Rotary BGA chip clamping device

By combining the rotating and sliding components of the rotary BGA chip clamping device, the problem of unstable clamping is solved, achieving automatic and continuous clamping, and improving processing accuracy and work efficiency.

CN224223676UActive Publication Date: 2026-05-12李南极
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
李南极
Filing Date
2025-05-29
Publication Date
2026-05-12

AI Technical Summary

Technical Problem

Existing BGA chip clamping devices cannot provide a constant clamping force under thermal expansion and contraction, resulting in unstable clamping and affecting processing accuracy and work efficiency.

Method used

The rotary clamping device uses a combination of rotating, sliding, and clamping components to automatically and continuously clamp BGA chips of different specifications. The design of the turntable and guide rod allows the slider to slide in the arc-shaped guide groove, providing a constant clamping force.

Benefits of technology

It achieves automatic and continuous clamping under thermal expansion and contraction, preventing loosening of the clamp and improving work efficiency and ease of use.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a rotary BGA chip clamping device, which comprises a supporting main disc, a rotating shaft, a rotating assembly, a sliding assembly and a clamping assembly, the top end of the rotating shaft is fixed with the rotating assembly, the bottom end of the rotating shaft is fixed with the middle part of the supporting main disc, the rotating assembly performs fixed-axis rotation above the supporting main disc by taking the rotating shaft as a supporting point, and the clamping assembly is fixed with the sliding assembly. The sliding assembly is installed between the rotating assembly and the supporting main disc, and the clamping assembly is arranged on the top of the rotating assembly and fixedly connected with the sliding assembly. Through cooperative operation of the rotating assembly, the sliding assembly and the clamping assembly, constant clamping force can be provided for BGA chips of different specifications, and the automatic and continuous clamping effect is achieved, so that clamping looseness caused by thermal expansion and cold contraction in the maintenance process is avoided, use is convenient and fast, and good practicability is achieved.
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Description

Technical Field

[0001] This utility model belongs to the field of electronic product repair technology, and in particular relates to a rotary BGA chip clamping device. Background Technology

[0002] In the processes of BGA chip soldering, testing, packaging and repair, clamping devices are required to fix the chip to ensure processing accuracy. For example, in the reflow soldering process, the chip position needs to be kept stable. The stability of the clamping device directly affects the processing accuracy and quality of the chip.

[0003] Currently, the most commonly used clamping methods in the industry are screw clamping and magnetic clamping. However, both of these clamping methods have obvious drawbacks in practical applications: 1) Screw clamping achieves point-to-point mechanical fixation. When changes in ambient temperature cause thermal expansion and contraction of the chip or clamping components, it cannot continuously provide a stable clamping force for the BGA chip, and the clamping is prone to loosening due to stress changes; 2) Magnetic clamping also faces similar problems. It relies on fixed magnetic points to attract the chip. Under the effect of thermal expansion and contraction, the contact state between the magnetic points and the chip changes, making it difficult to maintain a constant clamping force.

[0004] In existing technical solutions, whether screw-type or magnetic clamping, the point-to-point clamping structure cannot automatically adapt to dimensional changes caused by thermal expansion and contraction, resulting in persistent problems with unstable clamping. Furthermore, the need for frequent manual tightening of the clamping mechanism affects work efficiency. Utility Model Content

[0005] To address the problems mentioned above, this invention provides a rotary BGA chip clamping device. By cooperating with the rotating component, sliding component, and clamping component, it can provide a constant clamping force for BGA chips of different specifications, achieving an automatic and continuous clamping effect.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] A rotary BGA chip clamping device includes a support main disk, a rotating shaft, a rotating assembly, a sliding assembly, and a clamping assembly. The top end of the rotating shaft is fixed to the rotating assembly, and its bottom end is fixed to the middle of the support main disk. The rotating assembly rotates around the rotating shaft as a support point above the support main disk. The sliding assembly is installed between the rotating assembly and the support main disk. The clamping assembly is located on top of the rotating assembly and is fixedly connected to the sliding assembly.

[0008] Furthermore, the rotating assembly includes a turntable, a first guide rod, and a second guide rod. The bottom center of the turntable is fixed to the top of the rotating shaft. The first guide rod and the second guide rod are respectively located on the left and right sides of the rotating shaft and fixed to the bottom of the turntable. The sliding assembly is slidably sleeved on the first guide rod and the second guide rod. The bottom of the sliding assembly is connected to the supporting main disk, and its top is fixedly connected to the clamping assembly.

[0009] Furthermore, the sliding assembly includes a first slider and a second slider, which are symmetrically arranged on the upper and lower sides of the rotating shaft, and their ends are slidably sleeved on the first guide rod and the second guide rod, respectively. The bottom of the first slider and the second slider are both provided with guide pins, and the bottom end of the guide pins is connected to the supporting main disk. The clamping assembly is arranged on the top of the turntable and is fixed to the first slider and the second slider, respectively.

