Process furnace and process equipment

Abstract

The utility model relates to the technical field of semiconductors and photovoltaics, in particular to a process furnace and process equipment, and solves the problem that the productivity cannot be further improved due to low annealing efficiency in related technologies. The process furnace and the process equipment comprise a furnace body and a plurality of air inlet assemblies, a process chamber of the furnace body comprises a plurality of sub-chambers arranged in the first direction, and each sub-chamber is configured to contain a bearing assembly; the air inlet assemblies are oppositely arranged on the two sides of each sub-cavity in the first direction, each air inlet assembly communicates with the first air inlet, the air inlet assemblies are provided with a plurality of air outlet holes communicating with the first air inlet, and under the condition that the bearing assemblies are contained in the sub-cavities, the air outlet holes face the bearing assemblies; the plurality of gas outlet holes are configured to diffuse gas entering from the first gas inlet toward the sheet. According to the process furnace and the process equipment provided by the invention, the annealing uniformity and the annealing efficiency of simultaneous annealing of more sheets can be met, and the annealing capacity is further improved.

Description

Technical Field

[0001] This disclosure relates to the fields of semiconductor and photovoltaic technology, and in particular to a process furnace and process equipment. Background Technology

[0002] Photovoltaic power generation technology is one of the most important renewable energy technologies. Compared to traditional energy sources, the cost of solar power generation remains high, severely restricting its development and application. Therefore, industry and the scientific community have been committed to improving the photoelectric conversion efficiency of solar cells and reducing their manufacturing costs. To improve the photoelectric conversion efficiency, process equipment is needed to process the solar cells. Taking annealing as an example, traditional annealing furnaces use an assembly line to anneal individual sheets sequentially. To increase production capacity, the length of the assembly line needs to be increased, resulting in a larger footprint. If the annealing furnace anneales multiple sheets simultaneously, the time required to form a uniform and stable thermal field within the chamber is long, leading to reduced annealing efficiency and preventing effective increases in production capacity. Utility Model Content

[0003] In view of this, the present disclosure provides a process furnace and process equipment to solve the problem that the low annealing efficiency in the related art prevents further improvement of production capacity.

[0004] In a first aspect, one embodiment of this disclosure provides an annealing furnace configured to process sheets, wherein multiple sheets are supported by carriers, each or more carriers serving as a carrier assembly. The furnace includes: a furnace body having at least one process chamber, the process chamber having at least one first air inlet, the process chamber including multiple sub-chambers arranged along a first direction, each sub-chamber being configured to house a carrier assembly, and the extension direction of the sheet carried in the housed carrier assembly being parallel to the first direction; and multiple sets of air inlet assemblies, disposed opposite to each sub-chamber on both sides of the first direction, each air inlet assembly communicating with the first air inlet, the air inlet assembly having multiple air outlets communicating with the first air inlet, wherein when the sub-chamber houses the carrier assembly, the air outlets face the carrier assembly, and the multiple air outlets are configured to allow gas entering from the first air inlet to diffuse toward the sheet.

[0005] In some embodiments, the air intake assembly includes: two sets of first air intake assemblies disposed opposite to each other on the side walls of the process chamber in a first direction, the first air intake assemblies being connected to a first air inlet, and the first air intake assemblies having a plurality of air outlets distributed on the side of the first air intake assembly facing the process chamber in the first direction; and at least one set of second air intake assemblies disposed between the two sets of first air intake assemblies in the first direction, the second air intake assemblies being configured to divide the process chamber into a plurality of interconnected sub-chambers, and the second air intake assemblies being connected to the first air inlet, and the second air intake assemblies having a plurality of air outlets distributed on the opposite sides of the first air intake assembly.

[0006] In some embodiments, the number of first air inlets is multiple, and the multiple first air inlets include multiple first sub-air inlets and multiple second sub-air inlets. The first sub-air inlets are disposed on the side walls of the process chamber in a first direction, and the second sub-air inlets are disposed on the top wall of the process chamber. The first air intake assembly includes: a first flow equalizer disposed on the side walls of the process chamber in a first direction, the first flow equalizer having a first flow equalizer chamber communicating with the first sub-air inlets, and the first flow equalizer having an air outlet on the side opposite to the first sub-air inlets communicating with the first flow equalizer chamber; and a first air equalizer assembly having a first air inlet and multiple first air outlets, the first air inlet communicating with the first sub-air inlets, and at least a portion of the first air equalizer assembly extending outwards. The first air inlet chamber is provided with a second air inlet, such that a plurality of first air outlets are distributed in the first air inlet chamber; and / or, the second air inlet assembly includes: a second air inlet member disposed on the top wall of the process chamber and extending to the bottom wall of the process chamber, the second air inlet member being located between the two sets of first air inlet assemblies in a first direction, the second air inlet member having a second air inlet chamber communicating with a second sub-air inlet, and air outlets communicating with the second air inlet chamber being provided on both sides of the second air inlet member in the first direction; and a second air inlet pipe group having a second air inlet and a plurality of second air outlets, the second air inlet communicating with the second sub-air inlet, at least a portion of the second air inlet pipe group extending into the second air inlet chamber, such that a plurality of second air outlets are distributed in the second air inlet chamber.

[0007] In some embodiments, the process chamber has first air outlets on both side walls in the first direction, and the first air outlets on each side wall are located on one side of the first sub-inlet in the second direction. The first direction and the second direction are perpendicular, and the first air outlets and the second flow equalizer do not overlap in the orthographic projection of the second flow equalizer onto the side wall of the process chamber in the first direction. When the first air intake assembly includes the first flow equalizer and the second air intake assembly includes the second flow equalizer, the first flow equalizer includes: a first flow equalizer box having a first opening; a first flow equalizer plate covering the first opening to enclose the first flow equalizer chamber, and a plurality of air outlets are distributed on the first flow equalizer plate; the second flow equalizer includes: a second flow equalizer box, located on the side wall in the first direction. The two sides of the device are provided with second openings respectively; two second flow equalizing plates are respectively covered by the second openings to form a second flow equalizing chamber, and multiple air outlets are distributed on the second flow equalizing plates; wherein, in the vertical projection of the first flow equalizing element and the second flow equalizing element onto the bottom wall of the process chamber, the two first flow equalizing plates are respectively inclined at a first angle relative to the second direction, and the inclination directions of the two first flow equalizing plates are opposite, and the two second flow equalizing plates of each second flow equalizing box are respectively inclined at a second angle relative to the second direction, and the inclination directions of the two second flow equalizing plates are opposite, and the first flow equalizing plate and the second flow equalizing plate located in the same sub-chamber are inclined in opposite directions relative to the second direction, so that the gas discharged from the air outlet diffuses toward the first air outlet.

