Heat dissipation circuit board made of ultrahigh heat conduction material and used for mining machine

Abstract

The utility model relates to the field of circuit boards, in particular to an ultrahigh heat conduction material heat dissipation circuit board for a mining machine, which comprises a heat dissipation plate. The upper end of the heat dissipation plate is fixedly connected with a high-thermal-conductivity insulating layer, and the upper end of the high-thermal-conductivity insulating layer is fixedly connected with a circuit copper foil plate. An aluminum plate layer and a heat-conducting silicone grease layer of a traditional aluminum substrate are omitted, the high-heat-conducting insulating layer is directly attached to the heat dissipation plate and the circuit copper foil plate, the heat conduction path from the chip to the heat dissipation block is greatly shortened, the problem of heat dissipation attenuation caused by silicone grease aging and uneven smearing is thoroughly solved, the heat conduction efficiency is greatly improved, and the service life of the heat dissipation plate is prolonged. An independent aluminum plate layer and a silicone grease layer are omitted structurally, the number of circuit boards is reduced, the requirement for high-density deployment of a mining machine is met, a standard mining machine cabinet can be provided with a plurality of circuit boards, the cross block can be pushed in along the installation groove and is installed in the first screw hole and the second screw hole in a threaded mode through the threaded column, three-point locking is achieved, and the operation and maintenance cost of a mine field is greatly reduced.

Description

Technical Field

[0001] This utility model belongs to the field of circuit boards, specifically relating to a heat dissipation circuit board made of ultra-high thermal conductivity material for mining machines. Background Technology

[0002] With the rapid development of blockchain technology, mining machines, as the core equipment for cryptocurrency mining, have a crucial impact on computing power efficiency and operating costs due to their performance and stability. Core components of mining machines (such as ASIC chips) generate a large amount of heat during high-load operation, making efficient heat dissipation key to ensuring stable operation and extending the lifespan of the mining machines.

[0003] Traditional mining machine heat dissipation circuit boards have complex heat dissipation structures. The heat from the chip needs to pass through multiple layers of media, such as solder paste, copper foil, insulating layer, aluminum plate, and thermal grease, before it can be conducted to the heat dissipation aluminum component. This results in high thermal resistance and low thermal conductivity. The thermal conductivity of the thermal grease is only 2.0 W / mK, and its application thickness, uniformity, and contact area all affect the heat dissipation effect. Furthermore, the heat generated during equipment operation can cause the thermal grease to age, evaporate, and harden, reducing heat transfer efficiency and affecting the continuous operational stability of the equipment. In addition, the traditional structure also has the problems of large equipment size, heavy weight, and inconvenient assembly.

[0004] Therefore, a heat dissipation circuit board made of ultra-high thermal conductivity material for mining machines is proposed. This reduces the aluminum plate layer and thermal grease layer on the aluminum substrate, shortens the heat conduction channel, and allows the heat from the chip to be conducted to the heat sink more quickly and efficiently, thereby improving the service life of the equipment and making assembly faster and more convenient. Utility Model Content

[0005] To overcome the problems of existing circuit boards, such as difficulty in shortening the heat conduction path, inability to improve heat dissipation efficiency, large size, and inconvenient assembly, a heat dissipation circuit board made of ultra-high thermal conductivity material for mining machines is proposed.

[0006] The technical solution of this utility model is as follows: a heat dissipation circuit board made of ultra-high thermal conductivity material for mining machines, including a heat dissipation plate; a high thermal conductivity insulating layer is fixedly connected to the upper end of the heat dissipation plate, a circuit copper foil board is fixedly connected to the upper end of the high thermal conductivity insulating layer, a solder paste board is fixedly connected to the upper end of the circuit copper foil board, a plurality of chips are fixedly connected to the upper end of the solder paste board, a uniformly distributed heat dissipation block is fixedly connected to the lower end of the heat dissipation plate, a uniformly distributed first heat dissipation hole is opened through one side of the heat dissipation plate, a first heat conduction pillar is fixedly connected to the inner wall of the first heat dissipation hole, a second heat dissipation hole is opened through one side of the heat dissipation block, a second heat conduction pillar is fixedly connected to the inner wall of the second heat dissipation hole, a mounting groove is opened through the left end of the heat dissipation block, a cross block is slidably provided on the inner wall of the plurality of mounting grooves, and a locking mechanism is provided on the cross block and the heat dissipation plate.

