Semiconductor assembly press-fitting device

Abstract

The utility model belongs to the technical field of semiconductor assembly assembling, and particularly relates to a semiconductor assembly press-fitting device. According to the step, a movable screw rod, a push plate, a press-fitting assembly, clamping plates and a gear are arranged, the semiconductor assembly needing press-fitting is driven to move to be aligned with the push plate through a conveying belt assembly, the clamping plates on the two sides rotate to center and limit the semiconductor assembly through rotation of the gear, and the push plate is driven to move through rotation of the movable screw rod; the pressing assembly is composed of a hydraulic cylinder and a pressing plate assembly, the hydraulic cylinder drives a pressing plate to move, so that the pressing assembly can press the semiconductor assembly, after pressing is completed, a movable plate is driven to move through a first air cylinder, the movable plate is driven to move through a second air cylinder, and the semiconductor assembly is clamped and fixed through cooperation of the pushing plate and the fixed plate. And the movable plate pushes the pressed semiconductor assembly to the upper side of the conveying belt assembly so as to continuously move the semiconductor assembly, so that the semiconductor assembly is more convenient to load and unload, and the use convenience of the device is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor component assembly technology, specifically a semiconductor component pressing device. Background Technology

[0002] Semiconductor components are the core of modern electronic technology, encompassing a wide range of elements from basic discrete devices to complex integrated circuits. They play a key role in fields such as communications, computing, consumer electronics, industrial control, and new energy. When processing semiconductor components, bottom pressing devices are often used to press and assemble the various components.

[0003] Existing semiconductor component pressing devices do not have a workpiece conveying mechanism, which requires users to manually place and remove semiconductor workpieces, making the pressing device inconvenient to use. Therefore, a semiconductor component pressing device is proposed to address the above problems. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.

[0005] The technical solution adopted by this utility model to solve its technical problem is as follows: A semiconductor component pressing device of this utility model includes a base, a conveyor belt assembly disposed on the inner side of the base, a first motor fixedly connected to the outer side of the base, a movable screw fixedly connected to the output end of the first motor, a push plate threadedly connected to the outer side of the movable screw, a limit rod slidably connected to the inner side of the push plate, the limit rod being fixedly connected to the base, a fixing plate fixedly connected to the upper side of the base, the fixing plate and the push plate cooperating, a pressing assembly disposed on the outer side of the fixing plate, a clamping plate rotatably connected to the outer side of the push plate, a movable rod slidably connected to the inner side of the clamping plate, a gear fixedly connected to the outer side of the movable rod, both the gear and the movable rod being rotatably connected to the base, the gears meshing with each other, a second motor fixedly connected to the outer side of the base, and the output ends of the gear and the second motor fixedly connected on one side. The base is fixedly connected to the outer side by a first cylinder, and a movable plate is fixedly connected to the output end of the first cylinder. This step involves setting up a moving screw, a push plate, a pressing assembly, a clamping plate, and gears. The semiconductor component to be pressed is moved to the alignment with the push plate by the conveyor belt assembly. The rotation of the gears causes the clamping plates on both sides to rotate to center and limit the semiconductor component. The rotation of the moving screw drives the push plate to move, causing the push plate to push the semiconductor component to move. The push plate, in conjunction with the fixed plate, clamps and fixes the semiconductor component. The pressing assembly consists of a hydraulic cylinder and a pressure plate assembly. The hydraulic cylinder drives the pressure plate to move, thereby enabling the pressing assembly to press the semiconductor component. After pressing, the first cylinder drives the movable plate to move, causing the movable plate to push the pressed semiconductor component to the upper side of the conveyor belt assembly for further movement. This makes loading and unloading the semiconductor component more convenient and improves the ease of use of the device.

