Printed circuit board (PCB) with high voltage resistance

Abstract

The utility model provides a PCB circuit board with high pressure resistance, comprising a substrate and pins, the edge of the substrate is fixedly connected with a plurality of pins, the top surface of the substrate is provided with a chip, the top surface of the substrate is provided with a plurality of elements, and the top surface of the substrate is attached with a reinforcing layer. The utility model has the advantages that the plastic reinforcing frame is adhered to the surface of the reinforcing layer, the reinforcing frame is enclosed in a square shape, the axillary plates are fixedly connected to the corners of the inner side of the reinforcing frame, the inner frame is fixedly connected to the midpoint of the inner side of the reinforcing frame, and the plurality of fixing claws are fixedly connected to the inner side and the outer side of the reinforcing frame. The fixing claws are also fixedly connected to the surface of the reinforcing layer, the axillary plate and the inner frame improve the rigidity of the reinforcing frame, stress on the circuit board can be uniformly dispersed through the design of the reinforcing frame, and the overall stability of the circuit board is improved. The design of the fixing claws effectively improves the connection area of the reinforcing frame and the reinforcing layer, and the rigidity of the PCB is effectively improved, thereby effectively improving the pressure resistance of the PCB.

Description

Technical Field

[0001] This utility model relates to the field of PCB circuit board technology, and in particular to a PCB circuit board with high voltage resistance. Background Technology

[0002] A PCB (Printed Circuit Board) is a board that forms electrical connections between electronic components by laying patterned conductive copper foil on the surface of an insulating material (such as fiberglass, epoxy resin, etc.). Its main function is to achieve electrical connections between electronic components through these copper foil lines and to support and fix the components on the board.

[0003] Conventional PCB circuit boards generally have poor voltage resistance because they lack reinforced structures. During installation, a certain force needs to be applied to the board, and poor voltage resistance can lead to cracking or bending deformation. Therefore, a PCB circuit board with high voltage resistance is proposed to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this utility model is to provide a PCB circuit board with high voltage resistance to solve the problems mentioned in the background art and overcome the shortcomings of the prior art.

[0006] To achieve the above objectives, one embodiment of the present invention provides a PCB circuit board with high voltage resistance, including a substrate and pins. Several pins are fixedly connected to the edge of the substrate, a chip is mounted on the top surface of the substrate, and several components are mounted on the top surface of the substrate.

[0007] A reinforcing layer is attached to the top surface of the substrate, and a reinforcing frame is fixedly connected to the surface of the reinforcing layer. The reinforcing frame is U-shaped.

[0008] A side plate is fixedly connected to the inner corner of the reinforcing frame, and an inner frame is fixedly connected to the midpoint of the inner side of the reinforcing frame.

[0009] Several fixing claws are fixedly connected to the inner and outer sides of the reinforcement frame, and the fixing claws are also fixedly connected to the surface of the reinforcement layer.

[0010] Preferably, in any of the above embodiments, the substrate is made of copper and the pins are arranged vertically.

[0011] The above technical solution is adopted: the PCB board is installed and connected by direct insertion of pins.

[0012] Preferably, in any of the above embodiments, the reinforcing layer is made of epoxy resin, and the reinforcing layer is laminated or coated to the surface of the substrate.

[0013] The above technical solution involves soldering the component's leads to solder joints on the substrate. A reinforcing layer is fixedly connected to the substrate surface, except at the component mounting locations. This reinforcing layer is laminated or coated onto the substrate surface.

[0014] The core structure of this PCB circuit board consists of: a reinforcing layer, a reinforcing bracket, a side armhole plate, an inner frame, and fixing claws. The core advantages of this PCB circuit board are: laminating or coating an epoxy resin reinforcing layer on the substrate surface increases the overall thickness and strength of the circuit board, improving its bending and impact resistance. Then, a plastic reinforcing bracket, shaped like a U-shape, is bonded to the surface of the reinforcing layer. Side armhole plates are fixedly connected to the inner corners of the reinforcing bracket, and an inner frame is fixedly connected to the midpoint of the inner side of the reinforcing bracket. Several fixing claws are fixedly connected to both the inner and outer sides of the reinforcing bracket, and these claws are also fixed to the surface of the reinforcing layer. The side armhole plate and inner frame increase the rigidity of the reinforcing bracket, and the design of the reinforcing bracket evenly distributes stress on the circuit board, improving its overall stability. The design of the fixing claws effectively increases the connection area between the reinforcing bracket and the reinforcing layer, effectively improving the rigidity of the PCB circuit board and thus its voltage withstand performance.

