Electroplating clamp and electroplating equipment
By employing a design with fixed and movable conductive plates in the electroplating fixture, which is directly connected to an external power source, the problems of complex conductive areas, large space occupation, and high internal resistance in traditional electroplating fixtures are solved, thereby improving conductivity and electroplating efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUXI KINGENIOUS INTELLIGENT EQUIPMENT CO LTD
- Filing Date
- 2025-04-28
- Publication Date
- 2026-05-12
AI Technical Summary
Traditional electroplating fixtures have complex conductive area structures due to the placement of conductive frames, resulting in large space occupation, long electrical paths, increased internal resistance, and reduced conductivity.
The design employs a fixed conductive plate and a movable conductive plate. The upper edge of the fixed conductive plate extends vertically upward to form a fixed convex conductive part, while the upper edge of the movable conductive plate extends upward along the surface of the convex conductive part to form a movable convex conductive part. This design allows for direct electrical connection to an external power source, reducing the need for additional conductive frames, shortening the electrical path, and lowering the internal resistance.
It improves conductivity, reduces space occupation, avoids movement resistance, and achieves a more efficient electroplating process.
Smart Images
Figure CN224227268U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electroplating technology, specifically to electroplating fixtures and electroplating equipment. Background Technology
[0002] With the rapid development of the photovoltaic industry, the industrial manufacturing technologies for solar cells are becoming increasingly diversified.
[0003] Currently, photovoltaic electrode manufacturing processes use screen printing of silver electrodes, which consumes a large amount of silver paste, making the paste relatively expensive. Electroplating copper technology, with its advantages of low cost and superior conductivity compared to silver paste, is considered the most promising process for achieving silver-free photovoltaic electrode manufacturing.
[0004] Electroplating requires clamping and electrifying the sample to be plated using electroplating fixtures. Currently, in traditional electroplating fixtures, the conductive frame and the basket body are usually connected by welding or screw fastening to achieve conductivity.
[0005] However, the electroplating fixtures mentioned above have a complex conductive area structure due to the conductive frame, which not only takes up space but also results in a longer electrical path, increased internal resistance, and reduced conductivity. Utility Model Content
[0006] In view of this, the present invention provides an electroplating fixture and electroplating equipment to solve the above-mentioned problems of traditional electroplating tooling fixtures.
[0007] In a first aspect, this utility model provides an electroplating fixture, comprising:
[0008] A fixed conductive plate and a fixed support plate are provided, wherein the fixed conductive plate and the fixed support plate are arranged opposite to each other and a gap is left between them;
[0009] A fixed conductive shaft and a movable conductive shaft are both connected between the fixed conductive plate and the fixed support plate, and the movable conductive shaft can move relative to the fixed conductive shaft along its axial direction; the fixed conductive plate is electrically connected to the fixed conductive shaft.
[0010] A movable conductive plate is disposed on the fixed conductive plate and is electrically connected to the movable conductive shaft.
[0011] The movable conductive plate and the fixed conductive plate are insulated from each other. The upper edge of the fixed conductive plate extends vertically upward to form a fixed convex conductive part, which is suitable for electrical connection with an external power source. The upper edge of the movable conductive plate extends upward along the surface of the convex conductive part to form a movable convex conductive part, which is also suitable for electrical connection with an external power source.
[0012] The upper edge of the fixed conductive plate extends vertically upwards to form a fixed convex conductive part. In use, the fixed conductive plate directly connects to an external power source through this convex conductive part. Because the convex conductive part is formed by the upper edge of the fixed conductive plate extending vertically upwards, compared to the traditional additional conductive frame, the fixed convex conductive part in this embodiment occupies less space and does not need to protrude from the outside of the fixed conductive plate, thus reducing the electrical path and internal resistance, and improving conductivity. Similarly, the upper edge of the movable conductive plate extends upwards along the surface of the convex conductive part to form a movable convex conductive part. The movable conductive plate directly connects to an external power source through this movable convex conductive part, also without the need for an additional conductive frame, and it also has the advantages of smaller space occupation and better conductivity. Furthermore, since there is no conductive frame obstructing the movable conductive plate, there is no resistance to movement during its movement.
[0013] In one alternative embodiment, the movable protruding conductive portion extends vertically upward to the upper end of the fixed protruding conductive portion and then bends toward the fixed protruding conductive portion.
