Thermal management control system

Abstract

The utility model relates to the field of thermal management control, in particular to a thermal management control system. The utility model provides an integrated heat management control system, which abandons the design of a distributed controller in the aspect of cost, reduces the use of a plurality of heat management controller shells, reduces the cost of the shells, and is beneficial to effective integration of chips. Waste caused by the fact that a plurality of controllers are respectively provided with a power supply chip, a main chip and a CAN / LIN chip is avoided. In design and maintenance, the integrated design changes the complex condition of a distributed framework, independent function maintenance and updating for different controllers are not needed, the integration level and the resource utilization efficiency of the whole vehicle thermal management system are improved, and design and maintenance are simpler, more convenient and more efficient.

Description

Technical Field

[0001] This utility model relates to the field of thermal management control, and specifically to a thermal management control system. Background Technology

[0002] In new energy electric vehicles, especially hybrid vehicles, the distributed controller design increases costs due to the complexity of the system and hardware / software design, specifically the cost of three thermal management controller housings. Furthermore, each of the three controllers requires a power supply chip, a main chip, and a CAN / LIN chip, making effective chip integration difficult. Moreover, this distributed architecture is relatively complex to design and maintain, requiring different approaches for different controllers (such as...). Figure 1 As shown, thermal management controller A needs to control and monitor various cooling-related components, thermal management controller B needs to perform independent functional maintenance and updates for the PTC heater, and thermal management controller C needs to perform independent functional maintenance for the air conditioning compressor. This is not as efficient as an integrated design in terms of vehicle thermal management system integration and resource utilization. Utility Model Content

[0003] In view of this, the present invention provides a thermal management control system to solve the problems of high housing cost, ineffective chip integration, and relatively complex design and maintenance of traditional distributed thermal management controllers.

[0004] In a first aspect, this utility model provides a thermal management control system, which includes: a housing and a printed circuit board assembly, wherein the printed circuit board assembly is disposed inside the housing, and the grounding terminal of the printed circuit board assembly is connected to the housing.

[0005] The printed circuit board assembly includes a thermal management controller and multiple functional devices, which are respectively disposed on different surfaces of the printed circuit board assembly. The thermal management controller is connected to the functional devices.

[0006] Furthermore, the printed circuit board assembly is provided with a high-low voltage separation strip, and the high-low voltage separation strip is provided with an isolation communication device. The high-low voltage separation strip is a groove located on the laid copper foil layer. The high-low voltage separation strip is used to divide the printed circuit board assembly into a first region and a second region. The isolation communication device is respectively connected to the device deployed in the first region and the device deployed in the second region.

[0007] Furthermore, the isolated communication device includes: a signal amplifier, a filter, and a signal shaper. The input terminal of the signal amplifier receives the transmission signal from the functional device. The output terminal of the signal amplifier is connected to the input terminal of the filter. The output terminal of the filter is connected to the input terminal of the signal shaper. The output terminal of the signal shaper is connected to the thermal management controller.

[0008] Furthermore, the thermal management controller is disposed on the first surface of the first region, and the thermal management controller is connected to the detection device located on the first surface of the second region through the isolation communication device.

[0009] Furthermore, a low-voltage power supply, a load driving device, and a thermal environment control device are deployed on the second surface of the first region of the printed circuit board assembly; the low-voltage power supply is adjacent to the pins disposed on the second surface of the first region, and the low-voltage power supply is connected to the load driving device and the thermal environment control device respectively through conductive lines.

[0010] Furthermore, a high-voltage power supply and a power drive device are deployed on the second surface of the second region of the printed circuit board assembly; the high-voltage power supply is adjacent to the pins disposed on the second surface of the second region, and the high-voltage power supply is connected to the power drive module through a high-voltage filtering module.

[0011] Furthermore, the high-voltage filtering module includes a high-voltage common-mode inductor and a high-voltage filtering capacitor;

[0012] The high-voltage common-mode inductor is used to acquire the high-voltage power supply signal input from the high-voltage power supply and to perform common-mode interference suppression processing on the input high-voltage power supply signal to obtain the processed high-voltage power supply signal.

[0013] The high-voltage filter capacitor is used to acquire the high-voltage power supply signal after processing by the high-voltage common-mode inductor, and output a stable high-voltage power supply signal after filtering out high-frequency ripple and noise based on the processed high-voltage power supply signal.