[0008] In some embodiments, the first included angle and the second included angle are the same; and / or, the first flow equalizer is rotatably connected to the first flow equalizer box, and the first included angle is adjustable; and / or, the second flow equalizer is rotatably connected to the second flow equalizer box, and the second included angle is adjustable; and / or, the first included angle is less than or equal to 5°; and / or, the second included angle is less than or equal to 5°.

[0009] In some embodiments, the first air intake assembly further includes: a first heating element disposed in the first flow equalization chamber, the first heating element being configured to heat the gas before it is discharged from the air outlet; and / or, the second air intake assembly further includes: a second heating element disposed in the second flow equalization chamber, the second heating element being configured to heat the gas before it is discharged from the air outlet.

[0010] In some embodiments, the system further includes: a third flow equalizer disposed on both side walls of the process chamber in a first direction, the third flow equalizer disposed on one side of the first flow equalizer in a second direction, the third flow equalizer communicating with the first air outlet, the third flow equalizer having a third flow equalizer chamber communicating with the first air outlet, and the third flow equalizer having a plurality of air inlets communicating with the third flow equalizer chamber on the side of the third flow equalizer away from the first air outlet, the air inlets being configured to introduce gas from each sub-chamber into the third flow equalizer chamber through the air inlets.

[0011] In some embodiments, the furnace further includes: a conveying assembly disposed in the furnace body, the conveying assembly being configured to carry a plurality of carrier assemblies spaced apart along a first direction, and being configured to move the plurality of carrier assemblies along a second direction to simultaneously input or output a plurality of sub-chambers, the first direction and the second direction intersecting; and / or a heating assembly disposed on the top wall and / or bottom wall of each sub-chamber, the heating assembly being configured to heat the corresponding sub-chamber.

[0012] In some embodiments, where the process furnace includes a conveying assembly, the furnace body further includes: a first buffer chamber disposed on one side of the process chamber along a second direction, the first buffer chamber being configured to accommodate a plurality of carrier assemblies spaced apart along a first direction, the first buffer chamber having a second air inlet configured to supply gas into the first buffer chamber; and a first flap valve assembly disposed between the first buffer chamber and the process chamber, the first flap valve assembly being configured to connect or disconnect the first buffer chamber and the process chamber, wherein when the first flap valve assembly connects the first buffer chamber and the process chamber, the conveying assembly is configured to convey the plurality of carrier assemblies along a second direction. The conveying assembly is configured to transport the components to the process chamber in two directions; and / or, a second buffer chamber is disposed on the other side of the process chamber along the second direction, the second buffer chamber is configured to accommodate multiple sets of carrier components arranged at intervals along the first direction, the second buffer chamber is provided with a third air inlet, the third air inlet is configured to supply gas into the second buffer chamber; a second flap valve assembly is disposed between the second buffer chamber and the process chamber, the second flap valve assembly is configured to connect or disconnect the second buffer chamber and the process chamber, and when the second flap valve assembly connects the second buffer chamber and the process chamber, the conveying assembly is configured to convey the multiple sets of carrier components of the process chamber to the second buffer chamber.

[0013] Secondly, embodiments of this disclosure also provide a process apparatus, including: a process furnace as described in the above embodiments, the process furnace being configured to process sheets supported on multiple sets of support components; and a loading and unloading assembly disposed on at least one side of the process furnace, the loading and unloading assembly being configured to load the support components into the process furnace or unload the support components from the process furnace.

[0014] This disclosure provides a process furnace and process equipment that divides a process chamber into multiple sub-chambers, each of which can accommodate a carrier component. Air inlet components are provided on both sides of each sub-chamber along a first direction, allowing gas to diffuse from different directions into each sub-chamber through the air outlets of the air inlet components. This enables the gas to diffuse rapidly and uniformly to all areas of the sub-chambers, improving process efficiency while simultaneously processing more silicon wafers and facilitating further capacity increases.

[0015] In addition, multiple sets of air intake components are arranged opposite each other on both sides of each sub-chamber in the first direction, and the extension direction of the silicon wafer in the carrier component contained in each sub-chamber is parallel to the first direction. This allows the gas discharged from the air outlet to diffuse quickly and evenly toward the silicon wafer, thereby enabling a uniform and stable gas field to be quickly formed around the silicon wafer in each sub-chamber, further improving process efficiency. Attached Figure Description

[0016] The above and other objects, features, and advantages of this disclosure will become more apparent from the more detailed description of the embodiments thereof in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the disclosure and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0017] Figure 1 The diagram shown is a schematic diagram of a process furnace provided in an embodiment of this disclosure.

[0018] Figure 2 The diagram shown is a schematic diagram of multiple sets of carrier components provided in an embodiment of this disclosure.

[0019] Figure 3 The image shown is a cross-sectional view of a process chamber provided in an embodiment of this disclosure.

[0020] Figure 4 The diagram shown is a schematic diagram of a heating assembly provided in an embodiment of this disclosure.

[0021] Figure 5 The image shown is a cross-sectional view of a first buffer chamber provided in an embodiment of this disclosure.

[0022] Figure 6 The diagram shown is a schematic diagram of a first flap valve assembly provided in an embodiment of this disclosure.

[0023] Figure 7 The diagram shown is a schematic diagram of a process chamber carrying a support assembly according to an embodiment of the present disclosure.

[0024] Figure 8 The diagram shown is a schematic diagram of a process chamber provided in an embodiment of this disclosure that does not carry a carrier component.

[0025] Figure 9 As shown Figure 8 A magnified view of part A in the process chamber shown.

[0026] Figure 10 The image shown is a cross-sectional top view of a second air intake assembly provided in an embodiment of this disclosure.

[0027] Figure 11 The diagram shown is a schematic diagram of a first air intake assembly provided in an embodiment of this disclosure.

[0028] Figure 12 The image shown is a cross-sectional top view of a first air intake assembly provided in an embodiment of this disclosure.

