SOP16W lead frame and integrated packaging module
By setting multiple base islands and connecting rib structures in the SOP16W lead frame, the problems of multi-chip integration and stability are solved, and a highly reliable and stable package module is achieved, which is suitable for the field of integrated circuit packaging.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 四川明泰微电子有限公司
- Filing Date
- 2025-05-30
- Publication Date
- 2026-05-08
AI Technical Summary
Existing technologies make it difficult to achieve multi-chip integration in the SOP16W package, and the stability and reliability of the package structure are insufficient, especially when the bonding wires are too long, problems are likely to occur.
Design an SOP16W lead frame with three base islands inside, each connected to a different pin. The base islands are connected to the frame body through connecting ribs to ensure isolation between chips and avoid excessively long bonding wires. Locking holes are provided on the pins and base islands to improve stability.
It meets the requirements of multi-chip packaging, improves the reliability and stability of packaging modules, avoids the risk of wire breakage caused by excessively long bonding wires, and broadens the application range of lead frames.
Smart Images
Figure CN224218808U_ABST
Abstract
Description
Technical Field
[0001] This application relates to semiconductor technology, specifically to an SOP16W lead frame and integrated packaging module. Background Technology
[0002] Currently, to meet the demands of integrated packaging and miniaturization, an increasing number of packaged products are required to integrate more chips to replace traditional discrete devices. How to integrate multiple chip pairs within existing package models and sizes has become a key research focus in the packaging industry. The lead frame, as the chip carrier, has become a specific research area, and its internal structure design is closely related to subsequent wire bonding during packaging and ensuring the stability of the package structure after molding. The co-packaging of half-bridge circuits with control chips currently has high market demand, and SOP16W is a common package form factor for such products. To address this need, a universal, low-packaging-difficulty, and highly reliable lead frame urgently needs to be developed. Utility Model Content
[0003] To meet the needs of existing product development, this application provides an SOP16W lead frame and integrated packaging module, which has three base islands arranged internally and directly connected to different pins. This not only ensures the packaging requirements of multiple chips, but also ensures the isolation between them, and avoids excessively long bonding wires in subsequent packaging. While meeting functional requirements, it also improves the reliability of the resulting packaging module.
[0004] To achieve the above objectives, the present invention employs the following technology:
[0005] An SOP16W lead frame includes packaging units arrayed on the frame body. The packaging units are provided with a first base island and a second base island spaced apart along the width direction, and a third base island spaced apart from the second base island along the length direction.
[0006] Multiple pins are provided on both sides of the packaging unit along its length. The first base island is connected to one pin on one side of the packaging unit along its length. The second and third base islands are connected to multiple different pins on the other side of the packaging unit along its length. The remaining pins are spaced apart from each base island.
[0007] The first base island is connected to the frame body by a first base island connecting rib extending from one side of the packaging unit along its length. The second base island is connected to the frame body by a second base island connecting rib extending from one end of the packaging unit. The third base island is connected to the frame body by a third base island connecting rib extending from the other end of the packaging unit.
[0008] Furthermore, the packaging unit has a thirteenth pin, a twelfth pin, an eleventh pin, a tenth pin, a ninth pin, an eighth pin, and a seventh pin on one side along its length, and a first pin, a second pin, a third pin, a fourth pin, a fifth pin, and a sixth pin on the other side. The thirteenth pin is opposite to the first pin, and the seventh pin is opposite to the sixth pin. The thirteenth pin is connected to the first base island, the second, third, and fourth pins are connected to the second base island, and the fifth and sixth pins are connected to the third base island.
[0009] Furthermore, the seventh pin is folded, first extending along the width direction of the package unit towards the third base island, and then turning to extend along the length direction of the package unit towards the first base island; the remaining pins all extend along the width direction of the package unit towards the middle of the package unit.