[0010] Furthermore, the clamping assembly includes a first clamping plate, a second clamping plate, and two sets of fasteners. The first clamping plate and the second clamping plate are respectively placed on the top of the turntable and are respectively fixed to the first slider and the second slider by the two sets of fasteners.

[0011] Furthermore, the upper and lower sides of the center of the main support disk are respectively provided with arc-shaped guide grooves. Both arc-shaped guide grooves are inclined at a certain angle. The bottom ends of the guide pins of the first slider and the second slider are respectively embedded in the two arc-shaped guide grooves and form a sliding fit with them.

[0012] Furthermore, the turntable has two sets of clamping slots, and the bottom ends of the two sets of fasteners pass through the two sets of clamping slots respectively to be fixed to the first slider and the second slider, and respectively press the first clamping plate and the second clamping plate onto the top of the turntable.

[0013] Furthermore, the bottom of the turntable is provided with two slots spaced apart, and the two ends of the first guide rod and the second guide rod are respectively fixed to the two ends of the two slots.

[0014] Furthermore, a fixed base plate is fixedly provided at the bottom of the supporting main plate, and an anti-slip pad is fixedly provided at the bottom edge of the fixed base plate.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] This utility model discloses a rotary BGA chip clamping device, which includes a support main disk, a rotating shaft, a rotating component, a sliding component, and a clamping component. By cooperating with the rotating component, the sliding component, and the clamping component, a constant clamping force can be provided for BGA chips of different specifications, achieving an automatic and continuous clamping effect. This prevents the clamping from loosening due to thermal expansion and contraction during the repair process, optimizes the cumbersome manual clamping of traditional BGA chips, and improves the efficiency of its repair work. The device is convenient and quick to use and has good practicality. Attached Figure Description

[0017] Figure 1 This is a front view schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is an exploded view of the overall structure of this utility model;

[0019] Figure 3 This is a top view of the overall structure of this utility model;

[0020] Figure 4 This is a bottom view of the overall structure of this utility model;

[0021] Figure 5 This is a bottom view of a partial structure of the present invention. Figure 1 ;

[0022] Figure 6 This is a bottom view of a partial structure of the present invention. Figure 2 ;

[0023] Figure 7 This is a top view of a partial structure of the present invention.

[0024] In the diagram, 1 is the main support plate, 11 is the arc-shaped guide groove, 2 is the rotating shaft, 3 is the rotating assembly, 31 is the turntable, 311 is the clamping slide, 312 is the slot, 32 is the first guide rod, 33 is the second guide rod, 4 is the sliding assembly, 41 is the first slider, 42 is the second slider, 43 is the guide pin, 5 is the clamping assembly, 51 is the first clamping plate, 52 is the second clamping plate, 53 is the fastener, 6 is the fixed base plate, and 7 is the anti-slip pad. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] In the description of this utility model, it should be understood that the orientation and positional relationship indicated by terms such as "upper", "lower", "left", "right", "front", "back", "bottom", "inner" and "outer" are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0027] As attached Figure 1-7 As shown in this embodiment of the present invention, a rotary BGA chip clamping device includes a support main disk 1, a rotating shaft 2, a rotating component 3, a sliding component 4, and a clamping component 5. The top end of the rotating shaft 2 is fixed to the rotating component 3, and its bottom end is fixed to the middle of the support main disk 1. The rotating component 3 rotates on a fixed axis above the support main disk 1 with the rotating shaft 2 as the support point. The sliding component 4 is installed between the rotating component 3 and the support main disk 1. The clamping component 5 is disposed on the top of the rotating component 3 and is fixedly connected to the sliding component 4.

[0028] The rotating assembly 3 includes a turntable 31, a first guide rod 32, and a second guide rod 33. The bottom center of the turntable 31 is fixed to the top of the rotating shaft 2. The first guide rod 32 and the second guide rod 33 are respectively located on the left and right sides of the rotating shaft 2 and fixed to the bottom of the turntable 31. The sliding assembly 4 is slidably sleeved on the first guide rod 32 and the second guide rod 33. The bottom of the sliding assembly 4 is connected to the supporting main disk 1, and its top is fixedly connected to the clamping assembly 5.

[0029] The sliding assembly 4 includes a first slider 41 and a second slider 42. The first slider 41 and the second slider 42 are symmetrically arranged on the upper and lower sides of the rotating shaft 2, and their two ends are respectively slidably sleeved on the first guide rod 32 and the second guide rod 33. The bottom of the first slider 41 and the second slider 42 are provided with guide pins 43. The bottom end of the guide pins 43 is connected to the supporting main disk 1. The clamping assembly 5 is arranged on the top of the turntable 31 and is fixed to the first slider 41 and the second slider 42 respectively.

