023] Appendix Figure 3 This is a schematic diagram of the structure of the simple and compact multi-wafer loading device of this utility model after removing the tray module and the wafer stage.
[0024] Explanation of reference numerals in the attached drawings: 1. Wafer stage; 2. Wafer ring; 3. Ejector head; 4. Camera; 5. Tray rotation axis; 6. Tray; 7. Wafer placement hole; 8. Axial movement assembly; 9. Longitudinal movement assembly; 10. Vertical movement assembly; 11. Belt; 12. Drive wheel. Detailed Implementation
[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.
[0026] This specific embodiment provides a simple and compact multi-wafer loading device, which is mounted on the rack of a pick-and-place machine. Specifically, the multi-wafer loading device includes a wafer module, a ejector pin module, a tray module, and a vision module. The overall arrangement of each module is shown in the attached figure. Figure 1 As stated above. Furthermore, the axial direction of this solution is attached. Figure 1 In the x-direction, the longitudinal direction is attached. Figure 1 The middle y-direction, the vertical direction is attached. Figure 1 Central z direction.
[0027] The structure of each module is described in detail below:
[0028] In this specific embodiment, as shown in the appendix Figure 1 To the attached Figure 3 As shown, the wafer module includes a wafer stage 1, a first power assembly, an axial movement assembly 8, and a longitudinal movement assembly 9. A wafer fixing device is provided on the wafer stage 1, and a wafer ring 2 is rotatably connected to the wafer fixing device. The rotation center of the wafer ring 2 is shown in the attached figure. Figure 1As shown in Figure a, the first power assembly includes a belt 11, a drive wheel 12, and a first power component, which is a first motor mounted on the wafer stage 1. The belt 11 is wound around both the wafer ring 2 and the drive wheel 12, and the drive wheel 12 is connected to the power output end of the first power component. The rotational power component is mounted on the wafer ring 2. The moving part of the longitudinal movement assembly 9 is connected to the wafer stage 1, and the fixing part of the longitudinal movement assembly 9 is connected to the moving part of the axial movement assembly 8. The fixing part of the axial movement assembly 8 is used to connect to an external frame, so that the wafer stage 1 can be moved axially by the axial movement assembly 8, and the wafer stage 1 can be moved longitudinally by the longitudinal movement assembly 9. By setting the axial movement assembly 8 and the longitudinal movement assembly 9 to move the wafer stage 1 axially and longitudinally respectively, the loading requirements under different conditions can be better met. Among them, the axial moving component 8 and the longitudinal moving component 9 realize linear motion in the axial direction and the longitudinal direction, respectively. This linear motion can be realized by adopting a linear motor plus linear guide rail structure, or a slider plus guide rail structure, etc. These structures for realizing linear motion are all existing technologies. For those skilled in the art, the specific structure can be selected according to the actual design needs. Moreover, the implementation form of the linear structure will not have a substantial impact on the present solution and is not a technical solution that needs to be protected. Therefore, it will not be discussed in detail here.
[0029] In this specific embodiment, as shown in the appendix Figure 1 As shown, the tray module includes a tray 6 and a rotating power component. Multiple wafer placement holes 7 are evenly distributed circumferentially on the tray 6. In this specific embodiment, five wafer placement holes 7 are evenly distributed circumferentially on the tray 6. The wafer placement holes 7 are used to place wafers. When placing a wafer, the line connecting the center point of the wafer at the wafer placement hole 7 and the rotation center point of the tray 6 is perpendicular or parallel to the long or wide side of the chip segmented on the wafer. A tray rotation shaft 5 is connected to the middle of the tray 6. The rotating power component is mounted on the wafer stage 1, and its power output end is connected to the tray rotation shaft 5, allowing the rotating power component to drive the tray 6 to rotate via the tray rotation shaft 5. The rotation of the tray 6 causes the wafer placement stages at different positions to rotate to the vision module and the ejector pin module. In this specific embodiment, the rotating power component is a second motor.
[0030] In this specific embodiment, the image acquisition surface of the vision module faces the tray 6 to acquire the position information of the chip on the tray 6. In this specific embodiment, the vision module is a camera 4.
[0031] In this way, by setting up a vision module, the vision module is used to use the position information of the chip at the wafer placement location, so as to further control the rotation of the rotating power component and the first power component based on the position information of the chip collected by the vision module, and adjust the angle of the chip.
[0032] In this specific embodiment, as shown in the appendix Figure 3 As shown, the ejector module includes an ejector head 3 and a vertical moving component 10. The fixing component of the vertical moving component 10 is used to connect to an external frame, and the moving component of the vertical moving component 10 is connected to the ejector head 3, so that the ejector head 3 can move vertically through the moving component of the vertical moving component 10. The vertical moving component 10 achieves linear motion in the vertical direction. This linear motion can be achieved using a linear motor and linear guide rail structure, or a slider and guide rail structure, etc. These structural forms for achieving linear motion are all existing technologies. Those skilled in the art can choose the specific structure according to actual design needs. Moreover, the implementation of this linear structure does not have a substantial impact on the present solution and is not part of the technical solution to be protected; therefore, it will not be discussed in detail here.
[0033] In this way, when the tray 6 rotates and the chip to be bonded moves directly above the ejector head 3, the vertical moving component 10 drives the ejector head 3 to move upward and lift the chip, so as to facilitate the chip pick-up head to pick it up.