[0029] Figure label:

[0030] 10. Annealing furnace; 1. Furnace body; 11. Process chamber; 11a. First air inlet; 11a1. Second sub-air inlet; 11a2. First sub-air inlet; 11b. First air outlet; 11c. Temperature detection element; 111. Sub-chamber; 12. First buffer chamber; 12a. Second air inlet; 12b. Second air outlet; 121. Air inlet assembly; 122. Heating bar; 13. First flap valve assembly; 131. Door panel; 132. Connecting rod assembly; 133. Cylinder; 14. Second buffer chamber; 14a. Third air inlet; 14b. Third air outlet; 15. Second flap valve assembly; 16. Conveying assembly; 161. Motor; 162. Conveyor roller; 163. Conveyor belt; 164. Conveyor belt; 17. Air inlet assembly; 171. First air inlet assembly; 171a 1711. Air outlet; 1711a. First flow equalizer; 1712. First flow equalizer chamber; 1713. First air equalizer assembly; 1713a. First air outlet; 1713b. First air inlet; 1714. First heating element; 172. Second air inlet assembly; 1721. Second flow equalizer; 1721a. Second flow equalizer chamber; 1722. Second flow equalizer plate; 1723. Second air equalizer assembly; 1724. Second heating element; 18. Heating assembly; 181. Mounting bracket; 182. Heating tube; 183. Conductive connection part; 19. Third flow equalizer; 191. Air inlet; 2. Bearing assembly; 21. Bearing element; 3. Support plate; b1. First included angle; b2. Second included angle; X. First direction; Y. Second direction; Z. Vertical direction. Detailed Implementation

[0031] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0032] Figure 1 The diagram shown is a schematic diagram of a process furnace provided in an embodiment of this disclosure. Figure 2 The diagram shown is a schematic diagram of multiple sets of carrier components provided in an embodiment of this disclosure. Figure 3 The image shown is a cross-sectional view of a process chamber provided in an embodiment of this disclosure. Figure 4 The diagram shown is a schematic diagram of a heating assembly provided in an embodiment of this disclosure. Figure 5 The image shown is a cross-sectional view of a first buffer chamber provided in an embodiment of this disclosure. Figure 6The diagram shown is a schematic of a first flap valve assembly provided in an embodiment of this disclosure. Arrow X points to a first direction, arrow Y points to a second direction, and arrow Z points to a vertical direction. The first direction X, the second direction Y, and the vertical direction Z are mutually perpendicular, and will not be emphasized separately thereafter.

[0033] This disclosure provides a process furnace, such as Figures 1 to 6 The process furnace is used in process equipment and is configured to process sheets. Multiple sheets are supported by carriers 21, each or more carriers 21 serving as a carrier assembly 2. The process furnace includes a furnace body 1, which has at least one process chamber 11 configured to accommodate multiple sets of carrier assemblies 2 arranged along a first direction X.

[0034] Optionally, the wafer can be a semiconductor or photovoltaic material used to prepare solar cells, and is uniformly referred to as a "silicon wafer" in this disclosure. After being processed through different processes such as cutting, coating, and annealing, the silicon wafer is finally called a usable solar cell. The shape of the silicon wafer includes square, round, etc., and its specific size can be adapted to actual needs and is not specifically limited.

[0035] Optionally, such as Figure 2 The carrier 21 can be a boat structure for carrying multiple silicon wafers. The boat structure allows as many silicon wafers as possible to be exposed, facilitating the processing of the silicon wafers carried on the carrier 21. The specific structure of the carrier 21 is not described in detail. It should be emphasized that when multiple carriers 21 are combined into a carrier assembly 2, the multiple carriers 21 can be arranged in a multi-row, multi-column array. When the carrier assembly 2 is placed in the process chamber 11, the number of rows of multiple carriers 21 arranged in the first direction X is preferably no more than two. In this embodiment, the carriers 21 in the carrier assembly 2 are arranged in two rows and two columns, which is not a limitation. In addition, in order to facilitate the transport of multiple sets of carrier assemblies 2, multiple sets of carrier assemblies 2 are spaced apart on the tray 3 along the first direction X. The tray 3 and the multiple sets of carrier assemblies 2 are input to or output from the process chamber 11 together. Furthermore, among the multiple sets of carrier components 2 supported by the support plate 3, the multiple silicon wafers supported on each carrier component 21 can be arranged along the vertical direction Z. The plane of the silicon wafer is parallel to (or approximately parallel to) the horizontal plane formed by the first direction X and the second direction Y. The extension direction of the silicon wafer is parallel to the first direction X. Alternatively, the multiple silicon wafers supported on each carrier component 21 can be arranged along the second direction Y. The extension direction of the silicon wafer is parallel to (or approximately parallel to) the vertical plane formed by the first direction X and the vertical direction Z. In this case, the extension direction of the silicon wafer is also parallel to the first direction X. It can be adaptively adjusted according to actual needs. In this embodiment of the present disclosure, the multiple silicon wafers of the carrier component 21 are placed horizontally, and the multiple silicon wafers are arranged along the vertical direction Z.

[0036] Furthermore, among the multiple silicon wafers supported on the carrier 21, a gap can be reserved between each pair of adjacent silicon wafers, allowing the multiple silicon wafers to be arranged at intervals on the carrier 21 to facilitate double-sided processing of the silicon wafers; alternatively, each pair of adjacent silicon wafers can be grouped together, with the surfaces of the two silicon wafers in the same group bonded together, and a gap left between different groups to facilitate single-sided processing of the silicon wafers. Therefore, the specific arrangement of the multiple silicon wafers supported on the carrier 21 can be adaptively adjusted according to actual needs and is not specifically limited. In this embodiment of the present disclosure, the multiple silicon wafers of the carrier 21 are arranged in a form of equal intervals along the vertical direction Z, that is, there is a gap between each pair of adjacent silicon wafers supported by the carrier 21, and the size of the gap formed between adjacent silicon wafers can be adaptively adjusted according to actual needs.

[0037] It is understood that the process equipment can be related equipment for processing silicon wafers, such as annealing equipment, coating equipment, etc. In this embodiment, the process equipment is set as an annealing equipment for illustration, and the process furnace is correspondingly set as an annealing furnace 10. In the annealing furnace 10, the furnace body 1 can have one process chamber 11, or it can have multiple interconnected process chambers 11, which can be adapted to actual needs and are not specifically limited.

[0038] Understandably, the process chamber 11 is provided with at least one first air inlet 11a and at least one first air outlet 11b. The first air inlet 11a is connected to an external air intake device and is configured to introduce gas from the air intake device into the process chamber 11. The first air outlet 11b is connected to an external air extraction device and is configured to exhaust gas from the process chamber 11 to the air extraction device. The process chamber 11 is isolated from the external environment. The gas entering the process chamber 11 from the first air inlet 11a can be nitrogen to reduce the oxygen content in the process chamber 11. The gas enters from the first air inlet 11a and exits from the first air outlet 11b to achieve gas circulation in the process chamber 11, thereby increasing the gas flow rate within the process chamber 11.

