Glass substrate cutting system and glass substrate cutting device

Abstract

The utility model relates to a glass substrate cutting system and a glass substrate cutting device, the glass substrate cutting system comprises a first laser and a second laser, and a glass substrate comprises a layer-adding structure and a glass core plate which are arranged in a stacked mode. The first laser is used for emitting a first laser beam, and the first laser beam is used for grooving a layer-adding structure of the glass substrate to form a cutting channel; the second laser is used for emitting a second laser beam, and the second laser beam is used for modifying and processing the glass core plate at the position of the cutting channel. The first laser is used for slotting the layer-adding structure of the glass substrate, and the second laser is matched for modifying the glass core plate, so that the glass core plate is easy to break, the cutting of the glass substrate can be efficiently realized, and the problem that high-quality and high-efficiency cutting of the glass substrate cannot be realized in the current cutting technology is solved.

Description

Technical Field

[0001] This application relates to the field of laser cutting technology, and in particular to a glass substrate cutting system and a glass substrate cutting apparatus. Background Technology

[0002] With the development of high-performance chips, traditional organic material substrates (such as BT substrates and ABF substrates) have shown certain limitations in high-performance packaging applications, leading to the emergence of glass substrate technology for achieving high-density interconnection between chips.

[0003] Glass encapsulation substrates consist of a middle glass core and an outer layer of add-on structures. When cutting glass substrates, due to the differences in the constituent materials and physical properties of the substrates, cutting techniques used for traditional organic material substrates often result in poor cutting performance when faced with glass substrates. Utility Model Content

[0004] Therefore, it is necessary to provide a glass substrate cutting system and a glass substrate cutting device that can achieve efficient and high-quality cutting of glass substrates, addressing the aforementioned technical problems.

[0005] In a first aspect, this application provides a glass substrate cutting system for cutting glass substrates, the glass substrate cutting system including a first laser and a second laser; the glass substrate includes a stacked add-on structure and a glass core plate;

[0006] The first laser is used to emit a first laser beam, which performs grooving processing on the layered structure of the glass substrate to form a cutting path; the second laser is used to emit a second laser beam, which performs modification processing on the glass core plate at the location of the cutting path.

[0007] In one embodiment, the glass substrate cutting system further includes a cleaving mechanism for breaking the glass substrate along a modified glass core region.

[0008] In one embodiment, the cleaving mechanism includes a mechanical cleaving mechanism or a laser cleaving mechanism. The mechanical cleaving mechanism uses mechanical force to create cracks in the glass substrate along the modified glass core area to complete the cleaving. The laser cleaving mechanism uses laser energy to reduce the connection strength of the glass substrate along the modified glass core area to complete the cleaving.

[0009] In one embodiment, the wavelength of the first laser beam includes the ultraviolet to green light band, and the second laser beam output by the second laser is an ultrafast laser beam.

[0010] In one embodiment, the first laser beam is an ultrafast laser beam, and / or the wavelength of the second laser beam is infrared or green light.

[0011] In one embodiment, the glass substrate cutting system further includes a beam adjustment mechanism, which includes a first beam adjustment mechanism and a second beam adjustment mechanism;

[0012] The first beam adjustment mechanism includes a beam deflection device for controlling the first laser beam emitted by the first laser; the second beam adjustment mechanism includes a Bezier cutter head for controlling the second laser beam emitted by the second laser.

[0013] Secondly, this application also provides a glass substrate cutting system for cutting glass substrates, including a first laser processing device and a second laser processing device, wherein the first laser processing device is used to perform grooving processing on the glass substrate, and the second laser processing device is used to perform modification processing on the grooved glass substrate.

[0014] The first laser processing apparatus includes a first laser, a first beam adjustment mechanism, and a first processing platform. The first beam adjustment mechanism includes a beam deflection device for controlling the first laser beam emitted by the first laser and for grooving the glass substrate to be processed placed on the first processing platform.

[0015] The second laser processing apparatus includes a second laser, a second beam adjustment mechanism, and a second processing platform. The second beam adjustment mechanism includes a Bezier cutting head for controlling the second laser beam emitted by the second laser and modifying the grooved glass substrate placed on the second processing platform.

[0016] Thirdly, this application also provides a glass substrate cutting apparatus for cutting glass substrates, including a controller, a first laser, a second laser, a beam adjustment mechanism, and a processing platform. The processing platform is used to support the glass substrate to be processed. The controller is connected to the first laser and the second laser and is used to control the first laser to perform grooving processing and to control the second laser to perform modification processing. The beam adjustment mechanism is used to adjust the first laser beam emitted by the first laser and the second laser beam emitted by the second laser.

[0017] In one embodiment, the glass substrate cutting apparatus further includes a cleaving mechanism, and the controller is connected to the cleaving mechanism to control the cleaving mechanism to cleave the modified glass substrate.

[0018] In one embodiment, the beam adjustment mechanism includes a first beam adjustment mechanism and a second beam adjustment mechanism. The first beam adjustment mechanism includes a beam deflection device for controlling the first laser beam emitted by the first laser. The second beam adjustment mechanism includes a Bezier cutter for controlling the second laser beam emitted by the second laser.

