Electroplating device for circuit board processing

Abstract

The utility model discloses an electroplating device for circuit board processing, which comprises a hanging bracket, an electric drive hanging rail, a precipitation bottom table, a collecting main bin and a VCP jet liquid precipitation collecting unit.In the using process of the electroplating device, when a movable table drives a board to move to a spraying area, electroplating liquid is supplied and conveyed into an electromagnetic spray head by starting a spraying bin in a side spraying frame area; then, an electromagnetic spray head is driven to uniformly spray and electroplate from the two surfaces of the plate, so that the electroplating liquid surface is effectively attached to the surface of the plate layer, and a collecting inclined plane I at the top of a collecting main cavity is arc-shaped, so that the electroplating liquid falling on the surface of the collecting inclined plane I can smoothly flow into the collecting main cavity along the collecting inclined plane I; and flow guide slopes are arranged at the bottom in the collecting main cavity, and meanwhile buffer columns installed at the tops of the flow guide slopes can reduce the flow speed of the electroplating liquid, so that the electroplating liquid is smoothly shunted from the two groups of flow guide slopes to enter the precipitation cavity, and then recycling of the electroplating liquid is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of VCP jet electroplating technology for circuit board processing, specifically to an electroplating device for circuit board processing. Background Technology

[0002] The main purposes of circuit board electroplating include enhancing conductivity by uniformly depositing metal plating layers (such as copper and gold) on the surface of conductors, reducing resistance and optimizing high-frequency signal transmission performance, reducing signal loss and impedance fluctuations, and establishing a conductive medium. Chemical copper plating process deposits a 0.5μm copper layer on the hole wall to provide conductive leads for subsequent electroplating and ensure the reliability of interlayer conductivity in multilayer boards.

[0003] In the prior art, publication number "CN222594053U" discloses an electroplating apparatus for circuit board processing, including an electroplating tank with an open top. The top of the electroplating tank is equipped with a liftable mounting plate, and the bottom of the mounting plate has a fixed frame with an inverted U-shaped structure. The mounting plate is equipped with a wobbling mechanism for reciprocating up and down movement of the fixed frame, and the fixed frame is equipped with a clamping assembly for fixing the circuit board. This invention, under the action of the wobbling mechanism, enables the fixed frame to reciprocate up and down in the electroplating solution, allowing the circuit board to continuously move up and down in the solution. This helps ensure that the electroplating solution evenly covers the entire surface of the circuit board, thus avoiding uneven coverage. Furthermore, the continuous up-and-down wobbling helps break surface tension, reduces the generation of bubbles in the electroplating solution, and promotes contact between the electroplating solution and the circuit board surface.

[0004] However, existing technologies still have significant shortcomings, such as:

[0005] In the aforementioned devices and existing technologies, circuit boards electroplated using immersion technology need to be gradually moved and inserted into various liquid baths for degreasing, washing, and etching. During the movement of the circuit board, the board will shake significantly. This shaking can reduce the generation of bubbles in the electroplating solution, but when the board is taken out of the electroplating bath, the copper liquid on the surface of the board flows down rapidly, resulting in uneven copper plating on the surface of the board at the microscopic level. If VCP jet electroplating is used, it will be difficult to recycle the electroplating solution, resulting in excessively high circuit board electroplating costs. Utility Model Content

[0006] The purpose of this invention is to provide an electroplating apparatus for circuit board processing to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: an electroplating device for circuit board processing, comprising a hanger, an electrically driven rail, a sedimentation platform, a main collection chamber, and a VCP jet liquid sedimentation and collection unit. The hanger is configured in two sets, symmetrically arranged. The electrically driven rail is installed between adjacent hangers. The sedimentation platform is installed on the bottom surface of the hanger. The main collection chamber is installed on top of the sedimentation platform. The VCP jet liquid sedimentation and collection unit is located on both sides of the main collection chamber for recycling the jet liquid.

[0008] Preferably, the VCP jet liquid sedimentation collection unit includes a main collection section, the main collection section includes a buffer column, the main collection chamber is provided with a main collection cavity, the top of the main collection cavity is provided near the electric drive rail and the main collection cavity is provided with a collection ramp, the collection ramp is symmetrically arranged, the bottom area of ​​the main collection cavity is provided with a guide ramp, the guide ramp is also symmetrically arranged, and the buffer column is installed on the top of the guide ramp.