[0039] like Figure 3The process chamber 11 includes a plurality of sub-chambers 111 arranged along a first direction X. Each sub-chamber 111 is configured to house a carrier component 2, and the silicon wafer carried in the carrier component 2 extends parallel to the first direction X. A plurality of air intake components 17 are disposed opposite to each sub-chamber 111 on both sides of the first direction X. Each air intake component 17 is connected to a first air inlet 11a. The air intake component 17 is provided with a plurality of air outlets 171a connected to the first air inlet 11a. When the carrier component 2 is housed in the sub-chamber 111, the air outlets 171a face the carrier component 2. The plurality of air outlets 171a are configured to allow the gas entering from the first air inlet 11a to diffuse toward the silicon wafer.

[0040] The annealing furnace (process furnace) provided in this embodiment divides the process chamber 11 into multiple sub-chambers 111, so that each sub-chamber 111 can accommodate a carrier component 2. An air inlet component 17 is provided on both sides of each sub-chamber 111 along the first direction X, so that gas can diffuse towards the silicon wafer from different directions through the air outlet 171a of the air inlet component 17. This allows the gas to diffuse quickly and evenly to various areas of the sub-chamber 111, thereby improving annealing efficiency while enabling more silicon wafers to be annealed at the same time, which is conducive to further increasing production capacity.

[0041] In addition, multiple sets of air intake components 17 are arranged opposite each other on both sides of each sub-chamber 111 in the first direction X, and the extension direction of the silicon wafer in the carrier component 2 contained in each sub-chamber 111 is parallel to the first direction X, so that the gas discharged from the air outlet 171a can quickly and uniformly diffuse toward the silicon wafer, thereby quickly forming a uniform and stable gas field around the silicon wafer in each sub-chamber 111, further improving the annealing efficiency.

[0042] In addition, multiple sets of air intake components 17 are arranged opposite each other on both sides of each sub-chamber 111 in the first direction X, and the extension direction of the silicon wafer in the carrier component 2 contained in each sub-chamber 111 is parallel to the first direction X, and there is a gap between two (or two sets) adjacent silicon wafers. The gas discharged from the air outlet 171a can diffuse quickly and uniformly into the gap of the silicon wafer from different directions, further improving the annealing efficiency.

[0043] It is understandable that, such as Figure 3 and Figure 4The annealing furnace 10 also includes a heating assembly 18, which is disposed on at least one of the top and bottom walls of each sub-chamber 111. The heating assembly 18 can also be disposed on the two side walls of the process chamber 11 in the first direction X, and the heating assembly 18 does not interfere with the air inlet assembly 17. The heating assembly 18 is used to heat each sub-chamber 111, so that each sub-chamber 111 can quickly form a stable thermal field, which is beneficial to improving annealing efficiency and annealing quality. It should be emphasized that the heating assembly 18 can be configured as a heating plate at a corresponding position. The heating plate can be composed of a mounting bracket 181 and multiple heating tubes 182 arranged thereon. The multiple heating tubes 182 are connected to an external power source through a conductive connection part 183. It is understood that the heating tubes 182 can specifically be configured as hot wires, heating rods, or other structures using radiant heating, and can be adaptively adjusted according to actual needs without specific limitations.

[0044] Optionally, the furnace body 1 is also provided with a plurality of temperature detection elements 11c, each of which extends at least partially into a sub-chamber 111. The temperature detection elements 11c are configured to detect the temperature of the corresponding sub-chamber 111. The control unit connected to the temperature detection element 11c can adjust the heating efficiency of the heating component 18 according to the temperature detected by the temperature detection element 11c, so that each sub-chamber 111 can be maintained at the temperature required for annealing and maintained at that temperature to ensure the annealing effect on the silicon wafer.

[0045] In some embodiments, such as Figure 3 and Figure 5 The annealing furnace 10 also includes a conveying assembly 16, which is disposed in the furnace body 1. The conveying assembly 16 is configured to carry multiple sets of carrier components 2 arranged at intervals along a first direction X, and is configured to move the multiple sets of carrier components 2 along a second direction Y to simultaneously input or output multiple sub-chambers 111. When the process chambers 11 are configured as multiple sets arranged along the second direction Y, the multiple process chambers 11 are interconnected. The trays 3 carrying multiple sets of carrier components 2 are placed on the conveying assembly 16. The conveying assembly 16 can drive the trays 3 to move along the second direction Y, so that the multiple sets of carrier components 2 can sequentially pass through the sub-chambers 111 corresponding to different process chambers 11, so that the silicon wafers in the carrier components 2 can be annealed while moving. When it is necessary to improve the annealing efficiency, the conveying assembly 16 can convey multiple trays 3 at intervals, so that the multiple sets of carrier components 2 on the multiple trays 3 sequentially pass through different sub-chambers 111, which will not be described in detail.

[0046] Optionally, the conveying assembly 16 may include a plurality of conveying rollers 162 spaced apart along the second direction Y in the process chamber 11. The conveying rollers 162 are rotatably connected to the furnace body 1 and connected via a drive assembly. The drive assembly can drive the plurality of conveying rollers 162 to rotate, thereby causing the pallet 3 carried on the conveying rollers 162 to move along the second direction Y. It is understood that the drive assembly may include a motor 161 and a conveyor belt 164. The conveyor belt 164 connects the plurality of conveying rollers 162 and the motor 161, so that the plurality of conveying rollers 162 can rotate simultaneously and in the same direction, which will not be described in detail.

[0047] It is understood that the conveying assembly 16 may also include a ring-shaped conveyor belt 163, with multiple conveyor rollers 162 located in the ring area of ​​the conveyor belt 163, and the upper surface of the conveyor rollers 162 being flush with or nearly flush with the upper surface of the conveyor belt 163. The combination of the conveyor belt 163 and the conveyor rollers 162 is used to jointly convey multiple sets of bearing assemblies 2 supported on the pallet 3, so as to improve the support force on the bearing assemblies 2. This will not be described in detail.

[0048] In some embodiments, such as Figure 1 , Figure 5 and Figure 6 The furnace body 1 also includes a first buffer chamber 12 and a second buffer chamber 14. The first buffer chamber 12 is provided with a second air inlet 12a and a second air outlet 12b. The second buffer chamber 14 is provided with a third air inlet 14a and a third air outlet 14b. The second air inlet 12a and the third air inlet 14a are respectively connected to an air intake device, and the second air outlet 12b and the third air outlet 14b are respectively connected to an exhaust device. The first buffer chamber 12 and the second buffer chamber 14 are respectively located on both sides of the process chamber 11 in the second direction Y. The conveying assembly 16 extends to the first buffer chamber 12 and the second buffer chamber 14. The conveying assembly 16 can convey a pallet 3 carrying multiple sets of carrying assemblies 2 along the second direction Y through the first buffer chamber 12, the process chamber 11 and the second buffer chamber 14 in sequence.

