IO-Link slave station concentrator

Abstract

The utility model discloses an IO-Link slave station concentrator, and belongs to the technical field of communication. The device comprises a microcontroller module, an IO-Link communication module, a power management control module, an input and output module and a data storage module, the microcontroller module is in signal connection with an IO-Link main station through the IO-Link communication module; the microcontroller module is in signal connection with the input and output module and the data storage module. The power management control module supplies power to the microcontroller module, the IO-Link communication module, the input and output module and the data storage module. The IO-Link concentrator disclosed by the utility model supports cascading, and can be cascaded through the IO-Link communication interface, so that the cost is reduced, and the flexibility is improved.

Description

Technical Field

[0001] This utility model relates to the field of communication technology, specifically to an IO-Link slave hub. Background Technology

[0002] In the field of industrial automation, device interface technology is key to connecting sensors, actuators, and control systems.

[0003] While traditional interface technologies are stable, they suffer from problems such as cumbersome wiring processes, frequent wiring errors, and inability to monitor parameters. Utility Model Content

[0004] The purpose of this invention is to provide a high-efficiency IO-Link slave hub.

[0005] To solve the above-mentioned technical problems, this utility model provides an IO-Link slave hub, including a microcontroller module, an IO-Link communication module, a power management control module, an input / output module, and a data storage module;

[0006] The microcontroller module is connected to the IO-Link master station via the IO-Link communication module;

[0007] The microcontroller module is connected to the input / output module and the data storage module via signals, respectively.

[0008] The power management control module provides power to the microcontroller module, IO-Link communication module, input / output module, and data storage module;

[0009] Preferably, the power management control module includes a power chip U7;

[0010] The 24V voltage output terminal is connected to the VIN terminal of the power chip U7 through the Zener diode U5 and the inductor L2;

[0011] The 24V voltage output terminal is grounded after being connected in parallel with a bidirectional Zener diode and a thermistor U6.

[0012] The 24V voltage output terminal is grounded through capacitors C8 and C9 connected in parallel.

[0013] The EN terminal of the power chip U7 is grounded through resistor R24;

[0014] The EN terminal and VIN terminal of the power chip U7 are connected by a resistor R21.

[0015] The RT / CLK terminal of the power chip U7 is grounded through resistor R25;

[0016] The RT / CLK terminal and VIN terminal of the power chip U7 are connected in parallel via capacitors C12, C13 and C16.

[0017] The BOOT terminal of the power chip U7 is connected to the SW terminal of the power chip U7 through capacitor C7.

[0018] The SW terminal of the power chip U7 is connected to the 3.3V voltage output terminal through inductor L1;

[0019] The SW terminal and GND terminal of the power chip U7 are connected in parallel via capacitors C11, C10, and C14, and diode D2.

[0020] The GND terminal of the power chip U7 is grounded;

[0021] The FB terminal and SW terminal of the power chip U7 are connected in parallel via a resistor R18 and a capacitor C15.

[0022] The FB terminal of the power chip U7 is grounded through resistor R23;

[0023] The COMP terminal of the power chip U7 is grounded through resistor R20 and capacitors C19 and C20 connected in parallel.

[0024] Preferably, the input / output module includes an input circuit and an output circuit;

[0025] The input circuit includes an optocoupler U4;

[0026] The external input signal PORT1 is connected to terminal 1 of optocoupler U4 after passing through resistor R2 and LED U2;

[0027] Terminals 2 and 3 of the optocoupler U4 are grounded;

[0028] The four terminals of the optocoupler U4 are divided into two paths. One path is connected to the microcontroller module as a 3.3V digital signal output terminal through resistor R6, and the other path is grounded through capacitor C4.

[0029] The output circuit includes an NMOS transistor Q3 and a PMOS transistor Q1;

[0030] The digital signal DO1_EN output terminal of the microcontroller module is connected to the gate of NMOS transistor Q3 through resistor R11;

[0031] The resistor R11 is grounded through a resistor R13 and a capacitor C5 connected in parallel.

[0032] The source of the NMOS transistor Q3 is grounded;

[0033] The drain of the NMOS transistor Q3 is connected to the source of the PMOS transistor Q1 through resistor R9.

[0034] The VCC terminal is divided into two paths: one path is connected to the gate of PMOS transistor Q1 through resistor R7, and the other path is connected to the source of PMOS transistor Q1.

[0035] The drain of the PMOS transistor Q1 is connected to the fuse F1 and serves as the external output signal PORT1_PIN2.