[0034] The working principle of this solution is explained in further detail below: The multi-wafer loading device in this solution is installed on the rack of a pick-and-place machine. During operation, wafers are placed at each wafer placement hole 7. When placing wafers, the line connecting the center point of the wafer and the rotation center point of the tray 6 should be perpendicular or parallel to the length and width sides of the chips diced on the wafer. When a chip needs to be picked up from a wafer at one of the wafer placement holes 7, the rotating power component drives the tray rotation shaft 5 to rotate, causing the tray 6 to rotate. The rotation of the tray 6 drives the wafers at each wafer placement hole 7 to rotate until the wafer to be picked up is below the rotating camera 4. Due to the installation angle error of the wafer with the Z-axis as the rotation axis, the line connecting the center point of the wafer and the rotation center point of the tray 6 cannot be strictly perpendicular or parallel to the length and width sides of the chips diced on the wafer under normal circumstances. Even after the second motor drives the tray rotation shaft 5 to rotate a specific angle, this angular error still exists. After the chip rotates to a position below camera 4, camera 4 measures the angular rotation error of the chip to be picked up and then transmits the error to the controller. This controller is connected to both the first and second motors, enabling control of both. When camera 4 collects the chip's angular error information and transmits it to the controller, the controller identifies the error and controls the first and second motors accordingly. On one hand, the second motor drives tray 6 to rotate via tray rotation shaft 5; on the other hand, the first motor drives drive wheel 12 to rotate, which in turn drives wafer ring 2 via belt 11. Since the second motor is mounted on wafer ring 2, and tray 6 is connected to the second motor via tray rotation shaft 5, the rotation of wafer ring 2 further rotates the chip on wafer placement hole 7. This collectively adjusts the angle of the chip on wafer placement hole 7, eliminating the angular error—that is, aligning the chip's long and short sides with the XY axes of camera 4, and rotating the chip to the required position. Once the chip is in position, the vertical moving component 10 drives the ejector head 3 upwards, lifting the chip for easy pickup by the chip pick-up head. Once all the chips on a wafer have been picked up, tray 6 rotates at a specific angle so that the wafer at the next wafer placement hole 7 is below camera 4. Then, wafer ring 2 and tray 6 rotate to align the long and short sides of the chip with the XY axis of camera 4, and the chip rotates to the required position. The above steps are repeated to move all the wafers at the wafer placement holes 7 one by one to below camera 4 to meet the chip picking requirements.
[0035] In summary, this solution uses a tray 6 module on the wafer fixing device to rotate the tray 6 so that wafers at different positions correspond to the ejector pin module. Compared with the existing technology of directly using the wafer fixing device to mount wafers on the wafer stage 1, this solution can achieve the purpose of loading multiple wafers with a single ejector pin module. This solves the problem of high cost and high mechanical complexity caused by the need for multiple ejector pin modules for chip picking on multiple wafers in the existing technology. While reducing the difficulty of mechanical assembly and the number of motion axes of the mechanical motion mechanism, it also reduces the equipment manufacturing cost and the space occupied by the mechanical structure.
[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and not to limit the technical solutions. Those skilled in the art should understand that any modifications or equivalent substitutions to the technical solutions of this utility model that do not depart from the spirit and scope of this technical solution should be covered within the scope of the claims of this utility model.
Claims
1. A simple and compact multi-wafer loading device, comprising a wafer module and a ejector pin module, wherein the wafer module includes a wafer stage, and the wafer stage is provided with a wafer fixing device, characterized in that, It also includes a tray module, which includes a tray and a rotating power component. The tray has multiple wafer placement holes evenly distributed circumferentially, and the wafer placement holes are used to place wafers. A tray rotation shaft is connected to the middle position of the tray. The rotating power component is mounted on the wafer fixing device, and the power output end of the rotating power component is connected to the tray rotation shaft, so that the rotating power component can drive the tray to rotate through the tray rotation shaft. The rotation of the tray causes the wafer placement stages at different positions to rotate to the ejector pin module.
2. The simple and compact multi-wafer loading device according to claim 1, characterized in that, The wafer module further includes a first power assembly, which includes a belt, a drive wheel, and a first power component. A wafer fixing ring is rotatably connected to the wafer stage. The belt is wound around both the wafer fixing ring and the drive wheel. The drive wheel is connected to the power output end of the first power component. The rotational power component is mounted on the wafer fixing ring.
3. The simple and compact multi-wafer loading device according to claim 2, characterized in that, The multi-wafer loading device also includes a vision module, the image acquisition surface of which faces the tray, so as to acquire the position information of the chips on the tray.
4. The simple and compact multi-wafer loading device according to claim 1, characterized in that, The wafer module further includes an axial moving component and a longitudinal moving component. The moving part of the longitudinal moving component is connected to the wafer stage, and the fixing part of the longitudinal moving component is connected to the moving part of the axial moving component. The fixing part of the axial moving component is used to connect to an external rack so that the wafer stage can be moved axially by the axial moving component, and the wafer stage can be moved longitudinally by the longitudinal moving component.
5. The simple and compact multi-wafer loading device according to claim 1, characterized in that, The ejector pin module includes an ejector pin head and a vertical moving component. The fixing part of the vertical moving component is used to connect with an external frame, and the moving part of the vertical moving component is connected with the ejector pin head so that the ejector pin head can be driven to move in the vertical direction by the moving part of the vertical moving component.
6. The simple and compact multi-wafer loading device according to claim 1, characterized in that, The tray has five wafer placement holes evenly distributed along its circumference.
7. The simple and compact multi-wafer loading device according to claim 1, characterized in that, The line connecting the center point of the wafer at the wafer placement hole and the rotation center point of the tray is perpendicular or parallel to the long or wide side of the chip segmented on the wafer.
8. The simple and compact multi-wafer loading device according to claim 3, characterized in that, The vision module is a camera, and the image acquisition surface of the camera faces the tray.