Semiconductor silicon wafer grinding device

Abstract

The utility model relates to the technical field of semiconductor silicon wafer processing devices, and discloses a semiconductor silicon wafer grinding device which comprises a linear motor, a collecting tank, a dust suction box and a supply box which are placed in a processing area, a mechanical arm is movably arranged on the linear motor, and a grinding mechanism is arranged at the end of the mechanical arm. And a supply mechanism and a dust collection mechanism are arranged at the two ends of the grinding mechanism correspondingly, a grinding table is installed in the collecting tank, and a negative pressure mechanism is arranged in the grinding table. The grinding table is arranged, the negative pressure mechanism is arranged in the grinding table, and the semiconductor silicon wafer can be adsorbed through starting of the negative pressure mechanism, so that the grinding work on the semiconductor silicon wafer is facilitated; the grinding mechanism is arranged, so that grinding work is facilitated; and by arranging the supply mechanism, grinding liquid can be conveniently conveyed according to requirements, and effective grinding is achieved.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor silicon wafer processing equipment, specifically a semiconductor silicon wafer grinding device. Background Technology

[0002] Semiconductor silicon wafers, also known as silicon crystal wafers, are a crucial basic material for manufacturing integrated circuits and semiconductor devices. They are sheet-like objects made from silicon and are widely used in electronic devices such as mobile phones, computers, and televisions. During the processing of semiconductor silicon wafers, grinding equipment is used to remove the damaged layer on the surface of the wafer, achieving a flat and smooth state.

[0003] For some semiconductor silicon wafers that require polishing with polishing slurry, the polishing slurry is difficult to contact the semiconductor silicon wafer effectively, resulting in poor polishing effect. For some semiconductor silicon wafers that do not require polishing slurry, powder is generated during the polishing process. If it is not dealt with in time, it can easily affect subsequent polishing. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor silicon wafer grinding device that can perform grinding work with grinding slurry as needed, and can also adsorb the powder generated during grinding of the semiconductor silicon wafer surface when grinding without grinding slurry.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A semiconductor silicon wafer grinding apparatus includes a linear motor, a collection tank, a dust collection box, and a supply box placed in the processing area. A robotic arm is movably mounted on the linear motor, and a grinding mechanism is provided at the end of the robotic arm. A supply mechanism and a dust collection mechanism are respectively provided at both ends of the grinding mechanism. A grinding table is installed in the collection tank, and a negative pressure mechanism is provided inside the grinding table.

[0007] Furthermore, a slide is mounted on the linear motor, and the bottom of the robotic arm is mounted on the slide; the robotic arm is a five-axis robotic arm.

[0008] Furthermore, the grinding mechanism includes a protective shell, a grinding motor, and a grinding roller. The protective shell is installed at the end of the robotic arm, the grinding motor is installed on the side of the protective shell, the grinding roller is rotatably disposed inside the protective shell, and the output end of the grinding motor is drivenly connected to the grinding roller.

[0009] Furthermore, the supply mechanism includes a supply pipe, a mounting frame, and adjustable nozzles. The mounting frame is fixed to the side of the protective shell. One end of the supply pipe is connected to the supply box, and the other end is connected to the mounting frame. Multiple adjustable nozzles are provided and evenly arranged in the mounting frame. A regulating valve is installed on the supply pipe, and a connecting rod is connected to the regulating valve. The connecting rod is fixed to the protective shell. The supply pipe is a corrugated flexible hose.

[0010] Furthermore, the vacuuming mechanism includes a vacuum hood and a vacuum hose. One end of the vacuum hose is connected to the vacuum box, and the other end is connected to the vacuum hood. The vacuum hood is fixed to the side of the protective shell, and the vacuum hose is a corrugated flexible hose.

[0011] Furthermore, the grinding table is high in the middle and low around the edges. The negative pressure mechanism includes a through hole, a cover and a negative pressure motor. The through hole is evenly opened on the grinding table. The cover is installed inside the grinding table and connected to the through hole. The negative pressure motor is installed inside the grinding table. The negative pressure end of the negative pressure motor is connected to the bottom of the cover. A groove is provided between the grinding table and the collection tank for collecting the grinding liquid.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] This invention features a grinding table and a negative pressure mechanism inside the grinding table. The negative pressure mechanism can be activated to adsorb semiconductor silicon wafers, facilitating grinding. The grinding mechanism facilitates the grinding process. The supply mechanism allows for the delivery of grinding fluid as needed for effective grinding. The dust collection mechanism helps to collect powder generated during grinding, even when the grinding process is not involving the grinding fluid. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a partial front view of the supply mechanism, dust collection mechanism and grinding mechanism in this utility model;

[0016] Figure 3 This is a cross-sectional view of the grinding table in this utility model.

[0017] Figure label:

[0018] 1-Linear motor, 101-Slide, 2-Robotic arm, 3-Protective shell, 4-Grinding motor, 5-Dust hood, 6-Collection tank, 7-Grinding table, 701-Through hole, 702-Cover body, 703-Negative pressure motor, 8-Dust suction pipe, 9-Dust suction box, 10-Supply pipe, 11-Supply box, 12-Mounting bracket, 13-Adjustable nozzle, 14-Grinding roller, 15-Regulating valve. Detailed Implementation

[0019] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the present invention and should not be construed as limiting the scope of protection of the present invention.