[0019] The aforementioned glass substrate cutting system and apparatus include a first laser and a second laser. The glass substrate includes a stacked add-on structure and a glass core plate. The first laser emits a first laser beam to groove the add-on structure of the glass substrate, forming a cutting path. The second laser emits a second laser beam to modify the glass core plate at the location of the cutting path. By using the first laser to groove the add-on structure of the glass substrate, and in conjunction with the second laser to modify the glass core plate, making the glass core plate easier to break, efficient cutting of the glass substrate can be achieved, solving the problem that current cutting technologies cannot achieve high-quality and efficient cutting of glass substrates. Attached Figure Description

[0020] Figure 1 This is a schematic diagram illustrating the application of a glass substrate cutting system in one embodiment;

[0021] Figure 2 This is a schematic diagram of the glass substrate structure in one embodiment;

[0022] Figure 3 This is a schematic diagram of the glass substrate structure in another embodiment;

[0023] Figure 4 This is a schematic diagram of the cutting of a glass substrate in one embodiment;

[0024] Figure 5 This is a schematic diagram of the cutting path of the glass substrate in one embodiment;

[0025] Figure 6 This is a schematic diagram of the cutting of the glass substrate in another embodiment;

[0026] Figure 7 This is a schematic diagram of the cutting of the glass substrate in yet another embodiment;

[0027] Figure 8 This is a schematic diagram of the glass substrate cutting process in another embodiment;

[0028] Figure 9 This is a schematic diagram illustrating the application of the glass substrate cutting system in another embodiment;

[0029] Figure 10 This is a schematic diagram illustrating the application of the glass substrate cutting system in yet another embodiment;

[0030] Figure 11 This is a schematic diagram illustrating the application of a glass substrate cutting device in one embodiment.

[0031] Explanation of reference numerals in the attached drawings: glass substrate 100, glass core board 102, encapsulation channel 103, layered structure 104, first material layer 104a, second material layer 104b, first laser 110, second laser 130, third laser 150, processing platform 170, fixing device 172, flipping device 174, beam adjustment mechanism 190. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0033] It is understood that the terms "first," "second," etc., used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0034] It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have electrical signal or data transmission with each other.

[0035] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0037] With the development of modern industry, laser processing is widely used in various fields, utilizing the high energy contained in the laser beam to achieve different industrial applications such as drilling and cutting. With the development of high-performance chips, the materials of packaging substrates are also gradually being updated. Unlike traditional organic material substrates such as BT substrates (Bismaleimide Triazine substrates) and ABF substrates (Ajinomoto Build-up Film substrates), glass substrates with superior performance and higher chip interconnection density are gradually coming into the public eye.

[0038] After experiencing the actual production scenarios of glass substrates, the applicant discovered that currently used cutting technologies are based on the research and application of traditional organic material substrates. This results in poor cutting effects when cutting and packaging novel glass substrates for the packaging field. Therefore, the applicant began to consider how to achieve efficient cutting of glass substrates, and proposed the technical solution of this application, namely a glass substrate cutting system.

[0039] In one embodiment, such as Figure 1 As shown, this application provides a glass substrate cutting system for cutting glass substrates. The glass substrate cutting system includes a first laser 110 and a second laser 130. The first laser 110 is used to emit a first laser beam, which performs grooving processing on the added-layer structure of the glass substrate 100 to form a cutting path; the second laser 130 is used to emit a second laser beam, which performs modification processing on the glass core board at the location of the cutting path.

[0040] The glass substrate 100 includes a laminated add-on structure and a glass core plate. The add-on structure can be disposed on one side surface of the glass core plate, or it can be disposed on both sides of the glass core plate. Figure 2 As shown, when the added-layer structure 104 is disposed on both sides of the glass core plate 102, the added-layer structure 104 includes a first material layer 104a and a second material layer 104b, wherein the first material layer 104a is disposed in contact with the first side of the glass core plate 102, and the second material layer 104b is disposed in contact with the second side of the glass core plate 102.

[0041] The glass core board 102 is made of a glass substrate, which can be a flat glass sheet. An add-on structure 104 is covered / set on it to construct the glass substrate 100. The glass core board 102 has a certain light transmittance, excellent high and low temperature resistance, and high chemical stability, which is beneficial to improving the reliability of the glass substrate 100 when used in high-performance chip packaging.

[0042] Specifically, Figure 3This is a cross-sectional view of the glass substrate 100 along the stacking direction. In one embodiment, the add-on structure 104 of the glass substrate 100 may include a conductive material layer, an insulating material layer, and a capping material layer. The capping material layer is disposed on the side away from the glass core plate 102. The conductive material layer is disposed between the capping material layer and the glass core plate 102. The insulating material layer fills the space between the capping material layer and the glass core plate 102, and is alternately stacked with the conductive material layer. Exemplarily, the capping material layer is an ink layer, such as solder resist ink or anti-corrosion ink. The conductive material layer may be a copper foil layer with conductive lines. The insulating material layer may be an ABF thin film layer (Ajinomoto Build-up Film, a high-performance packaging substrate material). When there are multiple conductive material layers, the insulating material layer may be used to fill the spaces between the conductive material layers to insulate them from each other.