[0007] Preferably, the locking mechanism includes a first screw hole, a second screw hole, and a threaded post; the lower end of the cross block has two first screw holes, the lower end of the heat sink has two second screw holes, and the inner walls of the second screw holes and the first screw holes are threaded together with a threaded post.

[0008] Preferably, a third heat dissipation hole with an evenly distributed diameter is provided through the lower part of one side of the cross block.

[0009] Preferably, a second heat dissipation hole is provided through the lower part of one side of the heat dissipation block, and a second heat-conducting column is fixed to the inner wall of the second heat dissipation hole. The second heat dissipation hole and the third heat dissipation hole are distributed alternately.

[0010] Preferably, the lower end of the cross block is flush with the lower end of the heat sink.

[0011] Preferably, the left and right ends of the cross block are located outside the heat sink, and the left and right ends of the cross block are flush with the left and right ends of the heat sink, respectively.

[0012] Preferably, the sidewalls of the heat sink, the high thermal conductivity insulation layer, and the circuit copper foil are flush.

[0013] The beneficial effects of this utility model are as follows: By eliminating the aluminum plate layer and thermal grease layer of the traditional aluminum substrate, and using a high thermal conductivity insulating layer to directly bond the heat sink and the circuit copper foil board, the heat conduction path from the chip to the heat sink is significantly shortened, completely solving the problem of heat dissipation attenuation caused by aging and uneven application of thermal grease. The heat conduction efficiency is greatly improved. Structurally, the independent aluminum plate layer and thermal grease layer are eliminated, the circuit board is reduced in size, and it meets the high-density deployment requirements of mining machines. Multiple circuit boards can be installed in a standard mining machine cabinet. The cross block can be pushed in along the mounting slot and installed in the first and second screw holes through the threaded post, realizing three-point locking, which greatly reduces the operation and maintenance cost of the mining farm. The array-type heat sink on the bottom surface of the heat sink, together with the first and second heat conduction pillars, can increase the heat diffusion area, solving the problems of existing circuit boards that are difficult to shorten the heat conduction path, cannot improve heat dissipation efficiency, and are large in size and inconvenient to assemble. Attached Figure Description

[0014] Figure 1 The diagram shows a three-dimensional structural schematic of a heat dissipation circuit board made of ultra-high thermal conductivity material for mining machines according to this utility model.

[0015] Figure 2 The diagram shows a three-dimensional structural schematic of a heat sink for a high thermal conductivity material heat dissipation circuit board used in mining machines according to this utility model.

[0016] Figure 3 The diagram shows a three-dimensional disassembled structure of the heat sink block and cross block of a heat dissipation circuit board made of ultra-high thermal conductivity material for mining machines according to this utility model.

[0017] Figure 4 The diagram shows a three-dimensional structural schematic of a locking mechanism for a heat dissipation circuit board made of ultra-high thermal conductivity material used in mining machines, according to this utility model.

[0018] The labels in the attached diagram are as follows: 1. Heat sink; 2. High thermal conductivity insulation layer; 3. Circuit copper foil board; 4. Solder paste board; 5. Chip; 6. Heat sink block; 7. First heat dissipation hole; 8. First heat conduction pillar; 9. Second heat dissipation hole; 10. Second heat conduction pillar; 11. Mounting slot; 12. Cross block; 13. Third heat dissipation hole; 14. First screw hole; 15. Second screw hole; 16. Threaded post. Detailed Implementation

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Example 1: Please refer to Figures 1-4 A heat dissipation circuit board made of ultra-high thermal conductivity material for mining machines includes a heat dissipation plate 1; a high thermal conductivity insulating layer 2 is fixedly connected to the upper end of the heat dissipation plate 1, a circuit copper foil board 3 is fixedly connected to the upper end of the high thermal conductivity insulating layer 2, a solder paste board 4 is fixedly connected to the upper end of the circuit copper foil board 3, a plurality of chips 5 are fixedly connected to the upper end of the solder paste board 4, a uniformly distributed heat dissipation block 6 is fixedly connected to the lower end of the heat dissipation plate 1, a uniformly distributed first heat dissipation hole 7 is opened through one side of the heat dissipation plate 1, a first heat conduction pillar 8 is fixedly connected to the inner wall of the first heat dissipation hole 7, a second heat dissipation hole 9 is opened through one side of the heat dissipation block 6, a second heat conduction pillar 10 is fixedly connected to the inner wall of the second heat dissipation hole 9, a mounting groove 11 is opened through the left end of the heat dissipation block 6, a cross block 12 is slidably provided on the inner wall of the plurality of mounting grooves 11, and a locking mechanism is provided on the cross block 12 and the heat dissipation plate 1.