[0015] Preferably, as described in any of the above embodiments, the reinforcing frame is made of plastic and is located around most of the components.

[0016] Preferably, in any of the above embodiments, the reinforcing frame is bonded to the surface of the reinforcing layer, and the armpit plate is thermally fused to the reinforcing frame.

[0017] Preferably, in any of the above embodiments, the inner frame is perpendicular to the edge of the reinforcing frame, the fixing claw is thermally fused to the reinforcing frame, and the fixing claw is bonded to the surface of the reinforcing layer.

[0018] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:

[0019] This high-voltage-resistance PCB utilizes a combination of a reinforcing layer, a reinforcing frame, armpit plates, an inner frame, and fixing claws. An epoxy resin reinforcing layer is laminated or coated onto the substrate surface, increasing the overall thickness and strength of the PCB and improving its bending and impact resistance. A plastic reinforcing frame, shaped like a U-shape, is then bonded to the reinforcing layer. Armpit plates are fixedly connected to the inner corners of the reinforcing frame, and an inner frame is fixedly connected to its midpoint. Several fixing claws are fixedly connected to both the inner and outer sides of the reinforcing frame, also fixed to the reinforcing layer surface. The armpit plates and inner frame enhance the rigidity of the reinforcing frame, and its design evenly distributes stress on the PCB, improving its overall stability. The fixing claws effectively increase the connection area between the reinforcing frame and the reinforcing layer, significantly improving the PCB's rigidity and thus its voltage resistance.

[0020] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0021] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0022] Figure 1 This is a first-view structural schematic diagram of the present invention;

[0023] Figure 2 This is a structural schematic diagram of the present invention from a second perspective;

[0024] Figure 3 This is a schematic diagram of the structure of the substrate of this utility model.

[0025] In the diagram: 1-substrate, 2-pin, 3-chip, 4-component, 5-reinforcement layer, 6-reinforcement frame, 7-armpit plate, 8-inner frame, 9-fixing claw. Detailed Implementation

[0026] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0027] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0028] like Figure 1-3 As shown, this high voltage-resistant PCB circuit board includes a substrate 1 and pins 2. Several pins 2 are fixedly connected to the edge of the substrate 1. A chip 3 is mounted on the top surface of the substrate 1. Several components 4 are mounted on the top surface of the substrate 1.

[0029] A reinforcing layer 5 is attached to the top surface of the substrate 1, and a reinforcing frame 6 is fixedly connected to the surface of the reinforcing layer 5. The reinforcing frame 6 is in the shape of a square.

[0030] A side plate 7 is fixedly connected to the inner corner of the reinforcing frame 6, and an inner frame 8 is fixedly connected to the midpoint of the inner side of the reinforcing frame 6.

[0031] Several fixing claws 9 are fixedly connected to the inner and outer sides of the reinforcing frame 6, and the fixing claws 9 are also fixedly connected to the surface of the reinforcing layer 5.

[0032] Example 1: The substrate 1 is made of copper, and the pins 2 are vertically oriented. This PCB board is directly connected via the pins 2. The reinforcing layer 5 is made of epoxy resin and is laminated or coated onto the surface of the substrate 1. The leads of component 4 are soldered to solder joints on the substrate 1. A reinforcing layer 5 is fixedly connected to the surface of the substrate 1 except at the location where component 4 is mounted; the reinforcing layer 5 is laminated or coated onto the surface of the substrate 1.

[0033] Example 2: The reinforcing frame 6 is made of plastic and is located around most of the components 4. The reinforcing frame 6 is bonded to the surface of the reinforcing layer 5, and the armpit plate 7 is heat-fused to the reinforcing frame 6. The inner frame 8 is perpendicular to the edge of the reinforcing frame 6, and the fixing claw 9 is heat-fused to the reinforcing frame 6 and bonded to the surface of the reinforcing layer 5.

