Testing system for assembled circuit board

Abstract

The utility model provides a test system for an assembled circuit board, which comprises an upper computer and an integrated tooling plate, and a current detection module, a voltage detection module, a first communication module, a second communication module and a control module are integrated on the integrated tooling plate. The control module is electrically connected with the first communication module, the current detection module, the voltage detection module and the second communication module, the first communication module is electrically connected with the upper computer, and the current detection module, the voltage detection module and the second communication module are electrically connected with an assembled circuit board to be detected; the upper computer is used for carrying out current detection, voltage detection and communication detection on the to-be-tested assembled circuit board through the integrated tool plate, on the premise that multiple testing functions are achieved, integration is improved, the size of the whole system is reduced, and high space requirements and installation requirements are not needed; and the problem of complex wiring caused by the fact that the upper computer is electrically connected with the scattered modules can be avoided.

Description

Technical Field

[0001] This utility model relates to the field of electrical testing technology, specifically to a testing system for assembled circuit boards. Background Technology

[0002] PCBA (Printed Circuit Board Assembly) refers to a printed circuit board assembly, which can be understood as an assembled circuit board. It includes not only the bare printed circuit board (PCB) but also all the electronic components mounted on it, such as resistors, capacitors, and integrated circuits. These components are fixed on the printed circuit board by soldering to form a complete electronic module capable of performing specific functions.

[0003] Testing and assembling circuit boards is a crucial step in ensuring their quality, performance, and reliability. Comprehensive testing verifies that the assembled circuit boards meet design requirements and allows for the timely identification and correction of potential problems, thereby enhancing the product's market competitiveness and customer satisfaction.

[0004] Existing testing solutions for assembled circuit boards mainly use multiple distributed circuit modules or devices to implement the corresponding test items separately. This results in a large overall testing system size and high requirements for space and installation. Utility Model Content

[0005] In view of the shortcomings of the existing technology, this utility model provides a testing system for assembling circuit boards.

[0006] In one embodiment, the present invention provides a test system for assembling circuit boards. The test system for assembling circuit boards includes a host computer and an integrated tooling board. The integrated tooling board integrates a current detection module, a voltage detection module, a first communication module, a second communication module, and a control module.

[0007] The control module is electrically connected to the first communication module, the current detection module, the voltage detection module and the second communication module respectively. The first communication module is also electrically connected to the host computer. The current detection module, the voltage detection module and the second communication module are also used to electrically connect to the assembly circuit board under test respectively.

[0008] The host computer is used to perform current detection, voltage detection, and communication detection on the assembled circuit board under test through the integrated tooling board.

[0009] In one embodiment, the voltage detection module includes a first voltage sampling unit and a second voltage sampling unit;

[0010] The first voltage sampling unit and the second voltage sampling unit are electrically connected to the control module, respectively. The first voltage sampling unit and the second voltage sampling unit are also used to electrically connect to the assembly circuit board under test.

[0011] The measurement accuracy of the first voltage sampling unit is lower than that of the second voltage sampling unit.

[0012] In one embodiment, the first voltage sampling unit includes a first voltage divider resistor string, an analog-to-digital converter chip, and a digital isolation chip;

[0013] The first voltage divider resistor string is electrically connected to the analog-to-digital converter chip and is used for electrical connection to the assembly circuit board under test. The analog-to-digital converter chip is also electrically connected to the control module through a digital isolation chip.

[0014] In one embodiment, the second voltage sampling unit includes a second voltage divider resistor string, a voltage metering chip, and a voltage sampling digital isolation chip.

[0015] The second voltage divider resistor string is electrically connected to the voltage metering chip and used for electrical connection to the assembly circuit board under test. The voltage metering chip is also electrically connected to the control module through a voltage sampling digital isolation chip.

[0016] In one embodiment, the current detection module includes a current sampling unit;

[0017] The current sampling unit is electrically connected to the control module and is used for electrical connection with the assembly circuit board under test.

[0018] In one embodiment, the current sampling unit includes a current sampling resistor, a current metering chip, and a current sampling digital isolation chip;

[0019] The current sampling resistor is electrically connected to the current metering chip and is used to electrically connect to the assembly circuit board under test. The current metering chip is also electrically connected to the control module through the current sampling digital isolation chip.

[0020] In one embodiment, the current detection module includes a current generation unit and a signal transmission unit;

[0021] The current generation unit and the signal transmission unit are electrically connected to the control module, and the current generation unit and the signal transmission unit are also used to electrically connect to the assembly circuit board under test.

[0022] The control module is used to control the current generation unit to output test current to the assembly circuit board under test, so that the assembly circuit board under test samples the test current, and obtains the sampling detection result of the assembly circuit board under test based on the current sampling signal fed back by the signal transmission unit.