[0014] The power drive module is used to acquire the low-voltage signal input from the thermal management controller and the stable high-voltage power supply signal input from the high-voltage filter capacitor, and output a three-phase bridge drive signal to drive the PTC and the compressor according to the input control signal and the high-voltage power supply signal.

[0015] Furthermore, the printed circuit board assembly is also provided with a thermal environment control device, which includes a cooling system control module and a heating system control module;

[0016] The cooling system control module is connected to the coolant sensor, the electronic water pump, and the electronic water valve, respectively.

[0017] The cooling system control module is used to receive system requirements transmitted by the thermal management controller through the power control line, and control the opening of the electronic water valve according to the system requirements, thereby adjusting the flow rate and direction of the coolant.

[0018] The cooling system control module is used to acquire coolant data transmitted by the coolant sensor, analyze the coolant data, and if the coolant data exceeds a preset range, send a control command to the electronic water pump. The electronic water pump adjusts its speed according to the control command to adjust the circulation speed of the coolant.

[0019] Furthermore, the heating system control module is connected to the heater. The heating system control module is used to receive the start command transmitted by the thermal management controller through the power control line, and transmit the start parameters indicated by the start command to the heater so that the heater operates according to the start parameters.

[0020] Furthermore, the heating system control module includes a monitoring unit and an adjustment unit connected to the heater;

[0021] The monitoring unit is used to monitor the operating parameters of the heater. If the operating parameters are abnormal, it sends a control command to the regulating unit.

[0022] The regulating unit is used to receive the control command and adjust the power data input to the heater according to the control command.

[0023] This invention proposes an integrated thermal management control system. In terms of cost, this system eliminates the need for distributed controller designs, reducing the use of multiple thermal management controller housings and lowering housing costs. It also facilitates effective chip integration, avoiding the waste associated with configuring separate power chips, main chips, and CAN / LIN chips for multiple controllers. In terms of design and maintenance, the integrated design changes the complexity of distributed architectures, eliminating the need for independent functional maintenance and updates for different controllers. This improves the integration and resource utilization efficiency of the entire vehicle's thermal management system, making design and maintenance simpler and more efficient. Attached Figure Description

[0024] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0025] Figure 1This is a schematic diagram of a conventional thermal management control system according to some embodiments of the present invention;

[0026] Figure 2 This is a schematic diagram of a thermal management control system according to some embodiments of the present invention;

[0027] Figure 3 This is a schematic diagram of a thermal management control system according to other embodiments of the present invention;

[0028] Figure 4 This is a schematic diagram of a thermal management control system according to other embodiments of the present invention;

[0029] Figure 5 This is a schematic diagram of a thermal management control system according to other embodiments of the present invention;

[0030] Figure 6 This is a schematic diagram of a thermal management control system according to other embodiments of the present invention;

[0031] Figure 7 This is a schematic diagram of a thermal management control system according to other embodiments of the present invention.

[0032] Figure 8 This is a schematic diagram of a thermal management control system according to other embodiments of the present invention. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0034] This embodiment provides a thermal management control system. Figure 2 This is a schematic diagram of a thermal management control system according to an embodiment of the present utility model, as shown below. Figure 2 As shown, the thermal management control system includes a housing 1 and a printed circuit board assembly 2. The printed circuit board assembly 1 is disposed within the housing 2, and its grounding terminal is connected to the housing 1. The printed circuit board assembly includes a thermal management controller 201 and multiple functional devices, which are respectively disposed on different surfaces of the printed circuit board assembly 2. The thermal management controller 201 is connected to the functional devices. The functional devices include: a low-voltage power supply, a high-voltage power supply, a load driving device, a thermal environment control device, and a power driving device, etc.

[0035] In this embodiment, a single housing and printed circuit board assembly are used, changing the traditional approach of using three separate housings for the thermal management controller. This single housing reduces housing costs and avoids the additional material and assembly costs associated with multiple housings. The printed circuit board assembly integrates the thermal management controller 201 and multiple functional devices, and the thermal management controller 201 establishes electrical connections with the other devices to achieve data interaction and control.

[0036] Furthermore, when a printed circuit board (PCB) assembly is in operation, the electronic components and circuits on the board generate electromagnetic signals. Connecting the ground (GND) network surrounding the PCB assembly to the housing creates a continuous conductive shield. Since the ground network itself is a low-potential reference point, connecting it to the housing confines the electromagnetic signals generated on the board within this shield, while also preventing external electromagnetic signals from entering the board, thus forming an effective electromagnetic shielding layer.

