High-temperature-resistant RFID tire label

Abstract

The utility model relates to the technical field of tire labels, in particular to a high-temperature-resistant RFID tire label which comprises a PCB substrate, an RFID chip is welded to the center of the PCB substrate, a pair of welding spots are arranged on the outer side of the PCB substrate, a pair of antennas is arranged on the outer side of the RFID chip, the antennas are connected with the PCB substrate through the welding spots, and the RFID chip is connected with the PCB substrate through the welding spots. The outer side of the PCB substrate is provided with a silica gel packaging layer, and the silica gel packaging layer wraps the outer sides of the RFID chip, the welding spots and the antenna. According to the utility model, the elastic modulus of the silica gel can absorb the tire vulcanization pressure and the mechanical impact in the driving process, the collaborative design of the antenna and the silica gel further disperses the stress and prolongs the fatigue life, and the high-temperature-resistant polyimide protective film isolates the high temperature, so that the service life of the RFID chip and the PCB substrate is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of tire tag technology, and in particular to a high-temperature resistant RFID tire tag. Background Technology

[0002] Electronic tags (RFID) have unique identification codes. After being embedded inside an information carrier (such as a rubber tire), they are integrated into a single unit without affecting the carrier's performance. Driven by external reading and writing devices, data can be sent / read and written at any time, enabling real-time monitoring of the carrier throughout its production, sales, use, claims, or information-based management processes.

[0003] Regarding the aforementioned technologies, the existing tire tags have the following drawbacks: they often use epoxy resin or ordinary rubber for encapsulation, which are common in traditional RFID tags. However, these materials are prone to aging, cracking, or deformation under the high temperature of tire vulcanization, leading to tag failure. Therefore, this utility model provides a high-temperature resistant RFID tire tag. Utility Model Content

[0004] The purpose of this application is to provide a high-temperature resistant RFID tire tag to solve the problem mentioned in the background art that existing tire tags often use epoxy resin or ordinary rubber for encapsulation, but these materials are prone to aging, cracking or deformation under the high temperature of tire vulcanization, leading to tag failure.

[0005] To achieve the above objectives, this application provides the following technical solution: a high-temperature resistant RFID tire tag, comprising a PCB substrate, an RFID chip soldered to the center of the PCB substrate, a pair of solder joints disposed on the outer side of the PCB substrate, a pair of antennas disposed on the outer side of the RFID chip, the antennas being connected to the PCB substrate through the solder joints, and a silicone encapsulation layer disposed on the outer side of the PCB substrate, the silicone encapsulation layer covering the outer side of the RFID chip, solder joints, and antennas.

[0006] Preferably, a protective layer is provided on the outside of the silicone encapsulation layer, and the protective layer is a high-temperature resistant polyimide protective film.

[0007] Preferably, both the antenna and the RFID chip are horizontally arranged on the surface of the PCB substrate, and the antenna and the RFID chip are in the same plane.

[0008] Preferably, the antenna is composed of two wavy steel cords, and the two antennas form a coupling region that couples with the magnetic field of the PCB substrate.

[0009] Preferably, a positioning protrusion is provided at the outer edge of the PCB substrate, and the positioning protrusion is used for positioning the tire vulcanizing mold.

[0010] In summary, the technical effects and advantages of this utility model are as follows:

[0011] In this invention, the elastic modulus of silicone can absorb the pressure of tire vulcanization and mechanical impact during driving. The synergistic design of the antenna and silicone further disperses stress and improves fatigue life. In addition, the high-temperature resistant polyimide protective film isolates high temperature and increases the service life of RFID chips and PCB substrates. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a first-view axial side view of the structure of this utility model;

[0014] Figure 2 This is a schematic diagram of the second-view axial side structure of the present invention;

[0015] Figure 3 This is a schematic diagram of the RFID chip in this utility model.