[0049] A first flap valve assembly 13 is provided between the first buffer chamber 12 and the process chamber 11. The first flap valve assembly 13 is configured to connect or disconnect the first buffer chamber 12 and the process chamber 11. When the first flap valve assembly 13 connects the first buffer chamber 12 and the process chamber 11, the conveying assembly 16 is configured to convey multiple sets of carrying assemblies 2 to the process chamber 11 along the second direction Y. When the first flap valve assembly 13 disconnects the first buffer chamber 12 and the process chamber 11, the first buffer chamber 12 is in a closed state. The second air inlet 12a can introduce nitrogen from the air intake device into the first buffer chamber 12, and the second air outlet 12b can export oxygen from the first buffer chamber 12 to the extraction device to reduce the oxygen content of the first buffer chamber 12. It should be emphasized that the first flap valve assembly 13 can also be provided on the side of the first buffer chamber 12 away from the process chamber 11 in the second direction Y, so as to allow multiple sets of carrying assemblies 2 to enter.

[0050] The second buffer chamber 14 is disposed on the other side of the process chamber 11 along the second direction Y. The second buffer chamber 14 is configured to accommodate multiple sets of bearing components 2 arranged at intervals along the first direction X. The second buffer chamber 14 is provided with a third air inlet 14a, which is configured to allow gas to enter the second buffer chamber 14. The second flap valve assembly 15 is disposed between the second buffer chamber 14 and the process chamber 11, and the second flap valve assembly 15 is configured to connect or disconnect the second buffer chamber 14 and the process chamber 11. When the second flap valve assembly 15 connects the second buffer chamber 14 and the process chamber 11, the conveying assembly 16 is configured to convey multiple sets of carrier assemblies 2 from the process chamber 11 to the second buffer chamber 14. When the second flap valve assembly 15 disconnects the second buffer chamber 14 from the process chamber 11, the second buffer chamber 14 is in a closed state. The third air inlet 14a can introduce nitrogen from the air intake device into the second buffer chamber 14, and the third air outlet 14b can export oxygen from the second buffer chamber 14 to the extraction device to reduce the oxygen content in the second buffer chamber 14. It should be emphasized that the second buffer chamber 14 may also be provided with a second flap valve assembly 15 on the side of the second buffer chamber 14 away from the process chamber 11 in the second direction Y, for exporting multiple sets of carrier assemblies 2.

[0051] It is understandable that by utilizing the first buffer chamber 12 and the second buffer chamber 14, during the process of multiple sets of carrier components 2 being introduced into or into the process chamber 11, the connection between the process chamber 11 and the first buffer chamber 12 or the second buffer chamber 14 will not allow oxygen from the external environment to enter. The process chamber 11 does not need to be repeatedly filled with nitrogen to reduce the oxygen content, saving time and further improving the annealing efficiency.

[0052] Optionally, the sidewall of the first buffer chamber 12 may be provided with a heating strip 122 to preheat the silicon wafers on the multiple sets of carrier components 2 before entering the process chamber 11, thereby further improving the annealing efficiency.

[0053] Optionally, the second buffer chamber 14 may be equipped with a cooling component (not shown in the figure) for cooling the silicon wafer after annealing in the process chamber 11 so that the silicon wafer can quickly return to room temperature. This will not be described in detail.

[0054] It is understandable that the number of the first buffer chamber 12 and the second buffer chamber 14 can be one or more, and can be adapted to actual needs without specific limitations.

[0055] In addition, the second air inlet 12a of the first buffer chamber 12 and the third air inlet 14a of the second buffer chamber 14 can also be provided with an air inlet group 121 to improve the gas diffusion rate in the chamber. The air inlet group 121 can be the same as the air inlet component 17 provided in the process chamber 11 or it can be different. It can be adapted to actual needs and is not specifically limited.

[0056] It is understandable that the first flap valve assembly 13 and the second flap valve assembly 15 can be configured with the same structure. Taking the first flap valve assembly 13 as an example, as follows... Figure 6 The first flap valve assembly 13 includes a door panel 131 and a connecting rod assembly 132 connected to one side of the door panel 131. The door panel 131 can block the passage between the first buffer chamber 12 and the process chamber 11. The connecting rod assembly 132 is rotatably connected by a cylinder 133. The cylinder 133 can control the movement of the connecting rod assembly 132 to drive the door panel 131 to move accordingly to connect or disconnect the first buffer chamber 12 and the process chamber 11. No further details are provided.

[0057] Figure 7 The diagram shown is a schematic diagram of a process chamber carrying a support component 2 according to an embodiment of the present disclosure.

[0058] Figure 8 The diagram shown is a schematic diagram of a process chamber provided in an embodiment of this disclosure that does not carry the carrier component 2.

[0059] Figure 9 As shown Figure 8 A magnified view of part A in the process chamber shown. Figure 10 The image shown is a cross-sectional top view of a second air intake assembly provided in an embodiment of this disclosure. Figure 11 The diagram shown is a schematic diagram of a first air intake assembly provided in an embodiment of this disclosure. Figure 12 The image shown is a cross-sectional top view of a first air intake assembly provided in an embodiment of this disclosure.

[0060] The following uses a process chamber 11 as an example, combined with... Figure 2 , Figures 7-12 The specific structure of the annealing furnace 10 is described in detail.

[0061] Optionally, the number of sub-chambers 111 arranged along the first direction X within the process chamber 11 can be adaptively adjusted according to the required production capacity. The higher the production capacity requirement, the more sub-chambers 111 can be set, and the adjustment can be made according to actual needs. In this embodiment of the present disclosure, for ease of explanation and understanding, the number of sub-chambers 111 is set to two, but it is not limited thereto.