[0006] Preferably, a baffle is fixedly connected to the outer side of the base, and a movable screw is threadedly connected to the outer side of the base. One end of the movable screw is rotatably connected to a limiting plate, which works in conjunction with the conveyor belt assembly. This step, by setting up the baffle, movable screw, and limiting plate, allows the limiting plate to be gripped before the semiconductor assembly is conveyed, and then the movable screw to be rotated. Through the threaded connection between the movable screw and the base, the movable screw drives the limiting plate closer to the baffle, thereby further restricting the movement trajectory of the conveyed semiconductor, making its movement before pressing more stable and less prone to deviation, thus improving the stability of the device.

[0007] Preferably, a limiting rod is fixedly connected to the outer side of the base, and the limiting rod and the limiting plate are slidably connected. This step, by setting the limiting rod, restricts the movement of the limiting plate by the base, thereby limiting the movement of the limiting plate and improving the stability of the device.

[0008] Preferably, a movable plate is slidably connected to the inner side of the baffle, and a second cylinder is fixedly connected to the outer side of the base. The output ends of the movable plate and the second cylinder are fixedly connected. This step, by setting up the movable plate and the second cylinder, allows the movable plate to move when a semiconductor component is being pressed, thereby blocking subsequent semiconductor components. This, in conjunction with the stopping of the conveyor belt rotation, stops the subsequent semiconductor components, making it less likely for them to move before being pressed, and further improving the stability of the device.

[0009] Preferably, a limiting plate is fixedly connected to the outer side of the base, and the limiting plate is used in conjunction with the gear. This step, by setting the limiting plate, allows the limiting plate to be close to the gear, thereby further restricting the position of the gear by the mating base, making the meshing between the gears more stable and improving the stability of the device.

[0010] Preferably, a mounting plate is fixedly connected to the outer side of the base, and a friction block is fixedly connected to the outer side of the mounting plate. This step, by setting the mounting plate and the friction block, makes it easier to fix the device during installation by screwing screws into the grooves and mounting points on the surface of the mounting plate, and by having the friction block adhere tightly to the mounting point, making the installation of the device more stable and improving the stability of the device installation.

[0011] The advantages of this utility model are:

[0012] 1. This utility model, by setting up a movable screw, push plate, pressing assembly, clamping plate and gear, uses a conveyor belt assembly to move the semiconductor component to be pressed to the aligned push plate. The rotation of the gear causes the clamping plates on both sides to rotate to center and limit the semiconductor component. The rotation of the movable screw drives the push plate to move, so that the push plate pushes the semiconductor component to move. The push plate and the fixing plate clamp and fix the semiconductor component. The pressing assembly consists of a hydraulic cylinder and a pressing plate assembly. The hydraulic cylinder drives the pressing plate to move, so that the pressing assembly can press the semiconductor component. After pressing, the first cylinder drives the movable plate to move, so that the movable plate pushes the pressed semiconductor component to the upper side of the conveyor belt assembly for further movement. This makes the loading and unloading of semiconductor components more convenient and improves the ease of use of the device.

[0013] 2. By setting up a baffle, a movable screw, and a limiting plate, before the semiconductor component is conveyed, the limiting plate is first gripped, and then the movable screw is rotated. Through the threaded connection between the movable screw and the base, the movable screw drives the limiting plate closer to the baffle, thereby further restricting the movement trajectory of the conveyed semiconductor, making its movement before pressing more stable and less prone to deviation, thus improving the stability of the device. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a front view of the structure in this utility model;

[0016] Figure 2 This is a side view of the structure in this utility model;

[0017] Figure 3 This is a schematic diagram of the first motor structure in this utility model;

[0018] Figure 4 This is a schematic diagram of the second motor structure in this utility model;

[0019] Figure 5 This is a schematic diagram of the structure of the second cylinder in this utility model.

[0020] In the diagram: 1. Base; 101. Limiting rod; 2. Conveyor belt assembly; 3. First motor; 4. Moving screw; 5. Push plate; 6. Fixing plate; 7. Pressing assembly; 8. Clamping plate; 9. Movable rod; 10. Gear; 11. Second motor; 12. First cylinder; 13. Movable plate; 14. Baffle; 15. Movable screw; 16. Limiting plate; 17. Limiting rod; 18. Movable plate; 19. Second cylinder; 20. Limiting plate; 21. Mounting plate; 22. Friction block. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0022] Specific implementation examples are given below.

