Protector and electronic equipment

Abstract

The utility model relates to a protector and electronic equipment, and the protector is used for achieving the protection of a circuit element, and comprises a contact part which is used for making contact with the circuit element in a first direction; the grounding part is used for grounding the contact part; a connection portion connected between the contact portion and the ground portion; in the first direction, at least part of the contact part is located between the connecting part and the grounding part. According to the protector, the contact part making contact with the circuit element in the first direction and the grounding part making the contact part connected with the ground are arranged, the contact part and the grounding part are connected through the connecting part, a path for releasing static electricity is provided, interference of a static radiation field to the circuit element is reduced, and the shielding effect on the circuit element is achieved; meanwhile, at least part of the contact part is arranged between the connecting part and the grounding part in the first direction, so that the connecting part can bypass the side space of the protector to be connected with the grounding part, and occupation of the side space of the circuit element is reduced.

Description

Technical Field

[0001] This application relates to the field of electrostatic discharge protection technology, and more particularly to a protective device and electronic equipment. Background Technology

[0002] Currently, with the development of miniaturization and high integration in the circuit board (PCB) field, more functional modules and higher density circuit components are integrated in a limited space. However, the impact of electrostatic radiation fields is also constantly intensifying. Some circuit components (such as crystal oscillators) are easily interfered with by electrostatic radiation fields, leading to a decrease in the stability and reliability of circuit components.

[0003] Since other circuit components or solder joints are usually located near circuit components, it is not suitable to install electrostatic discharge protection structures in the side space of circuit components, and no reasonable solution is provided in related technologies. Utility Model Content

[0004] This application provides a protector to at least partially solve the above-mentioned technical problems.

[0005] To achieve the above objectives, according to a first aspect of this application, a protector is provided for electrostatic discharge (ESD) protection of circuit components, comprising:

[0006] Contact portion, used to contact the circuit element in a first direction;

[0007] A grounding part is used to connect the contact part to the ground.

[0008] A connecting portion is connected between the contact portion and the grounding portion;

[0009] In the first direction, at least a portion of the contact portion is located between the connecting portion and the grounding portion.

[0010] Optionally, in some embodiments of this application, the contact portion and the connecting portion at least partially overlap in a second direction;

[0011] The second direction intersects with the first direction.

[0012] Optionally, in some embodiments of this application, the connecting portion includes:

[0013] The first extension section at least partially overlaps with the grounding portion in a first direction;

[0014] The second extension is connected between the first extension and the grounding portion;

[0015] The first extension segment and the second extension segment have different extension directions.

[0016] Optionally, in some embodiments of this application, the second extension is inclined relative to the grounding portion, and the second extension has a first angle with the grounding portion, the first angle being in the range of 60° to 80°.

[0017] Optionally, in some embodiments of this application, the connecting portion further includes:

[0018] A transition section connects the second extension section and the grounding portion;

[0019] The transition section and the second extension section are connected smoothly, and the transition section and the grounding part are connected smoothly.

[0020] Optionally, in some embodiments of this application, the contact portion has a contact surface, which includes at least one curved surface.

[0021] Optionally, in some embodiments of this application, the width of the contact portion ranges from 1.5 mm to 3 mm;

[0022] And / or,

[0023] The width of the grounding part ranges from 1.5mm to 3mm.

[0024] Optionally, in some embodiments of this application, the protector further includes:

[0025] A limiting part is used to limit the connecting part;

[0026] The limiting portion has a limiting space extending at least along the first direction, and at least a portion of the connecting portion is located in the limiting space.

[0027] Optionally, in some embodiments of this application, the limiting portion includes:

[0028] Two limiting structures are provided on opposite sides of the limiting space;

[0029] The connecting portion is at least partially disposed between the two limiting structures.

[0030] According to a second aspect of this application, an electronic device is provided, comprising:

[0031] The equipment casing has a force-applying structure;

[0032] The circuit board is located inside the housing of the device;

[0033] Circuit components are mounted onto the circuit board;

[0034] And the protective devices mentioned above;

[0035] The force-applying structure abuts against the connecting part of the protector so that the contact part of the protector remains in contact with the circuit element.

[0036] In the protector of this application embodiment, by providing a contact portion that contacts the circuit element along the first direction and a grounding portion that connects the contact portion to the ground, and the contact portion and the grounding portion are connected by a connecting portion, a path for releasing static electricity is provided, reducing the interference of the circuit element by the electrostatic radiation field, and achieving a shielding effect on the circuit element; at the same time, in the first direction, at least a portion of the contact portion is provided between the connecting portion and the grounding portion, which allows the connecting portion to bypass the side space of the protector and connect to the grounding portion, reducing the occupation of the side space of the circuit element.

