Ultrasonic probe

Abstract

The utility model relates to the technical field of medical instruments, and discloses an ultrasonic probe. The ultrasonic probe comprises a probe handle, an installation carrier, a circuit assembly, a piezoelectric crystal assembly and a wire, the probe handle and the installation carrier are matched in an inserted mode to form a containing cavity, at least part of the circuit assembly is arranged in the containing cavity, and a positioning sinking groove is formed in the end, away from the probe handle, of the installation carrier and communicated with the containing cavity. The piezoelectric crystal assembly is limited in the positioning sinking groove and electrically connected with the circuit assembly through a wire, and the probe handle and the installation carrier are formed in a 3D printing mode. The ultrasonic probe disclosed by the utility model is convenient to process and low in manufacturing cost on the premise of ensuring the mounting precision of the piezoelectric crystal assembly.

Description

Technical Field

[0001] This utility model relates to the field of medical device technology, and in particular to an ultrasound probe. Background Technology

[0002] An ultrasound probe is a medical device capable of detecting tissue lesions. It comprises a housing, a circuit assembly, and a piezoelectric crystal assembly. The circuit assembly is housed within the housing, and the piezoelectric crystal assembly is fixed to the housing and electrically connected to it. The circuit assembly sends electrical signals to the piezoelectric crystal assembly, which then generates mechanical vibrations using the piezoelectric effect, thereby emitting ultrasonic waves.

[0003] The directional accuracy of the ultrasonic waves generated by the piezoelectric crystal assembly is affected by the installation accuracy of the piezoelectric crystal assembly on the housing assembly. This requires the installation of more positioning structures on the housing. In addition, the housing size of the ultrasonic probe is usually small, which makes the ultrasonic probe difficult to process and has a high manufacturing cost. Utility Model Content

[0004] The purpose of this invention is to propose an ultrasonic probe that, while ensuring the installation accuracy of the piezoelectric crystal assembly, is easy to process and has low manufacturing cost.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] An ultrasonic probe includes a probe handle, a mounting carrier, a circuit assembly, a piezoelectric crystal assembly, and wires. The probe handle is inserted into the mounting carrier to form a cavity. The circuit assembly is at least partially disposed within the cavity. A positioning groove is provided at one end of the mounting carrier away from the probe handle. The positioning groove communicates with the cavity. The piezoelectric crystal assembly is confined within the positioning groove and is electrically connected to the circuit assembly via wires. The probe handle and the mounting carrier are respectively formed by 3D printing.

[0007] As an optional solution, the piezoelectric crystal assembly includes a piezoelectric substrate, a first electrode sheet, and a second electrode sheet. The first electrode sheet is attached to the inner side of the piezoelectric substrate, and the second electrode sheet is partially attached to the outer side of the piezoelectric substrate and partially extends from the side of the piezoelectric substrate to be attached to the inner side of the piezoelectric substrate to form a welded portion. The first electrode sheet and the welded portion are respectively welded to the wire.

[0008] The bottom of the positioning groove is provided with an avoidance notch, which is configured to accommodate the weld point between the wire and the welding part.

[0009] As an optional solution, the probe handle is provided with a positioning groove, the circuit assembly is confined within the positioning groove, and the probe handle is also provided with a foolproof part, which is disposed opposite to the avoidance notch.

[0010] As an alternative, the piezoelectric crystal assembly is bonded to the wall of the positioning trough.

[0011] As an optional solution, one of the probe handle and the mounting carrier is provided with a positioning boss, and the other is provided with a positioning groove, wherein the positioning boss and the positioning groove are inserted and engaged.

[0012] As an optional solution, the cross-section of both the positioning boss and the positioning groove is non-circular.

[0013] As an optional solution, the positioning boss is bonded to the sidewall of the positioning groove.

[0014] As an alternative, the circuit assembly includes a circuit board and an interface device, wherein the piezoelectric crystal assembly is electrically connected to the circuit board, and the interface device is electrically connected to the circuit board.

[0015] The probe handle has a through hole, the circuit board abuts against the inner wall of the probe handle, the interface piece passes through the through hole, and the ultrasonic probe also includes a fastener, which is threadedly connected to the interface piece.