[0014] The movable protruding conductive part extends vertically upwards to the upper end of the fixed protruding conductive part, then bends towards the fixed protruding conductive part to allow the top portion of the movable protruding conductive part to adhere to the surface of the fixed protruding conductive part. An insulating material, as used in the prior art, is provided between the movable and fixed protruding conductive parts to insulate them. Because the top portion of the movable protruding conductive part adheres to the surface of the fixed protruding conductive part, the fixed protruding conductive part provides a fixing point for the top portion of the movable protruding conductive part, thus fixing the position of the top portion of the movable protruding conductive part.
[0015] In one optional embodiment, the movable conductive plate is divided into two halves by the fixed conductive plate, and the two halves are respectively connected to the movable conductive shafts of their corresponding parts.
[0016] The upper sides of both halves of the plate extend upwards and merge to form the convex conductive portion.
[0017] In one alternative implementation, the upwardly extending portions of the two half-plates merge at the bend.
[0018] In one optional embodiment, a plurality of hooks are provided on the side of the fixed conductive plate, and the plurality of hooks are distributed on both sides of the fixed protruding conductive part, and any sidewall on either side of the fixed protruding conductive part has a hooking gap in the width direction with respect to the hook on that side.
[0019] In one optional embodiment, the movable conductive plate is disposed on the outer side of the fixed conductive plate, and there is a gap between the movable conductive plate and the fixed conductive plate.
[0020] In one optional embodiment, a partition is provided on the outside of the fixed conductive plate, the end of the movable conductive shaft passes through the partition, and the movable conductive plate is attached to the outside of the partition and electrically connected to the movable conductive shaft.
[0021] In one alternative embodiment, a bushing is slidably provided inside the partition, and the end of the movable conductive shaft is fixed inside the bushing.
[0022] During use, the surface of the movable conductive shaft is usually coated with a layer of coating (such as polytetrafluoroethylene (PTFE) coating) to prevent the formation of a plating layer on the movable rod. The presence of the coating on the surface of the movable conductive shaft will affect the smoothness of the movement of the movable conductive shaft. By adding a bushing at the end of the movable rod, the movement of the movable conductive shaft can be made more convenient.
[0023] In one alternative embodiment, the electroplating fixture further includes a stop and a spring. The stop is fixed on the portion of the movable conductive shaft located inside the fixed conductive plate. One end of the spring abuts against the inner side of the fixed conductive plate, and the other end of the spring abuts against the stop.
[0024] In one alternative embodiment, the electroplating fixture further includes:
[0025] A fixed conductive block is connected to the fixed protruding conductive part;
[0026] A movable conductive block is connected to a movable protruding conductive part. Both the fixed conductive block and the movable conductive block are adapted to be electrically connected to an external power source.
[0027] Secondly, this utility model also provides an electroplating device, which includes the aforementioned electroplating fixture. Attached Figure Description
[0028] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0029] Figure 1 This is a schematic diagram of the structure of an electroplating fixture and electroplating equipment according to an embodiment of the present utility model;
[0030] Figure 2 This is a front view of an electroplating fixture and electroplating equipment according to an embodiment of the present utility model;
[0031] Figure 3 middle Figure 2 A magnified view of part A in the diagram.
[0032] Explanation of reference numerals in the attached figures:
[0033] 1. Fixed conductive plate; 2. Fixed support plate; 3. Fixed conductive shaft; 4. Movable conductive shaft; 5. Movable conductive plate; 6. Fixed protruding conductive part; 7. Protruding conductive part; 8. Partition plate; 9. Bushing; 10. Stop; 11. Spring; 12. Fixed conductive block; 13. Movable conductive block; 14. Hook. Detailed Implementation
[0034] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0035] With the rapid development of the photovoltaic industry, the industrial manufacturing technologies for solar cells are becoming increasingly diversified.
[0036] Currently, photovoltaic electrode manufacturing processes use screen printing of silver electrodes, which consumes a large amount of silver paste, making the paste relatively expensive. Electroplating copper technology, with its advantages of low cost and superior conductivity compared to silver paste, is considered the most promising process for achieving silver-free photovoltaic electrode manufacturing.
[0037] Electroplating requires clamping and electrifying the sample to be plated using electroplating fixtures. Currently, in traditional electroplating fixtures, the conductive frame and the basket body are usually connected by welding or screw fastening to achieve conductivity.
[0038] However, the aforementioned electroplating fixtures have a complex conductive area structure due to the conductive frame, which not only occupies space but also results in a longer electrical path, increased internal resistance, and reduced conductivity. Therefore, this embodiment provides an electroplating fixture and electroplating equipment to solve the above problems.
