Photoelectric sensor with anti-seismic structure
By introducing a C-shaped frame with damping discs and springs into the photoelectric sensor, the problems of component damage and positional displacement caused by vibration are solved, achieving good buffering and shock absorption effects and positional stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 深圳市华众自动化工程有限公司
- Filing Date
- 2025-06-09
- Publication Date
- 2026-05-12
AI Technical Summary
现有光电传感器在震动过程中，橡胶垫板的缓冲复位效果不佳，易导致内部元件受损及位置偏移，影响使用效果。
The seismic resistant assembly uses a combination of a C-shaped frame, a damping disc, and a spring. The damping disc and buffer oil work together to achieve damping and buffering, and the spring's reset function enhances the seismic resistance.
This effectively reduces damage to the internal components of the photoelectric sensor, maintains a stable installation position, and ensures optimal performance in subsequent use.
Smart Images
Figure CN224229166U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to photoelectric sensor technical field especially is photoelectric sensor with anti shock structure. BACKGROUND
[0002] Photoelectric sensor is a kind of device to convert optical signal into electrical signal, and its working principle is based on photoelectric effect.Photoelectric effect refers to the phenomenon that when light irradiates on certain material, the electron of the material absorbs the energy of photon and occurs corresponding electric effect, which can be used in measurement operation of multiple industries.
[0003] In the prior art, the installation of photoelectric sensor is usually connected with the butt joint by bolt, and the two are directly matched with rubber pad for buffering treatment, but the method has the following defects in actual use: in the process of being shocked, the buffering reset effect of rubber pad is poor, which easily leads to damage of internal elements of photoelectric sensor and position deviation phenomenon, affecting the subsequent use effect. UTILITY MODEL CONTENT
[0004] Therefore, it is necessary to provide a photoelectric sensor with anti shock structure to solve the problems of easy damage of internal elements and easy position deviation.
[0005] A photoelectric sensor with anti shock structure includes a sensor main body, and further includes an anti shock assembly arranged on the outer side of the sensor main body and used for buffering and resisting the vibration received by the sensor main body, wherein the anti shock assembly includes a C-shaped frame and four connecting rods, one end of each connecting rod penetrates into the inside of the C-shaped frame and is provided with a damping disc, a group of damping holes are formed in the inside of the damping disc, the connecting rod can move in horizontal direction and vertical direction, and the other end of the connecting rod is installed on the outer side of the sensor main body.
[0006] In one embodiment, a spring is installed on the side of the damping disc away from the connecting rod, and one end of the spring is installed in the inside of the C-shaped frame.
[0007] In one embodiment, a cavity for containing buffer oil is formed in the inside of the C-shaped frame, and an oil injection hole is arranged on the C-shaped frame.
[0008] In one embodiment, a group of movable grooves in communication with the cavity are formed in the inner wall of the C-shaped frame, a baffle for shielding the movable grooves is slidably arranged on the outer side of the connecting rod, and the baffle is slidably connected to the inside of the C-shaped frame.
[0009] In one embodiment, a convex-shaped sliding block is arranged between the baffle and the C-shaped frame, and a sealing gasket is arranged on the outer side of the convex-shaped sliding block.
[0010] In one of the embodiments, a sealing ring is arranged at the connection between the baffle and the connecting rod.
[0011] In one of the embodiments, two of the connecting rods are arranged in a bent manner, and the other two connecting rods are arranged in a cylindrical manner.
[0012] Advantages
[0013] 1. By arranging the damping disc, in the process of being subjected to the shock, the connecting rods arranged in a bent manner and the connecting rods arranged in a cylindrical manner are matched with the corresponding damping disc, and corresponding movements are made according to the shock condition, in the movement process, the buffer oil flows along the damping holes in the damping disc, so as to achieve the damping effect, so that the photoelectric sensor has good buffering and shock resistance effect, and the damage of internal elements is reduced;
[0014] 2. By arranging the spring, in the process of being subjected to the shock, the spring itself is driven to reset the corresponding damping disc by using the deformation force, so as to ensure that the photoelectric sensor is reset after being subjected to the shock, ensure the stability of the installation position, and ensure the subsequent use effect. BRIEF DESCRIPTION OF DRAWINGS
[0015] In order to more clearly illustrate the technical scheme of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description. Obviously, the drawings described below are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.