[0009] Preferably, the VCP jet liquid sedimentation collection unit further includes a secondary collection section, which includes a secondary collection chamber. The secondary collection chamber is configured in two sets, and the two sets of secondary collection chambers are installed on both sides of the main collection chamber. The secondary collection chamber is provided with a secondary collection cavity inside. The top of the secondary collection cavity is provided with a second collection slope, and the bottom of the secondary collection cavity is provided with a converging slope, with the bottom of the converging slope facing the guide slope.

[0010] Preferably, a moving platform is installed on the moving end of the electric drive rail, and splash guards are symmetrically installed on both sides of the bottom of the moving platform, and the splash guards are configured as L-shaped.

[0011] Preferably, a fixed base is installed at the bottom of the mobile platform.

[0012] Preferably, two sets of plate clamps are symmetrically installed at the bottom of the fixing base.

[0013] Preferably, the top of the sedimentation platform is provided with two sets of sedimentation chambers, which are connected to the main collection chamber.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. During use, after the plate clamp is loaded, the moving table is moved toward the spray electroplating area by driving the electric drive rail. When the moving table moves the plate to the spray area, the electroplating solution is supplied to the electromagnetic nozzle by activating the spray chamber in the side spray frame area. Then, the electromagnetic nozzle is driven to spray electroplating evenly from both sides of the plate, thereby ensuring that the electroplating solution effectively adheres to the plate surface and makes the electroplating layer on the plate surface uniform.

[0016] 2. During use, when the electroplating process is underway, the electroplating solution circulated from the electromagnetic nozzle will first come into contact with the substrate. After contact with the substrate, the electroplating solution will drip onto the outer area of ​​the substrate, and some of the electroplating solution will fall downward into the main collection chamber. The main collection chamber is the main collection area for the electroplating solution. The collection ramp at the top of the main collection chamber is arc-shaped, which allows the electroplating solution falling on the surface of the collection ramp to flow smoothly into the main collection chamber, improving the collection efficiency of the electroplating solution. The bottom of the main collection chamber is equipped with two sets of symmetrical guide ramps. At the same time, the buffer column installed at the top of the guide ramps can reduce the flow rate of the electroplating solution, so that the electroplating solution can be smoothly diverted from the two sets of guide ramps into the sedimentation chamber, thereby ensuring the recycling of the electroplating solution. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall device of this utility model;

[0018] Figure 2 This is a schematic diagram of the side spray frame part of this utility model;

[0019] Figure 3 This is a schematic diagram of the guide slope and buffer column in this utility model;

[0020] Figure 4 This is a schematic diagram of the mobile platform and splash guard in this utility model;

[0021] Figure 5 This is a schematic diagram of the collection compartment in this utility model.

[0022] In the diagram: 1. Hanger; 2. Electric drive rail; 21. Moving platform; 22. Splash guard; 23. Fixed base; 24. Plate clamp; 3. Settling bottom platform; 4. Main collection chamber; 41. Main collection cavity; 42. Collection ramp one; 43. Guide ramp; 44. Buffer column; 5. Sub-collection chamber; 51. Sub-collection cavity; 52. Collection ramp two; 53. Converging ramp; 6. Settling chamber; 7. Side spray frame; 71. Spray chamber; 72. Electromagnetic nozzle. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-5 This utility model provides a technical solution:

[0025] Example 1: An electroplating device for circuit board processing: including a hanger 1, an electric drive rail 2, a sedimentation platform 3, a main collection chamber 4, and a VCP jet liquid sedimentation and collection unit. The hangers 1 are configured in two sets, and the two sets of hangers 1 are symmetrically arranged. The electric drive rail 2 is installed between adjacent hangers 1. The sedimentation platform 3 is installed on the bottom surface of the hanger 1. The main collection chamber 4 is installed on the top of the sedimentation platform 3. The VCP jet liquid sedimentation and collection unit is set on both sides of the main collection chamber 4 for recycling the jet liquid.

