Glue dripping and laminating device for gold stamping surface of package

Abstract

The utility model discloses a packaging gilding surface glue dripping and laminating device, which comprises a conveying main body and is provided with a positioning structure, and when the packaging gilding surface glue dripping and laminating operation is carried out, the conveying main body conveys a package to be processed to the lower part of the positioning structure. The air cylinder is started, the telescopic driving column stretches out to push the positioning sliding plate to descend, and the positioning column gradually gets close to the packaging gilding face. After the positioning columns make contact with the packaging gold stamping face, the springs can buffer and finely adjust the positioning force according to the contact condition, and stable positioning is guaranteed. If a certain deviation exists in the position of the packaging gilding surface, the positioning sliding plate slides in the sliding rail through the sliding block to keep stable in the up-down moving process, and meanwhile, the rotating plate can rotate around the second fixing shaft to drive the connecting rod to rotate around the first fixing shaft, so that the position and the angle of the positioning column are adjusted in a self-adaptive mode, and accurate positioning is achieved; and the accuracy of subsequent glue dripping and laminating operation is ensured.

Description

Technical Field

[0001] This utility model relates to the field of hot stamping technology in packaging, specifically a device for applying adhesive to hot stamping surfaces of packaging. Background Technology

[0002] In the packaging and printing industry, hot stamping imparts a beautiful metallic texture and unique visual effect to packaging, enhancing product quality. Meanwhile, epoxy resin lamination strengthens the abrasion resistance, gloss, and protective properties of the hot stamped areas, further elevating the packaging's perceived quality. As market demands for packaging quality continue to rise, the importance of epoxy resin lamination technology for hot stamping surfaces is becoming increasingly apparent. However, some existing epoxy resin lamination devices suffer from insufficient positioning accuracy. During the lamination process, precise alignment between the hot stamping surface and the adhesive is difficult, resulting in uneven adhesive coverage and limiting their effectiveness.

[0003] CN216733062U discloses a lamination device for producing laminated TPU, including a feeding mechanism, a tensioning device 1, and an adhesive bonding mechanism. The tensioning device 1 includes a tensioning roller 1, a tensioning roller 2, and a frame 2. The tensioning roller 1 and tensioning roller 2 are installed on the upper and lower sides of the frame 2. The adhesive bonding mechanism includes bonding boxes with open sides. The tensioning device 2, adhesive bonding device, and bonding device are sequentially arranged inside the bonding box on the side away from the electric push rod. The tensioning device 2 includes two tensioning rollers located above and below the bonding box, respectively. The adhesive bonding device includes a glue box located above the bonding box, with a glue tube below it. The other end of the glue tube extends into the bonding box from the outside of the front side wall and is connected to a dropper. A triangular scraper is connected below the dropper, and the scraper has several glue outlet holes evenly distributed on it. The bonding device includes two pressure rollers located above and below the bonding box, respectively. Compared with the prior art, this invention has the advantages of simple and reasonable structure, high bonding efficiency, and good bonding effect.

[0004] Regarding the aforementioned prior art, the inventors believe that it has the following shortcomings. The bonding device, through the arrangement of tensioning device one, tensioning device two, and two pressing rollers located above and below the bonding box, has the advantages of simple and reasonable structure, high bonding efficiency, and good effect. However, the positioning accuracy of some components in the existing packaging hot stamping surface epoxy bonding device is not good. During the epoxy bonding process, it is difficult to accurately align the hot stamping surface and the adhesive, resulting in uneven adhesive coverage, which has limitations. Utility Model Content

[0005] The purpose of this utility model is to provide a packaging hot stamping surface epoxy adhesive bonding device to solve the problem mentioned in the background art. The bonding device has the advantages of simple and reasonable structure, high bonding efficiency and good effect through the setting of tensioning device one, tensioning device two and two pressure rollers located above and below the bonding box. However, the positioning accuracy of some devices in the existing packaging hot stamping surface epoxy adhesive bonding device is not good. During the epoxy adhesive bonding process, it is difficult to accurately align the hot stamping surface and the adhesive, resulting in uneven adhesive coverage and limitations.

[0006] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0007] This utility model relates to a packaging hot stamping surface epoxy bonding device, comprising a conveying body:

[0008] The upper side of the conveying body is fixedly connected to a positioning structure, which includes a fixed frame, a fixed shaft three, a rotating column, a positioning arm, a positioning column, a fixed column two, and a spring.