[0016] As an alternative, the through hole is filled with sealant.

[0017] As an alternative, the probe handle includes a grip portion with a textured surface.

[0018] The beneficial effects of this utility model are:

[0019] The ultrasonic probe of this invention features a positioning groove on the mounting carrier that can accommodate and limit the piezoelectric crystal assembly. The cavity formed by the probe handle and the mounting carrier can accommodate the circuit assembly. The positioning groove and the cavity are connected to facilitate electrical connection of the piezoelectric crystal assembly and the circuit assembly via wires. The probe handle and the mounting carrier are respectively formed by 3D printing, which is easy to manufacture and ensures high shape accuracy. Based on this, the simple positioning structure, such as the plug-in fit between the mounting carrier and the probe handle, and the positioning groove, can ensure the installation position accuracy of the piezoelectric crystal assembly relative to the ultrasonic probe's outer shell (i.e., the probe handle and the mounting carrier), thereby ensuring the directional accuracy of the ultrasonic waves generated by the piezoelectric crystal assembly. Furthermore, for small-batch production needs or personalized customization, the cost reduction advantage of this ultrasonic probe is even more significant. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the ultrasonic probe provided in a specific embodiment of the present invention from one viewing angle;

[0021] Figure 2 This is an exploded view of the ultrasonic probe provided in a specific embodiment of this utility model;

[0022] Figure 3 This is a schematic diagram of the probe handle provided in a specific embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the ultrasonic probe provided in a specific embodiment of the present invention from another perspective;

[0024] Figure 5 This is a schematic diagram of the installation carrier provided in a specific embodiment of the present invention from one perspective;

[0025] Figure 6 This is a schematic diagram of the piezoelectric crystal assembly provided in a specific embodiment of the present invention from one viewpoint;

[0026] Figure 7 This is a schematic diagram of the piezoelectric crystal assembly provided in a specific embodiment of the present invention from another perspective;

[0027] Figure 8 This is a structural schematic diagram of the installation carrier provided in a specific embodiment of the present invention from another perspective.

[0028] In the picture:

[0029] 10. Probe handle; 11. Positioning groove; 12. Foolproof part; 13. Through hole; 14. Grip part; 15. Positioning boss;

[0030] 20. Install the carrier; 21. Position the sinkhole; 22. Avoid the notch; 23. Position the groove;

[0031] 30. Circuit components; 31. Circuit boards; 32. Interface components;

[0032] 40. Piezoelectric crystal assembly; 41. Piezoelectric substrate; 42. First electrode sheet; 421. Welding part; 43. Second electrode sheet;

[0033] 50. Wire;

[0034] 61. Fasteners; 62. Gaskets. Detailed Implementation

[0035] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not the entire structure.

[0036] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0037] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0038] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0039] This embodiment provides an ultrasonic probe, such as Figure 1 and Figure 2As shown, the ultrasound probe includes a probe handle 10, a mounting carrier 20, a circuit assembly 30, a piezoelectric crystal assembly 40, and a wire 50. The probe handle 10 and the mounting carrier 20 are inserted into each other to form a receiving cavity. A positioning groove 21 is provided at the end of the mounting carrier 20 facing away from the probe handle 10, and the piezoelectric crystal assembly 40 is confined within the positioning groove 21. The circuit assembly 30 is partially disposed within the receiving cavity, and the positioning groove 21 communicates with the receiving cavity. The circuit assembly 30 is electrically connected to the piezoelectric crystal assembly 40 via the wire 50. A portion of the circuit assembly 30 extends outside the receiving cavity to facilitate electrical connection with external ultrasound diagnostic equipment. The probe handle 10 and the mounting carrier 20 are both formed using 3D printing.

