High-frequency high-speed circuit board

Abstract

The high-frequency and high-speed circuit board comprises a shell and a mounting block, the outer wall of the shell is fixedly connected with the mounting block, the upper end of the shell is fixedly connected with a cover plate, the middle of the cover plate is fixedly connected with a mounting ring, a miniature fan is mounted on the inner wall of the mounting ring, and the inner wall of the shell is connected with a mounting mechanism. The rubber block and the shell are integrated, the clamping block and the cover plate are integrated, the high-speed circuit board mechanism is placed in the groove in the surface of the rubber block, the cover plate covers the upper end of the shell, and the fixing screw is screwed into the rubber block and the clamping block, so that the clamping block and the rubber block have the effect of clamping and installing the high-speed circuit board mechanism. The cover plate on the shell does not need to be installed again after the high-speed circuit board mechanism is independently installed in the shell, and the effect of integrated assembly is achieved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a high-frequency, high-speed circuit board. Background Technology

[0002] The manufacturing process of high-frequency and high-speed PCBs is basically the same as that of ordinary PCBs. The key to achieving high frequency and high speed lies in...

[0003] The properties of raw materials, i.e., their characteristic parameters. The main material of high-frequency and high-speed PCBs is high-frequency and high-speed copper-clad laminate, whose core requirements are a low dielectric constant (Dk) and a low dielectric loss factor (Df). In addition to ensuring low Dk and Df, the consistency of the Dk parameter is also one of the important factors in measuring the quality of PCBs.

[0004] For example, a high-frequency high-speed circuit board with publication number "CN219145989U" solves the problem that existing high-frequency high-speed circuit boards cannot block water and moisture, which leads to a decrease in the heat dissipation performance of the PCB board. By placing the circuit board body in the enclosed space, the contact area between the circuit board body and the outside humid air is reduced. Then, by setting an active heat dissipation mechanism to work with the heat generated by the circuit board body when it is working, the hot air in the enclosed space is blown out. While improving the heat dissipation capacity of the circuit board body, it further reduces the humid gas content in the enclosed space. Considering that the high-frequency high-speed circuit board in the existing high-frequency high-speed circuit board needs to be installed separately in the housing and then the cover on the housing is installed again, it is impossible to achieve the effect of integrated assembly. Summary of the Invention

[0005] This invention aims to solve the problems existing in the prior art by providing a high-frequency, high-speed circuit board that eliminates the need to separately install the circuit board into the housing and then install the cover on the housing, achieving the effect of integrated assembly.

[0006] The technical solution adopted by this utility model to solve its technical problem is as follows:

[0007] Design a high-frequency, high-speed circuit board, including a housing and a mounting block. The outer wall of the housing is fixedly connected to the mounting block, the upper end of the housing is fixedly connected to a cover plate, the middle part of the cover plate is fixedly connected to a mounting ring, a miniature fan is mounted on the inner wall of the mounting ring, and a mounting mechanism is connected to the inner wall of the housing.

[0008] Further improvements include the installation mechanism comprising a rubber block, the lower end of which is fixedly connected to the outer shell, the inner wall of which is threadedly connected to a fixing screw, and the inner wall of which is fixedly connected to a clamping block.

[0009] Further improvements include a clamping block whose upper end is fixedly connected to the cover plate, a fixing screw whose outer wall is threadedly connected to the cover plate, and a high-speed circuit board mechanism connected to the lower end of the clamping block.

[0010] Further improvements include a high-speed circuit board mechanism comprising an upper substrate, the upper end of which abuts against a clamping block, the upper end of which is fixedly connected to a first GND layer, the lower end of which is fixedly connected to a first copper foil layer, the lower end of which is electrically connected to a power layer, the lower end of which is fixedly connected to a second copper foil layer, the lower end of which is fixedly connected to a second GND layer, the lower end of which is fixedly connected to a third copper foil layer, and the lower end of which is fixedly connected to a lower substrate.

[0011] As a further improvement, an air inlet is installed on the outer side of the outer casing.

[0012] Further improvements include a fixed connection between the inner wall of the mounting groove and the fixing strip, and a silicone threading hole machined on the side end of the outer shell.

[0013] To further improve the design, the upper end of the mounting ring is machined with an air vent.

