Grabbing manipulator compatible with various silicon wafer boxes

Abstract

The grabbing manipulator comprises a supporting seat, a height-adjustable supporting arm is arranged on the supporting seat, a cantilever bottom plate is arranged at the upper end of the supporting arm, and a plurality of silicon wafer boxes are arranged on the cantilever bottom plate. The cantilever bottom plate is provided with two groups of cantilever assembly seats with an adjustable distance, the cantilever assembly seats are driven by a multi-stage power driving assembly arranged on the supporting seat, the front ends of the cantilever assembly seats are provided with connecting arms, and one end, far away from the cantilever assembly seats, of each connecting arm is provided with a wafer box hanger hand used for clamping a silicon wafer wafer box. Compared with the prior art, the grabbing manipulator has the advantages that higher operation efficiency, accuracy and flexibility are provided in the silicon wafer box carrying process, the operation risk is reduced, and the silicon wafer cleaning machine is more efficient and reliable when processing silicon wafer boxes of different specifications.

Description

Technical Field

[0001] This application relates to the field of silicon wafer manufacturing technology, and more specifically to a gripping robot that is compatible with multiple silicon wafer cassettes. Background Technology

[0002] In the existing silicon wafer cassette handling process, silicon wafer cleaning machines clean silicon wafers of various sizes such as 4-inch, 6-inch, and 8-inch. Each time a different size cassette is changed, a mechanical hanger of a different size needs to be changed to clamp the cassette of that size, which takes a long time. If the installation is not in accordance with the requirements, it is easy to crush the silicon wafers inside the cassette, or if it is too loose, the cassette will fall off. Utility Model Content

[0003] To overcome the above-mentioned technical defects, this application provides a gripping robot that is compatible with various silicon wafer cassettes, enabling the robot to quickly switch between different opening and closing gaps. In other words, it can quickly grip silicon wafer cassettes of different sizes, and the gripping action is accurate.

[0004] According to this application, a gripping robot compatible with multiple silicon wafer cassettes includes a support base, on which a height-adjustable support arm is provided. The upper end of the support arm is provided with a cantilever base plate. The cantilever base plate is provided with two sets of adjustable-distance cantilever assembly seats, and the cantilever assembly seats are driven by a multi-stage power drive assembly provided on the support base. The front end of the cantilever assembly seat is provided with a connecting arm, and the end of the connecting arm away from the cantilever assembly seat is provided with a wafer cassette holder for clamping the silicon wafer cassette.

[0005] Preferably, two linear guide rails are provided opposite to each other on the cantilever base plate, and the bottoms of the two cantilever assembly seats are slidably connected to the two linear guide rails respectively through linear sliders.

[0006] Preferably, the multi-stage power drive assembly is an electric telescopic cylinder, and the output end of the electric telescopic cylinder is fixedly connected to the cantilever assembly seat.

[0007] Preferably, a number of position switches are arranged side by side on the cantilever base plate, and a position switch sensing piece that cooperates with the position switch is provided on one side of each of the two cantilever assembly seats.

[0008] Preferably, the interior of the support base is an installation cavity, the support base has an opening and the bottom end of the support arm passes through the opening and slides into the opening, a longitudinally arranged transmission screw is rotatably arranged in the installation cavity, the bottom end of the transmission screw is driven by a drive motor set at the bottom of the support base, and a lifting plate is also connected to the back of the bottom of the support arm and a transmission nut that is threaded into the transmission screw is provided on the lifting plate.

[0009] Compared with traditional technologies, the gripping robot compatible with multiple silicon wafer cassettes proposed in this application:

[0010] 1. Multi-specification compatibility: This gripping robot can hold silicon wafer cassettes of various sizes without the need to change mechanical hangers of different sizes, thereby reducing the time and effort required for the switching process and improving operational efficiency.

[0011] 2. Precise gripping: Through position switches and multi-stage power drive assembly, the robot can precisely position and grip silicon wafer cassettes, which ensures accurate gripping of silicon wafer cassettes of different sizes and reduces the risk of gripping errors.