[0037] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0040] Figure 1 This is a schematic diagram of the overall structure of the protector provided in an exemplary embodiment of this application;

[0041] Figure 2 This is a schematic diagram of the structure of the protector provided in an exemplary embodiment of this application;

[0042] Figure 3 This is a top view of the protector provided in an exemplary embodiment of this application;

[0043] Figure 4 This is a schematic diagram of the structure of the limiting part in the protector provided in an exemplary embodiment of this application;

[0044] Figure 5 This is a schematic diagram of the structure of the protector, circuit board and first housing in the electronic device provided in the exemplary embodiment of this application;

[0045] Figure 6 This is a schematic diagram of the structure of an electronic device provided in an exemplary embodiment of this application.

[0046] Explanation of reference numerals in the attached figures:

[0047] 100. Protective device;

[0048] 110. Contact part; 110a. Contact surface;

[0049] 111. Contact structure; 112. Connection structure;

[0050] 120. Grounding part;

[0051] 130. Connecting section; 131. First extension section; 132. Second extension section; 133. Transition section;

[0052] 140. Limiting part; 140a. Limiting space; 141. Limiting structure; 142. First connecting structure; 143. Second connecting structure;

[0053] 10. Electronic devices;

[0054] 210. Circuit element; 220. Circuit board; 230. Equipment housing; 231. First housing; 232. Second housing; 232a. Force-applying structure. Detailed Implementation

[0055] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0056] According to the first aspect of this application, referring to Figure 1 and Figure 2 This application provides a protector 100 for electrostatic protection of circuit element 210, including: a contact portion 110, a grounding portion 120 and a connecting portion 130.

[0057] A contact portion 110 is used to contact the circuit element 210 along a first direction, and a ground portion 120 is used to ground the contact portion 110; a connection portion 130 is connected between the contact portion 110 and the ground portion 120. In the first direction, at least a portion of the contact portion 110 is located between the connection portion 130 and the ground portion 120.

[0058] It should be noted that the first direction, indicating the up and down direction, is only for the convenience of introducing specific embodiments of this application. There is no absolute correspondence between the first direction and the up and down direction. Similarly, there is no absolute correspondence between the second direction and the left and right direction, and between the third direction and the front and back direction. Furthermore, the first direction, second direction, and third direction of this application are only used to express relative positional relationships; they only indicate approximate locations, not absolute geometric relationships.

[0059] It is understood that the grounding part 120 can be connected to the grounding electrode of the circuit board 220 to achieve grounding, and the connection part 130 extends at least from the grounding part 120 to the top of the circuit element 210 so that the contact part 110 contacts the circuit element 210 from the top of the circuit element 210 to achieve electrical connection between the connection part 130, the contact part 110 and the grounding part 120.

[0060] The contact portion 110 may include a contact structure 111 that directly contacts the circuit element 210 and a connecting structure 112 that connects to the connecting portion 130. Of course, the function of the connecting structure 112 can also be implemented by the connecting portion 130, that is, the connecting portion 130 can extend to connect with the contact structure 111.

[0061] By providing a contact portion 110 that contacts the circuit element 210 along the first direction and a ground portion 120 that connects the contact portion 110 to the ground, and connecting the contact portion 110 and the ground portion 120 through a connecting portion 130, a path for releasing static electricity is provided, reducing the interference of the circuit element 210 from the electrostatic radiation field and achieving a shielding effect on the circuit element 210. At the same time, in the first direction, at least a portion of the contact portion 110 is disposed between the connecting portion 130 and the ground portion 120, which allows the connecting portion 130 to bypass the side space of the protector 100 and connect to the ground portion 120, reducing the occupation of the side space of the circuit element 210.

[0062] Furthermore, due to the limited side space of circuit components 210 in the high-density design of circuit board 220, the structure of the protector 100 of this application can reduce the impact on the arrangement of other components in circuit board 220 while achieving electrostatic protection, thus reducing the layout difficulty of circuit board 220.

[0063] In some specific embodiments, the grounding portion 120 can be soldered to the circuit board 220. This soldering process can employ any soldering method well-known to those skilled in the art, as long as it achieves both physical and electrical connection between the grounding portion 120 and the circuit board 220. In the embodiments of this application, reflow soldering is used to perform the soldering operation.

[0064] In some specific embodiments, the grounding portion 120, the connecting portion 130, and the contact portion 110 of the protector 100 in this application embodiment can be integrally formed, for example, by bending a sheet made of a conductive material. Alternatively, the connecting portion 130 can be replaced with an independent conductor (e.g., a wire), which is welded to the grounding portion 120 and the contact portion 110 respectively.

