IC card carrier tape splicing structure

Abstract

The utility model is suitable for the technical field of IC card carrier tape processing, and provides an IC card carrier tape splicing structure which comprises a reinforcing plate arranged between two IC card carrier tapes and used for splicing the two IC card carrier tapes. The bonding layer is bonded on the reinforcing plate and is used for bonding and fixing the reinforcing plate and the two IC card carrier tapes; and the plurality of exposed holes are formed in the reinforcing plate, correspond to the IC card on the IC card carrier tape in position and are used for preventing the functional area of the IC card from being shielded. The IC card carrier tape splicing structure provided by the scheme is high in strength, smooth in operation, free of tape clamping and high in bending adaptability.

Description

Technical Field

[0001] This utility model belongs to the field of IC card carrier tape processing technology, and in particular relates to an IC card carrier tape splicing structure. Background Technology

[0002] IC card carrier tapes often need to be spliced ​​during the packaging process, but traditional splicing methods mostly use mechanical fixing with rivets, which has the following problems: even if ultra-thin rivets are used, their superimposed thickness will still affect the smooth operation of the carrier tape in high-speed packaging equipment, which can easily lead to tape jamming; the rivet area is too rigid, which can easily cause local deformation or even breakage of the carrier tape when it is rolled or bent. Utility Model Content

[0003] This utility model provides an IC card carrier tape splicing structure, which aims to solve the problems of excessive thickness, poor mechanical properties and process defects in the riveting splicing schemes proposed in the background art.

[0004] To solve the above problems, this utility model is implemented as follows: an IC card carrier splicing structure includes: a reinforcing plate disposed between two IC card carriers for splicing the two IC card carriers; an adhesive layer bonded to the reinforcing plate for bonding and fixing the reinforcing plate to the two IC card carriers; and several exposed holes formed on the reinforcing plate and corresponding to the positions of IC cards on the IC card carriers to avoid obstructing the functional areas of the IC cards.

[0005] Preferably, the reinforcing plate is made of glass fiber reinforced epoxy resin composite material (FR-4), and the thickness of the reinforcing plate is greater than or equal to 0.13 mm.

[0006] Preferably, the adhesive layer is made of acrylic adhesive, and the thickness after curing is ≤0.5mm.

[0007] Compared with related technologies, the IC card carrier splicing structure provided by this utility model has the following beneficial effects:

[0008] Compared with existing technologies, the IC card carrier tape splicing structure provided in this solution firmly bonds the reinforcing plate to the carrier tape through an adhesive layer, forming a stable splicing structure and ensuring splicing strength. At the same time, the exposed holes on the reinforcing plate ensure that the functional area of ​​the IC card is not obstructed during splicing. This achieves both reliable splicing of the carrier tape and normal use of the IC card, achieving a dual balance between splicing strength and functional integrity. Compared with the traditional splicing method that uses rivets for mechanical fixing, this splicing structure achieves carrier tape splicing through an adhesive layer, avoiding the situation where the thickness of the rivets affects the smooth operation of the carrier tape in high-speed packaging equipment. This effectively avoids tape jamming problems caused by increased thickness, ensuring the efficient and stable operation of the carrier tape in high-speed packaging equipment.

[0009] In summary, the IC card carrier splicing structure of this utility model has high strength, smooth operation without jamming, strong bending adaptability, and can ensure the integrity of IC card functions, thus significantly improving the IC card carrier packaging quality and product reliability. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the main structure of an IC card carrier tape splicing structure provided by this utility model;

[0011] Figure 2 This is a side view of an IC card carrier tape splicing structure provided by this utility model;

[0012] Figure 3 This is a schematic diagram of the main structure of the reinforcing plate provided by this utility model;

[0013] Figure 4 This is a second embodiment of the solder paste solder joint method for reinforcing boards provided by this utility model.

[0014] Reference numerals: 1. IC card carrier tape; 2. Reinforcing plate; 3. Adhesive layer; 4. Exposed hole; 5. Solder groove. Detailed Implementation

[0015] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings are used to distinguish different objects, not to describe a particular order; the terms "inner," "outer," "left," and "right" indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0016] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0017] This utility model embodiment provides an IC card carrier tape splicing structure, such as Figure 1-4 As shown, the IC card carrier splicing structure includes: a reinforcing plate 2 disposed between two IC card carriers 1 for splicing the two IC card carriers 1; an adhesive layer 3 bonded to the reinforcing plate 2 for bonding and fixing the reinforcing plate 2 to the two IC card carriers 1; and several exposed holes 4 formed on the reinforcing plate 2 and corresponding to the IC card positions on the IC card carriers 1 to avoid obstructing the IC card functional areas.

[0018] In this embodiment, the reinforcing plate 2 is disposed between the two IC card carrier tapes 1 as an intermediate connecting component for splicing. The adhesive layer 3 is bonded to the reinforcing plate 2, firmly bonding the reinforcing plate 2 to the two IC card carrier tapes 1 together, thereby forming a stable splicing structure. The reinforcing plate 2 has several exposed holes 4, the positions of which correspond precisely to the positions of the IC cards on the IC card carrier tapes 1. When the carrier tape splicing operation is performed, it can be ensured that the reinforcing plate 2 will not block the functional area of ​​the IC card, ensuring the normal use of the IC card function and avoiding product scrapping at the splicing overlap.