[0023] Please see Figures 1 to 5As shown, a semiconductor component pressing device includes a base 1, a conveyor belt assembly 2 disposed inside the base 1, a first motor 3 fixedly connected to the outside of the base 1, a movable screw 4 fixedly connected to the output end of the first motor 3, a push plate 5 threadedly connected to the outside of the movable screw 4, a limit rod 101 slidably connected to the inside of the push plate 5, the limit rod 101 being fixedly connected to the base 1, a fixing plate 6 fixedly connected to the upper side of the base 1, the fixing plate 6 and the push plate 5 cooperating, a pressing assembly 7 disposed outside the fixing plate 6, a clamping plate 8 rotatably connected to the outside of the push plate 5, a movable rod 9 slidably connected to the inside of the clamping plate 8, a gear 10 fixedly connected to the outside of the movable rod 9, both the gear 10 and the movable rod 9 being rotatably connected to the base 1, the gears 10 meshing with each other, a second motor 11 fixedly connected to the outside of the base 1, one side of the output end of the gear 10 and the second motor 11 being fixedly connected, the outside of the base 1 being fixedly connected to... The first cylinder 12 is connected to a movable plate 13 at its output end. This step involves a moving screw 4, a push plate 5, a pressing assembly 7, clamping plates 8, and gears 10. The conveyor belt assembly 2 moves the semiconductor component to be pressed to align with the push plate 5. The gears 10 rotate, causing the clamping plates 8 on both sides to rotate and center the semiconductor component. The moving screw 4 rotates, causing the push plate 5 to move, thus pushing the semiconductor component. The push plate 5, in conjunction with the fixed plate 6, clamps and secures the semiconductor component. The pressing assembly 7 consists of a hydraulic cylinder and a pressure plate assembly. The hydraulic cylinder moves the pressure plate, enabling the pressing assembly 7 to press the semiconductor component. After pressing, the first cylinder 12 moves the movable plate 13, pushing the pressed semiconductor component to the upper side of the conveyor belt assembly 2 for further movement. This makes loading and unloading the semiconductor component more convenient and improves the ease of use of the device.

[0024] Furthermore, such as Figure 1 As shown, a baffle 14 is fixedly connected to the outer side of the base 1, and a movable screw 15 is threadedly connected to the outer side of the base 1. One end of the movable screw 15 is rotatably connected to a limiting plate 16, which works in conjunction with the conveyor belt assembly 2. In this step, by setting up the baffle 14, the movable screw 15, and the limiting plate 16, before the semiconductor assembly is conveyed, the limiting plate 16 is first gripped, and then the movable screw 15 is rotated. Through the threaded connection between the movable screw 15 and the base 1, the movable screw 15 drives the limiting plate 16 closer to the baffle 14, thereby further restricting the movement trajectory of the conveyed semiconductor, making its movement before pressing more stable and less prone to deviation, thus improving the stability of the device.

[0025] Furthermore, such as Figure 1As shown, a limiting rod 17 is fixedly connected to the outer side of the base 1, and the limiting rod 17 and the limiting plate 16 are slidably connected. This step, by setting the limiting rod 17, restricts the movement of the limiting plate 16 by limiting the limiting rod 17 through the base 1, thereby restricting the movement of the limiting plate 16 and improving the stability of the device.

[0026] Furthermore, such as Figure 1 As shown, a movable plate 18 is slidably connected to the inner side of the baffle 14, and a second cylinder 19 is fixedly connected to the outer side of the base 1. The output ends of the movable plate 18 and the second cylinder 19 are fixedly connected. This step, by setting the movable plate 18 and the second cylinder 19, allows the movable plate 18 to move when a semiconductor component is being pressed, thereby blocking subsequent semiconductor components. This, in conjunction with the stopping of the conveyor belt assembly 2, stops the subsequent semiconductor components, making it less likely for them to move before being pressed, and further improving the stability of the device.