[0010] Furthermore, the first pin is located between the second base island and one end of the packaging unit, and the distance it extends along the width direction of the packaging unit is greater than the distance the other pins extend along the width direction of the packaging unit. The first pin is connected to the frame body through a pin connecting rib extending out of one end of the packaging unit.
[0011] Furthermore, the seventh pin extends along the width direction of the package unit to form a fourth base island.
[0012] Furthermore, the outer edges of the first, second, and third base island connecting ribs are all recessed inward to form pre-cut grooves.
[0013] Furthermore, the spacing between the first and second pins, the spacing between the fourth and fifth pins, and the spacing between the seventh and eighth pins are all greater than the spacing between the other adjacent pins.
[0014] An integrated packaging module includes an injection molded body and the SOP16W lead frame encapsulated within the injection molded body; a first base island is used to bond an IC driver chip, a second base island is used to bond a first power chip, a third base island is used to bond a second power chip, and the IC driver chip is connected to pins 13, 12, 11, 10, 9, 8, 7, the second base island, the first power chip, and the second power chip via bonding wires.
[0015] The beneficial effects of this utility model are as follows:
[0016] 1. The packaging unit has three base islands that are directly connected to different pins, and each base island is connected to the frame body by base island connecting ribs extending in different directions. This structure can not only meet the multi-chip packaging requirements, but also ensure the isolation between them, avoid excessively long bonding lines in subsequent packaging, and better ensure the structural stability after molding. This achieves the goal of improving the reliability of the formed packaging module while meeting functional requirements.
[0017] 2. An extension design of an independent pin along the package unit is used to form another base island for carrying a fourth chip, which broadens the applicability of the lead frame.
[0018] 3. Improve the stability after molding and avoid the risk of delamination by designing locking holes for the pins and / or base islands; increase the spacing between some pins to adapt to packaging requirements;
[0019] 4. The base island connecting ribs are pre-grooved to facilitate the punching of ribs during the formation of the encapsulation module. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of a lead frame packaging unit structure according to an embodiment of this application.
[0021] Figure 2 This is a schematic diagram of another lead frame packaging unit structure according to an embodiment of this application.
[0022] Figure 3 This is a partial schematic diagram of the overall structure of a lead frame according to an embodiment of this application.
[0023] Figure 4 This is a schematic diagram of the internal wiring of an integrated packaging module according to an embodiment of this application.
[0024] Figure 5 This is a schematic diagram of the internal wiring of another integrated packaging module according to an embodiment of this application. Detailed Implementation
[0025] To make the objectives, technical solutions and advantages of the present utility model clearer, the implementation methods of the present utility model will be described in detail below with reference to the accompanying drawings. However, the embodiments described in the present utility model are only some embodiments of the present utility model, and not all embodiments.
[0026] This application provides an SOP16W lead frame, such as Figure 3 As shown, it includes an encapsulation unit 2 arrayed on the frame body 1.
[0027] As an example of the internal structure of packaging unit 2, such as Figure 1As shown, a first base island 21 and a second base island 22 are spaced apart along the width direction, and a third base island 23 is spaced apart from the second base island 22 along the length direction. It can be seen that the first base island 21 and the second base island 22 are located on the left side of the packaging unit 2, and the third base island 23 is located on the right side of the packaging unit 2. The span of the third base island 23 along the width direction is greater than the span of either the first base island 21 or the second base island 22 along the width direction, but less than the overall span of the first base island 21 and the second base island 22 along the width direction. The first base island 21, the second base island 22, and the third base island 23 are each used to package one chip.
[0028] The packaging unit 2 has multiple pins on both sides along its length. Specifically, one side has pins A13 (13th), A12 (12th), A11 (11th), A10 (10th), A9 (9th), A8 (8th), and A7 (7th) in sequence, while the other side has pins A1 (1st), A2 (2nd), A3 (3rd), A4 (4th), A5 (5th), and A6 (6th). Pin A13 is opposite to pin A1, and pin A7 is opposite to pin A6. The spacing between pins A1 and A2, A4 and A5, and A7 and A8 is greater than the spacing between the other adjacent pins, thus adapting to the pin layout requirements of downstream applications of the packaging module.