[0065] In some specific embodiments, the conductive material may be beryllium copper (Be-Cu) material, and the surface of the protector 100 may be provided with a protective plating layer (e.g., tin plating) to slow down the oxidation of the protector 100.

[0066] In some embodiments of this application, reference is made to Figure 1 and Figure 2 The contact portion 110 and the connecting portion 130 at least partially overlap in a second direction. The second direction intersects the first direction.

[0067] It is understandable that on a projection plane perpendicular to the left and right directions, the projection of the contact part 110 on the projection plane and the projection of the connecting part 130 on the projection plane at least partially overlap. Such an arrangement is beneficial to the overall spatial arrangement of the protector 100.

[0068] In some specific embodiments, the contact portion 110 and the connecting portion 130 have the same width, which facilitates the processing and forming of the protector 100. This width can be understood as the dimension of the contact portion 110 and the connecting portion 130 in the front-back direction.

[0069] In some embodiments of this application, reference is made to Figure 1 and Figure 2 The width D1 of the contact portion 110 ranges from 1.5 mm to 3 mm. This width value ensures that the contact portion 110 and the circuit element 210 have sufficient contact surface area 110a while reducing the space occupied by the contact portion 110.

[0070] In some specific implementation methods, refer to Figure 3 The width D1 of the contact portion 110 ranges from 2 mm to 2.5 mm.

[0071] In some embodiments of this application, reference is made to Figure 3 The width D2 of the grounding portion 120 ranges from 1.5mm to 3mm. If the grounding portion 120 is too wide, it will occupy too much area of ​​the circuit board 220; if it is too narrow, the soldering reliability will be too low. This width value ensures soldering reliability while minimizing the area occupied.

[0072] In some specific embodiments, the width D2 of the grounding portion 120 ranges from 2 mm to 2.5 mm.

[0073] In some embodiments of this application, reference is made to Figure 1 and Figure 2 The connecting portion 130 includes a first extension 131 and a second extension 132. The first extension 131 at least partially overlaps with the grounding portion 120 in a first direction; the second extension 132 connects the first extension 131 and the grounding portion 120; the first extension 131 and the second extension 132 have different extending directions.

[0074] It is understood that the first extension 131 extends from the contact portion 110 to above the ground portion 120, so that while the second extension 132 is connected to the ground portion 120, it can maintain a suitable distance from the circuit element 210, so as to avoid the second extension 132 being too close to the circuit element 210 and interfering with the circuit element 210.

[0075] Meanwhile, since the first extension segment 131 and the second extension segment 132 have different extension directions, that is, the first extension segment 131 and the second extension segment 132 have a second included angle α, the first extension segment 131 and the second extension segment 132 as a whole have a certain deformation capability. When the connecting part 130 is subjected to external force, the first extension segment 131 can be bent relative to the second extension segment 132, that is, the second included angle is reduced, so that the contact part 110 contacts the circuit element 210.

[0076] In some specific embodiments, the distance H1 between the contact portion 110 and the connecting portion 130 in the first direction ranges from 1.4 mm to 2.1 mm. Of course, this distance can also be designed according to the height of the circuit element 210, so that the distance between the contact portion 110 and the connecting portion 130 in the first direction can be greater than the height of the circuit element 210. That is, when the connecting portion 130 is not subjected to external force, a suitable installation space is reserved between the contact portion 110 and the circuit board 220 to facilitate the soldering of the circuit element 210 and the circuit board 220. After the soldering of the circuit element 210 and the circuit board 220 is completed, a force is applied to the connecting portion 130 to achieve a soft overlap between the contact portion 110 and the circuit element 210, thus achieving a shielding effect.

[0077] In some other specific embodiments, no installation space may be reserved before soldering the circuit element 210 to the circuit board 220. That is, the distance between the contact portion 110 and the connecting portion 130 in the first direction may be less than or equal to the height of the circuit element 210. When installing the circuit element 210, the contact portion 110 can be lifted first to make room for the installation. After the circuit element 210 is soldered, the contact portion 110 can be released. At this time, no external force is required, and the contact portion 110 can maintain contact with the circuit element 210 by relying on the elasticity of the protector 100 itself.

[0078] In some specific embodiments, the connecting portion 130 and the grounding portion 120 have the same width, which facilitates the processing and forming of the protector 100. This width can be understood as the dimension of the grounding portion 120 and the connecting portion 130 in the front-back direction.

[0079] In some embodiments of this application, reference is made to Figure 2 The second extension segment 132 is inclined relative to the grounding portion 120, and the second extension segment 132 and the grounding portion 120 have a first included angle β, the value of the first included angle β being between 60° and 80°.

