Inverter and electrical apparatus

Abstract

The utility model provides an inverter and electrical equipment, the inverter comprises a box body, a heat dissipation assembly and a heating assembly, the box body comprises a sealing cavity and a ventilation cavity, the inner wall of the box body encloses to form the sealing cavity, the sealing cavity encloses at least the peripheral side of the ventilation cavity, and the ventilation cavity is communicated with the outer side of the box body; the heat dissipation assembly comprises a first heat dissipation piece, the first heat dissipation piece is arranged on the box body, the first heat dissipation piece is provided with a ventilation channel, and the ventilation channel communicates with the ventilation cavity; the heating assembly comprises a first heating component, and the first heating component is arranged on the first heat dissipation piece and located in the sealing cavity. According to the technical scheme, the heat dissipation effect is good, and the service life of the inverter can be prolonged.

Description

Technical Field

[0001] This application relates to the field of electrical equipment technology, specifically to an inverter and electrical equipment. Background Technology

[0002] With the development of energy storage technology, energy storage systems are being used more and more widely. Inverters are a key component in energy storage systems, and they are devices that convert batteries into alternating current.

[0003] In conceiving and implementing this application, the applicant discovered at least the following problems: the inverter enclosure is open, with ventilation holes for heat dissipation. The circuit board assembly and heat sink are both placed inside the enclosure, with heat-generating components placed on the heat sink. Because the enclosure is open, moisture, dust, insects, etc., in the air can enter through the ventilation holes, causing the circuit board assembly to be covered and corroded by dust, insects, etc., easily leading to circuit board assembly failure, and consequently resulting in a relatively short inverter lifespan.

[0004] The preceding description is intended to provide general background information and does not necessarily constitute prior art. Utility Model Content

[0005] To address the aforementioned technical problems, this application provides an inverter and electrical equipment with good heat dissipation, which can improve the inverter's lifespan. To solve the above technical problems, this application provides an inverter, comprising:

[0006] The enclosure includes a sealed cavity and a ventilation cavity. The inner wall of the enclosure forms the sealed cavity, which surrounds at least the periphery of the ventilation cavity. The ventilation cavity is connected to the outer side of the enclosure.

[0007] The heat dissipation assembly includes a first heat dissipation component, which is disposed on the housing and has a ventilation channel connected to a ventilation cavity.

[0008] The heating component includes a first heating element, which is disposed on a first heat sink and located within a sealed cavity.

[0009] Optionally, the enclosure includes a first sidewall and a second sidewall.

[0010] Optionally, the first sidewall and the second sidewall are spaced apart along the first direction.

[0011] Optionally, a first ventilation hole is provided on the first side wall.

[0012] Optionally, a second ventilation hole may be provided on the second side wall.

[0013] Optionally, the two opposite ends of the ventilation cavity are connected to the first ventilation hole and the second ventilation hole, respectively.

[0014] Optionally, the first port of the first heat sink is connected to the first ventilation hole.

[0015] Optionally, the second port of the first heat sink is connected to the second ventilation hole.

[0016] Optionally, the first port and the second port are two ports of the ventilation duct.

[0017] Optionally, the enclosure includes a lower enclosure and an upper cover, with the upper cover covering the lower enclosure.

[0018] Optionally, the first heat sink is disposed inside the housing, and the upper cover, lower housing, and the first heat sink form a sealed cavity.

[0019] Optionally, the first heat dissipation component is a heat sink.

[0020] Optionally, the inverter also includes a circuit board.

[0021] Optionally, the circuit board is disposed on the housing and located within the sealed cavity.

[0022] Optionally, the inverter also includes an insulating component.

[0023] Optionally, the insulating element is disposed between the first heat sink and the circuit board.

[0024] Optionally, the first heat sink has a housing.

[0025] Optionally, the housing surrounds the ventilation channel.

[0026] Optionally, the first heat sink has an opening.

[0027] Optionally, the circuit board is sealed in the opening and forms the ventilation channel.

[0028] Optionally, the heat dissipation assembly may also include a second heat sink.

[0029] Optionally, the second heat sink is disposed on the first heat sink and located inside the ventilation cavity.

[0030] Optionally, the second heat sink has an air inlet and an air outlet.

[0031] Optionally, the air inlet is connected to the first ventilation hole.

[0032] Optionally, the air outlet is connected to the port of the first heat sink.

[0033] Alternatively, the second heat sink can be a fan.

[0034] Optionally, the inverter also includes a first sealing ring.

[0035] Optionally, the first sealing ring is disposed between the first heat sink and the second heat sink.

