Heat dissipation structure of beauty instrument

Abstract

The utility model relates to a heat dissipation structure of a beauty instrument, which comprises a shell, a contact cover, a refrigeration structure and at least one first heat dissipation structure, one end of the shell is an opening structure, the contact cover is connected with the opening structure of the shell and seals the opening structure, the shell and the contact cover form an accommodating space, and the refrigeration structure is arranged in the accommodating space. The refrigeration structure is arranged in the containing space and attached to the contact cover, the face, close to the contact cover, of the refrigeration structure is a cold face, the face, away from the contact cover, of the refrigeration structure is a hot face, and the first heat dissipation structure is connected with the hot face of the refrigeration structure. When the refrigeration structure works, the temperature is reduced on the cold face and is transmitted out through the contact cover, and the temperature is increased on the hot face and is conducted to the first heat dissipation structure. The first heat dissipation structure is arranged to absorb and dissipate heat generated by the refrigeration structure, so that after the refrigeration structure works for a period of time, the temperature does not rise to be too high, and the endurance time of the product is prolonged.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for beauty instruments, and more particularly to a heat dissipation structure for a beauty instrument. Background Technology

[0002] Beauty devices are generally designed to be compact and small. To prevent water and cosmetic liquids from entering the device and affecting its performance and user experience, ventilation holes for heat dissipation are not easily incorporated into the exterior. This is especially true for beauty devices with cooling functions. Because these devices contain heating components such as thermoelectric coolers and PCBAs, which generate heat after a period of operation, excessively high internal temperatures can affect device performance and even cause the device to malfunction. Furthermore, prolonged operation at high temperatures can accelerate the degradation of component performance, thus reducing the product's lifespan.

[0003] Therefore, existing technologies have shortcomings and need to be improved. Summary of the Invention

[0004] This application provides a heat dissipation structure for a beauty device to address the problem that some beauty devices with cooling functions, due to the presence of components such as semiconductor cooling chips and PCBAs that generate heat during operation, experience excessively high temperatures after a period of operation, affecting device performance and even causing the product to malfunction. Additionally, prolonged operation of some components in high-temperature environments can increase the degree of component performance degradation, thereby reducing the product's lifespan.

[0005] In a first aspect, this application provides a heat dissipation structure for a beauty device, including a housing, a contact cover, a cooling structure, and at least one first heat dissipation structure. One end of the housing is an open structure, the contact cover is connected to and seals the open structure of the housing, the housing and the contact cover form an accommodating space, the cooling structure is disposed within the accommodating space and attached to the contact cover, the side of the cooling structure near the contact cover is a cold surface, and the side away from the contact cover is a hot surface, the first heat dissipation structure is connected to the hot surface of the cooling structure, and when the cooling structure is in operation, it cools down on the cold surface and transmits heat through the contact cover, heats up on the hot surface and conducts heat to the first heat dissipation structure.

[0006] Optionally, it also includes a PCBA motherboard, which is fixedly disposed within the accommodating space, and the cooling structure is electrically connected to the PCBA motherboard.

[0007] Optionally, it further includes at least one second heat dissipation structure, which is connected to the PCBA motherboard, and the PCBA motherboard conducts some of the heat generated during operation to the second heat dissipation structure.

[0008] Optionally, a first flexible thermally conductive material is provided between the cooling structure and the first heat dissipation structure, and the first flexible thermally conductive material is in close contact with the hot surface of the cooling structure and the first heat dissipation structure respectively.

[0009] Optionally, a second flexible thermal conductive material is provided between the second heat dissipation structure and the PCBA motherboard, and the second flexible thermal conductive material is tightly attached to the second heat dissipation structure and the PCBA motherboard respectively.

[0010] Optionally, it also includes a temperature detection sensor, which is disposed on the PCBA motherboard and close to the second heat dissipation structure. The temperature detection sensor is electrically connected to the PCBA motherboard. When the temperature detection sensor is working, it detects the temperature of the second heat dissipation structure and sends a detection signal to the PCBA motherboard. The PCBA motherboard has a temperature threshold. The PCBA motherboard converts the detection signal into an actual temperature value and compares it with the temperature threshold. When the actual temperature value is greater than the temperature threshold, the PCBA motherboard shuts down and issues an alarm.

[0011] Optionally, the first heat dissipation structure and the second heat dissipation structure are made of aluminum alloy or magnesium alloy.

[0012] Optionally, the first heat dissipation structure and the second heat dissipation structure can be integrally formed or designed separately.

[0013] Optionally, the outer casing includes a left shell and a right shell, the left shell and the right shell being detachably connected, and the left shell, the right shell and the contact cover forming the accommodating space.

[0014] Optionally, it also includes a battery and a charging interface. The battery is fixedly disposed within the accommodating space, and the charging interface is partially located within the accommodating space and partially exposed from the outer casing end away from the contact cover. The battery and the charging interface are electrically connected to the PCBA motherboard, respectively.

