Double-layer elastic sheet mechanism with three degrees of freedom
By designing a double-layer spring mechanism with three degrees of freedom, the problem of uneven bonding in temperature detection of electronic products in the prior art has been solved, realizing tight bonding between the product and the heat-conducting plate and real-time temperature measurement, thus improving the accuracy of detection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- INTELLIGENT AUTOMATION ZHUHAI CO LTD
- Filing Date
- 2025-06-05
- Publication Date
- 2026-05-12
AI Technical Summary
Existing temperature detection devices cannot accurately detect the surface temperature of electronic products, resulting in a discrepancy between the measured value and the product's surface temperature.
The device employs a double-layer spring mechanism with three degrees of freedom, including horizontal and vertical springs, which are hinged to a rotating shaft and connected to a temperature sensor to achieve a tight fit between the product and the heat-conducting plate. The elastic deformation of the springs adapts to uneven surfaces and measures the temperature in real time.
It achieves a tight fit within a limited space, enables real-time measurement of the temperature of the product and the heat-conducting plate, solves the problem of uneven bonding, and improves the accuracy of temperature detection.
Smart Images
Figure CN224231126U_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the technical field of temperature calibration, and in particular to a double-layer spring mechanism with three degrees of freedom. Background Technology
[0002] Electronic products are products that operate on the basis of electrical energy. They mainly include: watches, smartphones, telephones, televisions, DVD players (VCD, SVCD, DVD), video recorders, camcorders, radios, tape recorders, stereo systems, CD players, computers, game consoles, and mobile communication products. They are named electronic products because early products primarily used vacuum tubes as their basic components. Currently, testing electronic products requires the use of heating devices to raise the ambient temperature of the electronic product, thereby testing its high-temperature resistance.
[0003] For example, Chinese patent CN209764152U discloses a miniature temperature and humidity standard chamber. By creating a constant and accurate working environment with precise temperature and humidity within a chamber, it can verify and calibrate the temperature accuracy of electronic and electrical products. However, since it can only detect the temperature inside the chamber and cannot specifically detect the temperature of each product, there is a deviation between the test value and the surface temperature of the product. Therefore, it is necessary to provide a double-layer spring plate mechanism with three degrees of freedom. This mechanism has a simple structure, measures the temperature of the product and the temperature of the heat-conducting plate in real time, and allows the temperature patch to fit tightly to the product and the heat-conducting plate, effectively solving the problem of uneven adhesion. Utility Model Content
[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a double-layer spring sheet mechanism with three degrees of freedom. The structure is simple and can measure the temperature of the product and the temperature of the heat-conducting plate in real time. The temperature patch can fit tightly to the product and the heat-conducting plate, effectively solving the problem of uneven bonding.
[0005] The technical solution adopted by this utility model is as follows: This utility model includes a mounting base, the mounting base is provided with a temperature sensor, the bottom and side of the mounting base are respectively provided with a horizontal bonding piece and a vertical bonding piece, both of which are connected to the temperature sensor. The top of the mounting base is hinged with a spring composite assembly through a rotating shaft. The spring composite assembly includes a horizontal spring and a vertical spring. One end of the horizontal spring is connected to the rotating shaft, and the other end of the horizontal spring is connected to the vertical spring. The bottom of the horizontal spring is pressed against the mounting base by a spring.
[0006] As can be seen from the above scheme, the rotating shaft provides rotational freedom, the horizontal spring provides forward and backward freedom, and the vertical spring provides up and down freedom. Under the conditions of limited space and limited mass, it can conveniently realize the bonding and separation functions during the testing process. It has three degrees of freedom, strong adaptability, and can effectively achieve tight bonding. It is of great significance for the conduction of heat or force during the testing process. It has the advantages of small weight and small space occupation. It has a rotatable mechanism. The horizontal bonding piece is bonded to the product, and the vertical bonding piece is bonded to the external heat-conducting plate. It can adapt to the tight bonding of the two components, measure the temperature of the product and the temperature of the heat-conducting plate in real time, and the temperature patch can tightly bond the product and the heat-conducting plate, effectively solving the problem of uneven bonding.
[0007] A preferred embodiment is that both the horizontal and vertical springs are double-layered structures, each comprising two layers of springs, which are positioned together by an aluminum block and a pin.
[0008] In a preferred embodiment, the horizontal spring is disposed on the top of the mounting base in a horizontal direction, the top of the mounting base is provided with a stepped layer, the rotating shaft is disposed on the stepped layer in a horizontal direction, and the hinge end of the horizontal spring is rotatably engaged with the rotating shaft through a bushing.
[0009] In a preferred embodiment, the vertical spring is disposed on the top of the mounting base in a vertical direction, the lower end of the vertical spring is connected to the connecting end of the horizontal spring, and the upper end of the vertical spring is provided with a connecting screw. The external transverse module is connected to the spring composite assembly through the connecting screw.