[0012] 3. Height Adjustable: The robot can adjust the height of the silicon wafer cassette as needed to adapt to different working environments and requirements. This height adjustability helps to flexibly respond to different situations during operation.

[0013] In summary, the gripping robot of this application provides higher operational efficiency, precision and flexibility in the handling of silicon wafer cassettes, reduces operational risks, and makes the silicon wafer cleaning machine more efficient and reliable in handling silicon wafer cassettes of different specifications. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of a gripping robot compatible with multiple silicon wafer cassettes according to this application.

[0015] Figure 2 This is a partially enlarged structural diagram of the cantilever base plate of a gripping robot hand that is compatible with multiple silicon wafer cassettes, according to this application.

[0016] Figure 3 This is a schematic diagram of a gripping robot compatible with multiple silicon wafer cassettes for removing the front panel of a support base, according to this application.

[0017] Figure 4 This is a front view structural diagram of a gripping robot compatible with multiple silicon wafer cassettes for removing the front panel of a support base, according to this application.

[0018] Reference numerals: 1. Support base, 2. Support arm, 3. Cantilever base plate, 4. Cantilever assembly base, 5. Connecting arm, 6. Silicon wafer cassette, 7. Wafer cassette holder, 8. Linear guide rail, 9. Linear slider, 10. Electric telescopic cylinder, 11. Position switch, 12. Position switch sensor, 13. Mounting cavity, 14. Drive screw, 15. Drive motor, 16. Lifting plate, 17. Drive screw nut. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] Combined with appendix Figure 1 -Appendix Figure 4 A gripping robot compatible with multiple silicon wafer cassettes includes a support base 1, a height-adjustable support arm 2 on the support base 1, a cantilever base plate 3 at the upper end of the support arm 2, two sets of adjustable cantilever assembly seats 4 on the cantilever base plate 3, and the cantilever assembly seats 4 are driven by a multi-stage power drive assembly set on the support base 1. A connecting arm 5 is provided at the front end of the cantilever assembly seat 4, and a wafer cassette holder 7 for clamping silicon wafer cassettes 6 is provided at the end of the connecting arm 5 away from the cantilever assembly seat 4. The wafer cassette holder 7 is provided with a slot that conforms to the contour of the silicon wafer cassette 6, and the wafer cassette holder 7 is made of corrosion-resistant material.

[0021] In this embodiment, in order to stabilize the moving direction of the cantilever base plate 3, two linear guide rails 8 are provided on the cantilever base plate 3, and the bottoms of the two cantilever assembly seats 4 are slidably connected to the two linear guide rails 8 respectively through linear sliders 9.

[0022] In this embodiment, the multi-stage power drive assembly is an electric telescopic cylinder 10, and the output end of the electric telescopic cylinder 10 is fixedly connected to the cantilever assembly seat 4.

[0023] In this embodiment, a number of position switches 11 are arranged side by side on the cantilever base plate 3, and a position switch sensing piece 12 that cooperates with the position switch 11 is provided on one side of each of the two cantilever assembly seats 4. Each position switch 11 corresponds to the clamping position of a silicon wafer cassette 6 of a certain size; when a certain size of silicon wafer cassette 6 is set for clamping, the multi-stage power drive assembly drives the cassette holder hand 7 to stop at the position switch 11 corresponding to that silicon wafer cassette 6, thereby enabling precise clamping of silicon wafer cassette 6 of different sizes.