[0019] The reinforcing plate 2 and the carrier tape are firmly bonded together by the adhesive layer 3, forming a stable splicing structure that ensures splicing strength. At the same time, the exposed holes 4 on the reinforcing plate 2 ensure that the functional area of ​​the IC card is not obstructed during splicing. This achieves both reliable splicing of the carrier tape and normal use of the IC card, thus achieving a balance between splicing strength and functional integrity. Compared with the traditional splicing method that uses rivets for mechanical fixing, this splicing structure uses the adhesive layer 3 to splice the carrier tape, avoiding the situation where the thickness of the rivets affects the smooth operation of the carrier tape in high-speed packaging equipment. This effectively avoids the problem of tape jamming caused by increased thickness, ensuring the efficient and stable operation of the carrier tape in high-speed packaging equipment.

[0020] In a further preferred embodiment of the present invention, the reinforcing plate 2 may be made of glass fiber reinforced epoxy resin composite material (FR-4), PI material, or PET material, and the thickness of the reinforcing plate 2 is 0.13 mm.

[0021] In this embodiment, the FR-4 material reinforcing plate 2 has excellent mechanical and electrical properties. The 0.13mm thickness design ensures that the reinforcing plate 2 itself has sufficient strength to provide reliable support for the carrier tape splicing and ensure the stability of the splicing structure in various usage environments.

[0022] In a further preferred embodiment of this utility model, the adhesive layer 3 can be made of acrylic adhesive or pressure-sensitive adhesive, or it can be soldered using solder paste. The cured thickness is ≤0.5mm and the tensile strength is ≥110N.

[0023] In this embodiment, the adhesive layer 3 of the equivalent acrylic adhesive material has excellent bonding performance. After curing, it can form a strong adhesive force, firmly bonding the reinforcing plate 2 to the carrier tape, effectively resisting external tensile and shear forces, ensuring the strength and stability of the spliced ​​structure in various usage scenarios, avoiding loosening or separation at the splice, and ensuring the reliability of the carrier tape splicing.

[0024] To further improve the performance of this device, in addition to the above-mentioned solutions, this solution also includes the following embodiments:

[0025] In another embodiment of the present invention, it further includes: a solder groove 5 formed on the reinforcing plate 2, the solder groove 5 being used to apply solder paste into the solder groove 5 to connect the two IC card carrier tapes 1.

[0026] In this embodiment, during splicing, the reinforcing plate 2 is placed between the two IC card carrier strips 1 as an intermediate connecting component. Solder grooves 5 are pre-formed on the reinforcing plate 2, and solder paste is applied to the solder grooves 5. Subsequently, the solder paste is melted through heating and other processes. The molten solder paste will wet the carrier strips 1 and the reinforcing plate 2. After cooling and solidification, the solder paste firmly connects the reinforcing plate 2 and the two IC card carrier strips 1 together to form a stable splicing structure. At the same time, the several exposed holes 4 formed on the reinforcing plate 2 correspond precisely to the positions of the IC cards on the IC card carrier strips 1, ensuring that the reinforcing plate 2 will not obstruct the functional areas of the IC card during the splicing process, and ensuring that the IC card functions normally.

[0027] In summary, compared with related technologies, this splicing structure has high strength, smooth operation without jamming, strong bending adaptability, and can ensure the integrity of IC card functions, thus significantly improving the IC card carrier tape packaging quality and product reliability.

[0028] Furthermore, this splicing structure breaks through the limitations of the traditional continuous roll-to-roll production mode, innovatively adopting a sheet-like processing method, which has the following advantages:

[0029] By eliminating reliance on dedicated roll-to-roll equipment, production can be carried out using general-purpose equipment, significantly reducing the investment threshold for equipment; the range of raw material selection is wider, not limited by roll specifications, and the stability of the supply chain is significantly improved; the production process is simplified, processing links are reduced, and production costs are reduced while production efficiency is improved simultaneously; the sheet production mode is more conducive to process quality control, and compared with the traditional roll production method, product consistency and yield are comprehensively improved.

[0030] It should be understood, in the several embodiments provided in this application, that the disclosed apparatus may be implemented in other ways.

[0031] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Although this utility model has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add, delete, or otherwise adjust the features of the various embodiments of this utility model according to the circumstances without conflict or creative effort, thereby obtaining different technical solutions that do not fundamentally depart from the concept of this utility model. These technical solutions are also within the scope of protection of this utility model.

Claims

1. An IC card carrier tape splicing structure for splicing two IC card carrier tapes, characterized in that, include: A reinforcing plate (2) is placed between the two IC card carriers (1) for splicing the two IC card carriers (1); An adhesive layer (3) is bonded to the reinforcing plate (2) to bond and fix the reinforcing plate (2) to the two IC card carrier tapes (1); Several exposed holes (4) are opened on the reinforcing plate (2) and correspond to the IC card position on the IC card carrier (1) to avoid obscuring the IC card functional area.

2. The IC card carrier tape splicing structure as described in claim 1, characterized in that, The thickness of the reinforcing plate (2) is greater than or equal to 0.13 mm.

3. The IC card carrier tape splicing structure as described in claim 1, characterized in that, The adhesive layer (3) is made of acrylic adhesive and has a thickness of ≤0.5mm after curing.

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