[0026] The VCP jet liquid sedimentation collection unit includes a main collection section, which includes a buffer column 44. The main collection chamber 4 is provided with a main collection cavity 41. The top of the main collection cavity 41 is provided with a collection ramp 42 near the electric drive rail 2. The collection ramp 42 is symmetrically arranged. The bottom area of ​​the main collection cavity 41 is provided with a guide ramp 43. The guide ramp 43 is also symmetrically arranged. The buffer column 44 is installed on the top of the guide ramp 43.

[0027] A moving platform 21 is installed on the moving end of the electric drive rail 2. Splash guards 22 are symmetrically installed on both sides of the bottom of the moving platform 21. The splash guards 22 are L-shaped.

[0028] The bottom of the mobile station 21 is equipped with a fixed base 23.

[0029] Two sets of plate clamps 24 are symmetrically installed at the bottom of the fixed base 23.

[0030] Two sets of sedimentation chambers 6 are provided on the top of the sedimentation base 3, and the sedimentation chambers 6 are connected to the main collection chamber 41.

[0031] In this embodiment, the collection ramp 42 at the top of the main collection chamber 41 is arc-shaped, which allows the electroplating solution falling on the surface of the collection ramp 42 to flow smoothly into the main collection chamber 41, improving the collection efficiency of the electroplating solution. The bottom of the main collection chamber 41 is provided with a guide ramp 43, which is symmetrical in two sets. At the same time, the buffer column 44 installed at the top of the guide ramp 43 can reduce the flow rate of the electroplating solution, so that the electroplating solution can be smoothly diverted from the two sets of guide ramps 43 into the sedimentation chamber 6, thereby ensuring the recycling of the electroplating solution.

[0032] Example 2:

[0033] Based on Embodiment 1, this embodiment takes into account that the electroplating liquid circulated and sprayed from the electromagnetic nozzle 72 will scatter outwards, and the spray range of the electroplating liquid is larger than the size of the plate. This causes some of the electroplating liquid to drip from both sides of the plate. This part of the electroplating liquid cannot be directly collected by the main collection chamber 4. Therefore, this embodiment is provided with a secondary collection section to avoid the above problem.

[0034] The VCP jet liquid sedimentation collection unit also includes a secondary collection section, which includes a secondary collection chamber 5. The secondary collection chamber 5 is configured in two sets, and the two sets of secondary collection chambers 5 are installed on both sides of the main collection chamber 4. The secondary collection chamber 5 is provided with a secondary collection cavity 51. The top of the secondary collection cavity 51 is provided with a second collection slope 52, and the bottom of the secondary collection cavity 51 is provided with a confluence slope 53. The bottom of the confluence slope 53 faces the guide slope 43.

[0035] In this embodiment, a second collection slope 52 is provided in the top area of ​​the secondary collection cavity 51. The second collection slope 52 is also arc-shaped, which allows the electroplating liquid falling on the surface of the second collection slope 52 to flow smoothly into the secondary collection cavity 51 along the second collection slope 52, improving the collection effect of the electroplating liquid in this area. At the same time, a confluence slope 53 is provided at the bottom of the secondary collection cavity 51. The confluence slope 53 will guide the additional collected electroplating liquid to the main collection cavity 41, completing the overall collection of the electroplating liquid and further ensuring the recycling of the electroplating liquid.

[0036] Working principle: Before the electroplating step, the operator can drive the electric drive rail 2, which moves the moving table 21 to one side of the hanger 1. Then, the operator loads the circuit board through the board clamp 24 at the bottom of the moving table 21. After the board clamp 24 is loaded, the operator drives the electric drive rail 2 to move the moving table 21 toward the spray electroplating area. When the moving table 21 moves the board to the spray area, the spray chamber 71 in the side spray frame 7 area is activated to supply electroplating solution to the electromagnetic nozzle 72. Then, the electromagnetic nozzle 72 is driven to spray electroplating evenly from both sides of the board, thereby ensuring that the electroplating solution effectively adheres to the board surface and makes the electroplating layer on the board surface uniform.