[0015] Optionally, at least one raised heat dissipation structure is provided on the side of the second heat dissipation structure close to the PCBA motherboard, and the raised heat dissipation structure is connected to the PCBA motherboard.

[0016] The technical solutions provided in this application have the following advantages compared with the prior art:

[0017] This application embodiment absorbs and dissipates the heat generated by the cooling structure by setting a first heat dissipation structure, so that the temperature of the cooling structure does not rise too high after working for a period of time, thus ensuring the performance of the cooling structure, improving the product's battery life, avoiding the situation where the product cannot work for a short time and the cooling structure is in a high-temperature environment for a long time, reducing the degree of component performance degradation, and helping to improve the product's service life. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0021] Figure 1 This is a three-dimensional structural diagram of a heat dissipation structure for a beauty device provided in an embodiment of this application.

[0022] Figure 2 This is a cross-sectional schematic diagram of the heat dissipation structure of a beauty device provided in an embodiment of this application.

[0023] Figure 3 for Figure 2 Enlarged view of point A in the middle.

[0024] Figure 4 This is a three-dimensional structural diagram of a heat dissipation structure for a beauty device provided in an embodiment of this application, excluding the right shell portion.

[0025] Figure 5 This is a three-dimensional structural diagram of a heat dissipation structure for a beauty device provided in an embodiment of this application, excluding the interface soft rubber cover portion.

[0026] Figure 6 This is a three-dimensional structural diagram of the heat dissipation structure of a beauty device provided in an embodiment of this application.

[0027] Figure 7 This is a simplified structural diagram of the second heat dissipation structure, the second flexible thermal conductive material, and the PCBA motherboard of this application.

[0028] Figure 8 This is a three-dimensional structural diagram of a second heat dissipation structure and a raised heat dissipation structure provided in an embodiment of this application.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1. Outer shell; 2. Contact cover; 3. Cooling structure; 4. PCBA motherboard; 5. First heat dissipation structure; 6. Second heat dissipation structure; 7. Left shell; 8. Right shell; 9. Temperature detection sensor; 10. First flexible thermal conductive material; 11. Second flexible thermal conductive material; 12. Battery; 13. Charging interface; 14. Interface soft rubber cover; 15. Raised heat dissipation structure. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0033] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0034] To address the technical problems in the prior art, this application provides a heat dissipation structure for a beauty device. By setting a first heat dissipation structure, the heat generated by the cooling structure is absorbed and dissipated, ensuring that the temperature of the cooling structure does not rise too high after working for a period of time. This guarantees the performance of the cooling structure, improves the product's battery life, avoids situations where the product cannot work for a short period of time and the cooling structure operates in a high-temperature environment for a long time, reduces the degree of component performance degradation, and helps to extend the product's service life.

[0035] Figure 1-8A heat dissipation structure for a beauty device provided in this application includes a housing 1, a contact cover 2, a cooling structure 3, a PCBA mainboard 4, at least one first heat dissipation structure 5, and at least one second heat dissipation structure 6. One end of the housing 1 is open. The contact cover 2 is connected to and seals the open structure of the housing 1, thus reducing the possibility of external dirt entering the housing 1. The housing 1 and the contact cover 2 form an accommodating space. Specifically, the housing 1 includes a left shell 7 and a right shell 8, which are detachably connected. The left shell 7, right shell 8, and contact cover 2 form the aforementioned accommodating space. The detachable connection of the left shell 7 and right shell 8 facilitates disassembly and installation. The cooling structure 3 is disposed within the accommodating space, and the PCBA mainboard 4 is fixedly disposed within the accommodating space. The PCBA mainboard 4 is protected from scratches and damage by being fixed within the accommodating space. The first heat dissipation structure 5 and the second heat dissipation structure 6 are also disposed within the accommodating space. The cooling structure 3 is attached to the contact cover 2, with the side closer to the contact cover 2 being the cold side and the side farther from the contact cover 2 being the hot side. The first heat dissipation structure 5 is connected to the hot side of the cooling structure 3, and the second heat dissipation structure 6 is connected to the PCBA motherboard 4. The cooling structure 3 is electrically connected to the PCBA motherboard 4. When working, the cooling structure 3 cools down on the cold side and transmits the heat through the contact cover 2, and heats up on the hot side and conducts the heat to the first heat dissipation structure 5. When working, the PCBA motherboard 4 conducts some of the heat generated to the second heat dissipation structure 6. The contact cover 2 is used for contact with the user's skin, and the cooling structure 3 can achieve the function of cooling the user's skin by cooling the contact cover 2.