[0029] Pin A13 (the thirteenth pin) is connected to the first base island 21. Pins A2, A3, and A4 (the second pin) are connected to the second base island 22. Pins A5 and A6 (the fifth pin) are connected to the third base island 23. The remaining pins are spaced apart from each base island.
[0030] Specifically, such as Figure 1 In one example, pin A7 is folded, initially extending along the width of package unit 2 towards the third base island 23, then turning to extend along the length of package unit 2 towards the first base island 21; the remaining pins all extend along the width of package unit 2 towards the middle of package unit 2. Pin A7 is spaced apart from both the first base island 21 and the third base island 23. By extending towards the first base island 21, the length of the chip traces / bonding wires on the first base island 21 can be reduced, mitigating the risk of wire breakage during molding due to excessively long bonding wires.
[0031] Optional, such as Figure 2 In another example shown, the seventh pin A7 extends along the width direction of the package unit 2 to form a fourth base island 24 for packaging a fourth chip.
[0032] Specifically, such as Figure 1 and Figure 2As shown, the first base island 21 is connected to the frame body 1 via a first base island connecting rib 31 extending from one side of the packaging unit 2 along its length. Preferably, the first base island connecting rib 31 is located between two adjacent pins on one side of the packaging unit 2 along its length. Optionally, the first base island connecting rib 31 is located between the eighth pin A10 and the seventh pin A9, but it can also be located between other adjacent pins. The second base island 22 is connected to the frame body 1 via a second base island connecting rib 32 extending from one end of the packaging unit 2. The third base island 32 is connected to the frame body 1 via a third base island connecting rib 33 extending from the other end of the packaging unit 2. Preferably, the outer edges of the first base island connecting rib 31, the second base island connecting rib 32, and the third base island connecting rib 33 are all recessed inward to form a pre-cut groove 30 to facilitate punching during subsequent packaging.
[0033] The first pin A1 is located between the second base island 22 and one end of the packaging unit 2, and the distance it extends along the width direction of the packaging unit 2 is greater than the distance the other pins extend along the width direction of the packaging unit 2. The first pin A1 is connected to the frame body 1 through a pin connecting rib 34 extending out of one end of the packaging unit 2. Preferably, a pre-cut groove 30 is also formed on the pin connecting rib 34.
[0034] Preferably, some pins and / or base islands may be provided with locking holes to improve the structural stability after molding and reduce the risk of delamination. Specifically, each pin located on one side of the length direction of the packaging unit 2 is provided with a locking hole 5, and the second base island 22 is provided with a locking hole 5.
[0035] This application also provides an integrated packaging module, including an injection molded body and the SOP16W lead frame described in the previous embodiment encapsulated within the injection molded body.
[0036] like Figure 4 It demonstrates a Figure 1 The diagram shows the internal wiring of the integrated package module after the chips are bonded to each base island in the lead frame example. The first base island 21 is used to bond the IC driver chip 41, the second base island 22 is used to bond the first power chip 42, and the third base island 23 is used to bond the second power chip 43. The IC driver chip 41 is connected to the thirteenth pin A13, the twelfth pin A12, the eleventh pin A11, the tenth pin A10, the ninth pin A9, the eighth pin A8, the seventh pin A7, the second base island 22, the first power chip 42, and the second power chip 43 through bonding wires.
[0037] like Figure 5 It shows another Figure 2The diagram shows the internal wiring of the integrated package module after the chips are bonded to each base island in the lead frame example. Based on the previous integrated package module, the fourth base island 24 of the seventh pin A7 is used to bond the diode chip 44. The IC driver chip 41 is connected to the diode chip 44 through bonding wires, thereby achieving the integration of more chips and meeting more functional requirements without changing the package size and package form.
[0038] The above description is only a preferred embodiment of this application and is not intended to limit this application. Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application.