[0039] The following is combined with Figures 1 to 3 The following describes embodiments of the present invention.
[0040] According to an embodiment of the present invention, an electroplating fixture is provided, comprising a fixed conductive plate 1, a fixed support plate 2, a fixed conductive shaft 3, a movable conductive shaft 4, and a movable conductive plate 5. The fixed conductive plate 1 and the fixed support plate 2 are arranged opposite to each other with a gap between them. The fixed conductive shaft 3 and the movable conductive shaft 4 are both connected between the fixed conductive plate 1 and the fixed support plate 2, and the movable conductive shaft 4 can move relative to the fixed conductive shaft 3 along its axial direction. The fixed conductive plate 1 and the fixed conductive shaft 3 are electrically connected. The movable conductive plate 5 is disposed on the fixed conductive plate 1 and is electrically connected to the movable conductive shaft 4. The movable conductive plate 5 is insulated from the fixed conductive plate 1. The upper edge of the fixed conductive plate 1 extends vertically upward to form a fixed protruding conductive part 6, which is suitable for electrical connection with an external power source. The upper side of the movable conductive plate 5 extends upward along the surface of the protruding conductive part 7 to form a movable protruding conductive part 7, which is suitable for electrical connection with an external power source.
[0041] like Figure 1 As shown, the fixed conductive plate 1 and the fixed support plate 2 are arranged opposite to each other, forming the overall support frame of the electroplating fixture. The fixed conductive shaft 3 and the movable conductive shaft 4 are both connected between the fixed conductive plate 1 and the fixed support plate 2. Both the fixed conductive shaft 3 and the movable conductive shaft 4 are equipped with conductive clamping plates. During use, by adjusting the movable conductive shaft 4 to move relative to the fixed conductive shaft 3 along its axial direction, the electroplated part is clamped between the conductive clamping plates on the fixed conductive shaft 3 and the movable conductive shaft 4. The fixed conductive plate 1 is equipped with a movable conductive plate 5, which is insulated from the fixed conductive plate 1. The fixed conductive plate 1 is electrically connected to the fixed conductive shaft 3, and the movable conductive plate 5 is electrically connected to the movable conductive shaft 4, thereby enabling electroplating of the electroplated part clamped by the conductive clamping plates. The above structure and clamping process are conventional structures for electroplating fixtures, and therefore will not be described in detail here.
[0042] In the above embodiment, the upper edge of the fixed conductive plate 1 extends vertically upward to form a fixed protruding conductive part 6. During use, the fixed conductive plate 1 is directly electrically connected to an external power source through this fixed protruding conductive part 6. Since the fixed protruding conductive part 6 is formed by the upper edge of the fixed conductive plate 1 extending vertically upward, compared to the traditional additional conductive frame, the fixed protruding conductive part 6 in this embodiment occupies less space and does not need to protrude from the outside of the fixed conductive plate 1, thus reducing the electrical path and internal resistance, thereby improving conductivity. Similarly, the upper side of the movable conductive plate 5 extends upward along the surface of the protruding conductive part 7 to form a movable protruding conductive part 7. The movable conductive plate 5 is directly electrically connected to an external power source through this movable protruding conductive part 7, also without the need for an additional conductive frame, thus also having the advantages of smaller space occupation and better conductivity. Furthermore, since the movable conductive plate 5 is not obstructed by a conductive frame, there is no resistance to movement when the movable conductive plate 5 is in motion.
[0043] In one embodiment, such as Figure 2 As shown, the movable protruding conductive part 7 extends vertically upward to the upper part of the fixed protruding conductive part 6 and then bends towards the fixed protruding conductive part 6.
[0044] In the above embodiments, the movable protruding conductive part 7 extends vertically upward to the upper end of the fixed protruding conductive part 6 and then bends towards the fixed protruding conductive part 6, so as to attach the top end of the movable protruding conductive part 7 to the surface of the fixed protruding conductive part 6. An insulating material, as used in the prior art, is provided between the movable protruding conductive part 7 and the fixed protruding conductive part 6 to insulate them. Since the top end of the movable protruding conductive part 7 is attached to the surface of the fixed protruding conductive part 6, the fixed protruding conductive part 6 can provide a fixing point for the top end of the movable protruding conductive part 7, thereby fixing the position of the top end of the movable protruding conductive part 7.