[0036] Optionally, the inverter may also include a first protective grid and a second protective grid.

[0037] Optionally, a first protective net is installed on the first side wall and covers the first ventilation hole.

[0038] Optionally, a second protective net is installed on the second side wall and covers the second ventilation hole.

[0039] Optionally, the inverter also includes a second sealing ring and a third sealing ring.

[0040] Optionally, a second sealing ring is disposed between the first protective net and the first sidewall.

[0041] Optionally, a third sealing ring is disposed between the second protective net and the second sidewall.

[0042] This application also provides an electrical device including any of the inverters described above.

[0043] As described above, the inverter and electrical equipment provided in this application include the aforementioned inverter; the inverter includes a housing, the housing having a sealed cavity and a ventilation cavity, the inner wall of the housing forming the sealed cavity, the sealed cavity surrounding at least the periphery of the ventilation cavity, and the ventilation cavity communicating with the outer side of the housing; a heat dissipation assembly including a first heat dissipation element disposed on the housing, the first heat dissipation element having a ventilation channel communicating with the ventilation cavity; and a heat generation assembly including a first heat generation component disposed on the first heat dissipation element and located within the sealed cavity.

[0044] The technical solution of this application forms a sealed cavity on the housing, which prevents the circuit board and heating components located in the sealed cavity from being damaged by dust, moisture and other external factors; and / or, the ventilation cavity is set up so that the ventilation channel of the first heat sink is connected to the ventilation cavity, which can effectively conduct heat from the first heating component in the sealed cavity to the first heat sink and then to the external environment, thereby enhancing air circulation, improving heat dissipation efficiency, and / or reducing heat dissipation cost. Attached Figure Description

[0045] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0046] Figure 1This is an exploded view from a first perspective of an inverter according to an embodiment of this application;

[0047] Figure 2 This is an exploded view from a second perspective of an inverter according to an embodiment of this application;

[0048] Figure 3 for Figure 2 A sectional view of AA';

[0049] Figure 4 This is an assembly diagram of the circuit board and heat dissipation components in an inverter according to an embodiment of this application;

[0050] Figure 5 This is an exploded view of the circuit board and heat dissipation components in an inverter according to an embodiment of this application;

[0051] Figure 6 An exploded view from a first perspective of another inverter in an embodiment of this application;

[0052] Figure 7 This is an exploded view of the circuit board and heat dissipation components in another inverter according to an embodiment of this application;

[0053] Figure 8 This is a schematic diagram of the casing of another inverter in the embodiments of this application.

[0054] Label Explanation:

[0055] 100 - Inverter; 110 - Cabinet; 101 - Partition; 111 - First side wall; 1111 - First ventilation hole; 112 - Second side wall; 1121 - Second ventilation hole; 113 - Sealed cavity; 114 - Ventilation cavity; 115 - Lower cabinet; 116 - Top cover;

[0056] 120 - Circuit board;

[0057] 130 - Heat dissipation component; 131 - First heat sink; 1311 - Housing; 132 - Second heat sink;

[0058] 140 - Heating component; 141 - First heating element; 142 - Second heating element;

[0059] 150 - First sealing ring; 160 - Second sealing ring; 170 - Third sealing ring; 180 - First protective net; 190 - Second protective net; 200 - Insulating component.

[0060] The realization of the objectives, functional features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. The accompanying drawings have illustrated specific embodiments of this application, which will be described in more detail below. These drawings and textual descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this application to those skilled in the art through reference to specific embodiments. Detailed Implementation

[0061] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0062] Optionally, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Optionally, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which needs to be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.

[0063] It should be understood that in the description of this application, terms such as "inner" and "outer" indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. This is merely for the convenience of description and does not indicate or imply that the device or component must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.

[0064] And / or, optionally, in the description of this application, unless otherwise expressly specified and limited, the terms "connected" or "linked" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0065] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0066] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0067] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0068] In some designs, the inverter enclosure is open, with ventilation holes for heat dissipation. The circuit board components and heat sink are all housed inside the enclosure, with heat-generating components placed on the heat sink. Because the enclosure is open, moisture, dust, insects, and other pollutants in the air can enter through the ventilation holes, causing the circuit board components to become covered and corroded, easily leading to circuit board component failure and consequently a shorter inverter lifespan.

[0069] Therefore, the inverter provided in this application, by forming a sealed cavity on the casing, can prevent the circuit board and heat-generating components located in the sealed cavity from being damaged by dust, moisture, etc. in the external environment; and / or, the setting of the ventilation cavity, with the ventilation channel of the first heat sink connected to the ventilation cavity, can effectively conduct heat from the first heat-generating component in the sealed cavity to the first heat sink, and then to the external environment, thereby enhancing air circulation, improving heat dissipation efficiency, and / or reducing heat dissipation costs.