[0023] In one embodiment, the current generating unit includes a switching subunit, a third voltage divider resistor string, and a current transformer.

[0024] The third voltage divider resistor string is used to connect to the test power supply through the switching subunit and to electrically connect to the assembly circuit board under test through the current transformer. The switching subunit is also electrically connected to the control module.

[0025] In one embodiment, the second communication module includes a remote control unit and a signal transmission unit;

[0026] The remote control unit and the signal transmission unit are electrically connected to the control module, and the remote control unit and the signal transmission unit are respectively used to electrically connect to the assembly circuit board under test.

[0027] The control module is used to remotely control the assembled circuit board under test via the remote control unit, and obtain the remote signaling detection result of the assembled circuit board under test based on the remote signaling status signal fed back by the signal transmission unit.

[0028] In one embodiment, the remote control unit includes a transistor and a relay;

[0029] The base of the transistor is electrically connected to the control module, and the collector of the transistor is connected in series with the coil of the relay. The switching part of the relay is used to electrically connect to the assembly circuit board under test.

[0030] In one embodiment, the second communication module includes a remote signaling unit and a signal transmission unit;

[0031] The remote signaling unit and the signal transmission unit are electrically connected to the control module, and the remote signaling unit and the signal transmission unit are respectively used to electrically connect to the assembly circuit board under test.

[0032] The control module is used to send remote control command signals to the assembly circuit board under test through the signal transmission unit, and obtain the remote control test results of the assembly circuit board under test according to the remote signaling status of the remote signaling unit.

[0033] In one embodiment, the remote signaling unit includes an optical coupler;

[0034] The light-emitting part of the optocoupler is used for electrical connection with the circuit board under test, and the photosensitive part of the optocoupler is electrically connected to the control module.

[0035] In one embodiment, the signal transmission unit includes a 485 communication subunit and / or a CAN communication subunit.

[0036] In one embodiment, the test system for assembling the circuit board further includes a power module;

[0037] The power supply module is electrically connected to the current detection module, voltage detection module, first communication module, second communication module, and control module, respectively.

[0038] The power supply module is used to supply power to the current detection module, voltage detection module, first communication module, second communication module and control module respectively according to the initial power supply.

[0039] In one embodiment, the test system for assembling the circuit board further includes an adapter board;

[0040] The adapter board and the integrated tooling board are electrically connected via a ribbon cable. The adapter board is used to electrically connect to the assembled circuit board under test via probes.

[0041] The current detection module, voltage detection module, first communication module, second communication module, and control module in the integrated tooling board are used to electrically connect to the circuit board under test via the adapter board.

[0042] The aforementioned test system for assembled circuit boards integrates the current detection module, voltage detection module, first communication module, second communication module, and control module into a single circuit board, resulting in a corresponding integrated fixture board. This system improves integration and reduces the overall system size while achieving multiple testing functions, eliminating the need for high space and installation requirements. Furthermore, the integrated fixture board, acting as a lower-level machine to interact with the upper-level machine, avoids the complex wiring issues caused by the upper-level machine being electrically connected to each of the dispersed modules. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 This is a schematic diagram of the structure of a test system for assembling circuit boards in one embodiment of the present invention;

[0045] Figure 2 This is a schematic diagram of the voltage detection module in one embodiment of the present invention;

[0046] Figure 3 This is a schematic diagram of the structure of the first voltage divider resistor string in one embodiment of the present invention;

[0047] Figure 4 This is a schematic diagram of the structure of an analog-to-digital converter chip in one embodiment of the present invention;

[0048] Figure 5 This is a schematic diagram of the structure of an isolated voltage regulator unit in one embodiment of the present invention;

[0049] Figure 6 This is a schematic diagram of the structure of the second voltage divider resistor string in one embodiment of the present invention;

[0050] Figure 7This is a schematic diagram of the structure of the second voltage sampling unit in one embodiment of the present invention;

[0051] Figure 8 This is a schematic diagram of the specific structure of the current detection module in one embodiment of the present invention;

[0052] Figure 9 This is a schematic diagram of the structure of the switch subunit or the second power supply output control unit in one embodiment of the present invention;

[0053] Figure 10 This is a schematic diagram of the structure of the third voltage divider resistor string and the current transformer in one embodiment of the present invention;

[0054] Figure 11 This is a schematic diagram of the structure of the second communication module in one embodiment of the present invention;

[0055] Figure 12 This is a schematic diagram of the structure of the remote control unit in one embodiment of the present invention;

[0056] Figure 13 This is a schematic diagram of the remote signaling unit in one embodiment of the present invention;

[0057] Figure 14 This is a schematic diagram of the structure of the 485 communication subunit in one embodiment of the present invention;

[0058] Figure 15 This is a schematic diagram of the CAN chip in one embodiment of the present invention;