[0009] The fixed frame is fixedly installed on the upper side of the conveying body. The third fixed shaft is movably connected to the inner side of the fixed frame. The rotating column is fixedly connected to the lower side of the third fixed shaft. The positioning arm is fixedly connected to one side of the rotating column. The positioning column is fixedly connected to the lower side of the positioning arm. The second fixed column is fixedly connected to the lower side of the fixed frame. The spring is fixedly connected to one side of the second fixed column.

[0010] Furthermore, a column is provided on the upper side of the positioning arm, and the column is connected to a fixed column two by a spring.

[0011] Furthermore, the positioning structure also includes a fixed column, a fixed plate, a cylinder, a telescopic drive column, and a positioning slide plate;

[0012] The first fixed column is fixedly connected to the upper side of the conveying body, the fixed plate is fixedly connected to the upper side of the first fixed column, the cylinder is fixedly connected to the upper side of the fixed plate, the telescopic drive column is movably connected to the inner cavity of the cylinder, and the positioning slide plate is movably disposed on the upper side of the telescopic drive column.

[0013] Furthermore, the positioning structure also includes a sliding track;

[0014] The sliding track is fixedly connected to the upper side of the fixed plate, and a slider is provided between the sliding track and the positioning slide plate.

[0015] Furthermore, the positioning structure also includes a fixed shaft one, a connecting rod, a rotating plate, and a fixed shaft two;

[0016] The first fixed shaft is fixedly connected to the upper side of the positioning slide plate, the connecting rod is movably connected to the outside of the first fixed shaft, the rotating plate is movably disposed on the lower side of the connecting rod, the second fixed shaft is movably connected to the inner cavity of the rotating plate, and the rotating plate is connected to the fixed plate through the second fixed shaft.

[0017] Furthermore, an adjustment structure is fixedly connected to the upper side of the conveying body. The adjustment structure includes a fixed column three, a motor, a bidirectional screw, a moving block one, and a driving rod one.

[0018] The fixed column three is fixedly connected to the upper side of the conveying body, the motor is fixedly connected to one side of the fixed column three, the bidirectional screw is movably connected to one side of the fixed column three, the moving block one is threadedly connected to the outside of the bidirectional screw, and the driving rod one is movably connected to one side of the moving block one.

[0019] Furthermore, the adjustment structure also includes a second movable block, a second driving rod, a fourth fixed column, a fifth fixed column, and a fitting body;

[0020] The second movable block is threaded to the outside of the bidirectional screw, the second driving rod is movably connected to one side of the second movable block, the fourth fixed post is movably connected to one end of the second driving rod, the fifth fixed post is fixedly connected to one side of the fourth fixed post, and the fitting body is fixedly connected to the lower side of the fifth fixed post.

[0021] This utility model has the following beneficial effects:

[0022] I. This utility model incorporates a positioning structure. During the adhesive bonding process on the hot-stamped packaging surface, the conveyor body transports the package to be processed to the area below the positioning structure. A cylinder is activated, extending and retracting to extend the positioning column, which in turn lowers the positioning slide plate, gradually bringing the positioning column closer to the hot-stamped packaging surface. Once the positioning column contacts the hot-stamped surface, a spring buffers and fine-tunes the positioning force based on the contact situation, ensuring stable positioning. If there is a slight deviation in the position of the hot-stamped packaging surface, the positioning slide plate remains stable during its up-and-down movement by sliding within a sliding track via a slider. Simultaneously, a rotating plate rotates around a fixed axis, causing a connecting rod to rotate around a fixed axis, thereby adaptively adjusting the position and angle of the positioning column to achieve precise positioning and ensure the accuracy of subsequent adhesive bonding operations.