[0043] Furthermore, such as Figure 3 As shown, the add-on structure 104 may further include a reserved encapsulation channel 103. The encapsulation channel 103 is used to provide a cutting position for the glass substrate 100 and is composed of an insulating material. One side of the encapsulation channel 103 is attached to the glass core plate 102, and the other side of the encapsulation channel 103 is attached to the capping material layer. Specifically, when the add-on structure 104 includes a first material layer 104a and a second material layer 104b, the reserved encapsulation channel 103 can be set at a position symmetrical to the glass core plate 102 in the first material layer 104a and the second material layer 104b. The position of the encapsulation channel 103 can serve as the position of the cutting path for subsequent processing by the first laser beam or the second laser beam, that is, the cutting path corresponds to the encapsulation channel 103. Further, the reserved encapsulation channel does not contain conductive lines, that is, the reserved encapsulation channel 103 is entirely composed of insulating material. When designing and manufacturing conductive lines, the conductive material layer can be reserved at the position of the reserved encapsulation channel 103, without designing and manufacturing conductive lines. The encapsulation channel 103 does not contain conductive lines, which can reduce the cutting difficulty of the layered structure 104.

[0044] When cutting the glass substrate 100, the cutting can be performed at the position where the encapsulation channel is reserved. This eliminates the need to process conductive materials during the cutting process, which helps to reduce the cutting difficulty, reduce the cutting load, and improve the cutting efficiency.

[0045] The first laser 110 and the second laser 130 of the glass substrate cutting system can both emit laser beams. The laser energy of the laser beams is used to act on the glass substrate 100 to achieve laser cutting of the glass substrate 100, so that large-sized glass substrates can be divided into specific size units that meet application requirements.

[0046] In one embodiment, a first laser 110 emits a first laser beam, which is used to perform grooving processing on the add-on structure 104 of the glass substrate 100 to form a cutting path.

[0047] A cutting groove refers to the groove structure formed in a laminated structure during grooving, which is the structure of the laminated material removed during the grooving process. The sidewalls and bottom wall of this groove structure constitute the cutting groove. For example... Figure 4 As shown, the cutting groove is a groove structure obtained by the first laser beam removing material from the add-on structure 104. Specifically, it removes material from the location of the encapsulation channel 103. By removing the top capping material layer and the encapsulation channel 103, the glass core board 102 is exposed. By first creating a groove on the glass substrate to expose the glass core board 102, it is possible to avoid directly processing the add-on structure and the glass core board continuously, which would cause the thermal expansion coefficients of the glass core board 102 and the adjacent insulating material layer (such as the ABF film layer) to be different, resulting in the glass core board 102 warping and bursting due to the stress tension of the add-on structures 104 on both sides.

[0048] Among them, grooving in laser processing refers to using a laser beam to quickly and accurately remove material and cut blind grooves or through grooves on the workpiece (such as circuit boards, including PCBs and IC carrier boards). The shape of the groove is set according to the processing needs and can be square, rectangular, triangular, or irregular structure composed of straight lines and arcs.

[0049] Specifically, such as Figure 4 As shown, the add-on structure 104 of the glass substrate 100 is slotted to form a cutting path. During the processing, a first laser 110 emits a first laser beam to process the add-on structure of the glass substrate 100. The first laser beam performs slotting on the pre-reserved encapsulation channel 103 on the add-on structure through laser processing, forming a cutting path on the encapsulation channel 103, so that the bottom wall of the cutting path remains on the surface of the glass core plate 102, exposing the glass core plate 102. It can be understood that when the add-on structure 104 includes a first material layer 104a and a second material layer 104b, slotting is performed at symmetrical positions on different sides of the glass core plate 102 to form the cutting path.

[0050] Since the constituent materials of the added-layer structure are different from those of the glass core board, the different physical effects that occur when lasers with different parameters act on different materials can be utilized. By setting the laser parameters of the first laser 110 to match the material properties of the added-layer structure, the laser energy absorption rate of the added-layer structure to the first laser beam is high, while the laser energy absorption rate of the glass core board to the first laser beam is lower than a certain threshold. This allows for the creation of cutting paths by grooving only the added-layer structure without damaging the glass core board.

[0051] Furthermore, in an exemplary embodiment, the wavelength of the first laser beam can be set to include the ultraviolet to green light band, that is, the wavelength of the first laser beam is greater than or equal to ultraviolet light and less than or equal to green light. By selecting a first laser beam in the ultraviolet to green light band, the add-on structure has a high absorption rate to the first laser beam, while the glass core plate has a low absorption rate for this band. This ensures that the first laser beam can efficiently and accurately perform grooving processing on the add-on structure to form a cutting path without damaging the glass core plate, preventing cracks or breakage of the glass core plate. Specifically, the first laser beam is controlled to perform grooving processing along the cutting path on the glass substrate. The high absorption rate of the add-on structure on the glass substrate by the first laser beam facilitates the rapid removal of the add-on structure along the cutting path. If the added-layer structure has been completely removed and the glass core plate is exposed at the position irradiated by the first laser beam in the cutting path, the energy accumulated in the glass core plate when the first laser beam irradiates the glass core plate is lower than the damage threshold of the glass core plate, and will not have a significant impact on the properties of the glass core plate.