[0037] When the outer GND housing of the printed circuit board assembly forms a shielding layer, external electromagnetic interference signals are blocked and attenuated by the shielding layer before reaching the circuit board. The shielding layer guides external interference signals to the ground terminal, preventing them from directly affecting sensitive components and circuits on the circuit board. This improves the immunity of the printed circuit board assembly to external noise and ensures that it can still work stably and reliably in complex electromagnetic environments.

[0038] In terms of cost control, an integrated design concept is adopted, abandoning the distributed controller design architecture. By integrating thermal management control functions, only one housing is used, directly reducing the material procurement costs of three housings in the traditional distributed design, as well as the processing and assembly costs during the manufacturing process, effectively reducing the overall cost of the housing. At the same time, at the hardware circuit design level, the integrated design uses a single set of printed circuit board components, achieving a high degree of chip resource reuse. This saves at least two power chips, two main chips, and two CAN / LIN chips, which not only significantly reduces chip procurement costs but also simplifies the circuit topology, reduces circuit design complexity, and avoids resource waste and cost redundancy caused by multiple controllers with independently configured chips.

[0039] In the field of design and maintenance, integrated design has completely transformed the complexities of traditional distributed architectures. In a distributed architecture, each controller is independently designed based on different functional modules. Thermal management controller A controls cooling-related components, thermal management controller B manages the operation of the PTC heater, and thermal management controller C focuses on regulating the air conditioning compressor. This necessitates considering the compatibility and coordination between multiple controllers in system design, and requires independent functional maintenance and updates for the hardware interfaces and software logic of different controllers during maintenance, significantly increasing the workload and technical difficulty of design and maintenance. Integrated design, however, integrates commonly used thermal management functions into a single controller, constructing a highly integrated thermal management control system. During project development on different vehicle platforms, hardware selection technology allows for flexible adjustment of hardware configurations, optimizing the utilization of hardware resources. Combined with variant software version flashing technology, it enables rapid adaptation to the electrical parameters, control strategies, and other requirements of different platforms, achieving product platform compatibility. This design significantly improves the integration of the vehicle's thermal management system, optimizes the allocation and utilization efficiency of system resources, and simplifies and simplifies the design and maintenance process, providing strong support for the large-scale application and rapid iterative upgrades of thermal management control systems.

[0040] like Figure 3 As shown, the printed circuit board assembly 2 is provided with a high-low voltage separation strip 3, and the high-low voltage separation strip 3 is provided with an isolation communication device 202. The high-low voltage separation strip is a groove located on the laid copper foil layer. The high-low voltage separation strip is used to divide the printed circuit board assembly into a first area and a second area. The isolation communication device is respectively connected to the device deployed in the first area and the device deployed in the second area.

[0041] It should be noted that, to ensure electrical safety in both high and low voltage areas, a high-low voltage isolation zone is installed. Specifically, the copper foil layer on the circuit board is completely slotted and perforated, with a perforation width of 5mm. The purpose is to increase the electrical safety distance between high and low voltage areas, effectively reducing the risk of electrical breakdowns and leakage between them, and ensuring the stable and safe operation of the circuit board under different voltage conditions.

[0042] The isolated communication design employs a capacitive approach, utilizing the characteristics of capacitance to transmit signals. This effectively avoids high-frequency noise interference caused by magnetic field coupling in magnetic isolation, ensuring the purity and stability of signal transmission. Furthermore, to further enhance reliability, no sensitive components are placed within a 3-5mm radius around the isolator. This prevents the electric and magnetic fields and transient changes generated during the isolator's operation from affecting sensitive components, ensuring the stable operation of the entire circuit system.

[0043] The isolated communication device includes a signal amplifier, a filter, and a signal shaper. The input of the signal amplifier receives the transmitted signal from the functional device. The output of the signal amplifier is connected to the input of the filter. The output of the filter is connected to the input of the signal shaper. The output of the signal shaper is connected to the thermal management controller.

[0044] The transmitted signal generated by the functional device first enters the input terminal of the signal amplifier. Based on its own amplification circuit principle, the signal amplifier amplifies the voltage or current of the input signal, increasing its amplitude. This process utilizes the amplification characteristics of transistors; for example, by adjusting the base current, the current between the collector and emitter is controlled, thereby amplifying the input signal. The signal amplifier amplifies the amplitude of the received transmitted signal from the functional device by a certain factor, so that subsequent circuits can better process and transmit the signal. Finally, the amplified signal is output to the filter.