[0059] Figure 16 This is a schematic diagram of the structure of a digital isolation chip in one embodiment of the present invention;

[0060] Figure 17 This is a schematic diagram of the integrated tooling board including a power module in one embodiment of the present invention;

[0061] Figure 18 This is a schematic diagram of the structure of the first power supply unit in one embodiment of the present invention;

[0062] Figure 19 This is a schematic diagram of the structure of the second power supply unit in one embodiment of the present invention;

[0063] Figure 20 This is a schematic diagram of the structure of the third power supply unit in one embodiment of the present invention;

[0064] Figure 21 This is a schematic diagram of the structure of the first power supply output control unit in one embodiment of the present invention;

[0065] Figure 22This is a schematic diagram of the structure of the third power supply output control unit in one embodiment of the present invention;

[0066] Figure 23 This is a schematic diagram of the structure of the fourth power supply output control unit in one embodiment of the present invention;

[0067] Figure 24 This is a schematic diagram of the structure of the fifth power supply output control unit in one embodiment of the present invention;

[0068] Figure 25 This is a schematic diagram of the structure of the test system including the adapter board in one embodiment of the present invention. Detailed Implementation

[0069] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0070] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified. In this application, the term "exemplary" is used to mean "used as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to implement and use this invention. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that this invention can be implemented without using these specific details. In other instances, well-known structures and processes will not be described in detail to avoid obscuring the description of this invention with unnecessary detail. Therefore, this invention is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0071] Firstly, such as Figure 1 As shown, in one embodiment, the present invention provides a testing system for assembled circuit boards. The testing system for assembled circuit boards includes a host computer and an integrated tooling board. The integrated tooling board integrates a current detection module, a voltage detection module, a first communication module, a second communication module, and a control module.

[0072] The host computer includes, but is not limited to, a computer, and the control module includes, but is not limited to, an MCU (microcontroller).

[0073] The control module is electrically connected to the first communication module, the current detection module, the voltage detection module, and the second communication module, respectively. The first communication module is also electrically connected to the host computer. The current detection module, the voltage detection module, and the second communication module are also used to electrically connect to the assembly circuit board under test, respectively.

[0074] The host computer is used to perform current detection, voltage detection, and communication detection on the assembled circuit board under test through the integrated tooling board.

[0075] The host computer can send corresponding detection commands to the control module through the first communication module, thereby enabling the control module to control the corresponding current detection module, voltage detection module, and second communication module to detect the assembled circuit board under test.

[0076] The first communication module includes, but is not limited to, a 485 communication subunit and / or a CAN communication subunit.

[0077] The voltage detection module and the current detection module can be used to sample the voltage and current on the assembled circuit board under test, and can also be used to output the corresponding test voltage and test current to the assembled circuit board under test in order to detect the sampling capability of the assembled circuit board under test itself.

[0078] The second communication module can be used to transmit signals to the assembled circuit board under test, and it can also be used to test certain communication methods of the assembled circuit board under test.

[0079] The aforementioned test system for assembled circuit boards integrates the current detection module, voltage detection module, first communication module, second communication module, and control module into a single circuit board, resulting in a corresponding integrated fixture board. This system improves integration and reduces the overall system size while achieving multiple testing functions, eliminating the need for high space and installation requirements. Furthermore, the integrated fixture board, acting as a lower-level machine to interact with the upper-level machine, avoids the complex wiring issues caused by the upper-level machine being electrically connected to each of the dispersed modules.

[0080] like Figure 2 As shown, in one embodiment, the voltage detection module includes a first voltage sampling unit and a second voltage sampling unit.

[0081] The first voltage sampling unit and the second voltage sampling unit are electrically connected to the control module, respectively. The first voltage sampling unit and the second voltage sampling unit are also used to electrically connect to the assembly circuit board under test.

[0082] The first voltage sampling unit and the second voltage sampling unit are used to sample the voltage on the assembled circuit board under test, thereby determining whether the voltage is normal. This embodiment uses two voltage sampling units to meet different voltage sampling requirements; in other embodiments, only one voltage sampling unit may be used. In other embodiments, the voltage detection module may further include a voltage generation unit for outputting a test voltage to the assembled circuit board under test to detect its voltage sampling performance.

[0083] The first voltage sampling unit has a lower measurement accuracy than the second voltage sampling unit, allowing for voltage sampling of the assembled circuit board under test at different accuracies to meet various sampling requirements. For example, the first voltage sampling unit, with its relatively lower accuracy, can be used to determine whether the voltage is normal; conversely, the second voltage sampling unit, with its relatively higher accuracy, can be used to determine the power consumption of the assembled circuit board under test.

[0084] like Figure 3 and Figure 4 As shown, in one embodiment, the first voltage sampling unit includes a first voltage divider resistor string consisting of resistors R6, R7, R8 and R9, an analog-to-digital converter chip U11 and a digital isolation chip.