[0023] II. Based on the aforementioned beneficial effects, an adjustment structure is also provided. When it is necessary to adjust the bonding position or bonding pressure between the bonding body and the hot-stamped surface of the packaging, the motor is activated. The motor drives the bidirectional screw to rotate. Due to the special structure of the bidirectional screw, moving block one and moving block two will move in opposite directions. Moving block one drives rod one, and moving block two drives rod two to move fixed post four, thereby adjusting the position of fixed post five and the bonding body installed on its lower side. For example, when facing packaging of different thicknesses or different epoxy bonding process requirements, the position of the bonding body can be adjusted to change its relative distance to the hot-stamped surface of the packaging, achieving precise bonding and improving the quality and effect of epoxy bonding. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the overall design of this utility model;

[0026] Figure 2 This is a schematic diagram of the connection of the fixing column of the positioning structure of this utility model;

[0027] Figure 3 This is a schematic diagram of the rotating column connection of the positioning structure of this utility model;

[0028] Figure 4 This is a schematic diagram of the three connections of the adjusting structure fixing column of this utility model.

[0029] The attached diagram lists the components represented by each number as follows:

[0030] In the diagram: 1. Conveying body; 2. Positioning structure; 3. Adjustment structure; 201. Fixed column one; 202. Fixed plate; 203. Cylinder; 204. Telescopic drive column; 205. Positioning slide plate; 206. Sliding track; 207. Fixed shaft one; 208. Connecting rod; 209. Rotating plate; 210. Fixed shaft two; 211. Fixed frame; 212. Fixed shaft three; 213. Rotating column; 214. Positioning arm; 215. Positioning column; 216. Fixed column two; 217. Spring; 301. Fixed column three; 302. Motor; 303. Bidirectional screw; 304. Moving block one; 305. Drive rod one; 306. Moving block two; 307. Drive rod two; 308. Fixed column four; 309. Fixed column five; 310. Fitting body. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0033] Please see Figure 1-4 As shown, this utility model is a packaging hot stamping surface epoxy bonding device, including a conveying body 1:

[0034] A positioning structure 2 is fixedly connected to the upper side of the conveying body 1. The positioning structure 2 includes a fixed frame 211, a fixed shaft 212, a rotating column 213, a positioning arm 214, a positioning column 215, a fixed column 216, and a spring 217.

[0035] The fixed frame 211 is fixedly installed on the upper side of the conveying body 1. The fixed shaft 212 is movably connected to the inner side of the fixed frame 211. The rotating column 213 is fixedly connected to the lower side of the fixed shaft 212. The positioning arm 214 is fixedly connected to one side of the rotating column 213. The positioning column 215 is fixedly connected to the lower side of the positioning arm 214. The fixed column 216 is fixedly connected to the lower side of the fixed frame 211. The spring 217 is fixedly connected to one side of the fixed column 216.

[0036] Fixed shaft 212 can rotate flexibly inside fixed frame 211, allowing the connected rotating column 213 to rotate accordingly. The rotating column 213 drives the positioning arm 214 to rotate. The positioning column 215 is installed on the lower side of the positioning arm 214 and is used to position the hot-stamped surface of the packaging. Fixed column 216 is installed on the lower side of fixed frame 211, and spring 217 is connected to one side of fixed column 216. When the positioning column 215 contacts the hot-stamped surface of the packaging, the spring 217 plays the role of buffering, fine-tuning the positioning force, and resetting.

[0037] A column is provided on the upper side of the positioning arm 214, and the column is connected to the fixing column 216 by a spring 217.

[0038] Spring 217 is positioned between the column and the fixed column 216. After the hot stamping positioning is completed, spring 217 drives the positioning arm 214 to reset.

[0039] The positioning structure 2 also includes a fixed column 201, a fixed plate 202, a cylinder 203, a telescopic drive column 204, and a positioning slide plate 205;

[0040] Fixed column 201 is fixedly connected to the upper side of the conveying body 1, fixed plate 202 is fixedly connected to the upper side of fixed column 201, cylinder 203 is fixedly connected to the upper side of fixed plate 202, telescopic drive column 204 is movably connected to the inner cavity of cylinder 203, and positioning slide plate 205 is movably set on the upper side of telescopic drive column 204.

[0041] The sliding rail 206 is installed on the upper side of the fixed plate 202. The positioning slide plate 205 is connected to the sliding rail 206 by a slider. In this way, when the positioning slide plate 205 moves up and down, the slider slides in the sliding rail 206, ensuring the smooth movement of the positioning slide plate 205.

[0042] Positioning structure 2 also includes a sliding track 206;

[0043] The sliding rail 206 is fixedly connected to the upper side of the fixed plate 202, and a slider is provided between the sliding rail 206 and the positioning slide plate 205.

