Miniature thermoelectric power generation chip packaging structure

Abstract

The utility model relates to the technical field of chip packaging equipment, in particular to a miniature thermoelectric power generation chip packaging structure which comprises a base, a stand column and a cross beam, the stand column is vertically assembled on one side of the base, the cross beam is horizontally assembled on the top of the stand column, an XY-axis moving mechanism is arranged on the base, and a rotating mechanism is arranged on the XY-axis moving mechanism. The rotating mechanism is provided with a mold for placing a heat conducting plate, the XY-axis moving mechanism is used for driving the mold to horizontally move along an X axis or a Y axis, the rotating mechanism is used for driving the mold to horizontally rotate, a lifting mechanism is arranged at the bottom of the cross beam, an electric heating plate is arranged at the bottom of the lifting mechanism, and the lifting mechanism is used for driving the electric heating plate to be close to or away from the mold. And a heat dissipation mechanism is also arranged on the cross beam and / or the base. According to the packaging structure of the miniature thermoelectric power generation chip, less manual participation work is needed, the packaging effect on the miniature thermoelectric power generation chip is good, the packaging efficiency is high, and the product quality is indirectly improved.

Description

Technical Field

[0001] This application relates to the field of chip packaging equipment technology, and in particular to a micro thermoelectric power generation chip packaging structure. Background Technology

[0002] The thermoelectric effect refers to the phenomenon where electrons in a heated object move from a high-temperature region to a low-temperature region along a temperature gradient, generating an electric current or accumulating charge. Thermoelectricity has been widely applied in various fields, such as thermocouples, thermoelectric generators, and refrigeration chips. Thermoelectric power generation directly converts heat energy into electrical energy, using the temperature difference between high and low temperatures to convert moving heat energy into electrical energy. Temperature differences exist everywhere on Earth, offering virtually limitless potential for utilization. Applications range from homes to the entire planet, and the range of usable heat source temperatures is quite broad.

[0003] In traditional production, the packaging of thermoelectric chips relies on workers manually placing multiple N-type and P-type thermoelectric elements on designated positions on a heat-conducting plate, and then manually placing the heating device on the heat-conducting plate to heat and press it to complete the packaging. This process is very time-consuming and labor-intensive, resulting in low work efficiency and affecting product quality. Utility Model Content

[0004] This application provides a miniature thermoelectric power generation chip packaging structure to improve the following technical problems:

[0005] In traditional production, the packaging of thermoelectric chips relies on workers manually placing multiple N-type and P-type thermoelectric elements on designated positions on a heat-conducting plate, and then manually placing the heating device on the heat-conducting plate to heat and press it to complete the packaging. This process is very time-consuming and labor-intensive, resulting in low work efficiency and affecting product quality.

[0006] This application provides a miniature thermoelectric power generation chip packaging structure, which adopts the following technical solution:

[0007] A micro thermoelectric power generation chip packaging structure includes a base, a column, and a crossbeam, wherein the column is vertical.

[0008] The crossbeam is horizontally mounted on the top of the column and mounted on one side of the base. The base is provided with an XY-axis moving mechanism, and the XY-axis moving mechanism is provided with a rotating mechanism. The rotating mechanism is provided with a mold for placing a heat-conducting plate. The XY-axis moving mechanism is used to drive the mold to move horizontally along the X-axis or Y-axis. The rotating mechanism is used to drive the mold to rotate horizontally. The bottom of the crossbeam is provided with a lifting mechanism, and the bottom of the lifting mechanism is provided with an electric heating plate. The lifting mechanism is used to move the electric heating plate closer to or away from the mold. The crossbeam and / or the base are also provided with a heat dissipation mechanism.

[0009] In one feasible technical solution of this application, the XY axis moving mechanism includes a first linear slide module and a second linear slide module, both driven by servo motors. The first linear slide module is arranged along the X-axis direction, and the second linear slide module is arranged along the Y-axis direction. The rotating mechanism is mounted on the first linear slide module and driven to slide by the first linear slide module. The first linear slide module is mounted on the second linear slide module and driven to slide by the second linear slide module.

[0010] In one feasible technical solution of this application, the XY axis moving mechanism further includes a guide rod slider module, wherein the guide rod slider module and the second linear slide module are arranged in parallel and are respectively located on both sides of the bottom of the first linear slide module.

[0011] In one feasible technical solution of this application, the rotating mechanism includes a rotating motor and a connecting flange. The connecting flange is horizontally arranged and connected to the output shaft of the rotating motor. The connecting flange is attached to the bottom surface of the mold and fixedly connected by multiple sets of screws.

[0012] In one feasible technical solution of this application, the upper surface of the mold is provided with a groove for adapting to the heat-conducting plate, and the mold is a stainless steel part.

[0013] In one feasible technical solution of this application, the lifting mechanism includes two sets of lifting cylinders and a horizontally arranged support plate. The top of the body of the lifting cylinder is fixed to the lower surface of the crossbeam, the support plate is fixed to the bottom of the output shaft of the lifting cylinder, and the electric heating plate is fixed to the lower surface of the support plate.