[0040] The ultrasonic probe of this invention features a positioning groove 21 on the mounting carrier 20 that can accommodate and limit the piezoelectric crystal assembly 40. The cavity formed by the probe handle 10 and the mounting carrier 20 can accommodate the circuit assembly 30. The positioning groove 21 communicates with the cavity to facilitate electrical connection of the piezoelectric crystal assembly 40 and the circuit assembly 30 by the wire 50. The probe handle 10 and the mounting carrier 20 are respectively formed by 3D printing, which is easy to manufacture and ensures high shape accuracy. Based on this, the simple positioning structure, such as the insertion and mating of the mounting carrier 20 and the probe handle 10, and the positioning groove 21, can ensure the installation position accuracy of the piezoelectric crystal assembly 40 relative to the outer shell of the ultrasonic probe (i.e., the probe handle 10 and the mounting carrier 20), thereby ensuring the directional accuracy of the ultrasonic waves generated by the piezoelectric crystal assembly 40. Furthermore, for small-batch production needs or personalized customization, the cost reduction advantage of the ultrasonic probe of this embodiment is even more significant.

[0041] The working principle of the ultrasonic probe in this embodiment is roughly as follows: When the ultrasonic diagnostic equipment applies an excitation electrical signal to the piezoelectric crystal assembly 40 through the circuit component 30, the crystal lattice structure undergoes a slight change, causing the crystal to stretch and deform in a specific direction. This periodic deformation propagates out at a certain frequency, forming ultrasonic waves. The ultrasonic waves propagate from the front end of the ultrasonic probe towards the object being tested, and their propagation direction, intensity, and frequency are controlled by the position of the ultrasonic probe and the parameters of the excitation electrical signal. When the emitted ultrasonic waves encounter different tissue interfaces of the object being tested, reflection and scattering occur. The reflected ultrasonic waves act on the piezoelectric crystal assembly 40, causing the crystal to deform again. Due to the reverse process of the piezoelectric effect, the deformation of the crystal generates a weak electrical signal. This electrical signal is received by the circuit component 30 and subjected to preliminary processing such as filtering to improve the signal quality. The signal processed by the circuit component 30 is then transmitted to the ultrasonic diagnostic equipment for further analysis and processing.

[0042] like Figure 2As shown, the circuit assembly 30 includes a circuit board 31 and an interface component 32. The piezoelectric crystal assembly 40 is electrically connected to the circuit board 31 via a wire 50. The interface component 32 is electrically connected to the circuit board 31 and can extend outside the probe handle 10 for easy electrical connection with external ultrasound diagnostic equipment. In this embodiment, the interface component 32 adopts an SMA shielded interface, which not only facilitates connection with ultrasound diagnostic equipment but also blocks electromagnetic interference and improves signal transmission quality. It is understood that the circuit board 31 is an existing component, and its model only needs to be compatible with the frequency of the piezoelectric crystal assembly 40.

[0043] like Figure 2 As shown, a positioning groove 11 is provided on the probe handle 10, and the circuit assembly 30 is confined within the positioning groove 11. The positioning groove 11 prevents the circuit assembly 30 from shifting position during the use of the ultrasonic probe, thus preventing damage to the circuit assembly 30, reducing abnormal noise during use, and improving the user experience. In this embodiment, the cross-section of the end where the circuit board 31 connects to the interface component 32 (hereinafter referred to as the connection end) is the position with the largest cross-section of the entire circuit assembly 30. The cross-section of the positioning groove 11 is set to have the same shape and size as the connection end, ensuring reliable positioning of the circuit board 31 and smooth installation of the circuit board 31. The specific shape and size of the connection end can be set as needed, while the shape and size of the positioning groove 11 only need to match the connection end.

[0044] like Figures 2-4 As shown, the probe handle 10 has a through hole 13. The circuit board 31 abuts against the inner wall of the probe handle 10, and the interface component 32 passes through the through hole 13. The ultrasonic probe also includes a fastener 61, which is threadedly connected to the interface component 32. This configuration enables the entire circuit assembly 30 to be fixed, resulting in a simple structure and convenient installation. In this embodiment, the ultrasonic probe also includes a gasket 62, which is sandwiched between the fastener 61 and the probe handle 10. The gasket 62 can increase the range of force exerted by the fastener 61 on the probe handle 10, improving the reliability of fixing the circuit assembly 30. In this embodiment, the through hole 13 is filled with sealant, which can seal the accommodating cavity, thereby providing more reliable protection for the devices on the circuit board 31.