[0045] In one embodiment, such as Figure 1 As shown, the movable conductive plate 5 is divided into two halves by the fixed conductive plate 1, and the two halves are respectively connected to the movable conductive shaft 4 of their corresponding parts; wherein, the upper side of both halves extends upward and merges into an outwardly protruding conductive part 7.
[0046] exist Figure 1 In the structure shown, the lower part of the movable conductive plate 5 is divided into two halves, and several strip conductive plates are formed on the upper and lower sides of the two halves. Each strip conductive plate is connected to a movable conductive shaft 4. This structure can reduce the material used in the movable conductive plate 5.
[0047] In one embodiment, such as Figure 1 As shown, the upward extensions of the two half-plates merge at the bend.
[0048] In one embodiment, such as Figure 1 As shown, the fixed conductive plate 1 has a plurality of hooks 14 on its upper side. The plurality of hooks 14 are distributed on both sides of the fixed protruding conductive part 6, and any side wall on either side of the fixed protruding conductive part 6 has a hooking gap in the width direction with respect to the hook 14 on that side.
[0049] like Figure 1 As shown, in the width direction, a hooking gap is left between any sidewall on either side of the fixed protruding conductive part 6 and the hook 14 on that side, to provide space for the robotic arm to hook the flower basket. Specifically, Figure 1In the structure shown, the upper part of the fixed protruding conductive part 6 is T-shaped. Therefore, since any side wall on one side of the fixed protruding conductive part 6 has a hooking gap in the width direction with the hook 14 on this side, a hooking gap is left between the side wall of the outermost part of the fixed protruding conductive part 6, that is, the T-shaped part, and the hook 14, so that the robotic arm moving in the vertical width direction can smoothly pass through the hooking gap to hook the hook 14.
[0050] In one embodiment, the movable conductive plate 5 is disposed on the outer side of the fixed conductive plate 1, and there is a gap between the movable conductive plate 5 and the fixed conductive plate 1.
[0051] In one embodiment, a partition 8 is fixed to the outside of the fixed conductive plate 1, the end of the movable conductive shaft 4 passes through the partition 8, and the movable conductive plate 5 is located outside the partition 8 and electrically connected to the movable conductive shaft 4. Because the partition 8 is provided outside the fixed conductive plate 1, a gap exists between the movable conductive plate 5 and the fixed conductive plate 1.
[0052] In one embodiment, a bushing 9 is slidably provided inside the partition 8, and the end of the movable conductive shaft 4 is fixedly disposed inside the bushing 9. During use, the surface of the movable conductive shaft 4 is usually coated with a coating (e.g., a polytetrafluoroethylene (PTFE) coating) to prevent the formation of a plating layer on the movable rod. The presence of the coating on the surface of the movable conductive shaft 4 will affect the smoothness of the movement of the movable conductive shaft 4. By adding a bushing 9 to the end of the movable rod, the movement of the movable conductive shaft 4 can be made more convenient.
[0053] In one embodiment, such as Figure 3 As shown, the electroplating fixture also includes a stop 10 and a spring 11. The stop 10 is fixed on the part of the movable conductive shaft 4 located inside the fixed conductive plate 1. One end of the spring 11 abuts against the inside of the fixed conductive plate 1, and the other end of the spring 11 abuts against the stop 10.
[0054] When the electroplated part needs to be clamped, the operator pushes the movable conductive shaft 4 with external force, causing it to move axially relative to the fixed conductive shaft 3. During this process, the stop 10 fixed on the movable conductive shaft 4 also moves. Since one end of the spring 11 abuts against the inside of the fixed conductive plate 1 and the other end abuts against the stop 10, the spring 11 will be compressed. After being compressed, the spring 11 will generate a reverse elastic force, which is transmitted to the movable conductive shaft 4 through the stop 10. After the electroplated part is placed between the conductive clamping plates on the fixed conductive shaft 3 and the movable conductive shaft 4, the external force pushing the movable conductive shaft 4 is removed. The elastic force of the spring 11 will cause the movable conductive shaft 4 to maintain pressure towards the electroplated part, thereby making the conductive clamping plates tightly clamp the electroplated part and ensuring the stability of the electroplated part during the electroplating process.
[0055] In one embodiment, such as Figure 1As shown, the electroplating fixture also includes a fixed conductive block 12 and a movable conductive block 13. The fixed conductive block 12 is connected to the fixed protruding conductive part 6; the movable conductive block 13 is connected to the movable protruding conductive part 7. Both the fixed conductive block 12 and the movable conductive block 13 are suitable for electrical connection with an external power source.