[0070] First Embodiment

[0071] Figure 1 This is an exploded view from a first perspective of an inverter according to an embodiment of this application. Figure 2 This is an exploded view from a second perspective of an inverter according to an embodiment of this application. Figure 3 for Figure 2 A sectional view of AA'.

[0072] like Figures 1 to 3 As shown, this application embodiment provides an inverter 100, including:

[0073] The box 110 has a sealed cavity 113 and a ventilation cavity 114. The inner wall of the box 110 forms the sealed cavity 113, and the sealed cavity 113 surrounds at least the periphery of the ventilation cavity 114. The ventilation cavity 114 is connected to the outside of the box 110.

[0074] The heat dissipation assembly 130 includes a first heat dissipation component 131, which is disposed on the housing 110 and has a ventilation channel connected to the ventilation cavity 114.

[0075] The heating component 140 includes a first heating element 141, which is disposed on the first heat sink 131 and located inside the sealed cavity 113.

[0076] It should be noted that the inverter 100 is a power electronic device used to obtain direct current (DC) from batteries or solar panels and convert it into alternating current (AC). It is an indispensable key component in modern energy systems and is widely used in solar power generation, electric vehicles, uninterruptible power supplies (UPS), and home appliances.

[0077] Optionally, the inverter 100 also includes a circuit board 120, which is disposed on the housing 110 and located within the sealed cavity 113.

[0078] Optionally, the enclosure 110 has a sealed cavity 113 and a ventilation cavity 114. With this configuration, when the inverter 100 is used in an outdoor environment, facing the harsh outdoor climate, the sealed cavity 113 inside the inverter 100 can have waterproof, dustproof, and corrosion-resistant properties. This allows the circuit board 120 and the heating element 140 inside the sealed cavity 113 to have a dry and clean working environment, so that the circuit board 120 and the heating element 140 can work normally, improving the reliability of the circuit board 120 and the heating element 140, and / or extending the service life of the inverter 100.

[0079] The circuit board 120 and the heat-generating components are placed inside the sealed cavity 113, which prevents dust, moisture and other external factors from damaging the circuit board 120 and the components, thereby improving the reliability and service life of the inverter 100.

[0080] The presence of the ventilation cavity 114 allows for smoother airflow, reducing noise caused by air resistance and helping to lower the noise level of the inverter 100 during operation. By surrounding the ventilation cavity 114 with the sealed cavity 113, the inverter 100 maintains good heat dissipation performance while having a more compact overall structure, which helps save installation space.

[0081] This design facilitates the maintenance and upgrade of the inverter 100. Users can replace or upgrade heat-generating components or heat dissipation components 130 as needed without making large-scale modifications to the entire system.

[0082] Optionally, the sealed cavity 113 is a closed space, and the circuit board 120 is placed in the closed space to reduce the contact between the circuit board 120 and the outside air, thereby achieving the functions of dust prevention and moisture prevention and extending the working life of the circuit board 120.

[0083] The ventilation cavity 114 is connected to the outside. The first heating element 141 is in close contact with the first heat sink 131. When the first heating element 141 generates heat during operation, the heat is carried away by the first heat sink 131. Since the first heat sink 131 has a ventilation channel that can be connected to the ventilation cavity 114, when the airflow enters the ventilation cavity 114, it can also enter the ventilation channel, and the heat transferred to the first heat sink 131 can be carried away by the airflow.

[0084] Optionally, the box 110 can be a regular three-dimensional structure, or the box 110 can be a cubic structure, while the sealing cavity 113 and the ventilation cavity 114 can have a similar structure to the cube, so that the box 110 as a whole forms a thin-walled structure to improve its space utilization.

[0085] With the above-mentioned configuration, that is, by forming a sealed cavity 113 on the housing 110, the circuit board 120 and the heating component 140 located in the sealed cavity 113 can be protected from dust, moisture and other external environmental factors from damaging the circuit board 120 and the components. The ventilation cavity 114 is configured such that the ventilation channel of the first heat sink 131 is connected to the ventilation cavity 114, which can effectively conduct heat from the first heating component 141 in the sealed cavity 113 to the first heat sink 131, and then to the external environment, thereby enhancing air circulation, improving heat dissipation efficiency, and / or reducing heat dissipation costs.

[0086] Optionally, the heat dissipation assembly 130 also includes a second heat-generating element 142, which is located within the ventilation channel.