[0044] Positioning structure 2 also includes a fixed shaft 207, a connecting rod 208, a rotating plate 209, and a fixed shaft 210;

[0045] Fixed shaft 207 is fixedly connected to the upper side of positioning slide plate 205, connecting rod 208 is movably connected to the outer side of fixed shaft 207, rotating plate 209 is movably disposed on the lower side of connecting rod 208, fixed shaft 210 is movably connected to the inner cavity of rotating plate 209, and rotating plate 209 is connected to fixed plate 202 through fixed shaft 210.

[0046] A fixed shaft 207 is mounted on the upper side of the positioning slide plate 205. A connecting rod 208 can rotate around the fixed shaft 207. A rotating plate 209 is located on the lower side of the connecting rod 208 and is connected to the fixed plate 202 via a fixed shaft 210. This structure allows the rotating plate 209 to adjust its angle according to the actual situation during the movement of the positioning slide plate 205, further enhancing the adaptability of the positioning structure 2 to hot stamping surfaces of packaging with different shapes and positions.

[0047] Working Principle: During the hot-stamping and epoxy bonding process on the packaging, the conveyor body 1 transports the package to be processed to the area below the positioning structure 2. The cylinder 203 is activated, extending the column 204 and pushing the positioning slide plate 205 downwards, causing the positioning column 215 to gradually approach the hot-stamped surface of the packaging. After the positioning column 215 contacts the hot-stamped surface, the spring 217 buffers and fine-tunes the positioning force based on the contact situation, ensuring stable positioning. If there is a certain deviation in the position of the hot-stamped surface, the positioning slide plate 205 maintains stability by sliding within the sliding track 206 during its up-and-down movement. Simultaneously, the rotating plate 209 rotates around the second fixed axis 210, causing the connecting rod 208 to rotate around the first fixed axis 207, thereby adaptively adjusting the position and angle of the positioning column 215 to achieve precise positioning and ensure the accuracy of subsequent epoxy bonding operations.

[0048] This step adaptively adjusts the position and angle of the positioning post 215 to achieve precise positioning and ensure the accuracy of subsequent adhesive bonding operations.

[0049] Please see Figure 1-4 As shown, this embodiment, based on the above embodiment, further includes an adjustment structure 3.

[0050] An adjustment structure 3 is fixedly connected to the upper side of the conveying body 1. The adjustment structure 3 includes a fixed column 301, a motor 302, a bidirectional screw 303, a moving block 304, and a driving rod 305.

[0051] Fixed column 301 is fixedly connected to the upper side of conveying body 1, motor 302 is fixedly connected to one side of fixed column 301, bidirectional screw 303 is movably connected to one side of fixed column 301, moving block 304 is threadedly connected to the outside of bidirectional screw 303, and driving rod 305 is movably connected to one side of moving block 304.

[0052] Moving block 1 304 and moving block 2 306 are located at both ends of the bidirectional screw 303 and can move relative to or away from each other.

[0053] The adjustment structure 3 also includes a second movable block 306, a second driving rod 307, a fourth fixed column 308, a fifth fixed column 309, and a fitting body 310;

[0054] The second movable block 306 is threaded to the outside of the bidirectional screw 303, the second driving rod 307 is movably connected to one side of the second movable block 306, the fourth fixed post 308 is movably connected to one end of the second driving rod 307, the fifth fixed post 309 is fixedly connected to one side of the fourth fixed post 308, and the body 310 is fixedly connected to the lower side of the fifth fixed post 309.

[0055] When movable block 1 304 and movable block 2 306 move, they drive rod 1 305 and rod 2 307 respectively to drive fixed column 4 308 to move, thereby adjusting the lifting and lowering of the fitting body 310 to cope with packaging of different shapes.

[0056] Working Principle: When it is necessary to adjust the bonding position or bonding pressure between the bonding body 310 and the hot-stamped surface of the packaging, the motor 302 is activated. The motor 302 drives the bidirectional screw 303 to rotate. Due to the special structure of the bidirectional screw 303, the moving blocks 1 304 and 2 306 move in opposite directions. The moving block 1 304 drives the moving rod 1 305, and the moving block 2 306 drives the moving rod 2 307, respectively, to move the fixed post 4 308, thereby adjusting the position of the fixed post 5 309 and the bonding body 310 installed below it. For example, when facing packaging of different thicknesses or different epoxy bonding process requirements, the position of the bonding body 310 can be adjusted to change its relative distance to the hot-stamped surface of the packaging, achieving precise bonding and improving the quality and effect of epoxy bonding.

