Integrated circuit temperature display device

By designing active heat dissipation and multi-point temperature detection and display devices on the integrated circuit board, the problems of heat accumulation and insufficient temperature detection on the integrated circuit board are solved, thereby improving circuit performance and service life.

CN224231122UActive Publication Date: 2026-05-12WEIMEIO (BEIJING) TECHNOLOGY DEVELOPMENT CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
WEIMEIO (BEIJING) TECHNOLOGY DEVELOPMENT CO LTD
Filing Date
2025-07-21
Publication Date
2026-05-12

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Abstract

The utility model relates to the technical field of integrated circuit devices, and provides an integrated circuit temperature display device which comprises a first protection plate, a bottom frame fixedly arranged on the outer surface of the bottom of the first protection plate and a heat dissipation assembly arranged on the surface of the bottom frame. The device is provided with a structure for actively dissipating heat generated by working of the integrated circuit board, continuous accumulation of heat is avoided, the circuit performance of the integrated circuit board is improved, signal transmission delay is reduced, and the situation that the integrated circuit board is burnt out due to thermal runaway caused by local overheating is avoided; the integrated circuit board welding spot aging acceleration caused by thermal stress is avoided, the service life of the integrated circuit board and electronic components is prolonged, a structure for carrying out multi-point comprehensive temperature detection and display on the integrated circuit board is designed, the device can comprehensively detect the temperature of the integrated circuit board, missing of a key hot area is avoided, and the reliability is improved. The device can accurately display and adjust the temperature of the integrated circuit board.
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Description

Technical Field

[0001] This utility model relates to the field of integrated circuit device technology, and in particular to an integrated circuit temperature display device. Background Technology

[0002] Integrated circuit boards are core components of electronic products. They consist of an insulating substrate, conductive paths, and electronic components. Circuit patterns are formed through etching or printing, providing mechanical support and electrical connections, enabling signal transmission and power distribution between components. They are widely used in computers, communications, and various electronic devices.

[0003] In existing technologies, integrated circuit board devices lack a structure for actively dissipating the heat generated by the integrated circuit board during operation. This can easily lead to continuous heat accumulation, reduced circuit performance, increased signal transmission delay, and localized overheating that can cause thermal runaway and burn out the integrated circuit board. Thermal stress can also accelerate the aging of solder joints on the integrated circuit board, reducing the lifespan of the integrated circuit board and electronic components. Furthermore, the lack of a structure for comprehensive multi-point temperature detection and display of the integrated circuit board means that the device cannot comprehensively detect the temperature of the integrated circuit board, which can lead to the omission of critical hot areas. Additionally, the device cannot accurately display and adjust the temperature of the integrated circuit board. Utility Model Content

[0004] The purpose of this invention is to provide an integrated circuit temperature display device. This invention designs a structure for actively dissipating the heat generated by the integrated circuit board during operation, avoiding continuous heat accumulation, improving the circuit performance of the integrated circuit board, reducing signal transmission delay, preventing local overheating that could lead to thermal runaway and burnout of the integrated circuit board, preventing thermal stress from accelerating the aging of the solder joints of the integrated circuit board, and improving the service life of the integrated circuit board and electronic components. The invention also designs a structure for multi-point comprehensive temperature detection and display of the integrated circuit board. The device can comprehensively detect the temperature of the integrated circuit board, avoiding the omission of critical hot areas, and can accurately display and adjust the temperature of the integrated circuit board.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: an integrated circuit temperature display device, comprising:

[0006] A first protective plate, wherein a base frame is fixedly installed on the bottom outer surface of the first protective plate, and further includes:

[0007] A heat dissipation assembly is disposed on the surface of the base frame. The heat dissipation assembly includes a drive motor, which is fixedly mounted on the base frame. Two rotating shafts are rotatably connected to the inner surface of the base frame. Multiple blades are fixedly disposed on the outer surface of each of the two rotating shafts. Two gears are rotatably connected to the outer surface of the base frame. One gear is fixedly connected to one rotating shaft, and a transmission wheel is fixedly disposed on the outer surface of the other gear and the other rotating shaft. A synchronous belt is driven to the outer surface of the two transmission wheels. Multiple anti-slip grooves are formed on the inner surface of the synchronous belt. A monitoring and display assembly is disposed on the outer surface of the first protective plate. An installation assembly is disposed on the inner surface of the first protective plate. The output shaft of the drive motor drives one rotating shaft to rotate, which in turn drives the two gears and one transmission wheel to rotate. The synchronous belt drives the transmission wheel and rotating shaft on the other side to rotate synchronously. The synchronous rotation of the two rotating shafts drives the multiple blades to rotate, thereby increasing the airflow rate inside the first protective plate and at the heat dissipation fins, actively dissipating the heat generated by the integrated circuit board during operation, maintaining the temperature stability of the integrated circuit board, and ensuring the normal and stable operation of the integrated circuit board.