[0087] By placing the second heat-generating component 142 inside the ventilation channel, the heat distribution inside the inverter 100 is more uniform, avoiding local overheating and improving the overall system's thermal management capability.

[0088] Optionally, the second heat-generating component 142 is located directly within the ventilation channel, enabling it to dissipate the generated heat to the external environment more quickly. The airflow in the ventilation channel can directly carry away the heat generated by the second heat-generating component 142, improving heat dissipation efficiency. Because the heat from the second heat-generating component 142 can be quickly carried away by the airflow in the ventilation channel, the temperature fluctuation of the system is reduced, thereby improving the stability and reliability of the inverter 100.

[0089] This design allows for the flexible arrangement of multiple heat-generating components within the ventilation channels, facilitating optimized thermal management configurations to meet specific application requirements. Through effective heat conduction and dissipation, the overall temperature of the inverter 100 is reduced, thereby extending the lifespan of electronic components and minimizing the risk of failure due to overheating. Figure 4 This is an assembly diagram of the circuit board and heat dissipation components in an inverter according to an embodiment of this application. Figure 5 This is an exploded view of the circuit board and heat dissipation components in an inverter according to an embodiment of this application.

[0090] like Figures 1 to 5 As shown, optionally, the housing 110 includes a first sidewall 111 and a second sidewall 112, the first sidewall 111 and the second sidewall 112 are spaced apart along a first direction; a first ventilation hole 1111 is opened on the first sidewall 111, a second ventilation hole 1121 is opened on the second sidewall 112, and the opposite ends of the ventilation cavity 114 are respectively connected to the first ventilation hole 1111 and the second ventilation hole 1121.

[0091] Optionally, the arrangement of the first ventilation hole 1111 and the second ventilation hole 1121 allows air to enter the ventilation cavity 114 from one side wall and exit from the other side wall, forming an effective airflow path. This design ensures that the air inside the ventilation cavity 114 can flow continuously, enhancing the heat dissipation effect.

[0092] By providing a first ventilation hole 1111 and a second ventilation hole 1121 on the first sidewall 111 and the second sidewall 112 respectively, hot air can be quickly carried out of the housing 110, while cold air can be promptly replenished, forming an efficient heat exchange system that helps maintain the temperature stability inside the inverter 100. Through effective ventilation design, temperature fluctuations inside the inverter 100 are reduced, thereby improving the reliability and lifespan of electronic components and reducing the probability of failures due to overheating.

[0093] Since the two ends of the ventilation cavity 114 are connected to the outside, hot air is less likely to accumulate in the housing 110, thereby reducing the risk of local overheating and improving the system's thermal management capability.

[0094] Optionally, the first direction can be the length direction of the box 110, the width direction of the box 110, or the height direction of the box 110.

[0095] Optionally, the first ventilation hole 1111 can be in any shape, such as square, elliptical, trapezoidal, etc. This embodiment does not impose any specific restrictions on this.

[0096] Optionally, the second ventilation hole 1121 can be in any shape, such as square, elliptical, trapezoidal, etc. This embodiment does not impose any specific restrictions on this.

[0097] Optionally, the first port of the first heat sink 131 is connected to the first ventilation hole 1111, and the second port of the first heat sink 131 is connected to the second ventilation hole 1121.

[0098] Optionally, the first port and the second port are two ports of the ventilation duct.

[0099] By directly connecting the first port of the first heat sink 131 to the first ventilation hole 1111 of the housing 110, and directly connecting the second port of the first heat sink 131 to the second ventilation hole 1121 of the housing 110, a straight airflow path is formed, allowing air to enter directly from the first ventilation hole 1111, pass through the ventilation channel of the first heat sink 131, and be discharged from the second ventilation hole 1121, forming efficient air convection.

[0100] Due to the straight-through nature of the airflow path, air can pass through the ventilation channel of the first heat sink 131 more quickly, carrying away more heat, improving heat dissipation efficiency, and helping to maintain the internal temperature of the inverter 100 within the ideal range.

[0101] Optionally, the design of the first heat sink 131 allows heat to be transferred more directly to the flowing air, reducing thermal resistance, improving heat conduction efficiency, reducing temperature fluctuations inside the inverter 100, making the system operation more stable, and extending the service life of electronic components.

[0102] Optionally, the first port and the second port are arranged opposite each other, and their sizes can also be matched. The first port and the second port are the same size, which can ensure rapid airflow.