[0085] The common terminal of resistors R8 and R9 is electrically connected to analog-to-digital converter chip U11 to output the divided analog sampling voltage AIN0 to analog-to-digital converter chip U11. Resistor R6 is used to electrically connect to the assembly circuit board under test to receive the voltage under test VIN-ADC1. Analog-to-digital converter chip U11 is also electrically connected to the control module through a digital isolation chip to output the digital sampling voltage SCK1 after analog-to-digital conversion.

[0086] The ratio of the analog sampling voltage AIN0 to the voltage under test VIN-ADC1 is D = R9 / (R6+R7+R8+R9).

[0087] The first voltage divider resistor string can be configured with multiple elements to achieve multi-channel voltage sampling. For example, four elements can be configured to achieve four-channel voltage sampling.

[0088] like Figure 5 As shown, in one embodiment, the first voltage sampling unit further includes an isolation power supply chip U4, an isolation transformer T1, and a voltage regulator chip U5.

[0089] Among them, the isolation power supply chip U4 is electrically connected to the primary winding of the isolation transformer T1, and the secondary winding of the isolation transformer T1 is electrically connected to the voltage regulator chip U5. The input working voltage (such as +3.3V working voltage) can be isolated and regulated through the isolation power supply chip U4, the isolation transformer T1 and the voltage regulator chip U5, thereby outputting the working voltage VADC1 required by the analog-to-digital converter chip U11.

[0090] like Figure 6 and Figure 7 As shown, in one embodiment, the second voltage sampling unit includes a second voltage divider resistor string consisting of resistors R185, R186 and R187, a metering chip U39 and a digital isolation chip U41.

[0091] As a supplement, the digital isolation chip involved in the first voltage sampling unit mentioned above can specifically be the digital isolation chip U41 in this embodiment.

[0092] The common terminal of resistors R186 and R187 is electrically connected to the metering chip U39 to output the divided analog sampling voltage V4+ to the metering chip U39. Resistor R185 is used to electrically connect to the assembly circuit board under test to receive the voltage Vi4+ under test. The metering chip U39 is electrically connected to the control module through the digital isolation chip U41 to output the digital sampling voltage to the control module through the terminals RX16 and TX16 of the digital isolation chip U41.

[0093] Wherein, the simulated sampling voltage V4+ = (R187 * the voltage to be measured Vi4+) / (R185 + R186 + R187).

[0094] In this embodiment, the metering chip U39 can perform both voltage and current sampling. When used for voltage sampling, it functions as a voltage metering chip. Similarly, when used for voltage sampling, the digital isolation chip U41 functions as a voltage sampling digital isolation chip.

[0095] like Figure 8 As shown, in one embodiment, the current detection module includes a current sampling unit.

[0096] The current sampling unit is electrically connected to the control module and is used for electrical connection with the assembly circuit board under test.

[0097] The current sampling unit is used to sample the current of the assembled circuit board under test, obtain the sampled current, and thus determine whether the current of the assembled circuit board under test is abnormal, or combine it with the sampled voltage to determine the relevant power consumption of the assembled circuit board under test.

[0098] like Figure 7 As shown, in one embodiment, the current sampling unit includes a current sampling resistor (including resistor R162 and resistor R174), a metering chip U39, and a digital isolation chip U41.

[0099] Resistors R162 and R174 can be used to electrically connect to the assembly board under test via a shunt, current transformer, or Hall sensor to access the current to be measured (such as I4+ and I4-) on the assembly board under test.

[0100] Among them, shunts and current transformers can be used to achieve AC sampling, while Hall sensors can be used to achieve DC sampling.

[0101] Resistors R162 and R174 are also electrically connected to metering chip U39 to output analog sampling voltage obtained from current sampling to metering chip U39. Metering chip U39 is also electrically connected to control module through digital isolation chip U41 to output digital sampling voltage to control module through terminals RX16 and TX16 of digital isolation chip U41.

[0102] Wherein, the simulated sampling voltage = the current to be measured * (R162 + R174).

[0103] As mentioned in the above embodiments, the metering chip U39 can perform both voltage and current sampling. When used for current sampling, it functions as a current metering chip. Similarly, when used for current sampling, the digital isolation chip U41 functions as a current sampling digital isolation chip.

[0104] Among them, Figure 7 In this example, only one voltage sampling and one current sampling are shown. In other embodiments, there can be two voltage sampling and two current sampling, that is, two sets of second voltage divider series, two sets of current sampling resistors and two metering chips are set. In this case, only one digital isolation chip can be set, that is, the two metering chips share one digital isolation chip.

