Card swiping machine

Abstract

The utility model discloses a card swiping machine. The card swiping machine comprises a machine body, a main board, a component and a heat dissipation piece. A containing cavity is defined by the machine body. The main board is accommodated in the accommodating cavity; the components are electrically connected to the main board and comprise a first component and a second component, and the first component and the second component are arranged separately; the heat dissipation piece is connected to the sides, away from the mainboard, of the first device and the second device and used for absorbing heat of the first device and the second device. According to the card swiping machine, heat dissipation of the card swiping machine can be promoted, and the risk that temperature rise of the card swiping machine exceeds the standard is reduced.

Description

Technical Field

[0001] This utility model relates to the technical field of card readers, and more particularly to a card reader. Background Technology

[0002] To facilitate portability and use, card readers are designed to be miniaturized, thereby increasing their integration and power consumption. However, in related technologies, poor heat dissipation in card readers poses a risk of excessive temperature rise during operation. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a card reader that can promote heat dissipation and reduce the risk of the card reader overheating.

[0004] According to a first aspect of the present invention, the card reader includes a body, a motherboard, components, and a heat sink.

[0005] The body defines a receiving cavity; the motherboard is housed in the receiving cavity; components are electrically connected to the motherboard, the components including a first component and a second component, the first component and the second component being disposed separately; a heat sink is connected to the side of the first component and the second component away from the motherboard, the heat sink being used to absorb the heat of the first component and the second component.

[0006] The card reader according to the embodiments of this utility model has at least the following beneficial effects: By providing heat sinks on the first and second devices, the heat sinks can absorb the heat generated by the first and second devices during operation, thus preventing the card reader's temperature from exceeding the limit due to untimely heat dissipation. Furthermore, connecting the first and second devices to the motherboard allows heat from both devices to be conducted between them, thereby balancing their temperatures. Simultaneously, the spaced arrangement of the first and second devices prevents heat accumulation, further reducing the risk of the card reader's temperature exceeding the limit.

[0007] According to some embodiments of the present invention, the card reader includes at least two heat sinks, and the first device and the second device are respectively connected to the heat sinks on the side away from the motherboard, and the at least two heat sinks are arranged separately.

[0008] According to some embodiments of the present invention, the heat sink includes a heat-conducting part and a heat-dissipating part connected together. The heat-conducting part is connected to the side of the first device and the second device away from the motherboard, and the heat-dissipating part is connected to the side of the heat-conducting part away from the first device and the second device.

[0009] According to some embodiments of the present invention, the card reader further includes a screen body, which is connected to the machine body and disposed on the side of the heat dissipation part away from the motherboard. The heat dissipation part connected to the first device is connected to the screen body.

[0010] According to some embodiments of the present invention, the motherboard is provided with a through hole, the through hole connecting both sides of the motherboard, and the through hole is located between the first device and the second device.

[0011] According to some embodiments of the present invention, a passage is provided on the side of the motherboard away from the components, and the passage is used for the flow of heat dissipation medium.

[0012] According to some embodiments of the present invention, the motherboard includes a board body and a cover body, the components are connected to the board body, the board body has a groove on the side opposite to the components, and the cover body covers the board body to define the passage with the groove.

[0013] According to some embodiments of the present invention, the passage has a curved structure.

[0014] According to some embodiments of the present invention, the receiving cavity is connected to the side wall of the body to form an opening, and the body also includes a plurality of heat sinks, which are connected to the body and disposed at the opening, and the plurality of heat sinks are arranged sequentially along the opening.

[0015] According to some embodiments of the present invention, the heat sink has a connecting portion, which is rotatably connected to the body. The plurality of heat sinks move relative to the body through the connecting portion to change the angle with the opening.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0018] Figure 1 This is a schematic diagram of the card reader in an embodiment of the present utility model;

[0019] Figure 2 This is a schematic diagram showing the connection between the motherboard and components in an embodiment of this utility model;

[0020] Figure 3 This is a schematic diagram showing the connection between the motherboard and components in an embodiment of this utility model;

[0021] Figure 4 This is a schematic diagram of the card reader in an embodiment of the present utility model;

[0022] Figure 5 As an embodiment of this utility model Figure 4 Sectional view at point AA;

[0023] Figure 6 This is a schematic diagram of the motherboard in an embodiment of the present utility model;

[0024] Figure 7 This is a schematic diagram of the card reader in an embodiment of this utility model.