[0103] like Figures 1 to 5 As shown, optionally, the housing 110 includes a lower housing 115 and an upper cover 116. The upper cover 116 covers the lower housing 115, and the first heat sink 131 is disposed inside the housing 110. The upper cover 116, the lower housing 115 and the first heat sink 131 form a sealed cavity 113.

[0104] Optionally, the combination of the upper cover 116 and the lower housing 115 forms a closed structure, which, together with the first heat sink 131, forms a sealed cavity 113. This effectively prevents dust, moisture, and other contaminants from the external environment from entering, protecting the internal circuit board 120 and components, and improving the reliability of the system.

[0105] Optionally, the first heat sink 131 is disposed inside the sealed cavity 113, which can effectively conduct the heat generated by the heat-generating components to the outside of the housing 110. The design of the sealed cavity 113 ensures the effective transfer of heat inside and exhausts it through the ventilation channel.

[0106] Optionally, the design of the upper cover 116 and the lower housing 115 provides a robust structure capable of withstanding external mechanical shocks and vibrations, protecting the internal components. Optionally, the upper cover 116 can be easily removed from the lower housing 115 for easy inspection, maintenance, or replacement of the internal components.

[0107] Figure 6 This is a first-view exploded view of another inverter in an embodiment of this application. Figure 7 This is an exploded view of the circuit board and heat dissipation components in another inverter according to an embodiment of this application.

[0108] like Figures 1 to 7 As shown, optionally, the heat dissipation assembly 130 further includes a second heat dissipation component 132, which is disposed on the first heat dissipation component 131 and located in the ventilation cavity 114; the second heat dissipation component 132 has an air inlet and an air outlet, the air inlet is connected to the first ventilation hole 1111, and the air outlet is connected to the port of the first heat dissipation component 131.

[0109] By providing a second heat sink 132 on the first heat sink 131, a dual heat dissipation mechanism is formed. The dual heat dissipation design and optimized airflow path help maintain the temperature stability inside the inverter 100, reduce temperature fluctuations, and improve the stability and reliability of the system. The second heat sink 132 is located inside the ventilation cavity 114 and can directly exchange heat with the outside air, further enhancing the overall heat dissipation capacity.

[0110] Optionally, the second heat sink 132 has an air inlet and an air outlet. The air inlet is connected to the first ventilation hole 1111, and the air outlet is connected to the port of the first heat sink 131, forming an optimized airflow path to ensure that air can flow effectively through the second heat sink 132 and the first heat sink 131, carrying away more heat.

[0111] By connecting the air outlet of the second heat sink 132 to the port of the first heat sink 131, hot air can be discharged from the first heat sink 131 more effectively, reducing the accumulation of heat inside the system and improving heat dissipation efficiency.

[0112] Optionally, the first heat sink 131 may include other heat exchangers such as an evaporator, thereby ensuring that the air that has absorbed heat returns to the first heat sink 131 for rapid cooling, which is highly feasible.

[0113] Optionally, the second heat sink 132 may include a fan installed in the circulating air duct, which can accelerate the flow of gas in the circulating air duct.

[0114] Optionally, the first heat sink 131 can cool the air passing through the first heat sink 131 and the surrounding air, and the second heat sink 132 is used to drive the air and make the cooled air flow and circulate along the circulating air duct, thereby exchanging heat and cooling the heating component 140 to achieve the cooling effect, which can prevent the heating component 140 from being damaged due to excessive heat and thus reduce its service life.

[0115] Optionally, in the circulating air duct, the airflow driven by the second heat sink 132 flows, and the low-temperature air that has been cooled by heat exchange with the first heat sink 131 is blown into the installation space of the heating element 140 through the second heat sink 132, directly acting on the heating element 140 for heat dissipation and cooling. The air that has absorbed heat flows back to the area around the first heat sink 131 so that the first heat sink 131 can cool it down again, thus completing the internal cooling airflow circulation in the circulating air duct.

[0116] Optionally, the first heat sink 131 is a heat sink. Optionally, the first heat sink 131 is typically made of a high thermal conductivity material, such as aluminum or copper, which can quickly conduct heat, thereby effectively transferring the heat generated by the heat-generating components to the surface of the heat sink.

[0117] Alternatively, radiators are typically designed with multiple cooling fins, which significantly increase the surface area in contact with the air, thereby improving heat dissipation efficiency. By increasing the heat dissipation area, radiators can more effectively dissipate heat into the surrounding environment.

[0118] With the design of ventilation cavity 114, air can flow between the fins of the radiator, forming forced convection.

[0119] Optionally, the second heat sink 132 is a fan. Optionally, as a fan, the second heat sink 132 can actively drive airflow, increase the airflow through the heat sink, significantly improve heat dissipation efficiency, and ensure that heat can be quickly removed from the heat sink surface.