[0008] Preferably, the monitoring and display component includes a second protective plate, which is rotatably connected to the first protective plate. A mounting plate is fixedly disposed on the inner surface of the second protective plate, and multiple temperature sensors are fixedly mounted on the mounting plate. The multiple temperature sensors detect the temperature of the integrated circuit board on the integrated circuit board mounting plate.

[0009] Preferably, a control panel is fixedly embedded on the inner surface of the second protective plate, and a display screen is provided on the outer surface of the control panel. The control panel is electrically connected to the display screen, the multiple temperature sensors, and the drive motor. The temperature of the integrated circuit board is displayed on the display screen, and the display screen, the multiple temperature sensors, and the drive motor are controlled by the control panel.

[0010] Preferably, the installation assembly includes multiple positioning posts, each of which is fixedly disposed on the inner surface of the first protective plate, and an integrated circuit board fixing plate is fixedly disposed on the outer surface of the multiple positioning posts, the integrated circuit board fixing plate providing fixed support for the integrated circuit board.

[0011] Preferably, the inner surface of the integrated circuit board fixing plate is threaded with a plurality of fastening bolts, and the plurality of fastening bolts are respectively threaded to a plurality of positioning posts. By passing the plurality of fastening bolts through the integrated circuit board and tightening them in the plurality of positioning posts, the integrated circuit board is fastened and installed.

[0012] Preferably, a plurality of stabilizing seats are fixedly provided on the outer surface of the bottom of the first protective plate, and a plurality of heat dissipation fins are fixedly embedded on the inner surface of the bottom of the first protective plate. The plurality of heat dissipation fins are fixedly connected to the integrated circuit board fixing plate. The plurality of heat dissipation fins assist in dissipating the heat generated by the integrated circuit board during operation, and the plurality of stabilizing seats provide stable support for the first protective plate.

[0013] Preferably, a snap-fit ​​plate is fixedly provided on the inner surface of the first protective plate, and a snap-fit ​​groove is provided on the inner surface of the second protective plate. The snap-fit ​​plate is movably snapped into the snap-fit ​​groove, and the snap-fit ​​plate cooperates with the snap-fit ​​groove to engage the first protective plate and the second protective plate.

[0014] Preferably, two terminal blocks are fixedly embedded on the inner surface of the first protective plate. The two terminal blocks are symmetrically arranged on the first protective plate, and the integrated circuit board inside the first protective plate is connected to the external circuit through the two terminal blocks.

[0015] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0016] This invention features a device that actively dissipates heat generated by the integrated circuit board during operation, preventing continuous heat accumulation, improving the circuit performance of the integrated circuit board, reducing signal transmission delay, preventing thermal runaway caused by localized overheating leading to the burnout of the integrated circuit board, preventing thermal stress from accelerating the aging of the solder joints of the integrated circuit board, and extending the service life of the integrated circuit board and electronic components. The device is designed to perform multi-point comprehensive temperature detection and display on the integrated circuit board, enabling comprehensive detection of the integrated circuit board temperature, avoiding the omission of critical hot areas, and accurately displaying and adjusting the integrated circuit board temperature. Attached Figure Description

[0017] Figure 1 A three-dimensional structural diagram of an integrated circuit temperature display device provided by this utility model;

[0018] Figure 2 A three-dimensional structural diagram of an integrated circuit temperature display device provided by this utility model;

[0019] Figure 3 A side view of an integrated circuit temperature display device provided by this utility model;

[0020] Figure 4 An integrated circuit temperature display device provided by this utility model Figure 1 A magnified three-dimensional structural diagram at point A in the diagram.

[0021] Legend:

[0022] 1. First protective plate; 2. Wiring board; 3. Display screen; 4. Second protective plate; 5. Stabilizer; 6. Heat sink fins; 7. Control panel; 8. Shaft; 9. Base frame; 10. Gear; 11. Blade; 12. Drive wheel; 13. Synchronous belt; 14. Drive motor; 15. Snap-fit ​​plate; 16. Mounting plate; 17. Temperature sensor; 18. Snap-fit ​​groove; 19. Positioning post; 20. Integrated circuit board fixing plate; 21. Fastening bolts. Detailed Implementation