[0014] The beneficial effects of this utility model are as follows: This utility model integrates the rubber block with the outer shell and the clamping block with the cover plate. The high-speed circuit board mechanism is placed into the groove on the surface of the rubber block, the cover plate is placed on the upper end of the outer shell, and the fixing screws are screwed into the rubber block and the clamping block. This achieves the effect of clamping and installing the high-speed circuit board mechanism by the clamping block and the rubber block. It eliminates the need to install the high-speed circuit board mechanism separately into the shell and then install the cover plate on the shell again, thus achieving the effect of integrated assembly. Attached Figure Description

[0015] Figure 1 This is a three-dimensional schematic diagram of the present invention;

[0016] Figure 2 for Figure 1 A frontal sectional view;

[0017] Figure 3 for Figure 2 A top-view sectional diagram;

[0018] Figure 4 for Figure 2 Enlarged sectional view of part A in the middle:

[0019] Figure 5 for Figure 2 Enlarged sectional view of section B:

[0020] Figure 6 for Figure 1Enlarged sectional view of the outer shell.

[0021] Explanation of reference numerals in the attached figures: 1. Outer shell, 2. Mounting block, 3. Cover plate, 4. Mounting ring, 5. Miniature fan, 6. Mounting mechanism, 601. Rubber block, 602. Fixing screw, 603. Clamping block, 7. High-speed circuit board mechanism, 701. Upper substrate, 702. First GND layer, 703. First copper foil layer, 704. Power layer, 705. Second copper foil layer, 706. Second GND layer, 707. Third copper foil layer, 708. Lower substrate, 8. Air inlet, 9. Silicone wire hole, 10. Air outlet. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings:

[0023] Example 1:

[0024] See attached document Figure 1-6 In this embodiment, a high-frequency high-speed circuit board includes a housing 1 and a mounting block 2. The outer wall of the housing 1 is fixedly connected to the mounting block 2, the upper end of the housing 1 is fixedly connected to the cover plate 3, the middle part of the cover plate 3 is fixedly connected to the mounting ring 4, a miniature fan 5 is installed on the inner wall of the mounting ring 4, and a mounting mechanism 6 is connected to the inner wall of the housing 1.

[0025] The mounting mechanism 6 includes a rubber block 601. By screwing a fixing screw 602 into the rubber block 601 and the clamping block 603, the clamping block 603 and the rubber block 601 clamp and install the high-speed circuit board mechanism 7. The lower end of the rubber block 601 is fixedly connected to the outer shell 1, and the inner wall of the rubber block 601 is threadedly connected to the fixing screw 602. The inner wall of the fixing screw 602 is fixedly connected to the clamping block 603.

[0026] The rubber block 601 is integrated with the outer shell 1, and the clamping block 603 is integrated with the cover plate 3. The high-speed circuit board mechanism 7 is placed into the groove on the surface of the rubber block 601, and the cover plate 3 is placed on the upper end of the outer shell 1. The fixing screw 602 is screwed into the rubber block 601 and the clamping block 603, so that the clamping block 603 and the rubber block 601 clamp and install the high-speed circuit board mechanism 7. It is not necessary to install the high-speed circuit board mechanism 7 separately into the shell 1 and then install the cover plate 3 on the shell 1 again, so as to achieve the effect of integrated assembly.

[0027] The upper end of the clamping block 603 is fixedly connected to the cover plate 3, and the outer wall of the fixing screw 602 is threadedly connected to the cover plate 3. The lower end of the clamping block 603 is connected to a high-speed circuit board mechanism 7. The high-speed circuit board mechanism 7 includes an upper substrate 701. The upper end of the upper substrate 701 is pressed against the clamping block 603. The upper end of the upper substrate 701 is fixedly connected to the first GND layer 702. The lower end of the first GND layer 702 is fixedly connected to the first copper foil layer 703. The lower end of the first copper foil layer 703 is electrically connected to the power layer 704. The lower end of the power layer 704 is fixedly connected to the second copper foil layer 705. The lower end of the second copper foil layer 705 is fixedly connected to the second GND layer 706. The lower end of the second GND layer 706 is fixedly connected to the third copper foil layer 707. The lower end of the third copper foil layer 707 is fixedly connected to the lower substrate 708. The upper substrate 701 and the lower substrate 709 are epoxy resin, which is the most commonly used material for the lower substrate and has good mechanical strength and insulation properties.

[0028] An air inlet 8 is installed on the outer side of the outer casing 1. The inner wall of the mounting groove is fixedly connected to the fixing strip. A silicone wire hole 9 is machined on the side end of the outer casing 1. An air outlet 10 is machined on the upper end of the mounting ring 4.