[0025] Figure label:

[0026] Card reader 100;

[0027] Body 110; Receiving cavity 111; Opening 112; Heat sink 113; Connecting part 114;

[0028] Main board 120; Through hole 121; Passage 122; Bending structure 123; Board body 124; Groove 125; Cover 126;

[0029] Component 130; First component 131; Second component 132;

[0030] Heat sink 140; heat conduction part 141; heat dissipation part 142; screen body 150. Detailed Implementation

[0031] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0032] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0033] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0034] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0035] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0036] The card reader of this utility model is described below with reference to the accompanying drawings.

[0037] This utility model embodiment provides a card reader 100, see reference. Figures 1 to 5 As shown, the card reader 100 includes a body 110, a motherboard 120, components 130, and a heat sink 140. The body 110 has an internal cavity structure that defines a receiving cavity 111. The motherboard 120 is housed in the receiving cavity 111 and connected to the inner wall of the body 110. The motherboard 120 controls the operation of the components 130.

[0038] Component 130 includes a first component 131 and a second component 132, wherein the first component 131 and the second component 132 are working elements of the card reader 100. The first component 131 and the second component 132 are electrically connected to the motherboard 120 and controlled by the motherboard 120. The first component 131 and the second component 132 are disposed separately on the motherboard 120. Specifically, the first component 131 and the second component 132 generate heat during operation, which will cause the temperature rise in the receiving cavity 111 to increase. By dispersing the first component 131 and the second component 132 on the motherboard 120, the heat accumulation can be avoided, thereby reducing the temperature rise of the card reader 100 and promoting the heat dissipation effect of the card reader 100. Furthermore, the heat generated by the first device 131 and the second device 132 during operation is not exactly the same, so that the first device 131 and the second device 132 are both connected to the motherboard 120. The motherboard 120 can conduct some of the heat to the first device 131 and the second device 132, thereby equalizing the heat of the component 130 and preventing the temperature rise of a single component 130 from being too high.

[0039] A heat sink 140 is connected to the side of the first device 131 and the second device 132 opposite to the motherboard 120. Specifically, the first device 131 and the second device 132 are positioned between the heat sink 140 and the motherboard 120, thus separating the heat sink 140 from the motherboard 120. The heat sink 140 absorbs the heat generated by the first device 131 and the second device 132, thereby promoting heat dissipation in the card reader 100. Since the motherboard 120 and the components 130 are the main operating parts of the card reader 100, separating the heat sink 140 from the motherboard 120 prevents the heat absorbed by the heat sink 140 from being transferred back to the motherboard 120, thus avoiding overheating of the motherboard 120. The heat sink 140 ensures the effective operating temperature of the internal electronic components of the card reader 100, and its reasonable layout reduces the risk of performance degradation of the motherboard 120 due to overheating.

[0040] In related technologies, existing card readers 100, in pursuit of miniaturization, reduce the housing space of the card reader 100 body 110, resulting in a high degree of integration of the functional modules (such as the motherboard 120 and components 130). When the card reader 100 is working, the heat generated by the functional modules accumulates and cannot be dissipated in time, causing the power consumption of the card reader 100 to increase with the rise in temperature. The power consumption and temperature of the card reader 100 affect each other, leading to the risk of the card reader 100 exceeding the temperature limit during use.

[0041] Compared to related technologies, the card reader 100 of this embodiment of the invention provides heat sinks 140 on the first device 131 and the second device 132. This allows the heat sinks 140 to absorb the heat generated by the first device 131 and the second device 132 during operation, preventing the heat from being unable to dissipate in time and causing the card reader 100 to overheat. Furthermore, connecting the first device 131 and the second device 132 to the motherboard 120 allows the heat from the first device 131 and the second device 132 to be conducted between them through the motherboard 120, thereby balancing the temperatures of the first device 131 and the second device 132. Simultaneously, the spaced arrangement of the first device 131 and the second device 132 prevents heat accumulation, further reducing the risk of the card reader 100 overheating.