[0036] The first heat dissipation structure 5 is designed to absorb and dissipate the heat generated by the cooling structure 3 during operation within the outer casing 1, and then through the outer casing 1 to the outside. This accelerates heat dissipation, preventing the temperature of the cooling structure 3 from becoming excessively high after a period of operation, thus ensuring the performance of the cooling structure 3. The specific number of the first heat dissipation structures 5 is not limited and can be set according to the specific dimensions of the product and its heat dissipation requirements.

[0037] The second heat dissipation structure 6 accelerates the dissipation of heat from the PCBA motherboard 4, preventing its temperature from rising excessively after a period of operation. This reduces component performance degradation and extends product lifespan. The first and second heat dissipation structures 5 and 6 prevent abnormally high temperatures in the cooling structure 3 and PCBA motherboard 4, avoiding component burnout, battery 12 combustion, or minor explosions, thus improving safety. The specific number of the second heat dissipation structures 6 is not limited and can be determined based on the product's dimensions and heat dissipation requirements. Preferably, the cooling structure 3 is a semiconductor cooling chip.

[0038] In this embodiment of the invention, the first heat dissipation structure 5 and the second heat dissipation structure 6 are integrally formed. This integrated structure facilitates installation, disassembly, and heat distribution. When the temperature in the first heat dissipation structure 5 is too high, heat can be conducted to the second heat dissipation structure 6, and vice versa, which helps improve heat dissipation efficiency. A separate design can also be adopted, depending on the product size, heat dissipation requirements, and procurement costs.

[0039] Preferably, the first heat dissipation structure 5 and the second heat dissipation structure 6 are made of aluminum alloy or magnesium alloy, which have the advantages of being lightweight and having excellent thermal conductivity. This effectively avoids the situation where the product becomes too heavy due to the design of the first heat dissipation structure 5 and the second heat dissipation structure 6, thus preventing users from straining their hands when holding the product. The volume of the first heat dissipation structure 5 and the second heat dissipation structure 6 is 11-30 cm³. 3 The specific size can be selected based on the heat dissipation requirements of the cooling structure 3 and the PCBA motherboard 4, as well as the actual dimensions of the product. When the volume of the first heat dissipation structure 5 and the second heat dissipation structure 6 is 20cm3, it has a small size and weight while having a good heat dissipation effect.

[0040] Please see Figure 4 The heat dissipation structure of this beauty device also includes a temperature detection sensor 9. The temperature detection sensor 9 is mounted on the PCBA motherboard 4 and positioned close to the second heat dissipation structure 6. The temperature detection sensor 9 is electrically connected to the PCBA motherboard 4. During operation, the temperature detection sensor 9 detects the temperature of the second heat dissipation structure 6 and sends a detection signal to the PCBA motherboard 4. The PCBA motherboard 4 has a temperature threshold. It converts the detection signal into an actual temperature value and compares it with the temperature threshold. When the actual temperature value exceeds the temperature threshold, the PCBA motherboard 4 shuts down and issues an alarm. The placement of the temperature detection sensor 9 ensures that when the temperature of the second heat dissipation structure 6 exceeds the temperature threshold, the PCBA motherboard 4 shuts down promptly and issues an alarm light, preventing the PCBA motherboard 4 from operating in a high-temperature environment. This ensures the performance of the PCBA motherboard 4, reduces component performance degradation, extends product lifespan, and reduces the possibility of the PCBA motherboard 4 being burned out due to high temperatures. Light and sound alarms can be emitted by connecting indicator lights and speakers to the PCBA motherboard 4.

[0041] Please see Figure 3A first flexible thermally conductive material 10 is disposed between the cooling structure 3 and the first heat dissipation structure 5. The first flexible thermally conductive material 10 is in close contact with the hot surface of the cooling structure 3 and the first heat dissipation structure 5. The provision of the first flexible thermally conductive material 10 can effectively eliminate the contact gap that occurs when the cooling structure 3 and the first heat dissipation structure 5 are connected, which is beneficial to increasing the heat conduction efficiency; please refer to Figure 7 A second flexible thermally conductive material 11 is disposed between the second heat dissipation structure 6 and the PCBA motherboard 4, and the second flexible thermally conductive material 11 is tightly attached to both the second heat dissipation structure 6 and the PCBA motherboard 4. The provision of the second flexible thermally conductive material 11 can effectively eliminate the contact gap between the second heat dissipation structure 6 and the PCBA motherboard 4, which is beneficial to increasing the heat conduction efficiency. The materials of the first flexible thermally conductive material 10 and the second flexible thermally conductive material 11 are thermally conductive silicone or thermally conductive grease.