[0029] Working principle:

[0030] The upper substrate 701, the first GND layer 702, the first copper foil layer 703, the power layer 704, the second copper foil layer 705, the second GND layer 706, the third copper foil layer 707, and the solder layer 708 are pressed onto the upper end of the lower substrate 709 to form an integrated high-speed circuit board structure 7. This reduces thermal stress warping. The first copper foil layer 703, the second copper foil layer 705, and the third copper foil layer 707 for high-speed signals (such as differential pairs) are preferentially placed in the inner layers. The upper first GND layer 702 and the second GND layer are used as copper foil materials to form shielding to avoid surface radiation interference. The upper substrate 701 and the lower substrate 708 are also called solder layers. After holes are drilled in the upper substrate 701 and the lower substrate 708, the pins of the components pass through the upper substrate 701 and the lower substrate 708, so that the upper and lower ends of the pins of multiple components are soldered to the upper substrate 701 and the lower substrate 708.

[0031] The high-speed circuit board mechanism 7, with its soldered electronic components, is placed into the groove on the surface of the rubber block 601, which serves to limit the high-speed circuit board mechanism 7 inside the housing 1. The cover plate 3 is placed on the top of the housing 1, and the fixing screw 602 is screwed into the rubber block 601 and the clamping block 603 again, so that the clamping block 603 and the rubber block 601 clamp the high-speed circuit board mechanism 7. At the same time, the external wires on the high-speed circuit board mechanism 7 are passed out through the silicone wire hole 9. When the high-speed circuit board mechanism 7 generates heat during operation, the power switch of the micro fan 5 on the mounting ring 4 is turned on, and the micro fan 5 starts to work. The micro fan 5 draws the hot air from inside the housing 1 and exhausts it out through the air outlet 10. At the same time, the air inlet 8 on the side of the housing 1 introduces air into the housing 1, achieving the effect of heat dissipation and cooling inside the housing 1.

[0032] Although the present invention has been illustrated and described with reference to preferred embodiments, those skilled in the art should understand that various changes in form and detail are possible within the scope of the claims.

Claims

1. A high-frequency, high-speed circuit board, comprising a housing (1) and a mounting block (2), wherein the outer wall of the housing (1) is fixedly connected to the mounting block (2), characterized in that: The upper end of the outer shell (1) is fixedly connected to the cover plate (3), the middle part of the cover plate (3) is fixedly connected to the mounting ring (4), a miniature fan (5) is installed on the inner wall of the mounting ring (4), and an installation mechanism (6) is connected to the inner wall of the outer shell (1).

2. The high-frequency, high-speed circuit board according to claim 1, characterized in that: The installation mechanism (6) includes a rubber block (601), the lower end of which is fixedly connected to the outer shell (1), the inner wall of which is threadedly connected to a fixing screw (602), and the inner wall of the fixing screw (602) is fixedly connected to a clamping block (603).

3. The high-frequency, high-speed circuit board according to claim 2, characterized in that: The upper end of the clamping block (603) is fixedly connected to the cover plate (3), the outer wall of the fixing screw (602) is threadedly connected to the cover plate (3), and the lower end of the clamping block (603) is connected to a high-speed circuit board mechanism (7).

4. The high-frequency, high-speed circuit board according to claim 3, characterized in that: The high-speed circuit board mechanism (7) includes an upper substrate (701), the upper end of which is abutted against a clamping block (603). The upper end of the upper substrate (701) is fixedly connected to a first GND layer (702). The lower end of the first GND layer (702) is fixedly connected to a first copper foil layer (703). The lower end of the first copper foil layer (703) is electrically connected to a power layer (704). The lower end of the power layer (704) is fixedly connected to a second copper foil layer (705). The lower end of the second copper foil layer (705) is fixedly connected to a second GND layer (706). The lower end of the second GND layer (706) is fixedly connected to a third copper foil layer (707). The lower end of the third copper foil layer (707) is fixedly connected to a lower substrate (708).

5. The high-frequency, high-speed circuit board according to claim 1, characterized in that: An air inlet (8) is installed on the outer side of the outer casing (1).

6. The high-frequency, high-speed circuit board according to claim 1, characterized in that: The outer casing (1) has silicone threading holes (9) machined on its side.

7. The high-frequency, high-speed circuit board according to claim 1, characterized in that: The upper end of the mounting ring (4) is machined with an air vent (10).

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