[0042] In some embodiments, see Figures 1 to 5As shown, the card reader 100 includes at least two heat sinks 140. The first device 131 and the second device 132 are respectively connected to heat sinks 140 on the side facing away from the motherboard 120, and the at least two heat sinks 140 are separated. Specifically, in one example, the number of heat sinks 140 is the same as the number of devices included in the component 130, that is, there are two heat sinks 140. The first device 131 and the second device 132 are respectively connected to heat sinks 140 on the side facing away from the motherboard 120, and the heat sinks 140 of the first device 131 and the heat sinks 140 of the second device are separated.

[0043] By providing each of the first device 131 and the second device 132 with its own independent heat sink 140, each device can receive effective heat dissipation support, thus avoiding the problem of heat accumulating on one heat sink 140, which could lead to a decrease in the heat dissipation performance of the heat sink 140 or damage to the device. Separating the heat sinks 140 ensures that the heat conduction paths between the devices do not interfere with each other, and also prevents heat accumulation, thereby improving heat dissipation efficiency.

[0044] Furthermore, in some embodiments, the heat sink 140 includes a heat-conducting portion 141 and a heat-dissipating portion 142 connected to each other. The heat-conducting portion 141 is connected to the side of the first device 131 and the second device 132 opposite to the motherboard 120, and the heat-dissipating portion 142 is connected to the side of the heat-conducting portion 141 opposite to the first device 131 and the second device 132. Specifically, the heat sink 140 is connected to the side of the first device 131 and the second device 132 opposite to the motherboard 120, and the heat sink 140 is connected to the first device 131 and the second device 132 through the heat-conducting portion 141. The heat-conducting portion 141 is made of thermally conductive materials such as silicone or ceramic. The heat-conducting portion 141 facilitates heat conduction between the first device 131 and the second device 132, reduces the heat conducted from the first device 131 and the second device 132 to the motherboard 120, thereby improving the heat dissipation rate and promoting the heat dissipation efficiency of the card reader 100.

[0045] A heat dissipation section 142 is provided on the side of the heat-conducting section 141 opposite to the first device 131 and the second device 132. The heat dissipation section 142 absorbs the heat conducted from the first device 131 and the second device 132 to the heat-conducting section 141, thereby dissipating the heat to the external environment more quickly. This not only improves the heat transfer efficiency but also effectively reduces the operating temperature of the component 130. In this embodiment, the heat dissipation section 142 is made of a metal material. In other embodiments, the heat dissipation section 142 can also be made of graphite, heat pipes, or aluminum blocks, as long as the heat dissipation section 142 can dissipate heat.

[0046] Furthermore, in some embodiments, see [reference] Figures 1 to 5As shown, the card reader 100 also includes a screen 150, which is disposed in the receiving cavity 111 and connected to the inner wall of the body 110. The screen 150 is located on the side of the heat sink 142 away from the motherboard 120, and the screen 150 and the heat sink 142 of the first device 131 abut against each other. Specifically, by setting the screen 150, an intuitive operating interface can be provided to the user. Furthermore, by abutting the screen 150 and the heat sink 142, and by setting the screen 150 on the side of the heat sink 142 away from the motherboard 120, the screen 150 can not only become part of the heat dissipation system of the card reader 100, allowing it to absorb and dissipate some of the heat transferred from the heat sink 142, further enhancing the overall heat dissipation effect of the card reader 100, but also prevent the heat absorbed by the screen 150 from being conducted back to the motherboard 120, thus reducing the temperature rise of the motherboard 120. Meanwhile, the heat dissipation part 142 of the first device 131 is connected to the screen body 150, while the heat dissipation part 142 of the second device 132 is not connected to the screen body 150. This avoids the possibility that the heat conduction path between the first device 131 and the second device 132 will form a loop, which could prevent the heat from being dissipated in time.