[0045] After the signal amplifier outputs a signal, this signal is sent to the input of the filter. In this printed circuit board environment, the filter filters the input signal according to its pre-designed frequency characteristics. It is based on the characteristics of components such as capacitors and inductors, which generate different impedances for signals of different frequencies. For example, a low-pass filter allows signals below a certain frequency threshold to pass through, while attenuating signals above that frequency; a high-pass filter, conversely, allows signals above a certain frequency to pass through while attenuating low-frequency signals. The purpose of the filter is to extract the desired frequency range from the signal amplifier's output signal, remove unwanted frequency components, ensure better frequency purity in the signals received by subsequent circuits, and finally pass the filtered signal to the signal shaper.

[0046] The signal output from the filter enters the input of the signal shaper. In this system, the signal shaper primarily optimizes and adjusts the characteristics of the input signal to better meet the input requirements of the thermal management controller. It precisely adjusts the signal level, converting it into a signal that conforms to the system's logic level standards, ensuring signal stability and accuracy. For pulse signals, it adjusts the pulse width to meet the system's specified pulse width requirements, and optimizes the rising and falling edges to better match the signal edge characteristics required by the thermal management controller. After these processes, the signal shaper outputs the final adjusted signal to the thermal management controller, ensuring that the controller can accurately receive and process the signal.

[0047] Based on this, an integrated controller is adopted, which integrates commonly used thermal management functions. For the development needs of projects on different vehicle platforms, hardware modules can be flexibly configured by using hardware optional bonding. Combined with the operation of flashing variant software versions, the system can be adapted to different platforms and can be quickly updated and iterated to meet the differentiated requirements of different vehicle platforms in terms of thermal management.

[0048] In the embodiments of this application, such as Figure 4 As shown, the thermal management controller is disposed on the first surface of the first region, and the thermal management controller 201 is connected to the detection device 203 located on the first surface of the second region via an isolation communication device.

[0049] The thermal management controller is located on the first surface (front side) of the first region of the printed circuit board assembly. In the figure, the first region refers to a relatively low-voltage area, such as the area where the main chip is located. The thermal management controller is located on the front side of this region and is responsible for monitoring and regulating the thermal environment of the entire circuit board or related key components, such as controlling the start and stop of the cooling fan and adjusting the heat dissipation strategy according to the temperature.

[0050] The thermal management controller is connected to a detection device located on the first surface (front side) of the second region via an isolated communication device. For example... Figure 4 As shown, the circuit board has high and low voltage isolation strips separating the first area (first region) and the second area (high voltage area). The isolation communication device ensures signal transmission between the thermal management controller and the detection device under electrical isolation, preventing electrical interference from the high voltage area from affecting the normal operation of the thermal management controller, and also ensuring the stability and reliability of signal transmission. The detection device is located on the first surface of the second region. Its function is to detect parameters such as temperature, voltage, and current within this region and transmit the detected signals to the thermal management controller through the isolation communication device. The thermal management controller then makes corresponding thermal management decisions based on this information, such as determining whether to enhance heat dissipation, thereby ensuring the stable operation of the circuit board assembly under suitable temperature and electrical conditions.

[0051] In addition, such as Figure 4 As shown, the NMOS heat dissipation pad area of ​​the water pump is also windowed, and the heat dissipation capacity is improved by filling the holes with resin. This allows heat to be dissipated more effectively, avoiding thermal failure of the water pump NMOS and other related devices due to heat accumulation. Thermal failure manifests as degraded device performance, unstable operation, or even damage. This heat dissipation method can avoid interference and thermal failure caused by poor heat dissipation.

[0052] Meanwhile, structural heat dissipation bumps are used in conjunction with the application of thermal grease. The heat dissipation bumps increase the heat dissipation area, enabling more efficient heat conduction; the thermal grease fills the tiny gaps between the heat dissipation bumps and the heat-generating components, reducing thermal resistance and further improving heat conduction efficiency and heat dissipation effect. This further avoids interference and thermal failure problems caused by poor heat dissipation, ensuring the stability and reliability of the water pump drive circuitry under high current operation.

[0053] In the embodiments of this application, such as Figure 5 As shown, a low-voltage power supply 204, a load driving device 205, and a thermal environment control device 206 are deployed on the second surface of the first region of the printed circuit board assembly. The low-voltage power supply 204 is adjacent to the pins disposed on the second surface of the first region, and the low-voltage power supply 204 is connected to the load driving device 205 and the thermal environment control device 206 respectively through conductive lines.