[0024] In this embodiment, in order to adjust the height of the silicon wafer cassette 6 as needed, the support base 1 has an internal mounting cavity 13. The support base 1 has an opening, and the bottom end of the support arm 2 passes through the opening and slides into it. A longitudinally arranged transmission screw 14 is rotatably mounted inside the mounting cavity 13. The bottom end of the transmission screw 14 is driven by a drive motor 15 located at the bottom of the support base 1. A lifting plate 16 is also connected to the back of the bottom of the support arm 2, and the lifting plate 16 has a transmission nut 17 that is threaded into the transmission screw 14. When the drive motor 15 is started, it drives the transmission screw 14 to rotate. The transmission screw 14, together with the transmission nut 17 and the lifting plate 16, drives the support arm 2 to rise and fall, thereby adjusting the height of the silicon wafer cassette 6 as needed. The sliding engagement between the support arm 2 and the opening stabilizes the rising and falling direction of the support arm 2.

[0025] Working Principle: In practical applications, the support base 1 of this gripping robotic arm silicon wafer cleaning machine is installed on the silicon wafer cleaning machine. The entire assembly moves via the transmission components on the silicon wafer cleaning machine. During operation, the operator inputs the size of the silicon wafer to be cleaned, for example, setting it to clamp a 6-inch silicon wafer cassette 6. The control center controls the multi-stage power drive assembly, which moves under the action of the linear guide rail 8 until the cantilever assembly base 4 moves to the position switch 11 corresponding to the 6-inch silicon wafer cassette 6. Stop, and at the same time, the wafer holder arm 7 has already clamped the 6-inch silicon wafer cassette 6; after the silicon wafer cassette 6 moves to the designated position, the control center controls the multi-stage power drive assembly to move outward to the maximum opening position. At this time, the silicon wafer cassette 6 is released. When it is necessary to clamp the silicon wafer cassette 6 to a certain height, the drive motor 15 is started to drive the rotation of the transmission screw 14. The transmission screw 14, together with the transmission nut 17 and the lifting plate 16, drives the support arm 2 to rise and fall, so that the height of the silicon wafer cassette 6 can be adjusted according to the needs.

[0026] The above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope defined by the claims of this application.

Claims

1. A gripping robot compatible with multiple silicon wafer cassettes, comprising a support base (1), characterized in that, The support base (1) is provided with a height-adjustable support arm (2), and the upper end of the support arm (2) is provided with a cantilever base plate (3). The cantilever base plate (3) is provided with two sets of adjustable distance cantilever assembly seats (4), and the cantilever assembly seats (4) are driven by a multi-stage power drive assembly set on the support base (1). The front end of the cantilever assembly seat (4) is provided with a connecting arm (5), and the end of the connecting arm (5) away from the cantilever assembly seat (4) is provided with a wafer cassette hanger hand (7) for clamping the silicon wafer cassette (6).

2. The gripping robot compatible with multiple silicon wafer cassettes according to claim 1, characterized in that, The cantilever base plate (3) is provided with two linear guide rails (8) facing each other, and the bottoms of the two cantilever assembly seats (4) are slidably connected to the two linear guide rails (8) respectively through linear sliders (9).

3. A gripping robot compatible with multiple silicon wafer cassettes according to claim 1 or 2, characterized in that, The multi-stage power drive assembly is an electric telescopic cylinder (10), and the output end of the electric telescopic cylinder (10) is fixedly connected to the cantilever assembly seat (4).

4. The gripping robot compatible with multiple silicon wafer cassettes according to claim 3, characterized in that, Several position switches (11) are arranged side by side on the cantilever base plate (3), and a position switch sensing piece (12) that cooperates with the position switch (11) is provided on one side of each of the two cantilever assembly seats (4).

5. A gripping robot compatible with multiple silicon wafer cassettes according to claim 1, characterized in that, The interior of the support base (1) is a mounting cavity (13). The support base (1) has an opening and the bottom end of the support arm (2) passes through the opening and slides with the opening. A longitudinally arranged transmission screw (14) is rotatably arranged inside the mounting cavity (13). The bottom end of the transmission screw (14) is driven by a drive motor (15) set at the bottom of the support base (1). A lifting plate (16) is also connected to the back of the bottom of the support arm (2), and a transmission nut (17) is provided on the lifting plate (16) that is threaded with the transmission screw (14).

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