[0047] In some embodiments, see Figure 3 As shown, a through-hole 121 is provided on the motherboard 120, extending through both sides of the motherboard 120 and located between the first device 131 and the second device 132. Specifically, providing the through-hole 121 on the motherboard 120 can reduce the overall size of the motherboard 120. When the first device 131 and the second device 132 are working, the heat generated by the first device 131 and the second device 132 will be conducted on the motherboard 120. By providing the through-hole 121 to reduce the size of the motherboard 120, less heat from the first device 131 and the second device 132 can be conducted to the motherboard 120, thereby allowing most of the heat to be absorbed by the heat sink 140, thus reducing the temperature of the motherboard 120 itself and improving the working performance of the card reader 100.

[0048] Furthermore, the through-hole 121 facilitates airflow on the motherboard 120, effectively aiding in heat dissipation. Specifically, when the first device 131 and the second device 132 are operating, the heat generated by both can be better dissipated through the airflow on the motherboard 120, preventing localized overheating of the motherboard 120 and components 130. This not only improves the overall heat dissipation performance of the card reader 100 but also reduces the risk of electronic component failure due to excessive temperature.

[0049] In some embodiments, see Figure 3 and Figure 6As shown, a first device 131 and a second device 132 are connected to one side of the motherboard 120, and a passage 122 is provided on the other side. The passage 122 is used for the flow of a heat dissipation medium. Specifically, the passage 122 is located below the device 130. When the first device 131 and the second device 132 generate heat during operation, some of the heat is conducted to the motherboard 120. Because a heat dissipation medium flows through the passage 122, the temperature of the side of the motherboard 120 away from the device 130 is lower than the temperature of the side of the motherboard 120 connected to the device 130. At this time, heat transfer occurs between the two sides of the motherboard 120, thereby dissipating heat and cooling the motherboard 120. In this embodiment, the passage 122 is used for the flow of constant-temperature liquid water. In other embodiments, the passage 122 can also flow with refrigerant water or other refrigerant gases, such as Freon, ammonia, and carbon dioxide.

[0050] It should be noted that the electronic components and parts 130 on the motherboard 120 are separated from the passage 122. This prevents the heat dissipation medium in the passage 122 from splashing onto the electronic components and parts 130 on the motherboard 120, which could damage the components and affect the normal operation of the card reader 100.

[0051] For details, please refer to Figure 6 As shown, the motherboard 120 includes a board body 124 and a cover 126. The board body 124 is the main body of the motherboard 120, and the component 130 is connected to the board body 124. The board body 124 is a structural component with thickness. A groove 125 is recessed on the side of the board body 124 opposite to the component 130. The groove 125 constitutes the shape and structure of the passage 122 and the trajectory of the heat dissipation medium. The cover 126 is placed on the side of the board body 124 opposite to the component 130. The cover 126 and the groove 125 together define the passage 122. That is, the cover 126 is placed on the board body 124 to close the groove 125 at the bottom of the board body 124, so that the passage 122 is formed on the motherboard 120. At the same time, the cover 126 can prevent the heat dissipation medium in the passage 122 from flowing out from the bottom of the motherboard 120 when the card reader 100 is in the upright position.

[0052] Furthermore, in some embodiments, see [reference] Figure 6 As shown, the passage 122 has a curved structure 123. Specifically, the overall shape of the passage 122 is formed by multiple interconnected "U"-shaped structures. The curved structure 123 extends the path of the passage 122, thereby increasing the contact area between the passage 122 and the bottom of the motherboard 120, thus further improving the heat dissipation efficiency of the passage 122. Furthermore, the curved structure 123 not only reduces the flow resistance of the heat dissipation medium in the passage 122, but also acts as a guide for the heat dissipation medium, promoting its flow.