[0023] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0024] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0025] Example 1, such as Figures 1 to 4 As shown, this utility model provides an integrated circuit temperature display device, including a first protective plate 1, a base frame 9 fixedly mounted on the bottom outer surface of the first protective plate 1, and a heat dissipation assembly disposed on the surface of the base frame 9. The heat dissipation assembly includes a drive motor 14, which is fixedly mounted on the base frame 9. Two rotating shafts 8 are rotatably connected to the inner surface of the base frame 9, and multiple blades 11 are fixedly mounted on the outer surface of each of the two rotating shafts 8. Two gears 10 are rotatably connected to the outer surface of the base frame 9. One gear 10 is fixedly connected to one rotating shaft 8, and the outer surface of the other gear 10 and the other rotating shaft 8 are both fixedly equipped with transmission wheels 12. The outer surfaces of the two transmission wheels 12 are connected in a transmission manner. A synchronous belt 13 is provided, with multiple anti-slip grooves on its inner surface. A monitoring and display component is located on the outer surface of the first protective plate 1, and an installation component is located on the inner surface of the first protective plate 1. The output shaft of the drive motor 14 drives a rotating shaft 8 to rotate, which in turn drives two gears 10 and a transmission wheel 12 to rotate. The synchronous belt 13 drives the transmission wheel 12 on the other side to rotate synchronously with the rotating shaft 8. The synchronous rotation of the rotating shafts 8 on both sides drives multiple blades 11 to rotate, thereby increasing the airflow rate inside the first protective plate 1 and at the heat dissipation fins 6. This actively dissipates the heat generated by the integrated circuit board during operation, keeps the temperature of the integrated circuit board stable, and ensures the normal and stable operation of the integrated circuit board.

[0026] Furthermore, such as Figures 1 to 4As shown, the monitoring and display component includes a second protective plate 4, which is rotatably connected to the first protective plate 1. A mounting plate 16 is fixedly installed on the inner surface of the second protective plate 4, and multiple temperature sensors 17 are fixedly installed on the mounting plate 16. A control panel 7 is fixedly embedded on the inner surface of the second protective plate 4, and a display screen 3 is installed on the outer surface of the control panel 7. The control panel 7, the display screen 3, the multiple temperature sensors 17, and the drive motor 14 are all electrically connected. The multiple temperature sensors 17 detect the temperature of the integrated circuit board on the integrated circuit board fixing plate 20 and transmit the signal to the control panel 7. The control panel 7 conditions and converts the signal format, and displays the temperature of the integrated circuit board on the display screen 3.

[0027] Furthermore, such as Figures 1 to 4 As shown, the mounting assembly includes multiple positioning posts 19, which are fixedly mounted on the inner surface of the first protective plate 1. An integrated circuit board fixing plate 20 is fixedly mounted on the outer surface of the multiple positioning posts 19. Multiple fastening bolts 21 are threadedly connected to the inner surface of the integrated circuit board fixing plate 20. The multiple fastening bolts 21 are threadedly connected to the multiple positioning posts 19 respectively. The integrated circuit board is placed on the integrated circuit board fixing plate 20, and the multiple fastening bolts 21 are tightened by passing through the integrated circuit board and the integrated circuit board fixing plate 20 and screwing them into the multiple positioning posts 19 to secure the integrated circuit board.

[0028] Furthermore, such as Figures 1 to 4 As shown, a plurality of stabilizing seats 5 are fixedly installed on the bottom outer surface of the first protective plate 1, and a plurality of heat dissipation fins 6 are fixedly embedded on the bottom inner surface of the first protective plate 1. The plurality of heat dissipation fins 6 are all fixedly connected to the integrated circuit board fixing plate 20. The plurality of heat dissipation fins 6 assist in dissipating the heat generated by the integrated circuit board during operation, and the plurality of stabilizing seats 5 provide stable support for the first protective plate 1.

[0029] Furthermore, such as Figures 1 to 4 As shown, a snap-fit ​​plate 15 is fixedly provided on the inner surface of the first protective plate 1, and a snap-fit ​​groove 18 is provided on the inner surface of the second protective plate 4. The snap-fit ​​plate 15 and the snap-fit ​​groove 18 are movably snapped together, and the snap-fit ​​plate 15 cooperates with the snap-fit ​​groove 18 to snap the first protective plate 1 and the second protective plate 4 together.

[0030] Furthermore, such as Figures 1 to 4 As shown, two terminal blocks 2 are fixedly embedded on the inner surface of the first protective plate 1. The two terminal blocks 2 are symmetrically arranged on the first protective plate 1, and the integrated circuit board inside the first protective plate 1 is connected to the external circuit through the two terminal blocks 2.