[0010] In a preferred embodiment, the spring is a wave spring, which is vertically positioned at the top of the mounting base, and the bottom of the horizontal spring piece engages with the wave spring in a pressing fit. Attached Figure Description
[0011] Figure 1 This is a three-dimensional structural diagram of the present invention;
[0012] Figure 2 This is a three-dimensional structural diagram of the spring-loaded composite assembly;
[0013] Figure 3 This is an exploded three-dimensional structural diagram of this utility model;
[0014] Figure 4 This is a schematic diagram of the working principle of this utility model;
[0015] Figure 5 This is a structural diagram of the present invention when the external lifting module drives the product to move upward.
[0016] Figure 6This is a structural diagram of the present invention when the external lateral movement module drives the spring-piece composite assembly to move laterally.
[0017] Figure 7 This is a structural diagram of the present invention with three degrees of freedom. Detailed Implementation
[0018] like Figures 1 to 4 As shown, in this embodiment, the present invention includes a mounting base 1, on which a temperature sensor 2 is provided. A horizontal bonding piece 3 and a vertical bonding piece 4 are respectively provided on the bottom and sides of the mounting base 1. Both the horizontal bonding piece 3 and the vertical bonding piece 4 are connected to the temperature sensor 2. A spring-loaded composite assembly is hinged to the top of the mounting base 1 via a rotating shaft 5. The spring-loaded composite assembly includes a horizontal spring piece 6 and a vertical spring piece 7. One end of the horizontal spring piece 6 is connected to the rotating shaft 5, and the other end of the horizontal spring piece 6 is connected to the vertical spring piece 7. The bottom of the horizontal spring piece 6 is pressed against the mounting base 1 by a spring 8.
[0019] One end of the external heat-conducting plate is provided with several contoured grooves. The product is placed in the contoured grooves. The external lateral movement module drives the spring-loaded composite assembly to move laterally. The horizontal bonding piece 3 is located above the product. The external lifting module drives the external heat-conducting plate to rise, and the horizontal bonding piece 3 is bonded to the top of the product.
[0020] The external lateral movement module drives the spring-loaded composite assembly to move laterally a short distance. The vertical bonding piece 4 adheres to the external heat-conducting plate, and the horizontal spring piece 6 and the vertical spring piece 7 undergo slight deformation. The temperature patch can tightly adhere to the product and the heat-conducting plate, effectively solving the problem of uneven adhesion. The temperature sensor 2 detects the temperature of the product and the external heat-conducting plate in real time through the horizontal bonding piece 3 and the vertical bonding piece 4. By comparing the temperature read by the product itself with the temperature read by the heat-conducting plate, the temperature of the product is calibrated. Additionally, as... Figure 7 As shown, this mechanism has three degrees of freedom and can automatically adapt to the situation where the two components are not parallel during bonding, solving the problem of uneven bonding caused by excessive stiffness. Under the conditions of limited space and limited mass, it can conveniently realize the bonding and separation functions during the testing process.
[0021] like Figures 1 to 6 As shown, in this embodiment, both the horizontal spring 6 and the vertical spring 7 are double-layer structures. The double-layer structure includes two layers of springs, which are positioned by an aluminum block 9 and a pin 10.
[0022] Both layers of spring sheets are soft structures with relatively small mass and volume, leaving sufficient space for wiring operations, making them practically feasible and implementable for automated testing. The double-layer structure helps ensure greater stability and strength of the spring sheet structure, effectively preventing the spring sheet from exceeding its deformation limit and causing plastic deformation of the spring sheet material, thus losing its function. This mechanism has three degrees of freedom, automatically adapting to situations where the two components are not parallel during bonding, solving the problem of uneven bonding caused by excessive stiffness. The double-layer spring sheet design utilizes high-strength spring sheets to generate effective elastic force in the front-back and up-down directions. Simultaneously, this design incorporates a rotatable wave spring + shaft mechanism, providing an additional degree of freedom. This extra degree of freedom prevents jamming due to excessive guide rail rigidity during the pressing process. Furthermore, the clearance fit between the shaft and the hole allows for a small displacement range, effectively preventing excessive stiffness of the linear guide rail caused by assembly, which could lead to loose bonding.
[0023] like Figures 1 to 6 As shown, in this embodiment, the horizontal spring 6 is arranged horizontally on the top of the mounting base 1, the top of the mounting base 1 is provided with a stepped layer, the rotating shaft 5 is arranged horizontally on the stepped layer, and the hinge end of the horizontal spring 6 is rotatably engaged with the rotating shaft 5 through the bushing 11.