[0016] In the diagram: 1. Silicone encapsulation layer; 2. Protective layer; 3. PCB substrate; 4. RFID chip; 5. Antenna; 6. Solder joint. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0019] Example: Reference Figure 1-3 The high-temperature resistant RFID tire tag shown includes a PCB substrate 3. The PCB substrate 3 serves as the basic support structure for the tag, providing an installation platform for other components. Its material possesses excellent electrical insulation and mechanical strength, enabling it to stably support the RFID chip 4 soldered in the central position, ensuring the chip's normal operation in complex environments. The RFID chip 4 is soldered to the central position of the PCB substrate 3. The RFID chip 4 is the core component for the tag's information storage and wireless transmission; it stores data such as tire production information and usage status, and interacts with external reading and writing devices via radio frequency signals, enabling tire traceability. A pair of solder points 6 are provided on the outer side of the PCB substrate 3; these solder points 6 are key components for achieving circuit connections. The antenna 5 is used to firmly connect to the PCB substrate 3, ensuring that the signals received and transmitted by the antenna 5 can be accurately transmitted to the RFID chip 4, guaranteeing the stability and reliability of signal transmission. A pair of antennas 5 are provided on the outside of the RFID chip 4. The antennas 5 are responsible for receiving radio frequency signals transmitted by external reading and writing devices and transmitting the data in the RFID chip 4 in the form of electromagnetic waves, realizing wireless communication between the tag and the outside world. The antennas 5 are connected to the PCB substrate 3 through solder joints 6. A silicone encapsulation layer 1 is provided on the outside of the PCB substrate 3. The silicone encapsulation layer 1 has good flexibility and sealing properties, covering the outside of the RFID chip 4, solder joints 6, and antennas 5, effectively isolating external moisture, dust, and other contaminants, preventing them from damaging the internal electronic components. The silicone encapsulation layer 1 is protected against damage and also cushions external impacts, protecting internal components from mechanical damage. A protective layer 2, made of high-temperature resistant polyimide, is provided on the outside of the silicone encapsulation layer 1. Polyimide has excellent high-temperature resistance, enabling long-term stable use in high-temperature environments. It effectively resists the high temperatures generated by tires during driving and the high-temperature environment during vulcanization, preventing internal components from failing due to high temperatures and greatly improving the tag's high-temperature resistance and lifespan. The antenna 5 and RFID chip 2 are both horizontally arranged on the surface of the PCB substrate 1, with the antenna 5 and RFID chip 2 in the same plane. The wavy design increases the effective radiation area of ​​the antenna 5, enhancing its ability to receive and transmit signals and improving the tag's communication capabilities. Distance and stability: Antenna 5 consists of two wavy steel cords. The steel cords have good conductivity and mechanical strength, enabling stable transmission of electromagnetic signals. The two antennas 5 form a coupling area that is magnetically coupled with the PCB substrate 3. Through magnetic coupling, efficient energy transmission and signal interaction are achieved between antenna 5 and PCB substrate 3, further optimizing the tag's communication performance. Positioning protrusions are provided on the outer edge of PCB substrate 3. These protrusions are used for positioning the tire vulcanizing mold. During the tire vulcanization process, the positioning protrusions can accurately embed into the positioning groove of the mold, ensuring that the tag is installed in the tire in an accurate position and preventing the tag from shifting or misaligning during the tire vulcanization process, thus enabling the tag to work stably and reliably.

[0020] The working principle of this utility model is as follows: During the vulcanization process, the polyimide protective layer 2 isolates the high temperature, and the silicone encapsulation layer 1 buffers the pressure; the spiral structure of the antenna 5 enhances the magnetic field coupling.

[0021] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-temperature resistant RFID tire tag, comprising a PCB substrate (3), characterized in that: An RFID chip (4) is soldered to the center of the PCB substrate (3). A pair of solder joints (6) are provided on the outer side of the PCB substrate (3). A pair of antennas (5) are provided on the outer side of the RFID chip (4). The antennas (5) are connected to the PCB substrate (3) through the solder joints (6). A silicone encapsulation layer (1) is provided on the outer side of the PCB substrate (3). The silicone encapsulation layer (1) covers the outer side of the RFID chip (4), solder joints (6), and antennas (5).

2. The high-temperature resistant RFID tire tag according to claim 1, characterized in that: A protective layer (2) is provided on the outside of the silicone encapsulation layer (1), and the protective layer (2) is a high-temperature resistant polyimide protective film.

3. The high-temperature resistant RFID tire tag according to claim 2, characterized in that: The antenna (5) and the RFID chip (2) are both horizontally arranged on the surface of the PCB substrate (1), and the antenna (5) and the RFID chip (2) are in the same plane.

4. The high-temperature resistant RFID tire tag according to claim 1, characterized in that: The antenna (5) is composed of two wavy steel cords, and the two antennas (5) form a coupling region that is magnetically coupled to the PCB substrate (3).

5. A high-temperature resistant RFID tire tag according to claim 4, characterized in that: The PCB substrate (3) has a positioning protrusion at its outer edge, which is used for positioning the tire vulcanizing mold.

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