[0030] The support main plate 1 has arc-shaped guide grooves 11 on the upper and lower sides of its middle part. Both arc-shaped guide grooves 11 are inclined at a certain angle. The opening of the arc-shaped guide groove 11 on the upper side faces downward and the opening of the arc-shaped guide groove 11 on the lower side faces upward. The bottom ends of the guide pins 43 at the bottom of the first slider 41 and the second slider 42 are respectively embedded in the two arc-shaped guide grooves 11 and form a sliding fit with them. The first slider 41 can slide in the arc-shaped guide groove 11 on the upper side through its guide pin 43, and the second slider 42 can slide in the arc-shaped guide groove 11 on the upper side through its guide pin 43.

[0031] The first guide rod 32 and the second guide rod 33 respectively constrain the radial sliding of the first slider 41 and the second slider 42. When the turntable 31 rotates around the rotation axis 2, the first guide rod 32 and the second guide rod 33 rotate synchronously with the turntable 31, and their spatial azimuth angle changes, causing the first slider 41 and the second slider 42 to slide relative to each other along the axial direction of the first guide rod 32 and the second guide rod 33. At the same time, the guide pins 43 at the bottom of the first slider 41 and the second slider 42 are constrained by the trajectory of the arc-shaped guide groove 11, so that the first slider 41 and the second slider 42 slide in an arc shape along the arc-shaped guide groove 11 on the upper and lower sides respectively.

[0032] Under the aforementioned dual constraints, after manually pressing and rotating the turntable 31 clockwise, the first slider 41 and the second slider 42 move away from each other along the arc-shaped guide groove 11 under the drive of the first guide rod 32 and the second guide rod 33. When the turntable 31 is released, under the constraints of the shape and tilt angle of the arc-shaped guide groove 11, the first slider 41 and the second slider 42 slide in the opposite direction along the original path due to inertia. Finally, the first slider 41 and the second slider 42 move towards each other along the arc-shaped guide groove 11, thereby driving the clamping assembly 5 to close and clamp the workpiece. At the same time, the turntable 31 rotates in the opposite direction and resets with the first guide rod 32 and the second guide rod 33.

[0033] Specifically, the clamping assembly 5 includes a first clamping plate 51, a second clamping plate 52, and two sets of fasteners 53. The first clamping plate 51 and the second clamping plate 52 are respectively placed on the top of the turntable 31 and are respectively fixed to the first slider 41 and the second slider 42 by the two sets of fasteners 53. When the first slider 41 and the second slider 42 are far apart, the first clamping plate 51 and the second clamping plate 52 are open. When the first slider 41 and the second slider 42 are close together, the first clamping plate 51 and the second clamping plate 52 are closed.

[0034] The turntable 31 has two sets of clamping slots 311. The bottom ends of the two sets of fasteners 53 pass through the two sets of clamping slots 311 and are fixed to the first slider 41 and the second slider 42, respectively, and press the first clamping plate 51 and the second clamping plate 52 onto the top of the turntable 31. The first clamping plate 51 and the second clamping plate 52 can move towards or away from each other on the two sets of clamping slots 311 of the turntable 31.

[0035] The bottom of the turntable 31 is provided with two slots 312 spaced apart, and the two ends of the first guide rod 32 and the second guide rod 33 are respectively fixed to the two ends of the two slots 312.

[0036] Reference Figure 4 The bottom of the main support plate 1 is fixedly provided with a fixed base plate 6, and the bottom edge of the fixed base plate 6 is fixedly provided with an anti-slip pad 7. The anti-slip pad 7 prevents the main support plate 1 from being driven to rotate when the turntable 31 rotates.

[0037] In a specific implementation of this utility model, the working principle of the rotary BGA chip clamping device is as follows:

[0038] Initial state reference Figure 3 , 5 6, 7, The first slider 41 and the second slider 42 are located in the middle of the first guide rod 32 and the second guide rod 33, and are in contact with the upper and lower sides of the rotating shaft 2. The guide pins 43 fixed at their bottoms are respectively located at the ends of the two arc-shaped guide grooves 11 that are close to each other. The first clamping plate 51 and the second clamping plate 52 are in a closed state.

[0039] When BGA chips need to be clamped and repaired, the turntable 31 is manually pressed and rotated clockwise. The first guide rod 32 and the second guide rod 33 fixed at its bottom rotate and change their positions. At this time, the first slider 41 and the second slider 42 are forced to slide to their ends under the constraint of the first guide rod 32 and the second guide rod 33. At the same time, the guide pin 43 fixed at its bottom slides in an arc in the two arc-shaped guide grooves 11, so that the first clamping plate 51 and the second clamping plate 52 move away from each other and are in an open state.