[0016] Figure 1 It is a structural schematic view of the present application;
[0017] Figure 2 It is a structural schematic view of the C-shaped frame and the sensor main body of the present application;
[0018] Figure 3 It is a sectional view of the C-shaped frame of the present application;
[0019] Figure 4 It is Figure 3 It is an enlarged view of A in the figure.
[0020] Reference signs:
[0021] 100, sensor main body; 200, shock resistance assembly; 210, C-shaped frame; 211, movable groove; 220, connecting rod; 221, damping disc; 222, spring; 223, baffle. DETAILED DESCRIPTION
[0022] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0023] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there can be a middle component. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or there can be a middle component. The terms "vertical", "horizontal", "upper", "lower", "left", "right", and similar expressions used in the description of the present application are for the purpose of illustration only and do not indicate the only embodiments.
[0024] In addition, the terms "first", "second", "third", etc. are used only for descriptive purposes and should not be construed as indicating or implying relative importance or an indicated number of technical features. Therefore, the features defined as "first", "second", etc. can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.
[0025] In the present application, unless otherwise specifically defined and limited, the "on", "under", "above" and "below" of the first feature to the second feature can be that the first feature is in direct contact with the second feature, or the first feature is indirectly in contact with the second feature through an intermediate medium. Moreover, the "on", "above" and "below" of the first feature to the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "under", "below" and "below" of the first feature to the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0026] Unless otherwise defined, all technical and scientific terms used in the specification of the present application have the same meaning as understood by those skilled in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used in the specification of the present application includes any and all combinations of one or more related listed items.
[0027] The embodiments of the present application will be described below in conjunction with Figures 1-4 The photoelectric sensor with anti-seismic structure of the present application is described.
[0028] In one embodiment, a photoelectric sensor with an anti-shock structure comprises a sensor body 100; further comprising an anti-shock assembly 200 arranged outside the sensor body 100 and used to buffer the shock received by the sensor body 100; wherein the anti-shock assembly 200 comprises a C-shaped frame 210 and four connecting rods 220, one end of the connecting rod 220 penetrates into the inside of the C-shaped frame 210 and is provided with a damping disc 221, a group of damping holes are arranged in the inside of the damping disc 221, the connecting rod 220 can move in horizontal and vertical directions, and the other end of the connecting rod 220 is installed outside the sensor body 100.
[0029] As shown in Figure 3 , the damping disc 221 is provided with a spring 222 on the side away from the connecting rod 220, and one end of the spring 222 is installed in the inside of the C-shaped frame 210.
[0030] In this embodiment, when subjected to shock, the C-shaped frame 210 is pre-stressed, and then corresponding movement of the connecting rod 220 and the damping disc 221 can be realized according to the direction of the shock. During the movement, the buffer oil flows along the damping holes on the damping disc 221, and the buffer oil is blocked during the flow process, achieving a damping effect, thereby resisting and weakening the shock transmitted to the sensor body 100. In combination with the arrangement of the spring 222, the corresponding damping disc 221 can be driven to reset during the anti-shock process, restoring the installation position of the photoelectric sensor body 100, facilitating subsequent use.
[0031] It should be noted that the end of the C-shaped frame 210 is provided with an ear plate, and the user can use the ear plate to butt joint the end region of the C-shaped frame 210 with a horizontal butt joint piece through a bolt, and a metal gasket is additionally arranged on the bolt to improve the anti-shock effect.
[0032] As shown in Figure 1 , Figure 2 , Figure 3 and Figure 4 , a cavity for accommodating buffer oil is arranged in the inside of the C-shaped frame 210, and an oil injection hole is arranged on the C-shaped frame 210.
[0033] When the user installs the photoelectric sensor body 100, the buffer oil can be introduced into the cavity through the oil injection hole, and the subsequent buffer treatment between the oil and the damping disc 221 is completed.
[0034] It should be noted that a protective plug is arranged in the oil injection hole, and after the buffer oil is injected, the buffer oil will fill the inside of the cavity and submerge all the damping discs 221.