[0021] In use, the cross block 12 is placed on the inner wall of multiple mounting slots 11, and then the cross block 12 is locked onto the heat sink 1 using the locking mechanism. This can fix the cross block 12 and the heat sink 6 together. By reducing the aluminum plate layer and thermal grease layer of the aluminum substrate, the heat conduction channel is shortened, which improves the heat dissipation effect. The array heat sink 6 is fixed to the lower end of the heat sink 1. Together with the first heat conduction column 8 and the second heat conduction column 10, the heat diffusion area is increased, the heat radiation capability of the heat sink 1 to the air is enhanced, and local heat accumulation is avoided.

[0022] Please see Figure 1 and Figure 3 In this embodiment, a third heat dissipation hole 13 is evenly distributed through the lower part of one side of the cross block 12. The inner diameter of the third heat dissipation hole 13 is one millimeter. The micro-hole design of the third heat dissipation hole 13 further optimizes the air flow path and enhances the heat exchange efficiency between the heat dissipation block 6 and the external environment.

[0023] Please see Figure 1 and Figure 2In this embodiment, a second heat dissipation hole 9 is provided through the lower part of one side of the heat dissipation block 6. A second heat conduction column 10 is fixed to the inner wall of the second heat dissipation hole 9. The second heat dissipation hole 9 and the third heat dissipation hole 13 are distributed alternately. The combined design of the second heat dissipation hole 9 and the second heat conduction column 10 increases the surface area of ​​the heat dissipation block 6 and improves the overall heat dissipation capacity of the heat dissipation plate 1.

[0024] Please see Figure 1 and Figure 3 In this embodiment, the lower end of the cross block 12 is flush with the lower end of the heat sink 6. The flushness between the lower ends of the cross block 12 and the heat sink 6 ensures structural stability and avoids installation interference or airflow disturbance caused by protrusion.

[0025] Please see Figure 1 and Figure 3 In this embodiment, the left and right ends of the cross block 12 are located outside the heat sink 6. The left and right ends of the cross block 12 are flush with the left and right ends of the heat sink 1, respectively. The cross block 12 extends to the edge of the heat sink 1, which facilitates the operation of the locking mechanism and maintains the overall structural compactness.

[0026] Please see Figure 1 and Figure 2 In this embodiment, the sidewalls of the heat sink 1, the high thermal conductivity insulation layer 2, and the circuit copper foil plate 3 are flush. Aligning the sidewalls of the heat sink 1, the high thermal conductivity insulation layer 2, and the circuit copper foil plate 3 reduces interlayer thermal resistance and ensures that heat is efficiently transferred to the heat sink 6.

[0027] Example 2: Please refer to Figure 4 Based on Embodiment 1, this application provides a technical solution: the locking mechanism includes a first screw hole 14, a second screw hole 15, and a threaded post 16; the lower end of the cross block 12 has two first screw holes 14 through it, and the lower end of the heat sink 1 has two second screw holes 15 through it. The inner walls of the second screw holes 15 and the first screw holes 14 are threaded together with the threaded post 16. The threaded post 16 is threadedly installed on the inner walls of the first screw holes 14 and the second screw holes 15 to achieve three-point mechanical locking, which greatly improves the connection stability between the cross block 12 and the heat sink 6 and reduces the loosening of the cross block 12 on the circuit board caused by the vibration of the mining machine.

[0028] Working principle: When in use, first slide the cross block 12 horizontally into the inner wall of the multiple mounting slots 11 on the left end of the heat sink 6, so that the lower end of the cross block 12 is flush with the lower end of the heat sink 6, and the left and right ends of the cross block 12 extend beyond the heat sink 6 and are aligned with the edge of the heat sink 1. At this time, the third heat dissipation hole 13 of the cross block 12 and the second heat dissipation hole 9 of the heat sink 6 form a staggered ventilation channel. Then, screw the threaded post 16 into the first screw hole 14 on the bottom surface of the cross block 12 and the second screw hole 15 on the bottom surface of the heat sink 1 in sequence, and fix the cross block 12 and the heat sink 1 rigidly by locking the three-point thread.