[0105] As a supplement, the U39 metering chip can ensure measurement accuracy through calibration. Specifically, the standard voltage and standard current are connected to the voltage input terminal and current input terminal of the U39 metering chip, respectively. The control module or host computer calculates the D value and calibration coefficient based on the standard voltage and standard current and writes them into the ratio difference register of the U39 metering chip, thereby completing the calibration.

[0106] like Figure 8 As shown, in one embodiment, the current detection module includes a current generation unit and a signal transmission unit.

[0107] The current generation unit and the signal transmission unit are electrically connected to the control module, and the current generation unit and the signal transmission unit are also used to electrically connect to the assembly circuit board under test.

[0108] The control module is used to control the current generation unit to output test current to the assembly circuit board under test, so that the assembly circuit board under test samples the test current, and obtains the sampling detection result of the assembly circuit board under test based on the current sampling signal fed back by the signal transmission unit.

[0109] When the test current is applied to the assembled circuit board under test, the test current is sampled to obtain the corresponding sampled current, and then the current sampling signal is fed back to the control module based on the sampled current.

[0110] like Figure 9 and Figure 10As shown, in one embodiment, the current generating unit includes a switching subunit (including a transistor V1 and a relay K1), a third voltage divider resistor string consisting of resistors R304, R305, R306, R307, R308, R309, R310, R311, R312, and R313, and a current transformer TV1.

[0111] Resistor R304 is used to connect to the test power supply (such as the live wire of 220VAC) through the switching part of relay K1. Resistor R309 is used to connect to the test power supply (such as the neutral wire N of 220VAC). Resistors R308 and R313 are electrically connected to the primary winding of current transformer TV1, respectively. The secondary winding of current transformer TV1 is electrically connected to the assembly circuit board under test to output test current (such as current IA1+ and IA1-) to the assembly circuit board under test. The coil part of relay K1 is also electrically connected to the control module through transistor V1 to receive the control signal through the base of transistor V1.

[0112] When a high-level control signal is connected to the base of transistor V1, transistor V1 is turned on, and the 220VAC power supply can be output to the third voltage divider resistor string through relay K1. After the voltage divider and current limiting of the third voltage divider resistor string, a current with a small amplitude is connected to the secondary winding of current transformer TV1. The turns ratio of current transformer TV1 can be 1, so that the current with this amplitude can be directly used as the test current and output to the assembly circuit board under test.

[0113] The control module can obtain the amplitude of the test current in advance. If the amplitude of the current sampling signal obtained through the signal transmission unit is the same, it indicates that the current sampling function of the assembled circuit board under test is normal.

[0114] like Figure 11 As shown, in one embodiment, the second communication module includes a remote control unit and a signal transmission unit.

[0115] The remote control unit and the signal transmission unit are electrically connected to the control module, and the remote control unit and the signal transmission unit are respectively used to electrically connect to the assembly circuit board under test.

[0116] The control module is used to remotely control the assembled circuit board under test via the remote control unit, and obtain the remote signaling detection result of the assembled circuit board under test based on the remote signaling status signal fed back by the signal transmission unit.

[0117] Specifically, the remote control unit is used to electrically connect with the remote signaling circuit of the assembled circuit board under test. When the remote control unit executes a corresponding remote control operation, the remote signaling circuit of the assembled circuit board under test can feed back the corresponding remote signaling status, which is then fed back to the control module through the signal transmission unit. The control module compares the remote signaling status corresponding to the remote control operation with the remote signaling status in the remote signaling status signal. If they match, it indicates that the remote signaling circuit of the assembled circuit board under test is normal.

[0118] like Figure 12 As shown, in one embodiment, the remote control unit includes a transistor V3 and a relay K3.

[0119] The base of transistor V3 is electrically connected to the control module, and the collector of transistor V3 is connected in series with the coil of relay K3. The switching part of relay K3 is used to electrically connect with the remote signaling circuit of the assembly circuit board under test, specifically in series with the light-emitting part of optocoupler O300.

[0120] When a high-level control signal is applied to the base of transistor V3, transistor V3 conducts, and relay K3 conducts. If the remote signaling circuit of the assembly circuit board under test is normal, optocoupler O300 conducts, enabling the assembly circuit board under test to acquire a low-level remote signaling state, thereby feeding back a remote signaling state signal representing the low level to the control module. When a low-level control signal is applied to the base of transistor V3, transistor V3 is cut off, and relay K3 is disconnected. If the remote signaling circuit of the assembly circuit board under test is normal, optocoupler O300 is cut off, enabling the assembly circuit board under test to acquire a high-level remote signaling state, thereby feeding back a remote signaling state signal representing the high level to the control module.

[0121] like Figure 11 As shown, in one embodiment, the second communication module includes a remote signaling unit and a signal transmission unit.

[0122] The remote signaling unit and the signal transmission unit are electrically connected to the control module, and are also used to electrically connect to the assembly circuit board under test.