[0036] Preferably, the IO-Link communication module includes a communication chip U17;

[0037] The 3.3V voltage output terminal is connected to the VDD terminal and IN1 terminal of the communication chip U17;

[0038] The VDD and IN1 terminals of the communication chip U17 are grounded through capacitors C30 and C31 connected in parallel.

[0039] The 3.3V voltage output terminal is connected to the OL terminal of the communication chip U17 through resistor R49;

[0040] The VCC terminal of the communication chip U17 is divided into two paths: one path is connected to the +24Vin input terminal, and the other path is grounded through capacitor C32.

[0041] Preferably, the data storage module includes a storage chip U15;

[0042] The 3.3V voltage output terminal is connected to the WP terminal of the memory chip U15 through resistor R37;

[0043] The 3.3V voltage output terminal is connected to the VCC terminal of the memory chip U15;

[0044] The HOLD terminal of the memory chip U15 is grounded through resistor R34 and capacitor C23;

[0045] The CS, SO, SCK, and SI terminals of the data storage module are connected to the microcontroller module.

[0046] Preferably, the LED indicator module includes LED9, LED14 and LED15;

[0047] The positive terminal of the light-emitting diode LED9 is connected to the 3.3V voltage output terminal through resistor R155, and the negative terminal is connected to the POWER terminal of the microcontroller module.

[0048] The positive terminal of the light-emitting diode LED14 is connected to the 3.3V voltage output terminal through resistor R156, and the negative terminal is connected to the RUN terminal of the microcontroller module.

[0049] The positive terminal of the light-emitting diode LED15 is connected to the 3.3V voltage output terminal through resistor R157, and the negative terminal is connected to the ERROR terminal of the microcontroller module.

[0050] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0051] This invention allows IO-Link slave devices to connect to the IO-Link master station via the IO-Link interface, and the master station to connect to a host computer / PLC or other upper-level system via Ethernet protocol. Through the IO-Link interface, the upper-level system can remotely read and control the parameters of field sensors and actuators.

[0052] This invention offers a higher cost-performance ratio and can replace traditional Ethernet I / O modules, protecting existing investments.

[0053] This invention can convert digital or analog signals from ordinary sensors into IO-Link signals for transmission to the master station system, and can also receive signals sent by the master station to control actuators.

[0054] This invention supports cascading, allowing IO-Link hubs to be cascaded via the IO-Link communication interface, reducing costs and increasing flexibility. Attached Figure Description

[0055] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.

[0056] Figure 1 This is a block diagram illustrating the implementation of an IO-Link slave hub according to this utility model;

[0057] Figure 2 This is a schematic diagram of the operation of an IO-Link slave hub according to this utility model;

[0058] Figure 3 This is the circuit diagram of the input circuit;

[0059] Figure 4 This is the circuit diagram of the output circuit;

[0060] Figure 5 This is the circuit diagram of the IO-Link communication module;

[0061] Figure 6 This is the circuit diagram of the power management control module;

[0062] Figure 7 This is the circuit diagram of the data storage module;

[0063] Figure 8This is the circuit diagram for the LED indicator module. Detailed Implementation

[0064] Many specific details are set forth in the following description to provide a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0065] The terminology used in one or more embodiments of this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the one or more embodiments of this specification. The singular forms “a,” “described,” and “the” as used in one or more embodiments of this specification and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in one or more embodiments of this specification refers to and includes any or all possible combinations of one or more associated listed items.

[0066] It should be understood that although the terms first, second, etc., may be used to describe various information in one or more embodiments of this specification, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, first may also be referred to as second without departing from the scope of one or more embodiments of this specification, and similarly, second may also be referred to as first. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to a determination."

[0067] The present invention will now be described in further detail with reference to the accompanying drawings:

[0068] This utility model provides an IO-Link slave hub, including a microcontroller module, an IO-Link communication module, a power management control module, an input / output module, and a data storage module;

[0069] The microcontroller module is connected to the IO-Link master station via the IO-Link communication module;

[0070] The microcontroller module is connected to the input / output module and the data storage module via signals, respectively.

[0071] The power management control module provides power to the microcontroller module, IO-Link communication module, input / output module, and data storage module;

[0072] Preferably, the power management control module includes a power chip U7;

[0073] The 24V voltage output terminal is connected to the VIN terminal of the power chip U7 through the Zener diode U5 and the inductor L2;

[0074] The 24V voltage output terminal is grounded after being connected in parallel with a bidirectional Zener diode and a thermistor U6.