[0052] The first laser beam is emitted by a first laser. Optionally, in one embodiment, the first laser beam is an ultrafast laser beam with a pulse width less than or equal to the picosecond level, and correspondingly, the first laser 110 is an ultrafast laser.

[0053] Since the build-up structure consists of multiple alternating layers of ABF thin film and copper foil, heat accumulation during laser processing can lead to warping of the copper foil layer due to the different heat absorption rates and deformations of the ABF thin film and copper foil after heat absorption. This negatively impacts the morphology of the cutting path. In contrast, ultrafast laser beams can release laser energy in a very short time, resulting in extremely high peak power (reaching the GW level). This allows the laser energy to be concentrated within a very small time and space range, enabling the vaporization and removal of the build-up material. Furthermore, the interaction time between the ultrafast laser pulse and the material is extremely short, minimizing the thermal impact on the build-up structure and reducing or avoiding the adverse effects of heat accumulation during processing. Further, the wavelength of the first laser beam can be set to 343nm-532nm, and the first laser beam can be an ultrafast laser beam, such as a 343nm ultraviolet femtosecond laser or a 532nm green picosecond laser.

[0054] Furthermore, when the first laser beam performs grooving on the add-on structure along the cutting path, different cutting widths and shapes can be set to form cutting paths with different morphologies. The cutting width affects the area occupied by the cutting path and stress release, while the cutting shape affects the processing difficulty, the edge morphology of the cutting path, and the stress release effect. It is understandable that the cutting width and cutting shape of the cutting path can be adjusted according to the constituent materials and thickness of the add-on structure, the cutting requirements of the glass substrate, and the allowable area occupied by the cutting path, to achieve the removal of different amounts of add-on structure.

[0055] refer to Figure 4 , Figure 4 This is a cross-sectional view of the glass substrate 100 along the stacking direction. In this embodiment, the cutting width is the width of the cross-section along the direction perpendicular to the cutting path, closer to the glass core board. Figure 4 In a trapezoidal cross-section cut track, the length of the upper base near the glass core board. The cut shape is the cross-section of the cut track perpendicular to the cut path, such as... Figure 5 As shown, the glass substrate is divided into multiple regions, and cleaving paths are formed along the cutting route to cut a large glass substrate into glass substrates of a specified size. The location of the cutting path is also the location of the encapsulation channel. When the first laser beam processes along the cutting path, a cleaving channel is formed at the cutting path. The cross-section of the cleaving channel is shown in the figure. Figure 4 As shown, it can display the cutting shape, depth, maximum width, and minimum width of the cutting path.

[0056] In one embodiment, reference Figure 4 The cutting shape of the cutting channel is an inverted trapezoid. The width of the cutting channel on the side closer to the glass core is smaller than the width on the side farther from the glass core, resulting in an inverted trapezoidal cross-section. Setting the cutting shape as an inverted trapezoid helps to gradually release the stress of each layer during the grooving process of the added-layer structure, avoiding the occurrence of panel bursting during the cutting process.

[0057] It is understood that the accompanying drawings of this disclosure relating to glass substrates, processing equipment, and systems are drawn for ease of technical understanding and are not proportionally scaled down to the actual dimensions of the objects. Figure 3 and Figure 4 For example, the encapsulation channel and the cutting channel occupy a relatively large portion of the attached drawing, while the glass core board 102 and the add-on structure 104 occupy a smaller proportion. However, in actual processing, the width of the encapsulation channel and the cutting channel is much smaller than the unit size after the glass substrate is divided. Although the location of the cutting channel in the attached drawing is not connected to the add-on structure, in actual processing, the distance between the side wall of the cutting channel and the add-on structure is very close. The cutting process and cutting structure of the cutting channel will affect the stress release of the add-on structure.

[0058] In one embodiment, such as Figure 6 As shown, the waist of the inverted trapezoid of the cutting path can be set as... Figure 6 The stepped shape shown in the diagram involves removing less material as each step approaches the glass core, resulting in a narrower cut track. By maintaining the scanning pattern size of the first laser beam at a certain processing depth and then reducing it, and repeating this process sequentially, the stepped cut track is generated.

[0059] Furthermore, in one embodiment, such as Figure 7 As shown, multiple layers of blocking structures can be pre-embedded within the encapsulation channel. These blocking structures are distributed in pairs within the channel, with the opening distance between each pair equal to the width of the cutting path at the corresponding processing depth. The closer to the glass core, the smaller the opening distance between the pairs of blocking structures. The damage threshold of the blocking structures to the first laser beam is much greater than the damage threshold of the insulating material within the encapsulation channel. Therefore, when simultaneously irradiated by the first laser beam, the insulating material within the encapsulation channel is removed, while the blocking structures are preserved.

[0060] Specifically, the first laser beam removes the added-layer structure at the packaging channel along the cutting path until it irradiates the blocking structure. The blocking structure blocks the first laser beam, ensuring the step-shaped flatness of the cutting path, thus enabling the processing of a cutting path with a stable step-shaped morphology at the waist. Moreover, since the morphology of the cutting path is controlled by the blocking structure, there is no need to adjust the scanning pattern size of the first laser beam with the processing depth, which simplifies the laser control process.