[0014] In one feasible technical solution of this application, the support plate is a stainless steel mesh plate, and the projected area of ​​the support plate from top to bottom completely covers the movement range of the mold.

[0015] In one feasible technical solution of this application, the heat dissipation mechanism includes a first industrial fan, a bracket, and multiple second industrial fans. The first industrial fan is installed on the lower surface of the crossbeam and is used to cool the electric heating plate from top to bottom. The bracket is vertically installed on the other side of the base, and the second industrial fans are installed on the bracket. The second industrial fans are used to cool the electric heating plate and the mold from the side.

[0016] In summary, this application includes at least one of the following beneficial technical effects:

[0017] The XY-axis moving mechanism drives the mold to move freely in the horizontal direction. Then, in conjunction with the rotation mechanism, the direction of the mold can be adjusted as needed. Then, in conjunction with the lifting mechanism, the electric heating plate is pressed down, thereby completing the chip packaging work. When the entire equipment is not in operation, the heat dissipation mechanism can be activated to quickly cool down the electric heating plate and the mold. The whole equipment has a simple structure and stable operation, requires less manual intervention, has a good packaging effect on micro thermoelectric chips, has high packaging efficiency, and indirectly improves product quality. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the micro thermoelectric power generation chip packaging structure according to an embodiment of this application.

[0020] Explanation of reference numerals in the attached figures:

[0021] 1. Base;

[0022] 2. Columns;

[0023] 3. Crossbeam;

[0024] 4. XY axis moving mechanism; 41. First linear slide module; 42. Second linear slide module; 43. Guide rod slider module;

[0025] 5. Rotating mechanism; 51. Rotating motor; 52. Connecting flange;

[0026] 6. Mold; 61. Groove;

[0027] 7. Lifting mechanism; 71. Lifting cylinder; 72. Support plate;

[0028] 8. Electric heating plate;

[0029] 9. Heat dissipation mechanism; 91. First industrial fan; 92. Bracket; 93. Second industrial fan. Detailed Implementation

[0030] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0031] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0032] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0034] The following is in conjunction with the appendix Figure 1 This application will be described in further detail.

[0035] This application discloses a miniature thermoelectric power generation chip packaging structure. (Refer to...) Figure 1 The micro thermoelectric power generation chip packaging structure includes a base 1, a column 2, and a crossbeam 3. The column 2 is vertically mounted on one side of the base 1, and the crossbeam 3 is horizontally mounted on the top of the column 2. An XY axis moving mechanism 4 is provided on the base 1, and a rotating mechanism 5 is provided on the XY axis moving mechanism 4. A mold 6 for placing a heat-conducting plate is provided on the rotating mechanism 5. The XY axis moving mechanism 4 is used to drive the mold 6 to move horizontally along the X-axis or Y-axis, and the rotating mechanism 5 is used to drive the mold 6 to rotate horizontally. A lifting mechanism 7 is provided at the bottom of the crossbeam 3, and an electric heating plate 8 is provided at the bottom of the lifting mechanism 7. The lifting mechanism 7 is used to drive the electric heating plate 8 to move closer to or away from the mold 6. A heat dissipation mechanism 9 is also provided on the crossbeam 3 and / or the base 1. The upper surface of the mold 6 is provided with a groove 61 for adapting to the heat-conducting plate, and the mold 6 is made of stainless steel.

[0036] In this embodiment, the XY-axis moving mechanism 4 includes a first linear slide module 41 and a second linear slide module 42, both driven by servo motors. The first linear slide module 41 is arranged along the X-axis, and the second linear slide module 42 is arranged along the Y-axis. A rotating mechanism 5 is mounted on the first linear slide module 41 and driven to slide by it. The first linear slide module 41 is mounted on the second linear slide module 42 and driven to slide by it. The XY-axis moving mechanism 4 also includes a guide rod slider module 43, which is arranged in parallel with the second linear slide module 42, and both are located on the bottom sides of the first linear slide module 41. The XY-axis moving mechanism 4 described above has a simple structure, is easy to operate, and runs stably, which is beneficial for accurately moving the mold 6 to a suitable position.

[0037] In this embodiment, the rotating mechanism 5 includes a rotating motor 51 and a connecting flange 52. The connecting flange 52 is horizontally arranged and connected to the output shaft of the rotating motor 51. The connecting flange 52 is attached to the bottom surface of the mold 6 and fixedly connected by multiple sets of screws. The rotating mechanism 5 described above has a simple structure, is easy to operate, and runs stably, which is beneficial for accurately rotating the mold 6 to a suitable position.

[0038] In this embodiment, the lifting mechanism 7 includes two sets of lifting cylinders 71 and a horizontally arranged support plate 72. The top of the body of the lifting cylinder 71 is fixed to the lower surface of the crossbeam 3, the support plate 72 is fixed to the bottom of the output shaft of the lifting cylinder 71, and the electric heating plate 8 is fixed to the lower surface of the support plate 72. The support plate 72 is a stainless steel mesh plate, and the projected area of ​​the support plate 72 from top to bottom completely covers the movement range of the mold 6. The lifting mechanism 7 described above has a simple structure, is easy to operate, and runs stably, which is conducive to accurately driving the electric heating plate 8 to perform the downward pressing work.