[0120] Alternatively, the fan enhances convective cooling by accelerating airflow, reducing the buildup of hot air around the heatsink. This reduces the temperature of the heatsink and heat-generating components in a shorter time.

[0121] Optionally, the fan speed can be adjusted according to the internal temperature of the inverter 100 to achieve dynamic temperature control, which helps to maintain the temperature stability of the system under different load conditions and improve the reliability and lifespan of the system.

[0122] Optionally, the inverter 100 also includes an insulator 200 disposed between the first heat sink 131 and the circuit board 120.

[0123] Optionally, the insulating element 200 provides effective electrical isolation, preventing electrical contact between the first heat sink 131 and the circuit board 120. This isolation is crucial for preventing short circuits and other electrical faults, ensuring the safe operation of the system.

[0124] Alternatively, while the insulator 200 is primarily used for electrical isolation, modern insulating materials typically possess good thermal conductivity, enabling them to provide electrical isolation without compromising heat dissipation efficiency. This design ensures that the heat sink can still effectively conduct heat away from the heat-generating components on the circuit board 120.

[0125] Optionally, the insulation component 200 is typically made of materials that are resistant to high temperatures and chemical corrosion, enabling it to maintain stable performance under various environmental conditions and adapt to a variety of application scenarios for the inverter 100.

[0126] Optionally, the thickness and material of the insulation element 200 can be selected according to specific electrical and thermal management requirements, providing design flexibility to meet different application requirements.

[0127] Optionally, the inverter 100 further includes a first sealing ring 150, which is disposed between the first heat sink 131 and the second heat sink 132.

[0128] The first sealing ring 150 provides an effective seal, preventing air, dust, and moisture from seeping into the gap between the first heatsink 131 and the second heatsink 132. The use of the first sealing ring 150 ensures that the airflow generated by the fan is concentrated through the heatsink fins, rather than leaking out from the gaps. The sealing ring also acts as a shock absorber, reducing vibration and noise generated during fan operation and improving the system's quietness.

[0129] Alternatively, the sealing ring is typically made of a high-temperature resistant and corrosion-resistant elastic material, which can maintain its sealing performance during long-term use and adapt to various operating environments of the inverter 100.

[0130] Optionally, the first heat sink 131 has a housing 1311 that forms a ventilation channel.

[0131] The ventilation channel enclosed by the housing 1311 provides a clear path for airflow, allowing air to pass effectively through the heat sink. This design ensures the directionality and concentration of airflow, improving heat dissipation efficiency. The housing 1311 not only encloses the ventilation channel but also provides physical protection for the internal heat dissipation structure, preventing dust, moisture, and other contaminants from the external environment from entering and protecting the internal components.

[0132] Optionally, a ventilation channel can be formed using the outer casing 1311 of the first heat sink 131, which can also be a ventilation cavity 114.

[0133] Optionally, the first heat sink 131 has an opening, and the circuit board 120 is sealed in the opening to form a ventilation channel.

[0134] By sealing the circuit board 120 at the opening of the first heat sink 131, an integrated structure is formed. This design reduces the complexity of connections between components, improving the system's compactness and reliability. The circuit board 120's direct contact with the first heat sink 131 facilitates rapid heat conduction, allowing heat on the circuit board 120 to be quickly transferred to the heat sink and carried away, reducing the risk of heat buildup. The ventilation channel formed by the circuit board 120 and the first heat sink 131 provides a clear path for airflow, enabling air to effectively flow through the circuit board 120 and the heat sink, carrying away heat. This optimized heat dissipation path improves the system's heat dissipation efficiency. The circuit board 120, sealed at the opening and protected by the first heat sink 131, reduces the impact of the external environment on the circuit board 120, such as the intrusion of dust and moisture, thereby improving the safety and lifespan of the circuit board 120.

[0135] Figure 8 This is a schematic diagram of the casing structure of another inverter according to an embodiment of this application. Figure 8 As shown, optionally, in order to improve installation strength, multiple partitions 101 can be added to form a ventilation cavity 114.

[0136] Optionally, at least two partitions 101 are provided inside the housing 110, and the at least two partitions 101 are connected to form a ventilation cavity 114, and the first heat sink 131 is provided on the partition 101.