[0061] Setting the cutting shape to a stepped shape allows for step-by-step grooving, ensuring each step stops above the blocking structure. This facilitates simple and precise control of the step-by-step process, resulting in a more standardized stepped waist. This method eliminates the need to adjust the scanning pattern size of the first laser beam, simplifying operation and achieving higher grooving accuracy. Furthermore, using a stepped grooving method for the cutting path helps gradually release stress in each layer during the grooving process of the added-layer structure, preventing plate bursting during cutting.

[0062] In some embodiments, exemplarily, in the inverted trapezoidal cross-section of the cutting path, the width of the side of the inverted trapezoid closest to the glass core is used as the cutting width of the cutting path; that is, the shorter base of the trapezoid is selected as the cutting width. Therefore, in the glass substrate cutting method of this application, the cutting width of the cutting path can be set to 0.15mm-2.5mm, that is, the cutting width closest to the glass core is set to the range of 0.15mm to 2.5mm. A cutting width that is too small is not conducive to effective stress release during grooving, while a cutting width that is too large will reduce the effective utilization area of ​​the glass substrate and may even reduce the cutting efficiency of the glass substrate. A cutting width of 0.15mm-2.5mm not only takes into account stress release, glass substrate utilization, and cutting efficiency, but also is suitable for processing requirements involving mechanical cleaving or CO2 laser cleaving of the modified area of ​​the glass substrate, making it more widely applicable and easier to process.

[0063] In one embodiment, the second laser 130 emits a second laser beam to modify the glass core 102 of the glass substrate 100, specifically by modifying the glass core along the location of the cutting path.

[0064] The second laser beam can be generated by a second laser. This second laser beam is an ultrafast laser beam output from the second laser, with a pulse width less than or equal to picoseconds. It can be controlled by a Bezier cutting head to form a slender, columnar focusing region inside the glass core, generating a high peak power density. This causes localized vaporization or modification of the glass core, forming microcracks or modified channels. After inducing microcracks inside the glass core, the ultrafast laser beam is distributed along the scanning path of the glass core, distributing each microcrack along the cutting path to form continuous weakening lines. The location of these weakening lines is called the modification region, such as... Figure 8 As shown. In this way, a second laser beam can be used to modify the interior of the exposed glass core along the cutting path, changing the molecular structure of that region of the glass core, making the glass core along each cutting path easier to break, and then the glass substrate can be divided by simple mechanical processing or laser processing.

[0065] Specifically, such as Figure 8As shown, during the processing of the glass substrate 100, after the first laser 110 forms a cutting path on the surface of the glass substrate 100, the second laser 130 outputs a second laser beam, causing a change in the local structure of the glass substrate at the exposed position corresponding to the cutting path, forming a modified zone that facilitates subsequent cleaving. In this embodiment, the second laser 130 modifies the glass core 102 of the glass substrate 100, enabling precise control of the fracture process of the glass core 102. Through controllable fracture, the generation of glass core fragments or small glass particles is reduced, ensuring high efficiency and high quality in the processing of the glass substrate 100.

[0066] In one exemplary embodiment, the wavelength of the second laser beam can be infrared or green light. In a specific embodiment, the second laser can be an infrared femtosecond laser with a wavelength of 1030 nm, an infrared picosecond laser with a wavelength of 1064 nm, a green femtosecond laser with a wavelength of 532 nm, or a green picosecond laser.

[0067] In summary, this step of the present application, based on the output of a second laser beam along the cutting path, can accurately modify glass core sheets with the added-layer structure removed, while minimizing the impact on the added-layer structure. Through multi-focal internal focusing, the second laser beam can form a modified layer inside the glass core sheet, enabling high-precision and high-efficiency glass cutting and microstructure processing.

[0068] Furthermore, both the first laser beam and the second laser beam can be ultrafast laser beams with green wavelengths. In this case, the first laser 110 and the second laser 130 can be the same laser. It is only necessary to split the green ultrafast laser beam emitted by the green ultrafast laser (e.g., a green picosecond laser beam or a green femtosecond laser beam) into at least two beams in the optical path through a beam splitting device. One of the laser beams can be transmitted to the glass substrate 100 using a beam deflection device for grooving the added-layer structure 104. The other laser beam can be transmitted to the glass substrate 100 using a Bezier cutting head for modifying the grooved glass substrate to facilitate the laser cutting process of the glass substrate.

[0069] The glass substrate 100 is processed in layers by using the two lasers in combination. Different lasers are used to process different structures according to the composition and material properties of the glass substrate 100. First, the first laser is used to make precise grooves on the layer material 104 on the surface of the glass core plate 102. Then, the second laser is used to modify the glass core plate 102 at the grooved position. This controls the generation of glass fragments and glass particles during the cutting process, and achieves efficient and high-quality cutting of the glass substrate 100.

[0070] Furthermore, after the second laser 130 emits the second laser beam, the glass core plate 102 can be broken along the modified region by a cleaving process.

[0071] In some embodiments, the cleaving process can be performed by a cleaving mechanism, i.e., the glass substrate cutting system further includes a cleaving mechanism. The cleaving mechanism can be a mechanical cleaving mechanism, for example, it can use mechanical force to create cracks in the glass substrate along the modified glass core area to complete the cleaving. For instance, a cutting wheel with a certain hardness is used to scribble lines along the modified area of ​​the glass substrate to form cracks, while simultaneously applying external force to deepen the scribing cracks and penetrate the entire glass substrate, thereby completing the cleaving.