[0031] Working principle: The integrated circuit board is placed on the integrated circuit board fixing plate 20. Multiple fastening bolts 21 are passed through the integrated circuit board and tightened within multiple positioning posts 19, securing the integrated circuit board. Multiple temperature sensors 17 perform multi-point comprehensive temperature detection on the integrated circuit board on the fixing plate 20 and transmit the signals to the control panel 7. The control panel 7 conditions and converts the signal format, and the integrated circuit board temperature is displayed on the display screen 3. Multiple heat dissipation fins 6 assist in cooling the heat generated by the integrated circuit board during operation. When the integrated circuit board detects a temperature... When the value is higher than the preset value, the control panel 7 controls the drive motor 14 to start. The output shaft of the drive motor 14 drives a rotating shaft 8 to rotate, which in turn drives two gears 10 and a transmission wheel 12 to rotate. Through the synchronous belt 13, the transmission wheel 12 on the other side rotates synchronously with the rotating shaft 8. The synchronous rotation of the rotating shafts 8 on both sides drives multiple blades 11 to rotate, thereby increasing the airflow rate inside the first protective plate 1 and at the heat dissipation fins 6. This actively dissipates the heat generated by the integrated circuit board, keeps the temperature of the integrated circuit board stable, ensures the normal and stable operation of the integrated circuit board, improves the circuit performance of the integrated circuit board, and extends the service life of the integrated circuit board and electronic components.

[0032] The above are merely preferred embodiments of this utility model and are not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from the technical solution of this utility model shall still fall within the protection scope of this utility model.

Claims

1. An integrated circuit temperature display device, comprising: The first protective plate (1), wherein a base frame (9) is fixedly provided on the bottom outer surface of the first protective plate (1), is characterized in that it further includes: A heat dissipation assembly is disposed on the surface of the base frame (9). The heat dissipation assembly includes a drive motor (14). The drive motor (14) is fixedly mounted on the base frame (9). Two rotating shafts (8) are rotatably connected to the inner surface of the base frame (9). Multiple blades (11) are fixedly disposed on the outer surface of the two rotating shafts (8). Two gears (10) are rotatably connected to the outer surface of the base frame (9). One gear (10) is fixedly connected to one rotating shaft (8). A transmission wheel (12) is fixedly disposed on the outer surface of the other gear (10) and the other rotating shaft (8). A synchronous belt (13) is connected to the outer surface of the two transmission wheels (12). Multiple anti-slip grooves are opened on the inner surface of the synchronous belt (13). A monitoring and display component is disposed on the outer surface of the first protective plate (1); The mounting components are disposed on the inner surface of the first protective plate (1).

2. The integrated circuit temperature display device according to claim 1, characterized in that: The monitoring and display component includes a second protective plate (4), which is rotatably connected to the first protective plate (1). An mounting plate (16) is fixedly provided on the inner surface of the second protective plate (4), and multiple temperature sensors (17) are fixedly installed on the mounting plate (16).

3. The integrated circuit temperature display device according to claim 2, characterized in that: The inner surface of the second protective plate (4) is fixedly embedded with a control panel (7), and the outer surface of the control panel (7) is provided with a display screen (3). The control panel (7) is electrically connected to the display screen (3), the multiple temperature sensors (17) and the drive motor (14).

4. The integrated circuit temperature display device according to claim 1, characterized in that: The installation assembly includes multiple positioning posts (19), all of which are fixedly disposed on the inner surface of the first protective plate (1), and an integrated circuit board fixing plate (20) is fixedly disposed on the outer surface of the multiple positioning posts (19).

5. The integrated circuit temperature display device according to claim 4, characterized in that: The inner surface of the integrated circuit board fixing plate (20) is threaded with a plurality of fastening bolts (21), and the plurality of fastening bolts (21) are threadedly connected to the plurality of positioning pins (19).

6. The integrated circuit temperature display device according to claim 4, characterized in that: The bottom outer surface of the first protective plate (1) is fixedly provided with multiple stabilizing seats (5), and the bottom inner surface of the first protective plate (1) is fixedly embedded with multiple heat dissipation fins (6). The multiple heat dissipation fins (6) are all fixedly connected to the integrated circuit board fixing plate (20).

7. An integrated circuit temperature display device according to claim 2, characterized in that: The first protective plate (1) has a snap-fit ​​plate (15) fixedly installed on its inner surface, and the second protective plate (4) has a snap-fit ​​groove (18) opened on its inner surface. The snap-fit ​​plate (15) is movably snapped into the snap-fit ​​groove (18).

8. The integrated circuit temperature display device according to claim 1, characterized in that: Two wiring boards (2) are fixedly embedded on the inner surface of the first protective plate (1), and the two wiring boards (2) are symmetrically arranged on the first protective plate (1).