[0054] Specifically, the printed circuit board assembly has a first region, namely the low-voltage region, on which a variety of devices are deployed on its second surface (reverse side).

[0055] The low-voltage power supply 204 is connected through a low-voltage connector and can be considered a low-voltage power supply after low-voltage filtering. It is adjacent to the pins located on the second surface of the first region, and this adjacent layout is beneficial for power supply access and signal transmission.

[0056] The load driving device 205 includes a water pump driver three-phase bridge NMOS module, a water pump pre-driver chip, a multi-way valve driver module, and a stepper motor driver module. The water pump driver three-phase bridge NMOS module is used to drive the water pump and operates by receiving control signals such as KL30; the water pump pre-driver chip provides a pre-drive signal for the water pump driver; the multi-way valve driver module and the stepper motor driver module are used to drive the multi-way valve and the stepper motor, respectively, and both of them obtain VHD_12V power from a low-voltage power supply to maintain operation.

[0057] The thermal environment control device 206 is used to monitor and regulate thermal environment parameters such as temperature in the area to ensure stable operation of the device.

[0058] The low-voltage power supply 204 is connected to the load driving device 205 and the thermal environment control device 206 via conductive lines. Specifically, the VHD_12V voltage output from the low-voltage power supply after low-voltage filtering is connected to the load driving devices such as the water pump drive three-phase bridge NMOS module, the multi-way valve drive module, and the stepper motor drive module through lines to provide them with the power required for operation; at the same time, it also supplies power to the thermal environment control device, enabling it to perform thermal management functions normally and ensuring the stable operation of the entire first area (low-voltage area).

[0059] In this embodiment of the application, the printed circuit board assembly is further provided with a thermal environment control device. The thermal environment control device 206 is disposed on the second surface (i.e. the reverse side) of the printed circuit board assembly. The thermal environment control device 206 includes a cooling system control module and a heating system control module. The cooling system control module is connected to the thermal management controller through a digital control line. The heating system control module is connected to the thermal management controller through a power control line.

[0060] In this embodiment, the cooling system control module is connected to the coolant sensor, the electronic water pump, and the electronic water valve. The cooling system control module receives system requirements transmitted from the thermal management controller via the power control line and controls the opening of the electronic water valve according to the system requirements, thereby adjusting the flow rate and direction of the coolant. The cooling system control module also acquires coolant data transmitted from the coolant sensor, analyzes the coolant data, and if the coolant data exceeds a preset range, sends a control command to the electronic water pump. The electronic water pump adjusts its speed according to the control command to adjust the circulation speed of the coolant.

[0061] The cooling system control module and the thermal management controller are connected via a power control line. The thermal management controller generates corresponding system requirement signals based on the overall thermal management needs of the vehicle and system status information obtained from various relevant detection devices, and transmits these signals to the cooling system control module via the same power control line. Upon receiving these system requirement signals, the cooling system control module, according to predetermined control logic and the requirements for coolant flow and direction adjustment contained in the signals, outputs control signals to the electronic water valve via the corresponding control line. Based on the received control signals, the electronic water valve, through its internal motor drive and other actuators, changes its opening degree, thereby achieving precise adjustment of coolant flow and direction to adapt to the current operational needs of the thermal management system.

[0062] In addition, the cooling system control module is connected to a coolant sensor. The coolant sensor monitors relevant coolant parameters in real time, such as temperature and level, and transmits this data to the cooling system control module in the form of electrical signals. Upon receiving this data, the control module analyzes it to determine if it exceeds a pre-set normal range. If the coolant data exceeds the preset range, the control module sends a control command to the electric water pump via a specific control circuit, based on a corresponding control strategy. Upon receiving the control command, the electric water pump's internal motor and other drive components adjust their operating speed accordingly, thereby altering the coolant circulation speed throughout the cooling system. For example, when the coolant temperature is too high, the circulation speed is increased to enhance heat dissipation, ensuring that the coolant parameters remain within a reasonable range and guaranteeing the normal operation of the entire thermal management system.

[0063] In this embodiment, the heating system control module is connected to the heater. The heating system control module is used to receive the start command transmitted by the thermal management controller through the power control line, and transmit the start parameters indicated by the start command to the heater so that the heater works according to the start parameters.

[0064] In this embodiment, the heating system control module includes a monitoring unit and an adjustment unit connected to the heater; the monitoring unit is used to monitor the operating parameters of the heater, and if there is an abnormality in the operating parameters, it sends a control command to the adjustment unit; the adjustment unit is used to receive the control command and adjust the power data input to the heater according to the control command.