[0029] At this time, the structure of the cross block 12 embedded in the mounting slot 11 restricts the lateral displacement of the heat sink 6;

[0030] When chip 5 generates heat during operation, the heat is conducted through solder paste board 4 to circuit copper foil board 3, and then vertically introduced into heat sink 1 through high thermal conductivity insulation layer 2. The heat is then diffused to the surroundings by heat sink blocks 6 distributed in an array on the bottom surface of heat sink 1 through second heat conduction pillar 10. At the same time, first heat conduction pillar 8 exhausts the hot air in the first heat dissipation hole 7 on the side of heat sink 1. The micro-hole array of the third heat dissipation hole 13 of cross block 12 guides the airflow to penetrate the gap of heat sink block 6 laterally, forming a three-dimensional heat dissipation channel.

[0031] Because the heat sink 1, the high thermal conductivity insulation layer 2, and the copper foil board 3 are completely aligned, the interlayer thermal resistance is eliminated. Combined with the structural design of the heat sink 6 and the lower end of the cross block 12 being flush, installation interference is avoided and airflow disturbance is reduced. Ultimately, the heat of the chip 5 is efficiently dissipated. Compared with the traditional aluminum substrate + silicone grease solution, the heat conduction distance is shortened, which reduces the junction temperature of the chip 5 when the miner is running continuously. At the same time, the mechanical locking of the threaded post 16 effectively resists the structural loosening caused by the high frequency vibration of the miner.

Claims

1. A heat dissipation circuit board made of ultra-high thermal conductivity material for mining machines, comprising a heat sink (1); characterized in that: A high thermal conductivity insulating layer (2) is fixed to the upper end of the heat sink (1), a circuit copper foil board (3) is fixed to the upper end of the high thermal conductivity insulating layer (2), a solder paste board (4) is fixed to the upper end of the circuit copper foil board (3), and multiple chips (5) are fixed to the upper end of the solder paste board (4). A uniformly distributed heat sink block (6) is fixed to the lower end of the heat sink (1). A uniformly distributed first heat dissipation hole (7) is opened through one side of the heat sink (1), and a first heat conduction pillar (8) is fixed to the inner wall of the first heat dissipation hole (7). A second heat dissipation hole (9) is opened through one side of the heat sink block (6), and a second heat conduction pillar (10) is fixed to the inner wall of the second heat dissipation hole (9). A mounting groove is opened through the left end of the heat sink block (6). (11) A cross block (12) is slidably provided on the inner wall of multiple mounting slots (11). A locking mechanism is provided on the cross block (12) and the heat sink (1). The locking mechanism includes a first screw hole (14), a second screw hole (15) and a threaded post (16). Two first screw holes (14) are opened through the lower end of the cross block (12), and two second screw holes (15) are opened through the lower end of the heat sink (1). The inner wall of the second screw hole (15) and the first screw hole (14) are threaded together with a threaded post (16). The feature is that a third heat dissipation hole (13) is evenly distributed through the lower part of one side of the cross block (12). The inner diameter of the third heat dissipation hole (13) is one millimeter.

2. The heat dissipation circuit board made of ultra-high thermal conductivity material for mining machines according to claim 1, characterized in that: A second heat dissipation hole (9) is provided through the lower part of one side of the heat dissipation block (6). A second heat conduction column (10) is fixed to the inner wall of the second heat dissipation hole (9). The second heat dissipation hole (9) and the third heat dissipation hole (13) are distributed alternately.

3. The heat dissipation circuit board made of ultra-high thermal conductivity material for mining machines according to claim 1, characterized in that: The lower end of the cross block (12) is flush with the lower end of the heat sink (6).

4. A heat dissipation circuit board made of ultra-high thermal conductivity material for mining machines according to claim 1, characterized in that: The left and right ends of the cross block (12) are located outside the heat sink (6), and the left and right ends of the cross block (12) are flush with the left and right ends of the heat sink (1).

5. A heat dissipation circuit board made of ultra-high thermal conductivity material for mining machines according to claim 1, characterized in that: The sidewalls of the heat sink (1), the high thermal conductivity insulation layer (2), and the circuit copper foil plate (3) are flush.

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