[0034] The working principle of this utility model is as follows:

[0035] This PCB circuit board has the following components: bottom layer: copper substrate 1, middle layer: reinforcing layer 5, top layer: reinforcing frame 6, armpit plate 7, inner frame 8, and fixing claw 9.

[0036] The PCB board is directly connected via pin 2 for mounting, and the pins of component 4 are soldered to the solder joints on the substrate 1. A reinforcing layer 5 is fixedly connected to the surface of the substrate 1 except at the location where component 4 is mounted. The reinforcing layer 5 is laminated or coated on the surface of the substrate 1. A plastic reinforcing frame 6 is bonded to the surface of the reinforcing layer 5. The reinforcing frame 6 is U-shaped and encloses the substrate. A side armhole plate 7 is fixedly connected to the inner corner of the reinforcing frame 6. An inner frame 8 is fixedly connected to the midpoint of the inner side of the reinforcing frame 6. Several fixing claws 9 are fixedly connected to the inner and outer sides of the reinforcing frame 6.

[0037] Compared with the prior art, the present invention has the following advantages:

[0038] This high-voltage-resistant PCB circuit board utilizes a combination of a reinforcing layer 5, a reinforcing frame 6, a side armpit plate 7, an inner frame 8, and fixing claws 9. An epoxy resin reinforcing layer 5 is laminated or coated onto the surface of the substrate 1, increasing the overall thickness and strength of the circuit board and improving its bending and impact resistance. A plastic reinforcing frame 6, shaped like a U-shape, is then bonded to the surface of the reinforcing layer 5. Side armpit plates 7 are fixedly connected to the inner corners of the reinforcing frame 6, and an inner frame 8 is fixedly connected to the midpoint of the inner side of the reinforcing frame 6. Several fixing claws 9 are fixedly connected to the inner and outer sides of the reinforcing frame 6, also fixed to the surface of the reinforcing layer 5. The side armpit plate 7 and the inner frame 8 increase the rigidity of the reinforcing frame 6. The design of the reinforcing frame 6 evenly distributes stress on the circuit board, improving its overall stability. The design of the fixing claws 9 effectively increases the connection area between the reinforcing frame 6 and the reinforcing layer 5, effectively improving the rigidity of the PCB circuit board and thus its voltage resistance.

Claims

1. A PCB circuit board with high voltage resistance, characterized in that, Includes a substrate (1) and pins (2). Several pins (2) are fixedly connected to the edge of the substrate (1). A chip (3) is mounted on the top surface of the substrate (1). Several components (4) are mounted on the top surface of the substrate (1). A reinforcing layer (5) is attached to the top surface of the substrate (1), and a reinforcing frame (6) is fixedly connected to the surface of the reinforcing layer (5). The reinforcing frame (6) is in the shape of a square. A shank plate (7) is fixedly connected to the corner of the inner side of the reinforcing frame (6), and an inner frame (8) is fixedly connected to the midpoint of the inner side of the reinforcing frame (6). The inner and outer sides of the reinforcing frame (6) are fixedly connected with several fixing claws (9), which are also fixedly connected to the surface of the reinforcing layer (5).

2. The high voltage withstand performance PCB circuit board as described in claim 1, characterized in that: The substrate (1) is made of copper, and the pins (2) are arranged vertically.

3. The PCB circuit board with high voltage resistance as described in claim 2, characterized in that: The reinforcing layer (5) is made of epoxy resin, and the reinforcing layer (5) is laminated or coated to the surface of the substrate (1).

4. The high voltage withstand performance PCB circuit board as described in claim 3, characterized in that: The reinforcing frame (6) is made of plastic and is located around most of the components (4).

5. A high-voltage-resistance PCB circuit board as described in claim 4, characterized in that: The reinforcing frame (6) is bonded to the surface of the reinforcing layer (5), and the armpit plate (7) is heat-fused to the reinforcing frame (6).

6. A high-voltage-resistance PCB circuit board as described in claim 5, characterized in that: The inner frame (8) is perpendicular to the edge of the reinforcing frame (6), the fixing claw (9) is heat-fused to the reinforcing frame (6), and the fixing claw (9) is bonded to the surface of the reinforcing layer (5).

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