[0056] According to an embodiment of the present invention, another aspect provides an electroplating apparatus, including the electroplating fixture described above.
[0057] The electroplating equipment also includes a conductive base with a groove. The shape of the groove matches the shape of the fixed conductive block 12 and the movable conductive block 13 of the electroplating fixture to support them. During electroplating, the electroplating fixture is placed in the electroplating tank, and the fixed conductive block 12 and the movable conductive block 13 are supported on the conductive base. A cathode current is then passed through, allowing independent control of the current of the fixed conductive shaft 3 and the movable conductive shaft 4. This, in turn, achieves the goal of independently controlling the electroplating rate on both sides of the electroplated part.
[0058] The aforementioned electroplating equipment, by setting current contact points on each clamping point of the electroplating fixture, allows for the application of appropriate currents during the electroplating process based on the plating area and pattern on both sides of the workpiece. This ensures consistent current density across both sides of the solar cell during plating, resulting in excellent uniformity during double-sided electroplating. This effectively solves the problem of significant differences between the front and back sides caused by using the same input current.
[0059] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.
Claims
1. An electroplating fixture, characterized in that, include: A fixed conductive plate (1) and a fixed support plate (2) are provided, wherein the fixed conductive plate (1) and the fixed support plate (2) are arranged opposite to each other and there is a gap between them; A fixed conductive shaft (3) and a movable conductive shaft (4) are both connected between the fixed conductive plate (1) and the fixed support plate (2), and the movable conductive shaft (4) can move relative to the fixed conductive shaft (3) along its axial direction; the fixed conductive plate (1) is electrically connected to the fixed conductive shaft (3); A movable conductive plate (5) is disposed on the fixed conductive plate (1), and the movable conductive plate (5) is electrically connected to the movable conductive shaft (4); The movable conductive plate (5) and the fixed conductive plate (1) are insulated from each other. The upper edge of the fixed conductive plate (1) extends vertically upward to form a fixed convex conductive part (6), which is suitable for electrical connection with an external power source. The upper side of the movable conductive plate (5) extends upward along the surface of the convex conductive part (7) to form a movable convex conductive part (7), which is suitable for electrical connection with an external power source.
2. The electroplating fixture according to claim 1, characterized in that, The movable protruding conductive part (7) extends vertically upward to the upper part of the fixed protruding conductive part (6) and then bends toward the fixed protruding conductive part (6).
3. The electroplating fixture according to claim 2, characterized in that, The movable conductive plate (5) is divided into two halves by the fixed conductive plate (1), and the two halves are respectively connected to the movable conductive shaft (4) of their corresponding parts; The upper sides of both halves of the plate extend upward and merge to form the convex conductive portion (7).
4. The electroplating fixture according to claim 3, characterized in that, The two upwardly extending portions of the two halves merge at the bend.
5. The electroplating fixture according to any one of claims 1-4, characterized in that, The fixed conductive plate (1) is provided with a plurality of hooks (14) on its upper side. The plurality of hooks (14) are distributed on both sides of the fixed protruding conductive part (6), and any sidewall on either side of the fixed protruding conductive part (6) has a hooking gap in the width direction with the hook (14) on that side.
6. The electroplating fixture according to any one of claims 1-4, characterized in that, The movable conductive plate (5) is disposed on the outer side of the fixed conductive plate (1), and there is a gap between the movable conductive plate (5) and the fixed conductive plate (1).
7. The electroplating fixture according to claim 6, characterized in that, The fixed conductive plate (1) is provided with a partition (8) on the outside, the end of the movable conductive shaft (4) passes through the partition (8), and the movable conductive plate (5) is located outside the partition (8) and is electrically connected to the movable conductive shaft (4).
8. The electroplating fixture according to claim 7, characterized in that, The partition (8) is slidably provided with a bushing (9), and the end of the movable conductive shaft (4) is fixed inside the bushing (9).
9. The electroplating fixture according to claim 8, characterized in that, It also includes a stop (10) and a spring (11). The stop (10) is fixed on the part of the movable conductive shaft (4) located inside the fixed conductive plate (1). One end of the spring (11) abuts against the inside of the fixed conductive plate (1), and the other end of the spring (11) abuts against the stop (10).
10. An electroplating device, characterized in that, The electroplating equipment includes an electroplating fixture as described in any one of claims 1 to 9.