[0045] like Figure 4 As shown, the probe handle 10 includes a grip portion 14, the surface of which is textured to prevent the ultrasound probe from slipping during use and improve the user experience. The shape of the texture can be a grid, curve, etc., and is not specifically limited here.

[0046] like Figure 2 and Figure 5As shown, a positioning boss 15 is provided at the end of the probe handle 10 facing the mounting carrier 20, and a positioning groove 23 is provided at the end of the mounting carrier 20 facing the probe handle 10. The positioning boss 15 and the positioning groove 23 are interlocked. The cooperation between the positioning boss 15 and the positioning groove 23 can ensure the installation accuracy of both the probe handle 10 and the mounting carrier 20, thereby facilitating the positional accuracy of the piezoelectric crystal assembly 40 mounted on the mounting carrier 20 relative to the probe handle 10.

[0047] like Figure 2 and Figure 3 As shown, the cross-sections of both the positioning boss 15 and the positioning groove 23 are non-circular. This non-circular design prevents relative rotation between the probe handle 10 and the mounting carrier 20, thereby preventing excessive pulling on the wires 50 connecting the piezoelectric crystal assembly 40 and the circuit assembly 30, and preventing the solder joints at the ends of the wires 50 from breaking due to operational errors during the assembly of the ultrasonic probe. In this embodiment, the cross-sectional shapes of the positioning boss 15 and the positioning groove 23 are hexagonal. In other embodiments, the cross-sectional shapes of the positioning boss 15 and the positioning groove 23 can also be quadrilateral, triangular, etc., and are not specifically limited here.

[0048] In this embodiment, the positioning boss 15 is bonded to the side wall of the positioning groove 23. The piezoelectric crystal assembly 40 is also bonded to the groove wall of the positioning recess 21. This bonding method not only ensures the firmness of the connection between the probe handle 10 and the mounting carrier 20, and between the high-voltage crystal assembly 40 and the mounting carrier 20, but also seals the accommodating cavity, thereby protecting the circuit assembly 30.

[0049] like Figure 6 and Figure 7 As shown, the piezoelectric crystal assembly 40 includes a piezoelectric substrate 41, a first electrode sheet 42, and a second electrode sheet 43. The first electrode sheet 42 is attached to the inner side of the piezoelectric substrate 41, and the second electrode sheet 43 is partially attached to the outer side of the piezoelectric substrate 41 (i.e., the side of the piezoelectric substrate 41 facing away from the accommodating cavity), and partially extends from the side of the piezoelectric substrate 41 to the inner side of the piezoelectric substrate 41 to form a welding portion 421. The first electrode sheet 42 and the circuit board 31 are connected by a wire 50, and both ends of the wire 50 are welded to the first electrode sheet 42 and the circuit board 31, respectively. The welding portion 421 and the circuit board 31 are connected by a wire 50, and both ends of the wire 50 are welded to the welding portion 421 and the circuit board 31, respectively. The welding connection at both ends of the wire 50 ensures the reliability of the connection. In this embodiment, the wires 50 are all made of flexible shielded cables, thereby improving the reliability and stability of signal transmission.

[0050] like Figure 7As shown, on the inner side of the piezoelectric substrate 41, the welding portion 421 needs to be spaced apart from the first electrode sheet 42 to avoid short circuit between them. Therefore, the welding portion 421 is located at the edge of the piezoelectric substrate 41, such as... Figure 8 As shown, the bottom of the positioning groove 21 is provided with a clearance notch 22, which is configured to accommodate the solder joint between the wire 50 and the welding part 421. By providing the clearance notch 22 to accommodate the solder joint at the welding part 421, the flatness of the entire piezoelectric crystal assembly 40 installed in the positioning groove 21 can be ensured, thereby ensuring the accuracy of the direction of the ultrasonic waves emitted by the piezoelectric crystal assembly 40.