[0057] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A device for bonding hot stamping surface of packaging with epoxy resin, characterized in that, Including the main conveyor body (1): The upper side of the conveying body (1) is fixedly connected to a positioning structure (2), which includes a fixed frame (211), a fixed shaft three (212), a rotating column (213), a positioning arm (214), a positioning column (215), a fixed column two (216), and a spring (217). The fixed frame (211) is fixedly installed on the upper side of the conveying body (1). The fixed shaft three (212) is movably connected to the inner side of the fixed frame (211). The rotating column (213) is fixedly connected to the lower side of the fixed shaft three (212). The positioning arm (214) is fixedly connected to one side of the rotating column (213). The positioning column (215) is fixedly connected to the lower side of the positioning arm (214). The fixed column two (216) is fixedly connected to the lower side of the fixed frame (211). The spring (217) is fixedly connected to one side of the fixed column two (216).

2. The packaging hot stamping surface epoxy bonding device according to claim 1, characterized in that: The upper side of the positioning arm (214) is provided with a column, which is connected to the fixing column (216) by a spring (217).

3. The packaging hot stamping surface epoxy bonding device according to claim 1, characterized in that: The positioning structure (2) also includes a fixed column (201), a fixed plate (202), a cylinder (203), a telescopic drive column (204), and a positioning slide plate (205). The first fixed column (201) is fixedly connected to the upper side of the conveying body (1), the fixed plate (202) is fixedly connected to the upper side of the first fixed column (201), the cylinder (203) is fixedly connected to the upper side of the fixed plate (202), the telescopic drive column (204) is movably connected to the inner cavity of the cylinder (203), and the positioning slide plate (205) is movably disposed on the upper side of the telescopic drive column (204).

4. The packaging hot stamping surface epoxy bonding device according to claim 3, characterized in that: The positioning structure (2) also includes a sliding track (206); The sliding track (206) is fixedly connected to the upper side of the fixed plate (202), and a slider is provided between the sliding track (206) and the positioning slide plate (205).

5. The packaging hot stamping surface epoxy bonding device according to claim 4, characterized in that: The positioning structure (2) also includes a fixed shaft one (207), a connecting rod (208), a rotating plate (209), and a fixed shaft two (210). The first fixed shaft (207) is fixedly connected to the upper side of the positioning slide plate (205), the connecting rod (208) is movably connected to the outside of the first fixed shaft (207), the rotating plate (209) is movably disposed on the lower side of the connecting rod (208), the second fixed shaft (210) is movably connected to the inner cavity of the rotating plate (209), and the rotating plate (209) is connected to the fixed plate (202) through the second fixed shaft (210).

6. The packaging hot stamping surface epoxy bonding device according to claim 1, characterized in that: An adjustment structure (3) is fixedly connected to the upper side of the conveying body (1). The adjustment structure (3) includes a fixed column three (301), a motor (302), a bidirectional screw (303), a moving block one (304), and a driving rod one (305). The fixed column three (301) is fixedly connected to the upper side of the conveying body (1), the motor (302) is fixedly connected to one side of the fixed column three (301), the bidirectional screw (303) is movably connected to one side of the fixed column three (301), the moving block one (304) is threadedly connected to the outside of the bidirectional screw (303), and the driving rod one (305) is movably connected to one side of the moving block one (304).

7. The packaging hot stamping surface epoxy bonding device according to claim 6, characterized in that: The adjustment structure (3) also includes a second movable block (306), a second driving rod (307), a fourth fixed column (308), a fifth fixed column (309), and a fitting body (310). The second movable block (306) is threaded to the outside of the bidirectional screw (303), the second driving rod (307) is movably connected to one side of the second movable block (306), the fourth fixed post (308) is movably connected to one end of the second driving rod (307), the fifth fixed post (309) is fixedly connected to one side of the fourth fixed post (308), and the fitting body (310) is fixedly connected to the lower side of the fifth fixed post (309).

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