[0062] like Figure 3 , Figure 7 and Figure 8 The air intake assembly 17 includes two sets of first air intake assemblies 171 and one set of second air intake assemblies 172. The two sets of first air intake assemblies 171 are disposed opposite each other on the two side walls of the process chamber 11 in the first direction X. The first air intake assembly 171 is connected to the first air inlet 11a. The first air intake assembly 171 has a plurality of air outlets 171a distributed on the side of the first air intake assembly facing the process chamber 11 in the first direction X. The second air intake assembly 172 is disposed between the two sets of first air intake assemblies 171 in the first direction X. The second air intake assembly 172 is configured to divide the process chamber 11 into a plurality of interconnected sub-chambers 111. The second air intake assembly 172 is connected to the first air inlet 11a. The second air intake assembly 172 has a plurality of air outlets 171a distributed on the opposite sides of the first direction X. The second air intake component 172 separates multiple sets of carrier components 2, and each set of carrier components 2 is provided with air intake components on both sides of the first direction X, so that gas diffuses into the silicon wafer in the carrier component 2 from different directions. Each sub-chamber 111 can form an independent thermal field, so that the sub-chamber 111 can quickly reach a uniform and stable thermal field. While meeting the requirement of annealing more silicon wafers at the same time, the annealing efficiency can be further improved, thereby increasing the production capacity.

[0063] It is understandable that when the number of sub-chambers 111 exceeds two, the number of second air intake components 172 will also increase accordingly. The number of second air intake components 172 depends on the number of sub-chambers 111 to be divided, and is not specifically limited.

[0064] Optionally, there are multiple first air inlets 11a, including multiple first sub-air inlets 11a2 and multiple second sub-air inlets 11a1. The first sub-air inlets 11a2 are disposed on the two side walls of the process chamber 11 in the first direction X, and the second sub-air inlets 11a1 are disposed on the top wall of the process chamber 11. The first sub-air inlets 11a2 are connected to the first air intake assembly 171, and the second sub-air inlets 11a1 are connected to the second air intake assembly 172. By setting the number of first air inlets 11a to be multiple for connecting different air intake assemblies 17, different air intake assemblies 17 can be individually air-intaken through the connected sub-air inlets, thereby increasing the air intake rate and further improving the rate at which a uniform and stable thermal field is formed in the sub-chamber 111.

[0065] In some embodiments, such as Figure 11 and Figure 12 The first air intake assembly 171 includes a first flow equalizer 1711 and a first air equalizer tube assembly 1713. The first flow equalizer 1711 is disposed on both side walls of the process chamber 11 in the first direction X. The first flow equalizer 1711 has a first flow equalizer chamber 1711a communicating with the first sub-air inlet 11a2. The first flow equalizer 1711 has an air outlet 171a communicating with the first flow equalizer chamber 1711a on the side opposite to the first sub-air inlet 11a2. The first air equalizer tube assembly 1713 has a first air inlet 1713b and a plurality of first air outlets 1713a. The first air inlet 1713b is communicating with the first sub-air inlet 11a2. At least part of the first air equalizer tube assembly 1713 extends into the first flow equalizer chamber 1711a, so that the plurality of first air outlets 1713a are distributed in the first flow equalizer chamber 1711a. This allows the gas to be uniformly buffered in the first uniform flow chamber 1711a before it diffuses evenly from multiple outlet holes 171a to various areas of the sub-chamber 111, which helps to improve the uniformity of gas diffusion in the sub-chamber 111.

[0066] Optionally, the first flow equalizer 1711 can be configured as one or more. When the first flow equalizer 1711 is configured as one, multiple first sub-inlet ports 11a2 can be configured to communicate with the first flow equalizer chamber 1711a of the first flow equalizer 1711. When the first flow equalizer 1711 is configured as multiple, the first flow equalizer chamber 1711a of each first flow equalizer 1711 is connected to a first sub-inlet port 11a2, which is beneficial to increase the rate of air filling into the first flow equalizer chamber 1711a.

[0067] It is understood that a first heating element 1714 may also be provided in the first uniform flow chamber 1711a. The first heating element 1714 is disposed in the first uniform flow chamber 1711a and is configured to heat the gas before it exits from the gas outlet 171a. The first heating element 1714, by providing the first heating component 18, allows the gas to be preheated before entering the sub-chamber 111, which helps to increase the temperature rise rate within the sub-chamber 111 and further improves the rate at which the sub-chamber 111 achieves a uniform and stable thermal field. It should be emphasized that the first heating component 18 can be configured as multiple heating pipes distributed vertically in the Z-direction within the first sub-chamber 111, which will not be described in detail.

[0068] In some embodiments, such as Figure 9 and Figure 10 The second air intake assembly 172 includes a second flow equalizer 1721 and a second air equalizer tube group 1723. The second flow equalizer 1721 is disposed on the top wall of the process chamber 11 and extends to the bottom wall of the process chamber 11. The second flow equalizer 1721 is located between the two groups of first air intake assemblies 171 in the first direction X. The second flow equalizer 1721 has a second flow equalizer chamber 1721a communicating with the second sub-inlet 11a1. The second flow equalizer 1721 has outlet holes 171a communicating with the second flow equalizer chamber 1721a on both sides in the first direction X. The second air equalizer tube group 1723 has a second air inlet and a plurality of second air outlets. The second air inlet is communicating with the second sub-inlet 11a1. At least part of the second air equalizer tube group 1723 extends into the second flow equalizer chamber 1721a so that the plurality of second air outlets are distributed in the second flow equalizer chamber 1721a. This allows the gas to be uniformly buffered in the second uniform flow chamber 1721a before it diffuses evenly from multiple air outlets 171a on both sides to various areas of the sub-chamber 111, which helps to improve the uniformity of gas diffusion in the sub-chamber 111.

[0069] Optionally, the second flow equalizer 1721 can be configured as one or more. When the second flow equalizer 1721 is configured as one, multiple second sub-inlet ports 11a1 can be configured to communicate with the second flow equalizer chamber 1721a of one second flow equalizer 1721. When the second flow equalizer 1721 is configured as multiple, the second flow equalizer chamber 1721a of each second flow equalizer 1721 is connected to a second sub-inlet port 11a1, which is beneficial to increase the rate of air filling into the second flow equalizer chamber 1721a.

[0070] It is understood that a second heating element 1724 may also be provided in the second uniform flow chamber 1721a. The second heating element 1724 is configured to heat the gas before it exits from the gas outlet 171a. By providing the second heating element 1724, the gas can be preheated before entering the sub-chamber 111, which helps to increase the temperature rise rate within the sub-chamber 111 and further improves the rate at which the sub-chamber 111 achieves a uniform and stable thermal field. It should be emphasized that the second heating element 1724 can be configured as multiple heating pipes distributed vertically in the Z-direction within the second sub-chamber 111, which will not be described in detail.

[0071] Optionally, the first gas equalization tube group 1713 and the second gas equalization tube group 1723 can be composed of multiple interconnected branches to allow the gas to be dispersed and filled into each area of ​​the corresponding equalization chamber, which will not be described in detail.