[0072] Alternatively, the glass substrate forming the modified region can be cleaved using laser cleaving. In one embodiment, the cleaving mechanism of the glass substrate cutting system may include a laser cleaving mechanism. This mechanism uses laser energy to reduce the connection strength of the glass substrate along the modified glass core region, thereby completing the cleaving. Figure 9 As shown, the laser cleaving mechanism is a third laser 150, which generates a third laser beam. When the third laser beam moves and scans along the modified region of the glass core plate 102, it greatly reduces the bonding strength between the materials in the modified region. Then, by applying external force or other means, the glass core plate 102 is cleaved along the modified region. For example, the third laser 150 can be a CO2 laser, and the third laser beam is a CO2 laser beam.

[0073] It is understood that, in addition to mechanical cleaving and laser cleaving, other feasible cleaving processing methods, such as ultrasonic cleaving and thermal cleaving, can also be used for the cleaving treatment of the modified region of the glass substrate. This disclosure does not limit the specific processing method of cleaving treatment.

[0074] In one exemplary embodiment, such as Figure 10 As shown, the glass substrate cutting system also includes a beam adjustment mechanism 190, which is used to control the laser beams output by the first laser 110 and / or the second laser 130.

[0075] The beam adjustment mechanism 190 can control the transmission direction, focusing position, spot size and shape, spot energy distribution density and spot scanning deflection direction of the laser beam to complete the laser cutting process of the glass substrate according to the processing requirements.

[0076] Furthermore, the beam adjustment mechanism includes a first beam adjustment mechanism and a second beam adjustment mechanism. The first beam adjustment mechanism includes beam deflection devices, such as galvanometers, rotating mirrors, AODs, etc.; the second beam adjustment mechanism includes a Bezier cutter head.

[0077] The first beam adjustment mechanism is used to regulate the first laser beam emitted by the first laser, such as shaping, transmission, focusing and scanning, so that the original laser pulse emitted by the first laser forms a spot with a specific shape and energy distribution density at the groove processing position of the glass substrate. The beam deflection device controls the spot to move and scan along the cutting path on the glass substrate to form a cutting track on the glass substrate.

[0078] The second beam adjustment mechanism is used to regulate the second laser beam emitted by the second laser, such as shaping, transmission, focusing and scanning, so that the original laser pulse emitted by the second laser forms a spot with a specific shape and energy distribution density at the modification processing position of the glass substrate. The spot is controlled by the Bezier cutting head to move and scan along the cutting path on the glass substrate to form a modification area on the glass substrate.

[0079] Based on the same technical concept, this application also provides a glass substrate cutting system for cutting glass substrates, including a first laser processing device and a second laser processing device. The first laser processing device is used to perform grooving processing on the glass substrate, and the second laser processing device is used to perform modification processing on the grooved glass substrate.

[0080] The first laser processing device includes a first laser, a first beam adjustment mechanism, and a first processing platform. The first beam adjustment mechanism includes a beam deflection device for controlling the first laser beam emitted by the first laser and performing grooving processing on the glass substrate to be processed placed on the first processing platform. The second laser processing device includes a second laser, a second beam adjustment mechanism, and a second processing platform. The second beam adjustment mechanism includes a Bezier cutting head for controlling the second laser beam emitted by the second laser and performing modification processing on the grooved glass substrate placed on the second processing platform.

[0081] The first laser and the first beam adjustment mechanism in the first laser processing apparatus, and the second laser and the second beam adjustment mechanism in the second laser processing apparatus, have been described above and will not be repeated here.

[0082] A first processing platform is positioned corresponding to a first laser and is used to place the glass substrate to be processed. The glass substrate processed on the first processing platform of the first laser processing apparatus is a glass substrate that has not yet undergone grooving or modification processing. The glass substrate to be processed is placed on the first processing platform so that the first laser, under the control of the first beam adjustment mechanism, emits a first laser beam to perform grooving processing on the glass substrate.

[0083] The second processing platform is positioned corresponding to the second laser and is used to place the grooved glass substrate. The glass substrate processed on the second processing platform of the second laser processing device is a grooved glass substrate, which may be a glass substrate with grooving completed on both sides of the add-on structure. The grooved glass substrate is placed on the second processing platform so that the second laser, under the control of the second beam adjustment mechanism, emits a second laser beam to modify the grooved glass substrate. Specifically, the second laser beam modifies the glass core board at the location of the cutting path formed by the grooving process.

[0084] This application also provides a glass substrate cutting apparatus for cutting glass substrates, including a controller, a first laser, a second laser, a beam adjustment mechanism, and a processing platform. The processing platform is used to support the glass substrate to be processed. The controller is connected to the first laser and the second laser, and is used to control the first laser to perform grooving processing and to control the second laser to perform modification processing. The beam adjustment mechanism is used to adjust the first laser beam emitted by the first laser and the second laser beam emitted by the second laser.

[0085] The first laser, the second laser, and the beam adjustment mechanism have been described above and will not be repeated here.