[0075] The 24V voltage output terminal is grounded through capacitors C8 and C9 connected in parallel.

[0076] The EN terminal of the power chip U7 is grounded through resistor R24;

[0077] The EN terminal and VIN terminal of the power chip U7 are connected by a resistor R21.

[0078] The RT / CLK terminal of the power chip U7 is grounded through resistor R25;

[0079] The RT / CLK terminal and VIN terminal of the power chip U7 are connected in parallel via capacitors C12, C13 and C16.

[0080] The BOOT terminal of the power chip U7 is connected to the SW terminal of the power chip U7 through capacitor C7.

[0081] The SW terminal of the power chip U7 is connected to the 3.3V voltage output terminal through inductor L1;

[0082] The SW terminal and GND terminal of the power chip U7 are connected in parallel via capacitors C11, C10, and C14, and diode D2.

[0083] The GND terminal of the power chip U7 is grounded;

[0084] The FB terminal and SW terminal of the power chip U7 are connected in parallel via a resistor R18 and a capacitor C15.

[0085] The FB terminal of the power chip U7 is grounded through resistor R23;

[0086] The COMP terminal of the power chip U7 is grounded through resistor R20 and capacitors C19 and C20 connected in parallel.

[0087] Preferably, the input / output module includes an input circuit and an output circuit;

[0088] The input circuit includes an optocoupler U4;

[0089] The external input signal PORT1 is connected to terminal 1 of optocoupler U4 after passing through resistor R2 and LED U2;

[0090] Terminals 2 and 3 of the optocoupler U4 are grounded;

[0091] The four terminals of the optocoupler U4 are divided into two paths. One path is connected to the microcontroller module as a 3.3V digital signal output terminal through resistor R6, and the other path is grounded through capacitor C4.

[0092] The output circuit includes an NMOS transistor Q3 and a PMOS transistor Q1;

[0093] The digital signal DO1_EN output terminal of the microcontroller module is connected to the gate of NMOS transistor Q3 through resistor R11;

[0094] The resistor R11 is grounded through a resistor R13 and a capacitor C5 connected in parallel.

[0095] The source of the NMOS transistor Q3 is grounded;

[0096] The drain of the NMOS transistor Q3 is connected to the source of the PMOS transistor Q1 through resistor R9.

[0097] The VCC terminal is divided into two paths: one path is connected to the gate of PMOS transistor Q1 through resistor R7, and the other path is connected to the source of PMOS transistor Q1.

[0098] The drain of the PMOS transistor Q1 is connected to the fuse F1 and serves as the external output signal PORT1_PIN2.

[0099] Preferably, the IO-Link communication module includes a communication chip U17;

[0100] The 3.3V voltage output terminal is connected to the VDD terminal and IN1 terminal of the communication chip U17;

[0101] The VDD and IN1 terminals of the communication chip U17 are grounded through capacitors C30 and C31 connected in parallel.

[0102] The 3.3V voltage output terminal is connected to the OL terminal of the communication chip U17 through resistor R49;

[0103] The VCC terminal of the communication chip U17 is divided into two paths: one path is connected to the +24Vin input terminal, and the other path is grounded through capacitor C32.

[0104] Preferably, the data storage module includes a storage chip U15;

[0105] The 3.3V voltage output terminal is connected to the WP terminal of the memory chip U15 through resistor R37;

[0106] The 3.3V voltage output terminal is connected to the VCC terminal of the memory chip U15;

[0107] The HOLD terminal of the memory chip U15 is grounded through resistor R34 and capacitor C23;

[0108] The CS, SO, SCK, and SI terminals of the data storage module are connected to the microcontroller module.

[0109] Preferably, the LED indicator module includes LED9, LED14 and LED15;

[0110] The positive terminal of the light-emitting diode LED9 is connected to the 3.3V voltage output terminal through resistor R155, and the negative terminal is connected to the POWER terminal of the microcontroller module.

[0111] The positive terminal of the light-emitting diode LED14 is connected to the 3.3V voltage output terminal through resistor R156, and the negative terminal is connected to the RUN terminal of the microcontroller module.

[0112] The positive terminal of the light-emitting diode LED15 is connected to the 3.3V voltage output terminal through resistor R157, and the negative terminal is connected to the ERROR terminal of the microcontroller module.