[0020] Please see Figure 1-3 A semiconductor silicon wafer grinding device includes a linear motor 1, a collection tank 6, a dust collection box 9, and a supply box 11 placed in the processing area. A robotic arm 2 is movably mounted on the linear motor 1. A grinding mechanism is provided at the end of the robotic arm 2. A supply mechanism and a dust collection mechanism are respectively provided at both ends of the grinding mechanism. A grinding table 7 is installed in the collection tank 6. A negative pressure mechanism is provided inside the grinding table 7.

[0021] In practical use, by setting up a grinding table 7 and a negative pressure mechanism inside the grinding table 7, the semiconductor silicon wafer can be adsorbed by the activation of the negative pressure mechanism, thus facilitating the grinding work; by setting up a grinding mechanism, the grinding work can be carried out easily; by setting up a supply mechanism, the grinding fluid can be delivered according to the needs for effective grinding; by setting up a dust collection mechanism, the powder generated during the grinding process can be adsorbed even when the grinding fluid is not used, making it highly practical.

[0022] In this embodiment, a slide block 101 is mounted on the linear motor 1, and the bottom of the robotic arm 2 is mounted on the slide block 101. The robotic arm 2 is a five-axis robotic arm. Specifically, the linear motor 1 can be started to drive the slide block 101 to move, thereby driving the robotic arm 2 to move along the linear motor 1. At the same time, the robotic arm 2 is set as a five-axis robotic arm, which facilitates the grinding mechanism to perform grinding work on the semiconductor silicon wafer from multiple directions.

[0023] In this embodiment, the grinding mechanism includes a protective shell 3, a grinding motor 4, and a grinding roller 14. The protective shell 3 is installed at the end of the robotic arm 2, the grinding motor 4 is installed on the side of the protective shell 3, and the grinding roller 14 is rotatably disposed inside the protective shell 3. The output end of the grinding motor 4 is drivenly connected to the grinding roller 14. Specifically, the grinding roller 14 can be moved by starting the grinding motor 4, thereby facilitating the grinding of the adsorbed semiconductor silicon wafer. The protective shell 3 can prevent powder from splashing during the grinding process.

[0024] In this embodiment, the supply mechanism includes a supply pipe 10, a mounting frame 12, and adjustable nozzles 13. The mounting frame 12 is fixed to the side of the protective shell 3. One end of the supply pipe 10 is connected to the supply box 11, and the other end is connected through the mounting frame 12. Multiple adjustable nozzles 13 are provided and evenly arranged in the mounting frame 12. A regulating valve 15 is installed on the supply pipe 10, and a connecting rod is connected to the external of the regulating valve 15. The connecting rod is fixed to the protective shell 3. The supply pipe 10 is a corrugated hose. Specifically, the grinding fluid can be supplied to the mounting frame 12 through the supply pipe 10 and sprayed out through the adjustable nozzles. The regulating valve 15 can adjust the flow rate of the grinding fluid, so that the adjustable nozzles 13 can spray the grinding fluid according to the needs. The supply pipe 10 is made into a corrugated hose to facilitate the movement of the robotic arm 2.

[0025] In use, adjust the adjustable nozzle 13 as needed to better align the grinding roller 14 with the semiconductor silicon wafer and provide it with grinding fluid.

[0026] In this embodiment, the dust collection mechanism includes a dust collection hood 5 and a dust collection pipe 8. One end of the dust collection pipe 8 is connected to the dust collection box 9, and the other end is connected to the dust collection hood 5. The dust collection hood 5 is fixed to the side of the protective shell 3. The dust collection pipe 8 is a corrugated hose. Specifically, suction can be generated by the dust collection pipe 8, and the dust collection hood 5 can be used to adsorb the powder generated during the grinding process.

[0027] The supply box 11 contains grinding fluid and a supply pump body. The output end of the supply body is connected to the supply pipe 10. By activating the supply pump body, the grinding fluid is delivered to the supply pipe 10. The setting of the supply pump body is prior art and therefore will not be described in detail in the specification and accompanying drawings.

[0028] The dust collection box 9 is equipped with a dust collection motor. The dust collection end of the dust collection motor is connected to the dust collection pipe 8. When the dust collection motor is started, the dust collection pipe 8 can generate suction, thereby adsorbing the powder generated during the grinding process through the dust collection hood 5 into the dust collection box 9. The dust collection motor is a prior art and therefore will not be described in detail in the instruction manual and the accompanying drawings.