[0123] The control module is used to send remote control command signals to the assembly circuit board under test through the signal transmission unit, and obtain the remote control test results of the assembly circuit board under test according to the remote signaling status of the remote signaling unit.

[0124] Specifically, the remote signaling unit is used to electrically connect to the remote control circuit of the assembly circuit board under test (PCB). When the PCB receives a remote control command signal through the signal transmission unit, its internal remote control circuit executes the corresponding remote control operation according to the remote control command signal. The remote signaling unit can then feed back the corresponding remote signaling status to the control module. The control module compares the remote signaling status corresponding to the remote control operation contained in the remote control command signal with the remote signaling status fed back by the remote signaling unit. If they match, it indicates that the remote control circuit of the PCB is normal.

[0125] like Figure 13 As shown, in one embodiment, the remote signaling unit includes an optical coupler O500.

[0126] The light-emitting part of the optocoupler O500 is used to electrically connect with the remote control circuit of the assembled circuit board under test, specifically to the switching part of the relay K5, and the photosensitive part of the optocoupler O500 is electrically connected to the control module.

[0127] The coil of relay K5 is also electrically connected to the control circuit in the circuit board under test via transistor V500 to provide feedback on the corresponding remote signaling status.

[0128] When the circuit board under test (TBD) receives a high-level remote control command signal, the base of transistor V3 receives a high-level control signal. If the remote signaling circuit of the TBD is normal, transistor V3 conducts, relay K3 conducts, and optocoupler O500 conducts, allowing the control module to acquire a low-level remote signaling state. When the TBD receives a low-level remote control command signal, the base of transistor V3 receives a low-level control signal. If the remote signaling circuit of the TBD is normal, transistor V3 is cut off, relay K3 is disconnected, and optocoupler O500 is cut off, allowing the control module to acquire a high-level remote signaling state.

[0129] The remote signaling unit can also serve as a high / low level detection circuit for the input / output pins of the control module or a pulse period detection circuit for the assembled circuit board under test. Specifically, when detecting the pulse period (such as the clock period), the timer and capture functions of the control module (such as the MCU) are required.

[0130] The host computer sends a trigger rising edge capture command to the remote signaling unit through the first communication module. When the first rising edge is captured, the timer starts counting. When the second rising edge is captured, the timer stops counting and calculates the period of the pulse. The period value is returned to the host computer through the first communication module.

[0131] In one embodiment, the signal transmission unit includes a 485 communication subunit and / or a CAN communication subunit.

[0132] like Figure 14 As shown, in one embodiment, the 485 communication subunit includes a 485 chip U35 that integrates 485 functionality and digital isolation functionality. The 485 chip U35 is electrically connected to the 485 port of the assembly circuit board under test through resistors R177 and R178, respectively. The 485 chip U35 is electrically connected to the USART communication port of the control module through resistors R136 and R137, respectively. The 485 chip U35 is electrically connected to the I / O port of the control module through resistor R139.

[0133] Diodes DJ3 and DJ4 are used for overvoltage protection of the input voltage.

[0134] The 485 communication subunit can be configured with multiple channels, such as six. Specifically, when there are six channels, two of them can be non-isolated, and the other four can be isolated.

[0135] like Figure 15 and Figure 16 As shown, in one embodiment, the CAN communication subunit includes a CAN chip U31 and a digital isolation chip U29.

[0136] Specifically, CAN chip U31 is electrically connected to the CAN communication port of the circuit board under test via resistor R152. The TXD and RXD pins of CAN chip U31 are electrically connected to the VOA and VIE pins of digital isolation chip U29. Digital isolation chip U29 is electrically connected to the CAN communication port of the control module via resistors R124 and R130. The S pin of CAN chip U31 is electrically connected to the VOB pin of digital isolation chip U29. Digital isolation chip U29 is electrically connected to the control port of the control module via resistor R125.

[0137] Among them, CANCTL11 is used to control the state of CAN chip U31. When CANCTL11 is high, it corresponds to the standby state, and when CANCTL11 is low, it corresponds to the working state. The transmission rate can reach 5Mbps and can be set according to the baud rate of the assembled circuit board under test.

[0138] Diode D29 is used for overvoltage protection of the input voltage; resistor R152 is a matching resistor used to prevent signal reflection.

[0139] The CAN communication subunit can be configured with multiple channels, such as two. Specifically, when two channels are configured, both channels can be isolated.

[0140] like Figure 17 As shown, in one embodiment, the test system for assembling the circuit board also includes a power module.

[0141] The power supply module is electrically connected to the current detection module, voltage detection module, first communication module, second communication module and control module respectively.

[0142] Among them, Figure 17 To make the accompanying diagrams simpler, the connection relationships of the power modules are shown in the diagram.