[0039] In this embodiment, the heat dissipation mechanism 9 includes a first industrial fan 91, a bracket 92, and multiple second industrial fans 93. The first industrial fan 91 is mounted on the lower surface of the crossbeam 3 and is used to cool the electric heating plate 8 from top to bottom. The bracket 92 is vertically mounted on the other side of the base 1, and the second industrial fans 93 are mounted on the bracket 92. The second industrial fans 93 are used to cool the electric heating plate 8 and the mold 6 from the side. The heat dissipation mechanism 9 designed above has a reasonable structural layout and good heat dissipation effect.

[0040] The beneficial technical effects of the miniature thermoelectric power generation chip packaging structure in this application are roughly as follows:

[0041] The XY axis moving mechanism 4 drives the mold 6 to move freely in the horizontal direction. Then, the rotation mechanism 5 can adjust the direction of the mold 6 as needed. Then, the lifting mechanism 7 drives the electric heating plate 8 to press down, thereby completing the chip packaging work. When the whole equipment is not in operation, the heat dissipation mechanism 9 can be activated to quickly cool down the electric heating plate 8 and the mold 6. The whole equipment has a simple structure and stable operation, requires less manual intervention, has a good packaging effect on micro thermoelectric chips, has high packaging efficiency, and indirectly improves product quality.

[0042] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A micro thermoelectric power generation chip packaging structure, characterized in that, The device includes a base (1), a column (2), and a crossbeam (3). The column (2) is vertically mounted on one side of the base (1), and the crossbeam (3) is horizontally mounted on the top of the column (2). The base (1) is provided with an XY axis moving mechanism (4), and the XY axis moving mechanism (4) is provided with a rotating mechanism (5). The rotating mechanism (5) is provided with a mold (6) for placing a heat-conducting plate. The XY axis moving mechanism (4) is used to drive the mold (6) to move horizontally along the X-axis or Y-axis. The rotating mechanism (5) is used to drive the mold (6) to rotate horizontally. The bottom of the crossbeam (3) is provided with a lifting mechanism (7), and the bottom of the lifting mechanism (7) is provided with an electric heating plate (8). The lifting mechanism (7) is used to drive the electric heating plate (8) to move closer to or away from the mold (6). The crossbeam (3) and / or the base (1) are also provided with a heat dissipation mechanism (9).

2. The micro thermoelectric power generation chip packaging structure according to claim 1, characterized in that, The XY axis moving mechanism (4) includes a first linear slide module (41) and a second linear slide module (42), both driven by servo motors. The first linear slide module (41) is arranged along the X-axis direction, and the second linear slide module (42) is arranged along the Y-axis direction. The rotating mechanism (5) is mounted on the first linear slide module (41) and driven to slide by the first linear slide module (41). The first linear slide module (41) is mounted on the second linear slide module (42) and driven to slide by the second linear slide module (42).

3. The micro thermoelectric power generation chip packaging structure according to claim 2, characterized in that, The XY axis moving mechanism (4) further includes a guide rod slider module (43), which and the second linear slide module (42) are arranged in parallel and are located on the bottom sides of the first linear slide module (41), respectively.

4. The micro thermoelectric power generation chip packaging structure according to claim 1, characterized in that, The rotating mechanism (5) includes a rotating motor (51) and a connecting flange (52). The connecting flange (52) is arranged horizontally and connected to the output shaft of the rotating motor (51). The connecting flange (52) is attached to the bottom surface of the mold (6) and is fixedly connected by multiple sets of screws.

5. The micro thermoelectric power generation chip packaging structure according to claim 1, characterized in that, The upper surface of the mold (6) is provided with a groove (61) adapted to the heat-conducting plate, and the mold (6) is made of stainless steel.

6. The micro thermoelectric power generation chip packaging structure according to claim 1, characterized in that, The lifting mechanism (7) includes two sets of lifting cylinders (71) and a horizontally arranged support plate (72). The top of the body of the lifting cylinder (71) is fixed to the lower surface of the crossbeam (3), the support plate (72) is fixed to the bottom of the output shaft of the lifting cylinder (71), and the electric heating plate (8) is fixed to the lower surface of the support plate (72).

7. The micro thermoelectric power generation chip packaging structure according to claim 6, characterized in that, The support plate (72) is a stainless steel mesh plate, and the projected area of ​​the support plate (72) from top to bottom completely covers the moving range of the mold (6).

8. The micro thermoelectric power generation chip packaging structure according to claim 1, characterized in that, The heat dissipation mechanism (9) includes a first industrial fan (91), a bracket (92), and multiple second industrial fans (93). The first industrial fan (91) is installed on the lower surface of the crossbeam (3) and is used to cool the electric heating plate (8) from top to bottom. The bracket (92) is installed vertically on the other side of the base (1), and the second industrial fans (93) are installed on the bracket (92). The second industrial fans (93) are used to cool the electric heating plate (8) and the mold (6) from the side.

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