[0072] like Figure 8 , Figure 10 and Figure 12 The process chamber 11 has first air outlets 11b on each of its two side walls in the first direction X. Each first air outlet 11b is located on one side of the first sub-inlet 11a2 in the second direction Y. The first air outlets 11b and the second flow equalizer 1721 do not overlap in the orthographic projection of the second flow equalizer 1721 onto the side wall of the process chamber 11 in the first direction X. The first flow equalizer 1711 includes a first flow equalizer box with a first opening, a first flow equalizer plate 1712 covering the first opening to form a first flow equalizer chamber 1711a, and multiple air outlets 171a dispersedly arranged on the first flow equalizer plate 1712. The second flow equalizer 1721 includes: a second flow equalizer box with second openings on opposite sides in the first direction X; two second flow equalizer plates 1722 covering the second openings to form a second flow equalizer chamber 1721a, and multiple air outlets 171a dispersedly arranged on the second flow equalizer plates 1722. In the vertical direction Z-direction projection of the first flow equalizer 1711 and the second flow equalizer 1721 onto the bottom wall of the process chamber 11, the two first flow equalizers 1712 are respectively inclined at a first included angle b1 relative to the second direction Y, and the inclination directions of the two first flow equalizers 1712 are opposite. The two second flow equalizers 1722 of each second flow equalizer box are respectively inclined at a second included angle b2 relative to the second direction Y, and the inclination directions of the two second flow equalizers 1722 are opposite. The first flow equalizers 1712 and the second flow equalizers 1722 located in the same sub-chamber 111 are inclined in opposite directions relative to the second direction Y, so that the gas discharged from the air outlet 171a diffuses toward the first air outlet 11b.

[0073] Optionally, multiple air outlets 171a are evenly and dispersedly arranged on the first flow equalizer 1712 and the second flow equalizer 1722. The shape, size and density of the multiple air outlets 171a on each flow equalizer can be set to be the same or different, and can be adaptively adjusted according to actual needs.

[0074] Optionally, the first included angle b1 and the second included angle b2 are the same. The first included angle b1 is less than or equal to 5°, and the second included angle b2 is less than or equal to 5°. In this embodiment of the present disclosure, the first included angle b1 and the second included angle b2 are set to any angle not greater than 2°.

[0075] Optionally, the first flow equalizer 1712 is rotatably connected to the first flow equalizer box, and the first included angle b1 is adjustable. The second flow equalizer 1722 is rotatably connected to the second flow equalizer box, and the second included angle b2 is adjustable, so as to adjust the first included angle b1 and the second included angle b2 according to different scenarios.

[0076] It is understandable that the first air outlet 11b can be positioned in the second direction Y on the side of the first sub-inlet 11a2 near the first buffer chamber 12 or near the second buffer chamber 14, depending on actual needs. The tilt direction and tilt angle (i.e., the first included angle b1 and the second included angle b2) of the first flow equalizer 1712 and the second flow equalizer 1722 can be adjusted according to the specific position of the first air outlet 11b, so that the gas discharged from the air outlet 171a on the flow equalizer diffuses toward the first air outlet 11b on the opposite side, so that the air outlet 171a of each flow equalizer can be positioned opposite to the first air outlet 11b, so that the gas circulates and diffuses, thereby improving the gas flow rate.

[0077] In some optional embodiments, a third flow equalizer 19 is also included, which is disposed on both side walls of the process chamber 11 in the first direction X. The third flow equalizer 19 is disposed on one side of the first flow equalizer 1711 in the second direction Y. The third flow equalizer 19 is connected to the first air outlet 11b. The third flow equalizer 19 is provided with a third flow equalizer chamber connected to the first air outlet 11b. The side of the third flow equalizer 19 away from the first air outlet 11b is provided with a plurality of air inlets 191 connected to the third flow equalizer chamber. The air inlets 191 are configured to introduce the gas of each sub-chamber 111 into the third flow equalizer chamber from the air inlets 191, which is beneficial to the uniformity and stability of the thermal field in the sub-chamber 111.

[0078] This disclosure also provides a process apparatus, which includes a process furnace and a loading and unloading assembly. The process furnace is configured to process sheets supported on multiple sets of support assemblies 2. The loading and unloading assembly is disposed on at least one side of the process furnace and is configured to load the support assemblies 2 into the process furnace or unload the support assemblies 2 from the process furnace.

[0079] It is understood that the process furnace and corresponding process equipment can be referred to the relevant descriptions of the above embodiments, and will not be repeated here.

[0080] In the embodiments of this disclosure, unless otherwise specified, the connection can be a detachable connection using bolts and nuts, screws, clips, magnetic attraction, etc. In some connections where there is no particular requirement for a detachable fit, a non-detachable connection can be achieved through welding, bonding, or other methods.

[0081] The basic principles of this disclosure have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.

[0082] The block diagrams of devices, apparatuses, devices, and systems disclosed herein are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0083] It should also be noted that in the apparatus, devices, and methods of this disclosure, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions to this disclosure.

[0084] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of this disclosure. Therefore, this disclosure is not intended to be limited to the aspects shown herein, but rather to be carried out within the widest scope consistent with the principles and novel features disclosed herein.

[0085] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this disclosure to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations therein.

Claims

1. A process furnace, characterized in that, Configured to process sheets, wherein multiple sheets are supported by carriers, each or more of the carriers serving as a carrier assembly, the process furnace includes: A furnace body having at least one process chamber, the process chamber having at least one first air inlet, the process chamber comprising a plurality of sub-chambers arranged along a first direction, each of the sub-chambers being configured to house a support assembly, and the extension direction of the sheet carried in the housed support assembly being parallel to the first direction; and Multiple sets of air intake components are disposed opposite each other on both sides of each sub-chamber in the first direction. Each air intake component is connected to the first air inlet. Each air intake component is provided with multiple air outlets connected to the first air inlet. When the sub-chamber houses the support component, the air outlets face the support component. The multiple air outlets are configured to allow gas entering from the first air inlet to diffuse toward the sheet.

2. The process furnace according to claim 1, characterized in that, The air intake assembly includes: Two sets of first air intake components are disposed opposite to each other on the two side walls of the process chamber in the first direction. The first air intake components are connected to the first air inlet. The first air intake components have a plurality of air outlets distributed on the side of the first air intake components facing the process chamber in the first direction. At least one set of second air intake components is disposed between two sets of first air intake components in the first direction. The second air intake components are configured to divide the process chamber into a plurality of interconnected sub-chambers, and the second air intake components are connected to the first air inlet. The second air intake components have a plurality of air outlets distributed on opposite sides in the first direction.