Claims
1. An SOP16W lead frame, comprising packaging units (2) arrayed on a frame body (1), characterized in that: The packaging unit (2) is provided with a first base island (21) and a second base island (22) spaced apart along the width direction, and a third base island (23) spaced apart from the second base island (22) along the length direction. The packaging unit (2) has multiple pins on both sides of its length direction. The first base island (21) is connected to one pin on one side of the packaging unit (2) in the length direction. The second base island (22) and the third base island (23) are connected to multiple different pins on the other side of the packaging unit (2) in the length direction. The remaining pins are spaced apart from each base island. The packaging unit (2) has the following pins arranged sequentially on one side along its length: the thirteenth pin (A13), the twelfth pin (A12), the eleventh pin (A11), the tenth pin (A10), the ninth pin (A9), the eighth pin (A8), and the seventh pin (A7); and the first pin (A1), the second pin (A2), the third pin (A3), the fourth pin (A4), the fifth pin (A5), and the sixth pin (A6). Pin 13 (A13) is opposite to pin 1 (A1), and pin 7 (A7) is opposite to pin 6 (A6); The thirteenth pin (A13) is connected to the first base island (21), the second pin (A2), the third pin (A3), and the fourth pin (A4) are connected to the second base island (22), and the fifth pin (A5) and the sixth pin (A6) are connected to the third base island (23).
2. The SOP16W lead frame according to claim 1, characterized in that, The seventh pin (A7) is folded, first extending along the width direction of the package unit (2) toward the third base island (23), and then extending along the length direction of the package unit (2) toward the first base island (21); the remaining pins all extend along the width direction of the package unit (2) toward the middle of the package unit (2).
3. The SOP16W lead frame according to claim 2, characterized in that, The first pin (A1) is located between the second base island (22) and one end of the packaging unit (2), and the distance extended along the width direction of the packaging unit (2) is greater than the distance extended along the width direction of the other pins. The first pin (A1) is connected to the frame body (1) through the pin connecting rib (34) extending out of one end of the packaging unit (2).
4. The SOP16W lead frame according to claim 1, characterized in that, The seventh pin (A7) extends along the width direction of the package unit (2) to form a fourth base island (24).
5. The SOP16W lead frame according to claim 1, characterized in that, The first base island (21) is connected to the frame body (1) by a first base island connecting rib (31) extending out of one side of the encapsulation unit (2) along its length direction. The second base island (22) is connected to the frame body (1) by a second base island connecting rib (32) extending out of one end of the encapsulation unit (2). The third base island (23) is connected to the frame body (1) by a third base island connecting rib (33) extending out of the other end of the encapsulation unit (2).
6. The SOP16W lead frame according to claim 5, characterized in that, The outer edges of the first base island connecting bar (31), the second base island connecting bar (32), and the third base island connecting bar (33) are all recessed inward to form a pre-cut groove (30).
7. The SOP16W lead frame according to claim 1, characterized in that, The spacing between the first pin (A1) and the second pin (A2), the spacing between the fourth pin (A4) and the fifth pin (A5), and the spacing between the seventh pin (A7) and the eighth pin (A8) are all greater than the spacing between the other adjacent pins.
8. An integrated packaging module, characterized in that, Includes an injection molded body and an SOP16W lead frame as described in any one of claims 1-7 encapsulated within the injection molded body.
9. An integrated packaging module, characterized in that, The device includes an injection molded body and an SOP16W lead frame as described in any one of claims 1-7 encapsulated within the injection molded body. The first base island (21) is used to bond the IC driver chip (41), the second base island (22) is used to bond the first power chip (42), and the third base island (23) is used to bond the second power chip (43). The IC driver chip (41) is connected to the thirteenth pin (A13), the twelfth pin (A12), the eleventh pin (A11), the tenth pin (A10), the ninth pin (A9), the eighth pin (A8), the seventh pin (A7), the second base island (22), the first power chip (42), and the second power chip (43) via bonding wires.