[0037] During the electroplating process, the electroplating solution circulated from the electromagnetic nozzle 72 first comes into contact with the plate. After contacting the plate, the electroplating solution drips onto the outer area of ​​the plate. Some of the electroplating solution falls into the main collection chamber 4. The main collection chamber 41 inside the main collection chamber 4 can serve as the main collection area for the electroplating solution. The collection ramp 42 at the top of the main collection chamber 41 is arc-shaped, which allows the electroplating solution falling on the surface of the collection ramp 42 to flow smoothly into the main collection chamber 41, improving the collection efficiency of the electroplating solution. The bottom of the main collection chamber 41 is provided with a guide ramp 43. The two sets of guide ramps 43 are symmetrical. At the same time, the buffer column 44 installed at the top of the guide ramp 43 can reduce the flow rate of the electroplating solution, so that the electroplating solution is smoothly diverted from the two sets of guide ramps 43 into the sedimentation chamber 6, thereby ensuring the recycling of the electroplating solution.

[0038] The electroplating solution circulated and sprayed from the electromagnetic nozzle 72 will scatter outwards. The spray range of the electroplating solution is larger than the size of the plate, which causes some of the electroplating solution to drip from both sides of the plate. This part of the electroplating solution cannot be directly collected by the main collection chamber 4. In order to ensure the smooth collection of this part of the electroplating solution, auxiliary collection chambers 5 are installed on both sides of the main collection chamber 4 for collection. The auxiliary collection chamber 5 is provided with a secondary collection cavity 51. At the same time, a second collection slope 52 is provided at the top of the secondary collection cavity 51. The second collection slope 52 is also set as an arc. This allows the electroplating solution falling on the surface of the second collection slope 52 to flow smoothly into the secondary collection cavity 51 along the second collection slope 52, improving the collection effect of the electroplating solution in this area. At the same time, a converging slope 53 is provided at the bottom of the secondary collection cavity 51. The converging slope 53 will guide the additional collected electroplating solution to the main collection chamber 41 to complete the overall collection of the electroplating solution and further ensure the recycling of the electroplating solution.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An electroplating apparatus for circuit board processing, characterized in that: The system includes a hanger (1), an electric drive rail (2), a sedimentation platform (3), a main collection chamber (4), and a VCP jet liquid sedimentation and collection unit. The hanger (1) is configured in two sets, and the two sets of hangers (1) are symmetrically arranged. The electric drive rail (2) is installed between adjacent hangers (1). The sedimentation platform (3) is installed on the bottom surface of the hanger (1). The main collection chamber (4) is installed on the top of the sedimentation platform (3). The VCP jet liquid sedimentation and collection unit is set on both sides of the main collection chamber (4) for recycling the jet liquid.

2. The electroplating apparatus for circuit board processing according to claim 1, characterized in that: The VCP jet liquid sedimentation collection unit includes a main collection section, which includes a buffer column (44). The main collection chamber (4) is provided with a main collection cavity (41). The top of the main collection cavity (41) near the electric drive rail (2) is provided with a collection ramp (42). The collection ramp (42) is symmetrically arranged. The bottom area of ​​the main collection cavity (41) is provided with a guide ramp (43). The guide ramp (43) is also symmetrically arranged. The buffer column (44) is installed on the top of the guide ramp (43).

3. The electroplating apparatus for circuit board processing according to claim 2, characterized in that: The VCP jet liquid sedimentation collection unit also includes a secondary collection section, which includes a secondary collection chamber (5). The secondary collection chamber (5) is configured in two groups, and the two groups of secondary collection chambers (5) are installed on both sides of the main collection chamber (4). The secondary collection chamber (5) is provided with a secondary collection cavity (51) inside. The top of the secondary collection cavity (51) is provided with a second collection slope (52), and the bottom of the secondary collection cavity (51) is provided with a confluence slope (53). The bottom of the confluence slope (53) faces the guide slope (43).

4. The electroplating apparatus for circuit board processing according to claim 1, characterized in that: A mobile platform (21) is installed on the moving end of the electric drive rail (2). Splash guards (22) are symmetrically installed on both sides of the bottom of the mobile platform (21). The splash guards (22) are L-shaped.

5. The electroplating apparatus for circuit board processing according to claim 4, characterized in that: The bottom of the mobile platform (21) is equipped with a fixed base (23).

6. The electroplating apparatus for circuit board processing according to claim 5, characterized in that: Two sets of plate clamps (24) are symmetrically installed at the bottom of the fixed base (23).

7. The electroplating apparatus for circuit board processing according to claim 3, characterized in that: The sedimentation platform (3) is provided with two sedimentation chambers (6) at the top, and the sedimentation chambers (6) are connected to the main collection chamber (41).

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