[0137] The ventilation cavity 114 enclosed by the partition 101 provides a clear path for airflow, allowing cool air to flow effectively through the first heat sink 131, enhancing convective heat dissipation. This design ensures maximum heat dissipation efficiency. The partition 101 helps isolate heat sources from other sensitive components, preventing disorderly heat diffusion within the housing 110, thereby improving overall thermal management. The partition 101 provides additional structural support, allowing the first heat sink 131 to be securely mounted within the housing 110, reducing displacement or damage due to vibration or impact.

[0138] Optionally, a sealed cavity 113 is formed between the inner wall of the enclosure 110 and the partition 101. The sealed cavity 113 provides a closed space that effectively isolates dust, moisture and other contaminants from the external environment, protects internal components from these factors, and improves the reliability and lifespan of the system.

[0139] Optionally, considering the overall strength and aesthetics of the partition 101, at least two partitions 101 should extend in the same direction to ensure the overall consistency of the structure.

[0140] Optionally, the shape and size of at least two partitions 101 can be set according to the shape and size of the housing 110.

[0141] Optionally, the partition 101 and the box 110 can be connected by a fixed or detachable method, or by other methods, as long as the purpose of this embodiment can be achieved. Therefore, the connection method between the partition 101 and the box 110 is not limited.

[0142] Optionally, there are at least two first heating elements 141, and the two first heating elements 141 are disposed at intervals along the first direction on the first heat sink 131.

[0143] By arranging multiple first heat-generating components 141 at intervals along a first direction, the heat distribution on the first heat sink 131 is more uniform, helping to avoid localized overheating and improve heat dissipation efficiency. The interval arrangement of the first heat-generating components 141 allows air to flow more easily through the gaps between each component, enhancing convective heat dissipation. Through optimized thermal management, the operating temperature of the heat-generating components is reduced, decreasing the risk of failure due to overheating and extending the service life of the components.

[0144] Optionally, the first heat-generating element 141 is disposed on the first heat sink 131 by means of thermally conductive adhesive or thermally conductive sheet.

[0145] like Figures 1 to 7As shown, optionally, the inverter 100 further includes a first protective net 180 and a second protective net 190; the first protective net 180 is disposed on the first side wall 111 and covers the first ventilation hole 1111, and the second protective net 190 is disposed on the second side wall 112 and covers the second ventilation hole 1121.

[0146] The design of the first protective net 180 and the second protective net 190 not only prevents foreign objects from entering, but also maintains good ventilation, ensuring that airflow is not significantly obstructed, thereby maintaining good heat dissipation.

[0147] Optionally, a first protective mesh 180 covers the first ventilation hole 1111, and a second protective mesh 190 covers the second ventilation hole 1121, effectively preventing external foreign objects, dust, and insects from entering the inverter 100. This protective function helps protect internal components and reduces the risk of failure caused by foreign objects entering.

[0148] The first protective mesh 180 and the second protective mesh 190 typically take ventilation efficiency into account, with appropriately sized mesh openings. They provide protection while preventing foreign objects from entering, improving system reliability and reducing maintenance needs and downtime. The first protective mesh 180 and the second protective mesh 190 also prevent users or maintenance personnel from accidentally contacting internal electrical components during operation, increasing operational safety. This results in a cleaner and more aesthetically pleasing appearance for the inverter 100, while also providing additional mechanical protection for the equipment.

[0149] Optionally, the inverter 100 further includes a second sealing ring 160 and a third sealing ring 170; the second sealing ring 160 is disposed between the first protective net 180 and the first side wall 111, and the third sealing ring 170 is disposed between the second protective net 190 and the second side wall 112.

[0150] The second sealing ring 160 and the third sealing ring 170 provide additional sealing protection to prevent air, dust and moisture from entering the inverter 100 through the gap between the protective mesh and the side wall, helping to protect the internal components from environmental influences.

[0151] Through effective sealing and protection, the second sealing ring 160 and the third sealing ring 170 help extend the service life of the internal components of the inverter 100, reduce wear and failure caused by environmental factors, and improve the reliability of the entire inverter 100 system.

[0152] Optionally, the second sealing ring 160 and the third sealing ring 170 are typically made of a high-temperature resistant and corrosion-resistant elastic material, which can maintain their sealing performance during long-term use and adapt to various operating environments of the inverter 100.

[0153] The inverter provided in this application includes a housing with a sealed cavity and a ventilation cavity. The inner wall of the housing forms the sealed cavity, which surrounds at least the periphery of the ventilation cavity, and the ventilation cavity is connected to the outside of the housing. A circuit board is disposed on the housing and located within the sealed cavity. A heat dissipation assembly includes a first heat sink disposed on the housing and having a ventilation channel connected to the ventilation cavity. A heat generation assembly includes a first heat generation element disposed on the first heat sink and located within the sealed cavity.