[0113] To better illustrate the technical effects of this utility model, the present utility model provides the following specific embodiments to explain the above technical process:

[0114] Example 1: An IO-Link slave hub, comprising a microcontroller module, an IO-Link communication module, a power management and control module, an input / output module, a data storage module, and an indicator light module, such as... Figures 1-2 As shown

[0115] The power management control module provides power to the entire eight-port IO-Link hub through the power control chip; the input / output module is responsible for the input detection and output of switch signals from external devices to control external devices, and supports the configuration of up to 16 input or output switch signals.

[0116] The IO-Link communication module connects to the microcontroller's port via a chip communication interface and is responsible for data communication between the IO-Link hub and the IO-Link master station.

[0117] The microcontroller module includes a microcontroller and matching circuitry around the microcontroller, used to convert the I / O data of the output module to the I / O-Link communication module.

[0118] The data storage module is responsible for storing the configuration parameters issued by the IO-Link master station.

[0119] The indicator module is responsible for indicating the input and output signals of the eight-port IO-Link hub, as well as the system operating status and error indication.

[0120] In this embodiment, an IO-Link slave hub can expand to support up to 16 input or output switch signals by occupying only one IO-Link port; each port outputs power and IO control ports, and is equipped with overcurrent detection circuits to prevent large currents from damaging the ports.

[0121] IO-Link hubs enable sensors and actuators to self-calibrate by providing high-speed, bidirectional digital data communication, thereby further optimizing the production line and simplifying the entire production process.

[0122] The IO-Link hub can simultaneously connect up to 16 outputs or 16 inputs, thereby enabling efficient data interaction between external sensor devices and the host computer / PLC.

[0123] Circuit composition description:

[0124] 1. Input circuit description, such as Figure 3 As shown;

[0125] The IO input detection circuit consists of discrete components: optocouplers, resistors, LEDs, and capacitors. The LEDs are responsible for indicating the input signal, and the optocouplers are responsible for converting the external input signal into a 3.3V digital signal for the microcontroller module. The microcontroller module then sends the digital signal to the IO-Link master station via the IO-Link communication module.

[0126] 2. Output circuit description, such as Figure 4 As shown;

[0127] The IO output circuit consists of discrete components: NMOS transistor Q3, PMOS transistor Q1, resistors, fuses, and capacitors. The microcontroller module receives the output signal sent by the IO-Link master station through the IO-Link module. The microcontroller module then controls the DO1_EN output digital signal to be converted into an external output signal (PORT1_PIN2) through the NMOS and PMOS transistors to control external devices. Fuse F1 is responsible for overcurrent detection of the output signal line to prevent high current from burning out the output port and affecting the normal use of the device.

[0128] 3. IO-Link communication module circuit description, such as... Figure 5 As shown;

[0129] The IO-Link communication module consists of a communication chip U17 and discrete resistors and capacitors. The communication chip U17 can be the IO-Link chip L6362A, which enables data communication between the IO-Link master station and the IO-Link hub.

[0130] 4. Power supply circuit description, such as Figure 6 As shown;

[0131] The power supply circuit consists of a power chip U7 and discrete components. The power chip U7 can be an SCT2430 chip, which regulates the power supply voltage to 3.3V to power the MCU module and the IO-link communication module. A key feature of this circuit is the use of multiple varistors connected throughout, effectively enhancing its anti-interference capability.

[0132] 5. Data storage module circuit description, such as... Figure 7 As shown;

[0133] The data storage circuit consists of a memory chip U15 and resistors. The memory chip U15 can be a CAT25080. SPI_CSN, SPI_MISO, SPI_MOSI, and SPI_SCK are connected to the microcontroller module. Data processed by the microcontroller module is stored in the data storage chip, and the microcontroller module can also read data from the data storage chip for its own use.

[0134] 6. Microcontroller Module Description

[0135] The microcontroller module includes the U14 microcontroller chip, which is a high-performance microcontroller chip, specifically the GD32F303VCT6 chip. Its high performance facilitates rapid data signal forwarding, and its 100-pin pinout eliminates the need for external chips, enabling 16-channel operation with up to 70 pins.

[0136] 7. System LED indicator module, such as Figure 8 As shown;

[0137] The system LED indicator module includes light-emitting diodes (LEDs), consisting of two green LEDs and one red LED. The green LEDs indicate the power supply and system operating status, respectively, while the red LEDs indicate hub malfunctions or abnormalities.