[0065] First, the heating system control module is connected to the thermal management controller via dedicated power control lines laid on a printed circuit board assembly. The thermal management controller generates a start command based on factors such as the vehicle's thermal management requirements and the interior temperature. This start command includes start parameter information such as the desired heating power and target temperature, and is transmitted to the heating system control module via the aforementioned power control lines. Upon receiving the start command, the heating system control module extracts the start parameters according to a predetermined communication protocol and data processing method, and then transmits these start parameters to the heater via another connected power control line.

[0066] In this embodiment, the heating system control module includes a monitoring unit and an adjustment unit, both of which are closely connected to the heater.

[0067] The monitoring unit is connected to the heater via specific monitoring lines. These lines can acquire various operating parameters generated by the heater in real time, including but not limited to the heater's real-time temperature, operating current, and operating voltage. Based on corresponding sensor principles and signal acquisition mechanisms, the monitoring unit continuously collects these operating parameters and compares the collected data with pre-set normal parameter ranges. Once it detects that the collected operating parameters exceed the normal range, indicating an abnormal situation, the monitoring unit immediately sends a corresponding control command to the regulating unit through its internal signal transmission lines. This control command contains specific information about the abnormal situation and the corresponding adjustment direction.

[0068] After receiving the control command from the monitoring unit, the regulating unit adjusts the power input to the heater based on the information carried in the command, using its built-in control algorithm and related power regulation circuitry. For example, if the heater temperature is detected to be too high, the control command indicates that the power needs to be reduced. The regulating unit will reduce the electrical energy input to the heater by changing the output voltage, current, and other power data, thereby reducing the heater's heating power and restoring the heater's operating parameters to within the normal range. This ensures the heater operates safely, stably, and efficiently, guaranteeing the normal functioning of the heating function in the entire thermal management system.

[0069] In this embodiment, the air conditioning system control module is connected to the air conditioning compressor. The air conditioning system control module is used to receive control commands transmitted by the thermal management controller through a high-speed communication line, and transmit the control parameters indicated by the control commands to the air conditioning compressor so that the air conditioning compressor works according to the control parameters.

[0070] The air conditioning system control module is connected to the thermal management controller via a pre-installed high-speed communication line. The thermal management controller takes into account many factors such as the vehicle interior temperature setpoint, ambient temperature, and vehicle interior heat load, and generates corresponding control commands. These control commands cover specific control parameter information such as compressor speed setting, power setting in cooling or heating mode, and start / stop time.

[0071] The thermal management controller transmits the generated control commands to the air conditioning system control module via a high-speed communication line. After receiving the control commands, the air conditioning system control module will parse and process the control commands according to the established communication protocol and data parsing rules, and extract the specific control parameters from them.

[0072] Subsequently, the air conditioning system control module accurately transmits the extracted control parameters to the air conditioning compressor through another connected communication line (usually a control line adapted to the communication requirements of the air conditioning compressor).

[0073] After receiving these control parameters, the air conditioning compressor will operate according to its own mechanical and electrical control principles, such as adjusting the motor speed and changing the compression ratio inside the compressor, in accordance with the requirements set by the control parameters, thereby realizing the corresponding functions such as cooling or heating the air inside the vehicle and meeting the actual needs of regulating the thermal environment inside the vehicle.

[0074] In the embodiments of this application, such as Figure 6 As shown, a high-voltage power supply 207 and a power drive device 208 are deployed on the second surface of the second region of the printed circuit board assembly; the high-voltage power supply 207 is adjacent to the pins disposed on the second surface of the second region, and the high-voltage power supply 207 is connected to the power drive module 207 through the high-voltage filter module 208.

[0075] Specifically, the high-voltage filter module 208 includes a high-voltage common-mode inductor and a high-voltage filter capacitor;

[0076] The high-voltage common-mode inductor is used to acquire the high-voltage power supply signal from the high-voltage power supply input and to suppress common-mode interference in the input high-voltage power supply signal to obtain the processed high-voltage power supply signal.

[0077] High-voltage filter capacitors are used to acquire the high-voltage power supply signal after processing by the high-voltage common-mode inductor, and output a stable high-voltage power supply signal after filtering out high-frequency ripple and noise based on the processed high-voltage power supply signal.