3. The process furnace according to claim 2, characterized in that, The number of first air inlets is multiple, and each first air inlet includes multiple first sub-air inlets and multiple second sub-air inlets. The first sub-air inlets are disposed on the side walls of the process chamber in the first direction, and the second sub-air inlets are disposed on the top wall of the process chamber. The first intake assembly includes: The first flow equalizer is disposed on both sides of the process chamber in the first direction. The first flow equalizer has a first flow equalizer chamber that communicates with the first sub-inlet. The first flow equalizer has an outlet that communicates with the first flow equalizer chamber on the side opposite to the first sub-inlet. A first air-regulating tube assembly has a first air inlet and multiple first air outlets, the first air inlet communicating with a first sub-air inlet, and at least a portion of the first air-regulating tube assembly extending into the first flow-regulating chamber, such that the multiple first air outlets are distributed within the first flow-regulating chamber; and / or The second intake assembly includes: The second flow equalizer is disposed on the top wall of the process chamber and extends to the bottom wall of the process chamber. The second flow equalizer is located between the two sets of the first air inlet components in the first direction. The second flow equalizer has a second flow equalizer chamber that communicates with the second sub-air inlet. The second flow equalizer has air outlets that communicate with the second flow equalizer chamber on both sides in the first direction. The second air equalization pipe assembly has a second air inlet and a plurality of second air outlets. The second air inlet is connected to the second sub-air inlet. At least a portion of the second air equalization pipe assembly extends into the second flow equalization chamber, so that the plurality of second air outlets are distributed in the second flow equalization chamber.

4. The process furnace according to claim 3, characterized in that, The process chamber has first air outlets on each of its two side walls in the first direction. The first air outlet on each side wall is positioned on one side of the first sub-inlet in the second direction. The first direction and the second direction are perpendicular. In the orthographic projection of the second flow equalizer onto the side wall of the process chamber in the first direction, the first air outlet and the second flow equalizer do not overlap. This applies when both the first air inlet assembly and the second air inlet assembly include the first flow equalizer. The first flow equalizer includes: The first flow equalization box has a first opening; A first flow equalizer plate covers the first opening to form the first flow equalizer chamber, and a plurality of the air outlets are distributed on the first flow equalizer plate. The second flow equalizer includes: The second flow equalization box has a second opening on each of the two sides opposite to each other in the first direction; Two second flow equalizers are respectively covered by the second opening to form the second flow equalizer chamber, and a plurality of air outlets are distributed on the second flow equalizers; In the vertical projection of the first and second flow equalizers onto the bottom wall of the process chamber, the two first flow equalizers are inclined at a first angle relative to the second direction, and the inclination directions of the two first flow equalizers are opposite. The two second flow equalizers in each second flow equalizer box are inclined at a second angle relative to the second direction, and the inclination directions of the two second flow equalizers are opposite. Furthermore, the first and second flow equalizers located in the same sub-chamber are inclined in opposite directions relative to the second direction, so that the gas discharged from the air outlet diffuses toward the first air outlet.

5. The process furnace according to claim 4, characterized in that, The first included angle and the second included angle are the same; and / or, The first flow equalizer plate is rotatably connected to the first flow equalizer box, and the first included angle is adjustable; and / or, The second flow equalizer is rotatably connected to the second flow equalizer box, and the second included angle is adjustable; And / or, The first included angle is less than or equal to 5°; and / or, The second included angle is less than or equal to 5°.

6. The process furnace according to claim 3, characterized in that, The first intake assembly also includes: A first heating element is disposed in the first flow equalization chamber, and the first heating element is configured to heat the gas before it exits from the gas outlet; and / or The second intake assembly also includes: A second heating element is disposed in the second uniform flow chamber, and the second heating element is configured to heat the gas before it is discharged from the gas outlet.

7. The process furnace according to claim 4, characterized in that, Also includes: The third flow equalizer is disposed on both side walls of the process chamber in the first direction. The third flow equalizer is disposed on one side of the first flow equalizer in the second direction. The third flow equalizer is connected to the first air outlet. The third flow equalizer has a third flow equalizer chamber connected to the first air outlet. The third flow equalizer has a plurality of air inlets connected to the third flow equalizer chamber on the side opposite to the first air outlet. The air inlets are configured to introduce the gas from each of the sub-chambers into the third flow equalizer chamber through the air inlets.

8. The process furnace according to any one of claims 1-7, characterized in that, Also includes: A conveying assembly is disposed in the furnace body, the conveying assembly being configured to carry a plurality of the carrying assemblies spaced apart along a first direction, and being configured to move the plurality of the carrying assemblies along a second direction to simultaneously input or output a plurality of the sub-chambers, the first direction and the second direction intersecting; And / or, A heating assembly is disposed on the top and / or bottom wall of each of the sub-chambers, the heating assembly being configured to heat the corresponding sub-chamber.

9. The process furnace according to claim 8, characterized in that, In the case where the process furnace includes the conveying assembly, the furnace body further includes: A first buffer chamber is disposed on one side of the process chamber along the second direction. The first buffer chamber is configured to accommodate a plurality of the bearing components arranged at intervals along the first direction. The first buffer chamber is provided with a second air inlet, which is configured to allow gas to enter the first buffer chamber. A first flap valve assembly is disposed between the first buffer chamber and the process chamber. The first flap valve assembly is configured to connect or disconnect the first buffer chamber and the process chamber. When the first flap valve assembly connects the first buffer chamber and the process chamber, the conveying assembly is configured to convey multiple sets of the carrying assemblies to the process chamber along the second direction; and / or, A second buffer chamber is disposed on the other side of the process chamber along the second direction. The second buffer chamber is configured to accommodate a plurality of the bearing components arranged at intervals along the first direction. The second buffer chamber is provided with a third air inlet, which is configured to allow gas to enter the second buffer chamber. A second flap valve assembly is disposed between the second buffer chamber and the process chamber. The second flap valve assembly is configured to connect or disconnect the second buffer chamber and the process chamber. When the second flap valve assembly connects the second buffer chamber and the process chamber, the conveying assembly is configured to convey multiple sets of the carrying assemblies from the process chamber to the second buffer chamber.

10. A process equipment, characterized in that, include: The process furnace according to any one of claims 1-9, wherein the process furnace is configured to process sheets supported on a plurality of sets of support components; A loading and unloading assembly is disposed on at least one side of the process furnace, the loading and unloading assembly being configured to load the carrier assembly into the process furnace or unload the carrier assembly from the process furnace.

Images