[0138] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. An IO-Link slave hub, characterized in that, The microcontroller module, the IO-Link communication module, the power management control module, the input and output module and the data storage module are included. The microcontroller module is connected with the IO-Link master station signal through the IO-Link communication module. The microcontroller module is connected with the input and output module and the data storage module. The power management control module supplies power for the microcontroller module, the IO-Link communication module, the input and output module and the data storage module. The power management control module includes a power chip U7. The 24V voltage output end is connected with the VIN end of the power chip U7 through a voltage stabilizing diode U5 and an inductor L2. The 24V voltage output end is grounded through a bidirectional voltage stabilizing diode and a thermistor U6 arranged in parallel. The 24V voltage output end is grounded through a capacitor C8 and a capacitor C9 arranged in parallel. The EN end of the power chip U7 is grounded through a resistor R24. The EN end of the power chip U7 is connected with the VIN end through a resistor R21. The RT / CLK end of the power chip U7 is grounded through a resistor R25. The RT / CLK end of the power chip U7 and the VIN end are connected through a capacitor C12, a capacitor C13 and a capacitor C16 arranged in parallel. The BOOT end of the power chip U7 is connected with the SW end of the power chip U7 through a capacitor C7. The SW end of the power chip U7 is connected with the 3.3V voltage output end through an inductor L1. The SW end of the power chip U7 and the GND end are connected through a capacitor C11, a capacitor C10, a capacitor C14 and a diode D2 arranged in parallel. The GND end of the power chip U7 is grounded. The FB end of the power chip U7 and the SW end are connected through a resistor R18 and a capacitor C15 arranged in parallel. The FB end of the power chip U7 is grounded through a resistor R23. The COMP end of the power chip U7 is grounded through a resistor R20 and a capacitor C19 and a capacitor C20 arranged in parallel. The input and output module includes an input circuit and an output circuit. The input circuit includes an optocoupler U4. An external input signal PORT1 is connected with the 1 end of the optocoupler U4 through a resistor R2 and an LED lamp U2. The 2 end and the 3 end of the optocoupler U4 are grounded. The 4 end of the optocoupler U4 is divided into two paths, one path is connected with the microcontroller module as a 3.3V digital signal output end through a resistor R6, and the other path is grounded through a capacitor C4. The output circuit includes an NMOS tube Q3 and a PMOS tube Q1. The digital signal DO1_EN output end of the microcontroller module is connected with the gate of the NMOS tube Q3 through a resistor R11. The two ends of the resistor R11 are grounded through a resistor R13 and a capacitor C5 arranged in parallel. The source of the NMOS tube Q3 is grounded. The drain of the NMOS tube Q3 is connected with the source of the PMOS tube Q1 through a resistor R9. The VCC end is divided into two paths, one path is connected with the gate of the PMOS tube Q1 through a resistor R7, and the other path is connected with the source of the PMOS tube Q1. The drain of the PMOS tube Q1 is connected to the external output signal PORT1_PIN2 through the fuse F1; The IO-Link communication module comprises a communication chip U17; The 3.3V voltage output end is connected with the VDD end and the IN1 end of the communication chip U17; The VDD end and the IN1 end of the communication chip U17 are connected to the ground through the parallelly arranged capacitor C30 and the capacitor C31; The 3.3V voltage output end is connected with the OL end of the communication chip U17 through the resistor R49; The VCC end of the communication chip U17 is divided into two paths, one of which is connected with the +24Vin input end, and the other of which is connected to the ground through the capacitor C32; The data storage module comprises a storage chip U15; The 3.3V voltage output end is connected with the WP end of the storage chip U15 through the resistor R37; The 3.3V voltage output end is connected with the VCC end of the storage chip U15; The HOLD end of the storage chip U15 is connected to the ground through the resistor R34 and the capacitor C23; The CS end, the SO end, the SCK end and the SI end of the data storage module are connected with the microcontroller module; The LED indication lamp module comprises a light emitting diode LED9, a light emitting diode LED14 and a light emitting diode LED15; The anode of the light emitting diode LED9 is connected with the 3.3V voltage output end through the resistor R155, and the cathode is connected with the POWER end of the microcontroller module; The anode of the light emitting diode LED14 is connected with the 3.3V voltage output end through the resistor R156, and the cathode is connected with the RUN end of the microcontroller module; The anode of the light emitting diode LED15 is connected with the 3.3V voltage output end through the resistor R157, and the cathode is connected with the ERROR end of the microcontroller module.

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