[0078] The power drive module is used to acquire the low-voltage signal input from the thermal management controller and the stable high-voltage power supply signal input from the high-voltage filter capacitor, and output a three-phase bridge drive signal to drive the PTC and compressor based on the input control signal and high-voltage power supply signal.

[0079] The printed circuit board assembly has a second region on a second surface (reverse side) of which a high-voltage power supply and power drive devices are deployed. The high-voltage power supply is adjacent to pins located on the second surface of this region, facilitating access to the high-voltage power supply and electrical connections to other circuits.

[0080] The high-voltage power supply is connected to the power drive module through a high-voltage filter module. The high-voltage filter module plays a crucial role in purifying the power supply between the two, and it consists of a high-voltage common-mode inductor and a high-voltage filter capacitor.

[0081] High-voltage common-mode inductor: It receives the high-voltage power supply signal (HV+, HV-) from the high-voltage power supply input, which contains common-mode interference components. The high-voltage common-mode inductor suppresses common-mode interference in the input high-voltage power supply signal, attenuating the common-mode interference current to obtain the processed high-voltage power supply signal (HV+_1, HV-_1), making the power supply signal cleaner.

[0082] High-voltage filter capacitor: Receives the high-voltage power supply signal (HV+_1, HV-_1) after processing by the high-voltage common-mode inductor. Since the signal still contains high-frequency ripple and noise, the high-voltage filter capacitor further filters the input signal and outputs a stable high-voltage power supply signal (HV+_PWR) after filtering out high-frequency ripple and noise, providing a stable and reliable power input for the subsequent power drive module.

[0083] The power drive module (IGBT module) receives two input signals. One is the low-voltage signal from the thermal management controller (shown in the diagram as the PTC and compressor SVPWM signals, i.e., isolated low-voltage signals), used to control and transmit commands to the power drive module. The other is the stable high-voltage power supply signal (HV+_PWR) input from the high-voltage filter capacitor, providing energy for power conversion. Based on the input control signal and high-voltage power supply signal, the power drive module controls the on / off state of its internal IGBTs, outputting a three-phase bridge drive signal to drive the PTC and compressor, thus achieving power control for PTC heating and compressor operation.

[0084] As an example, such as Figure 7 As shown, the first surface of the printed circuit board assembly includes a low-voltage area and a high-voltage area separated by a high-low voltage separator. The high-low voltage separator houses isolation communication devices. The low-voltage area contains a thermal management controller and a water pump NMOS heat sink area. The water pump NMOS heat sink area is the printed circuit board area corresponding to the mounting position of the NMOS device in the water pump circuit system, and it plays a crucial role in heat dissipation. The high-voltage area contains detection devices.

[0085] Two methods are employed to enhance heat dissipation and prevent interference-induced thermal failure in the NMOS heat sink area of ​​the water pump. First, the heat sink is windowed and then filled with resin. This improves heat dissipation capacity and effectively avoids interference-induced thermal failure caused by heat accumulation. Second, a structural heat dissipation protrusion is designed, and thermal grease is applied to it to further reduce heat accumulation, thereby avoiding interference-induced thermal failure and ensuring the stable and reliable operation of the water pump NMOS device.

[0086] like Figure 8 As shown, the second surface of the printed circuit board assembly includes a low-voltage region and a high-voltage region separated by a high-low voltage separator. In the low-voltage region, the low-voltage power input passes through lines KL30 and KL31, and is then filtered to output VHD_12V, which powers the water pump drive three-phase bridge NMOS module, the multi-way valve drive module, and the stepper motor drive module. The water pump drive three-phase bridge NMOS module is also connected to the water pump pre-driver chip, both of which require the KL30 signal. In the high-voltage region, the IGBT module receives the SPWM signals from the PTC and the compressor, and outputs a three-phase bridge drive signal, which is connected to HV_GND and HV+_PWR. HV+_PWR passes through a high-voltage filter capacitor and a high-voltage common-mode inductor, and is then connected to HV+ and HV- via a high-voltage connector, realizing the different functions and electrical connections of the high and low voltage regions.

[0087] The design of high-voltage filter capacitors, high-voltage common-mode inductors, and high-voltage connectors ensures stable, reliable, and safe system operation. High-voltage filter capacitors smooth the voltage output of the power drive module, reducing fluctuations and ripple, providing a stable voltage to the load, and suppressing high-frequency electromagnetic interference. High-voltage common-mode inductors effectively suppress common-mode interference current, improving the system's anti-interference capability and protecting equipment. High-voltage connectors provide reliable electrical connections, ensuring stable transmission of high-voltage power and facilitating system installation and maintenance.