[0029] In this embodiment, the grinding table 7 is higher in the middle and lower around the edges. The negative pressure mechanism includes a through hole 701, a cover 702, and a negative pressure motor 703. The through holes 701 are evenly distributed on the grinding table 7. The cover 702 is installed inside the grinding table 7 and communicates with the through holes 701. The negative pressure motor 703 is installed inside the grinding table 7, and the negative pressure end of the negative pressure motor 703 is connected to the bottom of the cover 702. A groove is provided between the grinding table 7 and the collection tank 6 for collecting the grinding liquid. Specifically, a semiconductor silicon wafer can be placed on the grinding table 7, and the negative pressure motor 703 can be started, so that the cover 702 can drive the through holes 701 to generate negative pressure, adsorbing the placed semiconductor silicon wafer and fixing it.

[0030] As required, a discharge port can be opened on the side of the collection tank 6 and a valve can be installed. The installation of the discharge port and valve is prior art and therefore will not be described in detail in the instruction manual and its accompanying drawings.

[0031] When in use, the semiconductor silicon wafer will completely cover the through hole 701. Therefore, when the polishing slurry is sprayed to assist polishing, the polishing slurry will flow from the periphery of the polishing table 7 into the groove between the collection tank 6 and the polishing table 7, and will not flow directly into the interior of the polishing table 7 through the through hole 701.

[0032] Working principle: The operator places the semiconductor silicon wafer to be processed on the grinding table 7, completely covering the through hole 701. The negative pressure motor 703 is started, so that the cover 702 can drive the through hole 701 to generate negative pressure, adsorbing the placed semiconductor silicon wafer and fixing it. After fixing, the linear motor 1 and the robotic arm 2 are controlled to drive the grinding mechanism to perform comprehensive grinding work on the semiconductor silicon wafer. Depending on the grinding requirements, it is selected whether to use grinding fluid for grinding. If grinding fluid is selected for grinding, the supply pump is controlled to deliver grinding fluid to the supply pipe 10, and the flow rate of grinding fluid is adjusted by the regulating valve 15. The spray direction of grinding fluid is adjusted by adjusting the adjustable nozzle 13 so that it can be better aligned with the position of the grinding roller 14 and the semiconductor silicon wafer to provide grinding fluid. If grinding fluid is not required for grinding, the dust collection motor is started during the grinding process, so that the dust suction pipe 8 can generate suction, thereby adsorbing the powder generated during the grinding process into the dust collection box 9 through the dust suction hood 5.

[0033] It should be noted that in this document, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, unless otherwise explicitly specified and limited, the terms "fixed," "installed," "connected," and "linked" should be interpreted broadly. For example, "linked" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a mechanical connection or an electrical connection; "linked" can be a direct connection, an indirect connection through an intermediate medium, or a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0034] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model, and they should all be covered within the scope of the claims and specification of this utility model.

Claims

1. A semiconductor silicon wafer grinding apparatus, comprising a linear motor (1) placed in the processing area, a collection tank (6), a dust collection box (9), and a supply box (11), characterized in that: A mechanical arm (2) is movably mounted on the linear motor (1). A grinding mechanism is provided at the end of the mechanical arm (2). A supply mechanism and a dust collection mechanism are respectively provided at both ends of the grinding mechanism. A grinding table (7) is installed in the collection tank (6). A negative pressure mechanism is provided inside the grinding table (7). The grinding mechanism includes a protective shell (3), a grinding motor (4) and a grinding roller (14). The protective shell (3) is installed at the end of the robotic arm (2), the grinding motor (4) is installed on the side of the protective shell (3), and the grinding roller (14) is rotatably installed inside the protective shell (3). The output end of the grinding motor (4) is connected to the grinding roller (14) for driving. The supply mechanism includes a supply pipe (10), a mounting frame (12), and an adjustable nozzle (13). The mounting frame (12) is fixed to the side of the protective shell (3). One end of the supply pipe (10) is connected to the supply box (11), and the other end is connected to the mounting frame (12). Multiple adjustable nozzles (13) are provided and evenly arranged in the mounting frame (12). A regulating valve (15) is installed on the supply pipe (10). A connecting rod is connected to the regulating valve (15), and the connecting rod is fixed on the protective shell (3). The supply pipe (10) is a corrugated hose. The vacuuming mechanism includes a vacuum hood (5) and a vacuum pipe (8). One end of the vacuum pipe (8) is connected to the vacuum box (9), and the other end is connected to the vacuum hood (5). The vacuum hood (5) is fixed to the side of the protective shell (3). The vacuum pipe (8) is a corrugated hose.

2. The semiconductor silicon wafer grinding apparatus according to claim 1, characterized in that: The linear motor (1) is equipped with a slide (101), and the bottom of the robotic arm (2) is mounted on the slide (101). The robotic arm (2) is a five-axis robotic arm.

3. The semiconductor silicon wafer grinding apparatus according to claim 1, characterized in that: The grinding table (7) is high in the middle and low around the edges. The negative pressure mechanism includes a through hole (701), a cover (702) and a negative pressure motor (703). The through hole (701) is evenly opened on the grinding table (7). The cover (702) is installed inside the grinding table (7) and is connected to the through hole (701). The negative pressure motor (703) is installed inside the grinding table (7). The negative pressure end of the negative pressure motor (703) is connected to the bottom of the cover (702). A groove is provided between the grinding table (7) and the collection tank (6) for collecting grinding liquid.

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