[0154] By forming a sealed cavity on the enclosure, the circuit board and heat-generating components located within the sealed cavity can be protected from damage caused by dust, moisture, etc. in the external environment; and / or, the ventilation cavity, with the ventilation channel of the first heat sink connected to the ventilation cavity, can effectively conduct heat from the first heat-generating component in the sealed cavity to the first heat sink, and then to the external environment, enhancing air circulation, improving heat dissipation efficiency, and / or reducing heat dissipation costs.

[0155] Second Embodiment

[0156] This application also provides an electrical device, including the inverter 100 described in the above embodiments.

[0157] The structure and function of the inverter 100 provided in this application embodiment can be referred to the above embodiments, and will not be repeated here.

[0158] It is understood that the above scenarios are merely examples and do not constitute a limitation on the application scenarios of the technical solutions provided in the embodiments of this application. The technical solutions of this application can also be applied to other scenarios. For example, as those skilled in the art will know, with the evolution of system architecture and the emergence of new business scenarios, the technical solutions provided in the embodiments of this application are also applicable to similar technical problems.

[0159] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0160] The units in the device of this application embodiment can be merged, divided, and deleted according to actual needs.

[0161] In this application, the same or similar terms, concepts, technical solutions and / or application scenario descriptions are generally described in detail only when they appear for the first time. When they appear again, they are generally not repeated for the sake of brevity. When understanding the technical solutions and other contents of this application, the same or similar terms, concepts, technical solutions and / or application scenario descriptions that are not described in detail later can be referred to their previous relevant detailed descriptions.

[0162] In this application, the descriptions of the various embodiments have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0163] The technical features of the present application can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of the present application.

[0164] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An inverter, characterized in that, include: The enclosure includes a sealed cavity and a ventilation cavity, the inner wall of the enclosure forming the sealed cavity, the sealed cavity surrounding at least the periphery of the ventilation cavity, and the ventilation cavity communicating with the outer side of the enclosure; A heat dissipation assembly includes a first heat dissipation component, which is disposed on the housing and has a ventilation channel connected to the ventilation cavity. The heating component includes a first heating element, which is disposed on the first heat sink and located within the sealed cavity.

2. The inverter according to claim 1, characterized in that, The enclosure includes a first sidewall and a second sidewall, which are spaced apart along a first direction. A first ventilation hole is formed on the first sidewall, and a second ventilation hole is formed on the second sidewall. The two opposite ends of the ventilation cavity are respectively connected to the first ventilation hole and the second ventilation hole.

3. The inverter according to claim 2, characterized in that, The first port of the first heat sink is connected to the first ventilation hole, and the second port of the first heat sink is connected to the second ventilation hole; The first port and the second port are two ports of the ventilation channel.

4. The inverter according to claim 2, characterized in that, The enclosure includes a lower enclosure and an upper cover. The upper cover is disposed on the lower enclosure. The first heat sink is disposed inside the enclosure. The upper cover, the lower enclosure, and the first heat sink form the sealed cavity.

5. The inverter according to claim 2, characterized in that, It also includes at least one of the following: The first heat dissipation component is a heat sink; The inverter also includes a circuit board, which is disposed on the housing and located inside the sealed cavity; The inverter also includes an insulating component disposed between the first heat sink and the circuit board; The first heat sink has a housing that encloses the ventilation channel; The first heat sink has an opening, and the circuit board seals the opening and forms the ventilation channel.

6. The inverter according to any one of claims 2 to 5, characterized in that, The heat dissipation assembly further includes a second heat dissipation component, which is disposed on the first heat dissipation component and located inside the ventilation cavity.

7. The inverter according to claim 6, characterized in that, It also includes at least one of the following: The second heat dissipation component is a fan; The inverter also includes a first sealing ring, which is disposed between the first heat sink and the second heat sink. The second heat sink includes an air inlet and an air outlet. The air inlet is connected to the first ventilation hole, and the air outlet is connected to the port of the first heat sink.

8. The inverter according to any one of claims 2 to 5, characterized in that, The inverter also includes a first protective grid and a second protective grid; The first protective net is installed on the first side wall and covers the first ventilation hole, and the second protective net is installed on the second side wall and covers the second ventilation hole.

9. The inverter according to claim 8, characterized in that, The inverter also includes a second sealing ring and a third sealing ring; The second sealing ring is disposed between the first protective net and the first side wall, and the third sealing ring is disposed between the second protective net and the second side wall.

10. An electrical device, characterized in that, Including the inverter as described in any one of claims 1 to 9.

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