[0024] like Figures 4 to 6 As shown, in this embodiment, the vertical spring piece 7 is vertically disposed on the top of the mounting base 1. The lower end of the vertical spring piece 7 is connected to the connecting end of the horizontal spring piece 6, and the upper end of the vertical spring piece 7 is provided with a connecting screw 12. The external lateral movement module is connected to the spring piece composite assembly through the connecting screw 12. The external lateral movement module drives the spring piece composite assembly to move laterally through the connecting screw 12.
[0025] like Figures 1 to 6 As shown, in this embodiment, the spring 8 is a wave spring, which is vertically disposed on the top of the mounting base 1, and the bottom of the horizontal spring 6 is press-fitted with the wave spring.
[0026] In this embodiment, in the prior art, the commonly used elastic device in industry is a spring, and the device for realizing linear motion is a linear guide rail; devices that need to provide both elastic force and linear motion are often combined into a spring + linear guide rail form. However, in actual use, this combination of spring + linear guide rail has the following drawbacks: it occupies a large space and is relatively heavy, especially when linear motion is required in both forward and backward and left and right directions. In this case, the linear guide rail needs to occupy physical space in two directions, making the mechanism lengthy and space-consuming, without reserving space for wiring. At the same time, because it needs to withstand the large internal force of the spring, the guide rail + spring mechanism needs to overcome a large elastic force, resulting in a heavy burden on the structural materials.
[0027] This application employs a double-layer spring sheet structure, eliminating the guide rail structure and the guiding and limiting structures involving guide rails and springs in both horizontal and vertical directions. The double-layer spring sheet structure relies on high-performance stainless steel to provide strong elasticity, enabling elastic deformation within a limited range. It occupies less space and facilitates maintenance and calibration. Replacing the guide rail + spring mechanism with a thin sheet results in relatively lighter weight. Furthermore, due to its relatively simple structure, it leaves space for wiring for grounding or other applications.
[0028] In addition, in the existing technology, the linear guide rail + spring structure has a large rotational stiffness and limited degrees of freedom, which often makes it difficult to achieve rotation. The allowable rotational degrees of freedom are small, so even a small deflection can easily cause a large contact problem in actual use, often resulting in incomplete fit and separation, which is not conducive to achieving the desired full fit and separation.
[0029] This application employs a double-layer spring design, utilizing high-strength springs to generate effective elastic force in both the front-to-back and up-to-down directions. It also incorporates a rotatable wave spring and shaft mechanism, providing an additional degree of freedom for rotation. This extra degree of freedom prevents jamming during the pressing process caused by excessive guide rail rigidity. Furthermore, the clearance fit between the shaft and the hole allows for a small displacement range, preventing excessive rigidity of the linear guide rail due to assembly issues, which could lead to a loose fit.
[0030] Although the embodiments of this utility model are described with reference to actual solutions, they do not constitute a limitation on the meaning of this utility model. For those skilled in the art, modifications to the implementation schemes and combinations with other schemes based on this specification are obvious.
Claims
1. A double-layer spring mechanism with three degrees of freedom, comprising a mounting base (1), wherein a temperature sensor (2) is provided on the mounting base (1), characterized in that: The bottom and side of the mounting base (1) are respectively provided with a horizontal bonding piece (3) and a vertical bonding piece (4). Both the horizontal bonding piece (3) and the vertical bonding piece (4) are connected to the temperature sensor (2). The top of the mounting base (1) is hinged with a spring composite assembly through a rotating shaft (5). The spring composite assembly includes a horizontal spring piece (6) and a vertical spring piece (7). One end of the horizontal spring piece (6) is connected to the rotating shaft (5), and the other end of the horizontal spring piece (6) is connected to the vertical spring piece (7). The bottom of the horizontal spring piece (6) is pressed against the mounting base (1) by a spring (8).
2. The double-layer spring mechanism with three degrees of freedom according to claim 1, characterized in that: Both the horizontal spring (6) and the vertical spring (7) are double-layer structures, each consisting of two layers of springs, which are positioned by an aluminum block (9) and a pin (10).
3. The double-layer spring mechanism with three degrees of freedom according to claim 1, characterized in that: The horizontal spring (6) is arranged horizontally on the top of the mounting base (1). The top of the mounting base (1) is provided with a stepped layer. The rotating shaft (5) is arranged horizontally on the stepped layer. The hinge end of the horizontal spring (6) is rotatably engaged with the rotating shaft (5) through a bushing (11).
4. The double-layer spring mechanism with three degrees of freedom according to claim 1, characterized in that: The vertical spring (7) is arranged vertically on the top of the mounting base (1). The lower end of the vertical spring (7) is connected to the connecting end of the horizontal spring (6). The upper end of the vertical spring (7) is provided with a connecting screw (12). The external transverse module is connected to the spring composite assembly through the connecting screw (12).
5. The double-layer spring mechanism with three degrees of freedom according to claim 1, characterized in that: The spring (8) is a wave spring, which is arranged vertically on the top of the mounting base (1), and the bottom of the horizontal spring (6) is pressed against the wave spring.