[0080] By adopting this scheme, the overall elasticity of the protector 100 is further improved by setting the first included angle between the second extension section 132 and the grounding part 120, and the soft connection effect between the contact part 110 and the circuit element 210 is improved.

[0081] In some specific implementation methods, refer to Figure 5 When the connecting part 130 is not subjected to external force, the first included angle β ranges from 70° to 75°. However, when subjected to external force, refer to... Figure 6 The reduction of the first included angle causes the contact portion 110 to move closer to and make contact with the circuit element 210.

[0082] In some embodiments of this application, reference is made to Figure 1 and Figure 2 The connecting portion 130 further includes a transition section 133. The transition section 133 is connected between the second extension section 132 and the grounding portion 120; the connection between the transition section 133 and the second extension section 132 is smoothly disposed, and the connection between the transition section 133 and the grounding portion 120 is also smoothly disposed.

[0083] By setting the transition section 133, the second extension section 132 can smoothly transition to the grounding part 120, reducing the stress concentration between the second extension section 132 and the grounding part 120.

[0084] In some specific embodiments, at least a portion of the transition section is configured as a curved structure.

[0085] In some embodiments of this application, reference is made to Figure 1 and Figure 2 The contact portion 110 has a contact surface 110a, which includes at least one curved surface.

[0086] It is understood that by having at least one curved surface, the contact portion 110 has a certain deformation capability, thereby achieving flexible contact between the contact portion 110 and the circuit element 210 and avoiding damage to the circuit element 210 due to pressure between the contact portion 110 and the circuit element 210.

[0087] In some specific embodiments, the contact structure 111 of the contact portion 110 includes at least one curved surface, and the connecting structure 112 of the contact portion 110 includes at least one curved surface, such that the contact portion 110 as a whole constitutes a hook-shaped structure.

[0088] In some embodiments of this application, reference is made to Figure 1 and Figure 2 The overall dimension D3 of the protector 100 in the left-right direction is 4mm to 6mm. The overall dimension H2 of the protector 100 in the up-down direction is 3.2mm to 4.8mm. Of course, the dimensions of the protector 100 can also be adjusted according to the dimensions of the circuit component 210 being protected.

[0089] In some embodiments of this application, reference is made to Figure 1 , Figure 2 and Figure 4 The protector 100 further includes a limiting portion 140. The limiting portion 140 is used to limit the connecting portion 130; the limiting portion 140 has a limiting space 140a extending at least along the first direction, and at least a portion of the connecting portion 130 is located in the limiting space 140a.

[0090] It is understood that the limiting part 140 can be fixedly connected to the circuit board 220, or it can be fixedly connected to the device housing 230 of the electronic device 10.

[0091] By adopting this scheme, the movement of the connecting part 130 is limited to the limiting space 140a through the setting of the limiting part 140, so as to prevent the connecting part 130 from being laterally displaced in the front-back direction when subjected to external force, thereby improving the reliability of the protector 100.

[0092] In some embodiments of this application, reference is made to Figure 4 The limiting part 140 includes two limiting structures 141.

[0093] Two limiting structures 141 are disposed on opposite sides of the limiting space 140a. At least a portion of the connecting portion 130 is disposed between the two limiting structures 141. Such limiting structures 141 are easy to manufacture and have low cost.

[0094] It is understood that the two limiting structures 141 are arranged parallel to each other and extend in the vertical direction respectively, and the distance between the two limiting structures 141 in the front-back direction is greater than or equal to the width of the connecting part 130.

[0095] In some specific embodiments, two limiting structures 141 are disposed on both sides of the first extension 131, thereby improving the stability of the contact portion 110.

[0096] In some embodiments of this application, reference is made to Figure 1 and Figure 4 The limiting part 140 further includes a first connecting structure 142. The first connecting structure 142 is used to connect with the circuit board 220, and the first connecting structure 142 is respectively connected to the ends of the two limiting structures 141 near the circuit board 220, so that the two limiting structures 141 form a whole. The provision of the first connecting structure 142 facilitates the installation of the limiting part 140 onto the circuit board 220.

[0097] In some embodiments of this application, reference is made to Figure 1 and Figure 4 The limiting part 140 also includes a second connecting structure 143, which is connected to the ends of the two limiting structures 141 away from the circuit board 220. That is, the first connecting structure 142, the second connecting structure 143, and the two limiting structures 141 are connected in a ring to form the aforementioned limiting space 140a. The stability of the limiting structure 141 is improved by the provision of the second connecting structure 143.