[0143] It is understood that, in addition to supplying power to the current detection module, voltage detection module, first communication module, second communication module, and control module, the power supply module can also supply power to the circuit board under test. The power supply to the circuit board under test can be controlled by the control module.

[0144] like Figure 18 As shown, in one embodiment, the power module includes a first power supply unit with a power chip U1 as its core.

[0145] The first power supply unit can perform amplitude conversion based on the initial DC power supply (such as a 24V DC power supply) and output the first target DC power supply (such as a 12V DC power supply).

[0146] Among them, fuse RT1 is used for current overload protection, unidirectional TVS diode D1 is used to prevent the power chip U1 from being damaged by overvoltage, and capacitors C8, C3 and C4 are used for filtering.

[0147] like Figure 19 As shown, in one embodiment, the power module includes a second power supply unit with power chip U3 as its core.

[0148] The second power supply unit can perform amplitude conversion based on the first target DC power supply (such as a 12V DC power supply) and output a second target DC power supply (such as a +3.3V DC power supply).

[0149] like Figure 20 As shown, in one embodiment, the power module includes a third power supply unit with power chip U19, transformer T3 and power chip U18 as its core.

[0150] Among them, the power chip U19 and the transformer T3 form a 24V to 12V isolated power supply, which is then converted into a third DC power supply V485 (such as a 5V DC power supply) by the power chip U18.

[0151] like Figure 21 As shown, in one embodiment, the power module includes a first power output control unit consisting of a transistor V2 and a relay K2.

[0152] The control module can control the switching state of relay K2 through transistor V2, thereby controlling whether the 24V DC power supply is input to the circuit board under test.

[0153] Similarly, refer to Figure 9In this embodiment, the switching subunit consisting of transistor V1 and relay V1 can also serve as a second power supply output control unit. The control module can control the switching state of relay K1 through transistor V1, thereby controlling whether 220V AC power is input to the circuit board under test.

[0154] like Figure 22 As shown, in one embodiment, the power module includes a third power output control unit with a power chip U9 as its core.

[0155] The enable pin EN of the power chip U9 is used to connect to the control signal output by the control module through resistor R63. When a high level is connected, a 12V DC power supply is input to the assembly circuit board under test.

[0156] like Figure 23 As shown, in one embodiment, the power module includes a fourth power output control unit with the power chip U10 as its core.

[0157] The enable pin EN of the power chip U10 is used to connect to the control signal output by the control module through resistor R62. When a high level is connected, a 5V DC power supply is input to the assembly circuit board under test.

[0158] like Figure 24 As shown, in one embodiment, the power module includes a fifth power output control unit with a power chip U8 as its core.

[0159] The enable pin EN of the power chip U8 is used to connect the control signal output by the control module through resistor R60. When a high level is connected, a 3.3V DC power supply is input to the circuit board under test.

[0160] like Figure 25 As shown, in one embodiment, the test system for assembling the circuit board also includes an adapter board.

[0161] The adapter board is electrically connected to the integrated tooling board via a ribbon cable. The adapter board is used to electrically connect to the assembled circuit board under test via probes.

[0162] The current detection module, voltage detection module, first communication module, second communication module, and control module in the integrated tooling board are used to electrically connect to the circuit board under test via the adapter board.

[0163] The adapter board is electrically connected to the integrated tooling board via a ribbon cable, ensuring the reliability of the connection; the adapter board is electrically connected to the circuit board under test via probes, ensuring the ease of connection.

[0164] As a supplement, the circuit board under test in any of the above embodiments includes, but is not limited to, metering products such as electronic energy meters, measurement terminals, and measurement switches.

[0165] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the detailed descriptions of other embodiments above, which will not be repeated here.

[0166] The above provides a detailed description of a dual-power supply control system provided by this utility model. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

[0167] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

Claims

1. A testing system for assembled circuit boards, characterized in that, The test system for the assembled circuit board includes a host computer and an integrated fixture board. The integrated fixture board integrates a current detection module, a voltage detection module, a first communication module, a second communication module, and a control module. The control module is electrically connected to the first communication module, the current detection module, the voltage detection module and the second communication module respectively. The first communication module is also electrically connected to the host computer. The current detection module, the voltage detection module and the second communication module are also used to electrically connect to the assembly circuit board under test. The host computer is used to perform current detection, voltage detection, and communication detection on the assembled circuit board under test through the integrated tooling board.

2. The testing system for assembled circuit boards according to claim 1, characterized in that, The voltage detection module includes a first voltage sampling unit and a second voltage sampling unit; The first voltage sampling unit and the second voltage sampling unit are respectively electrically connected to the control module, and the first voltage sampling unit and the second voltage sampling unit are also respectively used to be electrically connected to the assembly circuit board under test; The measurement accuracy of the first voltage sampling unit is lower than that of the second voltage sampling unit.