[0053] In some embodiments, see Figure 7As shown, the receiving cavity 111 is connected to the side wall of the body 110, forming an opening 112. The body 110 includes multiple heat sinks 113, all of which are connected to the body 110 and positioned at the opening 112. The multiple heat sinks 113 are arranged along the opening 112. Specifically, the opening 112 is formed by the receiving cavity 111 connecting to the body 110, and the receiving cavity 111 communicates with the external environment through the opening 112. When the heat sinks 113 are positioned at the opening 112, a portion of the heat sinks 113 is housed within the receiving cavity 111 to connect with the inner wall of the body 110. The heat sinks 113 are arranged sequentially along the shape and structure of the opening 112 and exposed to the external environment. Since the interior of the body 110 is used to house the motherboard 120 and components 130, heat is generated from within the body 110. By providing the heat sinks 113, the heat generated internally can be effectively dissipated to the external environment, thereby maintaining a suitable operating temperature inside the device. This not only improves heat dissipation efficiency but also reduces the risk of performance degradation or component damage to the card reader 100 due to overheating.

[0054] Furthermore, in some embodiments, see [reference] Figure 7 As shown, the heat sink 113 has a connecting portion 114, which is the part where the heat sink 113 connects to the body 110 and is housed in the receiving cavity 111. The connecting portion 114 is rotatably connected to the body 110, and multiple heat sinks 113 can rotate relative to the body 110 through the connecting portion 114, thereby changing the angle between the opening 112 and the heat sink 113.

[0055] Specifically, when the heat sink 113 is mounted on the housing 110, it blocks the opening 112. The heat sink 113 and housing 110 are rotatably connected via the connecting part 114, allowing adjustment of the degree of blockage by the heat sink 113 on the opening 112. This adjusts the size of the opening 112, thereby altering the heat dissipation effect of the housing 110. Simultaneously, the rotation of the heat sink 113 relative to the housing 110 via the connecting part 114 also allows the opening 112 to be closed when the card reader 100 is at a low temperature, preventing external environmental impurities from entering the receiving cavity 111 through the opening 112 and damaging the motherboard 120 and components 130.

[0056] Furthermore, in some embodiments, the heat sink 113 is equipped with an automatic adjustment mechanism. For example, by using a temperature sensor to monitor the internal temperature of the card reader 100, the automatic adjustment mechanism can automatically adjust the angle of the heat sink 113 according to temperature changes, thereby achieving intelligent heat dissipation management. This not only improves the adaptability and stability of the card reader 100 in complex environments but also extends the service life of the equipment.

[0057] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A card reader, characterized in that, include: The body defines the containing cavity; The motherboard is housed in the receiving cavity; The components are electrically connected to the motherboard, and the components include a first component and a second component, which are disposed separately. A heat sink is connected to the side of the first device and the second device away from the motherboard, and the heat sink is used to absorb the heat of the first device and the second device.

2. The card reader according to claim 1, characterized in that, The card reader includes at least two heat sinks, with the first device and the second device respectively connected to the heat sinks on the side away from the motherboard, and the at least two heat sinks are arranged separately.

3. The card reader according to claim 2, characterized in that, The heat sink includes a heat-conducting part and a heat-dissipating part connected together. The heat-conducting part is connected to the side of the first device and the second device away from the motherboard, and the heat-dissipating part is connected to the side of the heat-conducting part away from the first device and the second device.

4. The card reader according to claim 3, characterized in that, The card reader also includes a screen, which is connected to the machine body and located on the side of the heat sink away from the motherboard. The heat sink connected to the first device is connected to the screen.

5. The card reader according to claim 1, characterized in that, The motherboard has a through hole that connects both sides of the motherboard and is located between the first device and the second device.

6. The card reader according to claim 1, characterized in that, The motherboard has a passage on the side opposite to the components, and the passage is used to circulate heat dissipation medium.

7. The card reader according to claim 6, characterized in that, The motherboard includes a board body and a cover body. The components are connected to the board body. The board body has a groove on the side opposite to the components. The cover body covers the board body to define the passage with the groove.

8. The card reader according to claim 7, characterized in that, The pathway has a curved structure.

9. The card reader according to claim 1, characterized in that, The receiving cavity is connected to the side wall of the body to form an opening. The body also includes a plurality of heat sinks, which are connected to the body and disposed at the opening. The plurality of heat sinks are arranged sequentially along the opening.

10. The card reader according to claim 9, characterized in that, The heat sink has a connecting part that is rotatably connected to the body. The plurality of heat sinks move relative to the body through the connecting part to change the angle with the opening.

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