[0086] The processing platform is used to support the glass substrate to be processed. The controller can control the first laser and the second laser based on a preset program. First, the first laser is controlled to emit the first laser beam. Under the control of the beam adjustment mechanism, the glass substrate to be processed is grooved. Then, the second laser is controlled to emit the second laser beam. Under the control of the beam adjustment mechanism, the grooved glass substrate is modified.

[0087] Optionally, the controller can be connected to a beam adjustment mechanism and / or a processing platform, and control the beam adjustment mechanism and / or processing platform to cooperate in completing the glass substrate cutting through a preset program.

[0088] Furthermore, such as Figure 11 As shown, the processing platform 170 includes a fixing device 172 and a flipping device 174. The glass substrate 100 is fixed based on the fixing device 172, and the flipping device 174 is used to control the glass substrate 100 to flip when triggered, such as vacuum adsorption flipping, clamping flipping, or other corresponding vacuum adsorption or robotic arm structures. After flipping the first material layer and the second material layer, the first laser 110 is controlled to perform grooving processing on the second material layer.

[0089] Specifically, a first laser is positioned on the glass substrate near the first material layer. The first laser is controlled to emit a first laser beam along the cutting path, causing the laser beam to react with the first material layer and remove it from the corresponding position along the cutting path. After the first material layer is removed, a second material layer needs to be removed. This can be achieved by controlling the glass substrate to rotate, causing the first material layer facing the first laser to shift so that the second material layer faces the first laser, allowing the laser beam from the first laser to process the second material layer.

[0090] In this embodiment, when dealing with an add-on structure comprising a first material layer and a second material layer, two different solutions can be provided: adding a first laser to perform grooving on both the first and second material layers respectively; or setting a flipping mechanism to flip the glass substrate to complete the grooving of both material layers. This accurate removal of the add-on structure facilitates subsequent cutting of the glass core and ensures the accuracy of the glass substrate processing.

[0091] In one embodiment, the glass substrate cutting apparatus further includes a cleaving mechanism, and a controller is connected to the cleaving mechanism. The controller is used to control the cleaving mechanism to cleave the modified glass substrate. Specifically, the controller can control the cleaving mechanism to cleave the modified glass core board based on a preset program. The cleaving mechanism has been described above and will not be repeated here.

[0092] In one embodiment, the beam adjustment mechanism includes a first beam adjustment mechanism and a second beam adjustment mechanism. The first beam adjustment mechanism includes a beam deflection device for controlling the first laser beam emitted by the first laser. The second beam adjustment mechanism includes a Bezier cutter for controlling the second laser beam emitted by the second laser. The first and second beam adjustment mechanisms have been described above and will not be repeated here.

[0093] To better illustrate the various embodiments of this application, one embodiment will be used as an example for explanation.

[0094] In one embodiment, the glass substrate cutting system includes a first laser, a second laser, a cleaving mechanism, a beam adjustment mechanism, and a processing platform. The first and second lasers are respectively equipped with a first beam adjustment mechanism and a second beam adjustment mechanism on their optical paths. The first laser beam emitted by the first laser passes through the first beam adjustment mechanism and acts on the glass substrate to be processed, placed on the first processing platform, to perform grooving processing on the layered structure of the glass substrate to be processed, forming a cutting path. The grooved glass substrate is then transferred to the second processing platform. The second laser beam emitted by the second laser passes through the second beam adjustment mechanism and acts on the glass substrate to be processed, placed on the second processing platform, to perform modification processing along the cutting path on the glass substrate to be processed, forming a modified region. The cleaving mechanism cleaves the glass substrate along the modified region, causing the glass substrate to split into units of specific sizes along the modified region.

[0095] Furthermore, the beam adjustment mechanism includes a first beam adjustment mechanism and a second beam adjustment mechanism. The first beam adjustment mechanism includes beam deflection devices, such as galvanometers, rotating mirrors, and AOD (Alternating Optical Discharge) devices; the second beam adjustment mechanism includes a Bezier cutting head. The first beam adjustment mechanism is used to control the first laser beam emitted by the first laser, such as shaping, transmission, focusing, and scanning, so that the original laser pulse emitted by the first laser forms a spot of a specific shape and energy distribution density at the grooving processing position of the glass substrate. The beam deflection device controls the spot to move and scan along the cutting path on the glass substrate, forming a cutting path on the glass substrate. The second beam adjustment mechanism is used to control the second laser beam emitted by the second laser, such as shaping, transmission, focusing, and scanning, so that the original laser pulse emitted by the second laser forms a spot of a specific shape and energy distribution density at the modification processing position of the glass substrate. The Bezier cutting head controls the spot to move and scan along the cutting path on the glass substrate, forming a modified area on the glass substrate.

[0096] The first laser is selected from lasers with wavelengths in the ultraviolet to green range. More specifically, it can be an ultrafast laser with wavelengths of 343nm-532nm and pulse widths less than or equal to picoseconds. The second laser is selected from ultrafast lasers with output laser pulse widths less than or equal to picoseconds. More specifically, it can be an ultrafast laser with wavelengths of infrared or green light, including an infrared femtosecond laser with a wavelength of 1030nm, an infrared picosecond laser with a wavelength of 1064nm, a green femtosecond laser with a wavelength of 532nm, or a green picosecond laser. The cleaving mechanism can be a mechanical cleaving mechanism or a laser cleaving mechanism.