[0042] Please see Figure 2 and Figure 5 The heat dissipation structure of this beauty device also includes a battery 12 and a charging interface 13. The battery 12 is fixedly disposed within the accommodating space, and the charging interface 13 is partially located within the accommodating space and partially exposed from the end of the outer shell 1 away from the contact cover 2. The battery 12 and the charging interface 13 are electrically connected to the PCBA mainboard 4. The placement of the battery 12 allows the product to be used without being connected to a power cord, making it convenient to use, easy to carry, and reducing the possibility of electric shock to the user. Preferably, the charging interface 13 is a Type-C interface.

[0043] Please see Figure 6 The heat dissipation structure of this beauty device also includes an interface soft rubber cover 14, which is detachably connected to and seals the charging interface 13. The interface soft rubber cover 14 ensures that the charging interface 13 is sealed when not in use, improving the overall sealing of the product and reducing the possibility of water or cosmetic liquid entering the product and contaminating or corroding internal components. The interface soft rubber cover 14 is preferably made of soft rubber.

[0044] Please see Figure 8 At least one raised heat dissipation structure 15 is provided on the side of the second heat dissipation structure 6 near the PCBA motherboard 4, and the raised heat dissipation structure 15 is connected to the PCBA motherboard 4. The provision of the raised heat dissipation structure 15 increases the contact area between the PCBA motherboard 4 and the heat dissipation structure, which is beneficial to improving the heat dissipation efficiency of the PCBA motherboard 4.

[0045] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0046] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0047] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0048] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0049] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0050] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0051] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Since these modifications and variations fall within the scope of the claims and their equivalents, this application also intends to include these modifications and variations.

[0052] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation structure for a beauty device, characterized in that: The device includes a housing, a contact cover, a cooling structure, and at least one first heat dissipation structure. One end of the housing is an open structure. The contact cover is connected to and seals the open structure of the housing. The housing and the contact cover form an accommodating space. The cooling structure is disposed within the accommodating space and attached to the contact cover. The side of the cooling structure near the contact cover is a cold surface, and the side away from the contact cover is a hot surface. The first heat dissipation structure is connected to the hot surface of the cooling structure. When the cooling structure is in operation, it cools down on the cold surface and transmits heat through the contact cover, and heats up on the hot surface and conducts heat to the first heat dissipation structure.

2. The heat dissipation structure of the beauty device according to claim 1, characterized in that: It also includes a PCBA motherboard, which is fixedly disposed within the accommodating space, and the cooling structure is electrically connected to the PCBA motherboard.

3. The heat dissipation structure of the beauty device according to claim 2, characterized in that: It also includes at least one second heat dissipation structure, which is connected to the PCBA motherboard, and the PCBA motherboard conducts some of the heat generated during operation to the second heat dissipation structure.

4. The heat dissipation structure of the beauty device according to claim 1, characterized in that: A first flexible thermally conductive material is provided between the cooling structure and the first heat dissipation structure, and the first flexible thermally conductive material is in close contact with the hot surface of the cooling structure and the first heat dissipation structure respectively.

5. The heat dissipation structure of the beauty device according to claim 3, characterized in that: A second flexible thermal conductive material is provided between the second heat dissipation structure and the PCBA motherboard, and the second flexible thermal conductive material is tightly attached to the second heat dissipation structure and the PCBA motherboard respectively.

6. The heat dissipation structure of the beauty device according to claim 3, characterized in that: It also includes a temperature detection sensor, which is disposed on the PCBA motherboard and close to the second heat dissipation structure. The temperature detection sensor is electrically connected to the PCBA motherboard. When working, the temperature detection sensor detects the temperature of the second heat dissipation structure and sends a detection signal to the PCBA motherboard. The PCBA motherboard is provided with a temperature threshold. The PCBA motherboard converts the detection signal into an actual temperature value and compares it with the temperature threshold. When the actual temperature value is greater than the temperature threshold, the PCBA motherboard shuts down and issues an alarm.

7. The heat dissipation structure of the beauty device according to claim 3, characterized in that: The first heat dissipation structure and the second heat dissipation structure are made of aluminum alloy or magnesium alloy.

8. The heat dissipation structure of the beauty device according to claim 3, characterized in that: The first heat dissipation structure and the second heat dissipation structure are either integrally formed or separately designed.

9. The heat dissipation structure of the beauty device according to claim 1, characterized in that: The outer casing includes a left shell and a right shell, the left shell and the right shell are detachably connected, and the left shell, the right shell and the contact cover form the accommodating space.

10. The heat dissipation structure of the beauty device according to claim 2, characterized in that: It also includes a battery and a charging interface. The battery is fixedly disposed in the accommodating space, and the charging interface is partially located in the accommodating space and partially exposed from the outer shell end away from the contact cover. The battery and the charging interface are electrically connected to the PCBA motherboard.

11. The heat dissipation structure of the beauty device according to claim 3, characterized in that: At least one raised heat dissipation structure is provided on the side of the second heat dissipation structure close to the PCBA motherboard, and the raised heat dissipation structure is connected to the PCBA motherboard.

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