[0040] After the first clamping plate 51 and the second clamping plate 52 are opened to a certain distance, the maintenance personnel can place the BGA chip on the turntable 31 located between the first clamping plate 51 and the second clamping plate 52; then the turntable 31 is released, and under the constraint of the shape and tilt angle of the two arc-shaped guide grooves 11, the guide pins 43 fixed at the bottom of the first slider 41 and the second slider 42 slide in the opposite direction along the original path due to inertia. Finally, the first slider 41 and the second slider 42 move closer to each other in their original positions (i.e., the original end positions), thereby driving the first clamping plate 51 and the second clamping plate 52 to close and clamp the BGA chip, while giving the BGA chip an automatic and continuous clamping effect; at this time, the turntable 31 and the first guide rod 32 and the second guide rod 33 at its bottom return to their original positions.

[0041] When the BGA chip needs to be removed after the inspection is completed, continue to follow the above operation until the first clamping plate 51 and the second clamping plate 52 open a certain distance and no longer clamp the BGA chip, then it can be removed.

[0042] This utility model's rotary BGA chip clamping device can provide a constant clamping force for BGA chips of different specifications, achieving an automatic and continuous clamping effect. Therefore, the clamping will not loosen due to thermal expansion and contraction during the maintenance process. It is convenient, quick to use, and has good practicality.

[0043] In the above description, it should be noted that the terms "installation", "connection", "connection" and other such terms should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components.

[0044] The present invention has been described in detail above. The above description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made in accordance with the scope of this application should still fall within the scope of the present invention.

Claims

1. A rotary BGA chip clamping device, characterized in that: It includes a supporting main disk, a rotating shaft, a rotating assembly, a sliding assembly, and a clamping assembly. The top end of the rotating shaft is fixed to the rotating assembly, and its bottom end is fixed to the middle of the supporting main disk. The rotating assembly rotates around the rotating shaft as a support point above the supporting main disk. The sliding assembly is installed between the rotating assembly and the supporting main disk. The clamping assembly is located on the top of the rotating assembly and is fixedly connected to the sliding assembly.

2. The rotary BGA chip clamping device according to claim 1, characterized in that: The rotating assembly includes a turntable, a first guide rod, and a second guide rod. The bottom center of the turntable is fixed to the top of the rotating shaft. The first guide rod and the second guide rod are respectively located on the left and right sides of the rotating shaft and fixed to the bottom of the turntable. The sliding assembly is slidably sleeved on the first guide rod and the second guide rod. The bottom of the sliding assembly is connected to the supporting main disk, and its top is fixedly connected to the clamping assembly.

3. The rotary BGA chip clamping device according to claim 2, characterized in that: The sliding assembly includes a first slider and a second slider, which are symmetrically arranged on the upper and lower sides of the rotating shaft, and their ends are respectively slidably sleeved on the first guide rod and the second guide rod. The bottom of the first slider and the second slider are provided with guide pins, and the bottom end of the guide pins is connected to the supporting main plate. The clamping assembly is arranged on the top of the turntable and is fixed to the first slider and the second slider respectively.

4. The rotary BGA chip clamping device according to claim 3, characterized in that: The clamping assembly includes a first clamping plate, a second clamping plate, and two sets of fasteners. The first clamping plate and the second clamping plate are respectively placed on the top of the turntable and are respectively fixed to the first slider and the second slider by the two sets of fasteners.

5. The rotary BGA chip clamping device according to claim 3, characterized in that: The support main plate has arc-shaped guide grooves on the upper and lower sides of the middle part, and both arc-shaped guide grooves are inclined at a certain angle. The bottom ends of the guide pins of the first slider and the second slider are respectively embedded in the two arc-shaped guide grooves and form a sliding fit with them.

6. The rotary BGA chip clamping device according to claim 4, characterized in that: The turntable has two sets of clamping slots. The bottom ends of the two sets of fasteners pass through the two sets of clamping slots and are fixed to the first slider and the second slider, respectively, and press the first clamping plate and the second clamping plate onto the top of the turntable.

7. The rotary BGA chip clamping device according to claim 2, characterized in that: The bottom of the turntable has two slots spaced apart, and the two ends of the first guide rod and the second guide rod are respectively fixed to the two ends of the two slots.

8. The rotary BGA chip clamping device according to claim 1, characterized in that: The bottom of the supporting main plate is fixedly provided with a fixed base plate, and the bottom edge of the fixed base plate is fixedly provided with an anti-slip pad.