[0097] The cutting path of the glass substrate is obtained, and the first laser is controlled to emit a first laser beam along the cutting path to perform grooving processing on the added-layer structure along the cutting path to form a cutting channel; the second laser is controlled to output a second laser beam along the cutting path to perform modification treatment on the glass core board at the corresponding position of the cutting channel to form a modified area; the cleaving mechanism is controlled to perform cleaving treatment on the glass substrate along the modified area to break the modified glass core board.

[0098] In this embodiment, a first laser is used to slot the layered structure of the glass substrate, and a second laser is used to modify the glass core plate, so that the glass core plate is easy to break under the action of the cleaving mechanism. This can efficiently cut the glass substrate and solve the problem of low efficiency of current cutting technology when dealing with glass substrates.

[0099] It is understood that the embodiments of this disclosure describe only the cutting and processing of glass substrates with a glass substrate as the intermediate core and an add-on structure mainly composed of copper layers and ABF thin film layers. However, the technical concept and implementation methods of this disclosure are also applicable to the grooving processing of add-on structures composed of other metal materials and other insulating materials, and also applicable to the cutting and processing of other encapsulation substrates with a non-glass substrate as the intermediate core. In related applications, the need to perform grooving processing of add-on structures composed of different materials with inverted trapezoidal cross sections, or the need to process encapsulation substrates that overcome stress problems of the core and add-on structure, all fall within the protection scope of this disclosure.

[0100] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0101] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A glass substrate cutting system, used for cutting glass substrates, characterized in that, The glass substrate cutting system includes a first laser and a second laser; the glass substrate includes a stacked add-on structure and a glass core plate; The first laser is used to emit a first laser beam, which performs grooving processing on the layered structure of the glass substrate to form a cutting path; the second laser is used to emit a second laser beam, which performs modification processing on the glass core plate at the location of the cutting path.

2. The glass substrate cutting system according to claim 1, characterized in that, The glass substrate cutting system further includes a cleaving mechanism for breaking the glass substrate along the modified glass core region.

3. The glass substrate cutting system according to claim 2, characterized in that, The cleaving mechanism includes a mechanical cleaving mechanism or a laser cleaving mechanism. The mechanical cleaving mechanism uses mechanical force to create cracks in the glass substrate along the modified glass core area to complete the cleaving. The laser cleaving mechanism uses laser energy to reduce the connection strength of the glass substrate along the modified glass core area to complete the cleaving.

4. The glass substrate cutting system according to claim 1, characterized in that, The wavelength of the first laser beam includes the ultraviolet to green light band, and the second laser beam output by the second laser is an ultrafast laser beam.

5. The glass substrate cutting system according to claim 4, characterized in that, The first laser beam is an ultrafast laser beam, and / or the wavelength of the second laser beam is infrared or green light.

6. The glass substrate cutting system according to claim 1, characterized in that, The glass substrate cutting system further includes a beam adjustment mechanism, which includes a first beam adjustment mechanism and a second beam adjustment mechanism. The first beam adjustment mechanism includes a beam deflection device for controlling the first laser beam emitted by the first laser; the second beam adjustment mechanism includes a Bezier cutter head for controlling the second laser beam emitted by the second laser.

7. A glass substrate cutting system, used for cutting glass substrates, characterized in that, It includes a first laser processing device and a second laser processing device. The first laser processing device is used to perform grooving processing on the glass substrate, and the second laser processing device is used to perform modification processing on the grooved glass substrate. The first laser processing apparatus includes a first laser, a first beam adjustment mechanism, and a first processing platform. The first beam adjustment mechanism includes a beam deflection device for controlling the first laser beam emitted by the first laser and for grooving the glass substrate to be processed placed on the first processing platform. The second laser processing apparatus includes a second laser, a second beam adjustment mechanism, and a second processing platform. The second beam adjustment mechanism includes a Bezier cutting head for controlling the second laser beam emitted by the second laser and modifying the grooved glass substrate placed on the second processing platform.

8. A glass substrate cutting apparatus, used for cutting glass substrates, characterized in that, The device includes a controller, a first laser, a second laser, a beam adjustment mechanism, and a processing platform. The processing platform is used to support the glass substrate to be processed. The controller is connected to the first laser and the second laser and is used to control the first laser to perform grooving processing and to control the second laser to perform modification processing. The beam adjustment mechanism is used to regulate the first laser beam emitted by the first laser and the second laser beam emitted by the second laser.

9. The glass substrate cutting apparatus according to claim 8, characterized in that, The glass substrate cutting device further includes a cleaving mechanism, and the controller is connected to the cleaving mechanism. The controller is used to control the cleaving mechanism to cleave the modified glass substrate.

10. The glass substrate cutting apparatus according to claim 8, characterized in that, The beam adjustment mechanism includes a first beam adjustment mechanism and a second beam adjustment mechanism. The first beam adjustment mechanism includes a beam deflection device for controlling the first laser beam emitted by the first laser. The second beam adjustment mechanism includes a Bezier cutter head for controlling the second laser beam emitted by the second laser.

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