[0098] In some embodiments of this application, the limiting part 140 may be a separate component from the connecting part 130, and the two may be soldered to the circuit board 220 respectively; of course, the limiting part 140 and the connecting part 130 may also be integrally formed.

[0099] In some embodiments of this application, the thickness of the entire assembly consisting of the contact portion 110, the connecting portion 130, and the grounding portion 120 ranges from 0.08 mm to 0.1 mm. The thickness of the limiting portion 140 ranges from 0.08 mm to 0.1 mm.

[0100] According to the second aspect of this application, referring to Figure 5 and Figure 6 An electronic device 10 is provided, which includes: a device housing 230, a circuit board 220, circuit elements 210, and a protector 100 as described above.

[0101] The device housing 230 has a force-applying structure 232a, which may be a protrusion formed on the inner wall of the device housing 230. The circuit board 220 is disposed inside the device housing, and the circuit element 210 is mounted to the circuit board 220. The force-applying structure 232a abuts against the connecting portion 130 of the protector 100 so that the contact portion 110 of the protector 100 remains in contact with the circuit element 210.

[0102] By adopting this solution, the force is applied to the connection part 130 by the force-applying structure 232a on the device housing 230, so that the contact part 110 maintains a soft contact with the circuit element 210, thereby achieving a shielding effect on the circuit element 210 (e.g., crystal oscillator). In this way, the housing of the circuit element 210 can be made of a low-cost plastic housing.

[0103] For wireless products, since the onboard antenna needs to be close to the edge of the circuit board 220, the crystal oscillator will inevitably be close to the edge of the circuit board 220 and is susceptible to electrostatic interference. The electrostatic protection of the crystal oscillator by the protector 100 of this application enhances the electrostatic immunity performance of the crystal oscillator when it is close to the edge of the board.

[0104] In some specific implementation methods, refer to Figure 6 The device housing 230 includes a first housing 231 and a second housing 232. The circuit board 220 is mounted to the first housing 231, and the force-applying structure 232a is formed in the second housing 232. When the first housing 231 and the second housing 232 are installed and fixed, the force-applying structure 232a can be aligned with the connecting part 130 and apply force.

[0105] In some other embodiments of this application, a portion of the connecting part 130 can be directly installed to the second housing 232, and while the first housing 231 and the second housing 232 are installed and fixed, the contact part 110 is brought close to and in contact with the circuit element 210.

[0106] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0107] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0108] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0109] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A protector for electrostatic discharge protection of circuit components, characterized in that, include: Contact portion, used to contact the circuit element in a first direction; A grounding part is used to connect the contact part to the ground. A connecting portion is connected between the contact portion and the grounding portion; In the first direction, at least a portion of the contact portion is located between the connecting portion and the grounding portion.

2. The protector according to claim 1, characterized in that, The contact portion and the connecting portion at least partially overlap in the second direction; The second direction intersects with the first direction.

3. The protector according to claim 1, characterized in that, The connecting part includes: The first extension section at least partially overlaps with the grounding portion in a first direction; The second extension is connected between the first extension and the grounding portion; The first extension segment and the second extension segment have different extension directions.

4. The protector according to claim 3, characterized in that, The second extension is inclined relative to the grounding part, and the second extension has a first angle with the grounding part, the first angle being in the range of 60° to 80°.

5. The protective device according to claim 3, characterized in that, The connecting part further includes: A transition section connects the second extension section and the grounding portion; The transition section and the second extension section are smoothly connected, and the transition section and the grounding section are also smoothly connected.

6. The protective device according to any one of claims 1 to 5, characterized in that, The contact portion has a contact surface, which includes at least one curved surface.

7. The protective device according to any one of claims 1 to 5, characterized in that, The width of the contact portion ranges from 1.5 mm to 3 mm; And / or, The width of the grounding part ranges from 1.5mm to 3mm.

8. The protective device according to any one of claims 1 to 5, characterized in that, The protector also includes: A limiting part is used to limit the connecting part; The limiting portion has a limiting space extending at least along the first direction, and at least a portion of the connecting portion is located in the limiting space.

9. The protector according to claim 8, characterized in that, The limiting part includes: Two limiting structures are provided on opposite sides of the limiting space; The connecting portion is at least partially disposed between the two limiting structures.

10. An electronic device, characterized in that, include: The equipment casing has a force-applying structure; The circuit board is located inside the housing of the device and has a grounding electrode; Circuit components are mounted onto the circuit board; And the protector as described in any one of claims 1 to 9; The grounding part of the protector is connected to the grounding electrode; The force-applying structure abuts against the connecting portion of the protector so that the contact portion of the protector remains in contact with the circuit element.

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