3. The testing system for assembled circuit boards according to claim 2, characterized in that, The first voltage sampling unit includes a first voltage divider resistor string, an analog-to-digital converter chip, and a digital isolation chip; The first voltage divider resistor string is electrically connected to the analog-to-digital converter chip and is used to electrically connect to the assembly circuit board under test. The analog-to-digital converter chip is also electrically connected to the control module through the digital isolation chip.

4. The testing system for assembled circuit boards according to claim 2, characterized in that, The second voltage sampling unit includes a second voltage divider resistor string, a voltage metering chip, and a voltage sampling digital isolation chip; The second voltage divider resistor string is electrically connected to the voltage metering chip and is used to electrically connect to the assembly circuit board under test. The voltage metering chip is also electrically connected to the control module through the voltage sampling digital isolation chip.

5. The testing system for assembled circuit boards according to claim 1, characterized in that, The current detection module includes a current sampling unit; The current sampling unit is electrically connected to the control module and is used to electrically connect to the assembly circuit board under test.

6. The testing system for assembled circuit boards according to claim 5, characterized in that, The current sampling unit includes a current sampling resistor, a current metering chip, and a current sampling digital isolation chip; The current sampling resistor is electrically connected to the current metering chip and is used to electrically connect to the assembly circuit board under test. The current metering chip is also electrically connected to the control module through the current sampling digital isolation chip.

7. The testing system for assembled circuit boards according to claim 1, characterized in that, The current detection module includes a current generation unit and a signal transmission unit; The current generating unit and the signal transmission unit are respectively electrically connected to the control module, and the current generating unit and the signal transmission unit are also respectively used to be electrically connected to the assembly circuit board under test; The control module is used to control the current generation unit to output a test current to the assembly circuit board under test, so that the assembly circuit board under test samples the test current, and obtains the sampling detection result of the assembly circuit board under test based on the current sampling signal fed back by the signal transmission unit.

8. The testing system for assembled circuit boards according to claim 7, characterized in that, The current generating unit includes a switching subunit, a third voltage divider resistor string, and a current transformer. The third voltage divider resistor string is used to connect to the test power supply through the switch subunit and to be electrically connected to the assembly circuit board under test through the current transformer. The switch subunit is also electrically connected to the control module.

9. The testing system for assembled circuit boards according to claim 1, characterized in that, The second communication module includes a remote control unit and a signal transmission unit; The remote control unit and the signal transmission unit are electrically connected to the control module, and the remote control unit and the signal transmission unit are respectively used to electrically connect to the assembly circuit board under test; The control module is used to remotely control the assembled circuit board under test through the remote control unit, and to obtain the remote signaling detection result of the assembled circuit board under test based on the remote signaling status signal fed back by the signal transmission unit.

10. The testing system for assembled circuit boards according to claim 9, characterized in that, The remote control unit includes a transistor and a relay; The base of the transistor is electrically connected to the control module, the collector of the transistor is connected in series with the coil of the relay, and the switching part of the relay is used to electrically connect to the assembly circuit board under test.

11. The testing system for assembled circuit boards according to claim 1, characterized in that, The second communication module includes a remote signaling unit and a signal transmission unit; The remote signaling unit and the signal transmission unit are respectively electrically connected to the control module, and the remote signaling unit and the signal transmission unit are respectively used to electrically connect to the assembly circuit board under test; The control module is used to send remote control command signals to the assembly circuit board under test through the signal transmission unit, and obtain the remote control detection result of the assembly circuit board under test according to the remote signaling status of the remote signaling unit.

12. The testing system for assembled circuit boards according to claim 11, characterized in that, The remote signaling unit includes an optical coupler; The light-emitting part of the optocoupler is used to be electrically connected to the assembly circuit board under test, and the photosensitive part of the optocoupler is electrically connected to the control module.

13. The testing system for assembled circuit boards according to any one of claims 9 to 12, characterized in that, The signal transmission unit includes a 485 communication subunit and / or a CAN communication subunit.

14. The testing system for assembled circuit boards according to any one of claims 1 to 12, characterized in that, The test system for the assembled circuit board also includes a power supply module; The power module is electrically connected to the current detection module, the voltage detection module, the first communication module, the second communication module, and the control module, respectively. The power module is used to supply power to the current detection module, the voltage detection module, the first communication module, the second communication module and the control module respectively according to the initial power supply.

15. The testing system for assembled circuit boards according to any one of claims 1 to 12, characterized in that, The testing system for the assembled circuit board also includes an adapter board; The adapter board is electrically connected to the integrated tooling board via a ribbon cable, and the adapter board is used to electrically connect to the assembled circuit board under test via a probe; The current detection module, the voltage detection module, the first communication module, the second communication module, and the control module in the integrated tooling board are respectively used to electrically connect with the assembly circuit board under test through the adapter board.

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