[0051] like Figure 2 As shown, the probe handle 10 is also provided with a foolproof part 12, which is positioned opposite to the clearance notch 22. When assembling the ultrasonic probe, the operator can refer to the foolproof part 12 and the clearance notch 22 to assemble the probe handle 10 and the mounting carrier 20, ensuring that both are installed in the preset orientation. This avoids significant bending or tangling of the wire 50 connecting the circuit board 31 and the piezoelectric crystal assembly 40, ensuring the reliability of the solder joint connection at the end of the wire 50. Optionally, in this embodiment, the foolproof part 12 is a countersunk hole formed on the positioning boss 15. In other embodiments, the foolproof part 12 can also be a protrusion formed on the positioning boss 15; in this embodiment, a corresponding clearance hole needs to be provided on the mounting carrier 20 to avoid the protrusion.

[0052] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. For those skilled in the art, based on the concept of this utility model, there will be changes in the specific implementation methods and application scope. The content of this specification should not be construed as a limitation of this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. An ultrasonic probe, characterized in that, The device includes a probe handle (10), a mounting carrier (20), a circuit assembly (30), a piezoelectric crystal assembly (40), and a wire (50). The probe handle (10) is inserted into the mounting carrier (20) to form a receiving cavity. The circuit assembly (30) is at least partially disposed in the receiving cavity. The mounting carrier (20) has a positioning groove (21) at one end away from the probe handle (10). The positioning groove (21) communicates with the receiving cavity. The piezoelectric crystal assembly (40) is confined within the positioning groove (21) and is electrically connected to the circuit assembly (30) through the wire (50). The probe handle (10) and the mounting carrier (20) are respectively formed by 3D printing.

2. The ultrasonic probe as described in claim 1, characterized in that, The piezoelectric crystal assembly (40) includes a piezoelectric substrate (41), a first electrode sheet (42), and a second electrode sheet (43). The first electrode sheet (42) is attached to the inner side of the piezoelectric substrate (41), and the second electrode sheet (43) is partially attached to the outer side of the piezoelectric substrate (41) and partially extends from the side of the piezoelectric substrate (41) to be attached to the inner side of the piezoelectric substrate (41) to form a welding part (421). The first electrode sheet (42) and the welding part (421) are respectively welded to the wire (50). The bottom of the positioning groove (21) is provided with a clearance notch (22), which is configured to accommodate the weld point between the wire (50) and the welding part (421).

3. The ultrasonic probe as described in claim 2, characterized in that, The probe handle (10) is provided with a positioning groove (11), the circuit assembly (30) is located within the positioning groove (11), and the probe handle (10) is also provided with a foolproof part (12), which is disposed opposite to the clearance notch (22).

4. The ultrasonic probe as described in claim 1, characterized in that, The piezoelectric crystal assembly (40) is bonded to the wall of the positioning sink (21).

5. The ultrasonic probe as described in claim 1, characterized in that, Of the probe handle (10) and the mounting carrier (20), one is provided with a positioning boss (15) and the other is provided with a positioning groove (23), and the positioning boss (15) and the positioning groove (23) are inserted into each other.

6. The ultrasonic probe as described in claim 5, characterized in that, The cross-sections of the positioning boss (15) and the positioning groove (23) are both non-circular.

7. The ultrasonic probe as described in claim 5, characterized in that, The positioning boss (15) is bonded to the side wall of the positioning groove (23).

8. The ultrasonic probe according to any one of claims 1-7, characterized in that, The circuit assembly (30) includes a circuit board (31) and an interface (32). The piezoelectric crystal assembly (40) is electrically connected to the circuit board (31), and the interface (32) is electrically connected to the circuit board (31). The probe handle (10) is provided with a through hole (13), the circuit board (31) abuts against the inner wall of the probe handle (10), the interface piece (32) passes through the through hole (13), the ultrasonic probe also includes a fastener (61), the fastener (61) is threadedly connected to the interface piece (32).

9. The ultrasonic probe as described in claim 8, characterized in that, The through hole (13) is filled with sealant.

10. The ultrasonic probe according to any one of claims 1-3, characterized in that, The probe handle (10) includes a grip (14) with a textured surface.

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