[0035] As shown in Figure 3 and Figure 4As shown, the inner wall of the C-shaped frame 210 is provided with a set of movable grooves 211 in communication with the cavity, and the outer side of the connecting rod 220 is slidably sleeved with a baffle 223 for shielding the movable grooves 211, and the baffle 223 is slidably connected to the inside of the C-shaped frame 210.
[0036] With the arrangement of the movable grooves 211, the corresponding connecting rod 220 has enough space to perform corresponding anti-seismic activities after being shaken, and the arrangement of the baffle 223 can shield the buffer oil without affecting the movement of the connecting rod 220.
[0037] As shown in Figure 4 , a convex slide is arranged between the baffle 223 and the C-shaped frame 210, and a sealing gasket is arranged on the outer side of the convex slide.
[0038] This can reduce the phenomenon of buffer oil leakage.
[0039] As shown in Figure 4 , a sealing ring is arranged at the connection between the baffle 223 and the connecting rod 220.
[0040] This can reduce the accidental leakage of buffer oil along the connection between the baffle 223 and the connecting rod 220.
[0041] As shown in Figure 1 and Figure 3 , two of the connecting rods 220 are arranged in a bent manner, and the remaining two connecting rods 220 are arranged in a cylindrical manner.
[0042] The connecting rod 220 arranged in a cylindrical manner is used for vertical buffering movement, and the connecting rod 220 arranged in a bent manner is used for horizontal buffering movement.
[0043] Working principle: the C-shaped frame 210 is installed on the butt joint member through the ear plate, and when shaken, the photoelectric sensor body 100 can move vertically or horizontally according to the vibration, and in the movement process, the damping disc 221 cooperates with the buffer oil to perform damping buffering treatment, achieving the effect of anti-seismic, reducing the damage to the sensor body 100, and then the spring 222 drives the connecting rod 220 and the sensor body 100 to reset for subsequent use.
[0044] The technical features of the above-described embodiments can be combined in any manner, and to make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, however, as long as the combinations of the technical features do not exist contradictory, it should be considered as the scope of the present application.
[0045] The above-described embodiments only express several implementation manners of the present application, the description is relatively specific and detailed, but cannot be understood as the limitation of the scope of the present application. It should be pointed out that, for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.
Claims
1. A photoelectric sensor with a shock-resistant structure, characterized in that, include: Sensor body (100); It also includes a shock-absorbing component (200), which is disposed on the outside of the sensor body (100) and is used to buffer and resist the vibrations received by the sensor body (100); The seismic component (200) includes a C-shaped frame (210) and four connecting rods (220). One end of each connecting rod (220) is inserted into the interior of the C-shaped frame (210) and a damping disc (221) is installed thereon. A set of damping holes are provided inside the damping disc (221). The connecting rod (220) can move in both the horizontal and vertical directions. The other end of each connecting rod (220) is installed on the outside of the sensor body (100).
2. The photoelectric sensor with an anti-vibration structure according to claim 1, characterized in that, A spring (222) is installed on the side of the damping disc (221) away from the connecting rod (220), and one end of the spring (222) is installed inside the C-shaped frame (210).
3. The photoelectric sensor with an anti-vibration structure according to claim 1, characterized in that, The C-shaped frame (210) has an internal cavity for accommodating buffer oil, and the C-shaped frame (210) is provided with an oil injection hole.
4. The photoelectric sensor with an anti-vibration structure according to claim 1, characterized in that, The inner wall of the C-shaped frame (210) is provided with a set of movable slots (211) that communicate with the cavity. The outer side of the connecting rod (220) is slidably fitted with a baffle (223) for blocking the movable slots (211). The baffle (223) is slidably connected to the inside of the C-shaped frame (210).
5. The photoelectric sensor with an anti-vibration structure according to claim 4, characterized in that, A convex slider is provided between the baffle (223) and the C-shaped frame (210), and a sealing gasket is provided on the outside of the convex slider.
6. The photoelectric sensor with an anti-vibration structure according to claim 4, characterized in that, A sealing ring is provided at the connection between the baffle (223) and the connecting rod (220).
7. The photoelectric sensor with an anti-vibration structure according to claim 1, characterized in that, Two of the connecting rods (220) are bent, while the remaining two connecting rods (220) are cylindrical.