[0088] The above description is merely a preferred embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

[0089] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A thermal management control system, characterized in that, The thermal management control system includes: a housing and a printed circuit board assembly, wherein the printed circuit board assembly is disposed inside the housing, and the grounding terminal of the printed circuit board assembly is connected to the housing. The printed circuit board assembly includes a thermal management controller and multiple functional devices, which are respectively disposed on different surfaces of the printed circuit board assembly. The thermal management controller is connected to the functional devices.

2. The thermal management control system according to claim 1, characterized in that, The printed circuit board assembly is provided with a high-low voltage separation strip, and the high-low voltage separation strip is provided with an isolation communication device. The high-low voltage separation strip is a groove located on the laid copper foil layer. The high-low voltage separation strip is used to divide the printed circuit board assembly into a first region and a second region. The isolation communication device is respectively connected to the device deployed in the first region and the device deployed in the second region.

3. The thermal management control system according to claim 2, characterized in that, The isolated communication device includes a signal amplifier, a filter, and a signal shaper. The input terminal of the signal amplifier receives the transmitted signal from the functional device. The output terminal of the signal amplifier is connected to the input terminal of the filter. The output terminal of the filter is connected to the input terminal of the signal shaper. The output terminal of the signal shaper is connected to the thermal management controller.

4. The thermal management control system according to claim 2, characterized in that, The thermal management controller is disposed on the first surface of the first region, and the thermal management controller is connected to the detection device located on the first surface of the second region through the isolation communication device.

5. The thermal management control system according to claim 2, characterized in that, A low-voltage power supply, a load driving device, and a thermal environment control device are deployed on the second surface of the first region of the printed circuit board assembly; the low-voltage power supply is adjacent to the pins disposed on the second surface of the first region, and the low-voltage power supply is connected to the load driving device and the thermal environment control device respectively through conductive lines.

6. The thermal management control system according to claim 2, characterized in that, A high-voltage power supply and a power drive device are deployed on the second surface of the second region of the printed circuit board assembly; the high-voltage power supply is adjacent to the pins disposed on the second surface of the second region, and the high-voltage power supply is connected to the power drive module through a high-voltage filtering module.

7. The thermal management control system according to claim 6, characterized in that, The high-voltage filtering module includes a high-voltage common-mode inductor and a high-voltage filtering capacitor; The high-voltage common-mode inductor is used to acquire the high-voltage power supply signal input from the high-voltage power supply and to perform common-mode interference suppression processing on the input high-voltage power supply signal to obtain the processed high-voltage power supply signal. The high-voltage filter capacitor is used to acquire the high-voltage power supply signal after processing by the high-voltage common-mode inductor, and output a stable high-voltage power supply signal after filtering out high-frequency ripple and noise based on the processed high-voltage power supply signal. The power drive module is used to acquire the low-voltage signal input from the thermal management controller and the stable high-voltage power supply signal input from the high-voltage filter capacitor, and output a three-phase bridge drive signal to drive the PTC and the compressor according to the input control signal and the high-voltage power supply signal.

8. The thermal management control system according to claim 1, characterized in that, The printed circuit board assembly is also provided with a thermal environment control device, which includes a cooling system control module and a heating system control module. The cooling system control module is connected to the coolant sensor, the electronic water pump, and the electronic water valve, respectively. The cooling system control module is used to receive system requirements transmitted by the thermal management controller through the power control line, and control the opening of the electronic water valve according to the system requirements, thereby adjusting the flow rate and direction of the coolant. The cooling system control module is used to acquire coolant data transmitted by the coolant sensor, analyze the coolant data, and if the coolant data exceeds a preset range, send a control command to the electronic water pump. The electronic water pump adjusts its speed according to the control command to adjust the circulation speed of the coolant.

9. The thermal management control system according to claim 8, characterized in that, The heating system control module is connected to the heater. The heating system control module is used to receive the start command transmitted by the thermal management controller through the power control line, and transmit the start parameters indicated by the start command to the heater so that the heater works according to the start parameters.

10. The thermal management control system according to claim 9, characterized in that, The heating system control module includes a monitoring unit and an adjustment unit connected to the heater; The monitoring unit is used to monitor the operating parameters of the heater. If the operating parameters are abnormal, it sends a control command to the regulating unit. The regulating unit is used to receive the control command and adjust the power data input to the heater according to the control command.

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