[0027] Furthermore, such as Figure 2 As shown, a limiting plate 20 is fixedly connected to the outer side of the base 1. The limiting plate 20 and the gear 10 are used in conjunction. This step, by setting the limiting plate 20, allows the limiting plate 20 to be close to the gear 10, thereby further restricting the position of the gear 10 on the base 1, making the meshing between the gears 10 more stable and improving the stability of the device.

[0028] Furthermore, such as Figure 1 As shown, a mounting plate 21 is fixedly connected to the outer side of the base 1, and a friction block 22 is fixedly connected to the outer side of the mounting plate 21. This step, by setting the mounting plate 21 and the friction block 22, makes it easier to fix the device during installation by screwing the screws into the groove and mounting position on the surface of the mounting plate 21. The friction block 22 is also used to press against the mounting position, making the installation of the device more stable and improving the stability of the device installation.

[0029] The working principle is as follows: the conveyor belt assembly 2 moves the semiconductor component to be pressed to the alignment push plate 5. The second motor 11 drives the gear 10 to rotate. The gears 10 mesh with each other, causing the two sides of the gears 10 to rotate relative to each other. The gears 10 drive the two clamping plates 8 to rotate to center and limit the semiconductor component. The first motor 3 drives the moving screw 4 to rotate. The moving screw 4 drives the push plate 5 to move, causing the push plate 5 to push the semiconductor component. The push plate 5, together with the fixing plate 6, clamps and fixes the semiconductor component. The pressing assembly 7 consists of a hydraulic cylinder and a pressure plate assembly. The hydraulic cylinder drives the pressure plate to move, so that the pressing assembly 7 can press the semiconductor component. After pressing, the first cylinder 12 drives the movable plate 13 to move, so that the movable plate 13 pushes the pressed semiconductor component to the upper side of the conveyor belt assembly 2 for further movement, making the loading and unloading of semiconductor components more convenient.

[0030] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0031] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A semiconductor component pressing device, comprising a base (1), characterized in that: A conveyor belt assembly (2) is provided on the inner side of the base (1). A first motor (3) is fixedly connected to the outer side of the base (1). A moving screw (4) is fixedly connected to the output end of the first motor (3). A push plate (5) is threadedly connected to the outer side of the moving screw (4). A limit rod (101) is slidably connected to the inner side of the push plate (5). The limit rod (101) is fixedly connected to the base (1). A fixing plate (6) is fixedly connected to the upper side of the base (1). The fixing plate (6) and the push plate (5) are used together. A pressing assembly (7) is provided on the outer side of the fixing plate (6). (5) A clamping plate (8) is rotatably connected to the outside. A movable rod (9) is slidably connected to the inside of the clamping plate (8). A gear (10) is fixedly connected to the outside of the movable rod (9). The gear (10) and the movable rod (9) are rotatably connected to the base (1). The gears (10) mesh with each other. A second motor (11) is fixedly connected to the outside of the base (1). The output end of the gear (10) and the second motor (11) is fixedly connected on one side. A first cylinder (12) is fixedly connected to the outside of the base (1). A movable plate (13) is fixedly connected to the output end of the first cylinder (12).

2. The semiconductor component pressing device according to claim 1, characterized in that: A baffle (14) is fixedly connected to the outside of the base (1), and a movable screw (15) is threadedly connected to the outside of the base (1). One end of the movable screw (15) is rotatably connected to a limiting plate (16), and the limiting plate (16) is used in conjunction with the conveyor belt assembly (2).

3. The semiconductor component pressing device according to claim 2, characterized in that: A limiting rod (17) is fixedly connected to the outside of the base (1), and the limiting rod (17) and the limiting plate (16) are slidably connected.

4. The semiconductor component pressing device according to claim 3, characterized in that: A movable plate (18) is slidably connected to the inner side of the baffle (14), and a second cylinder (19) is fixedly connected to the outer side of the base (1). The output ends of the movable plate (18) and the second cylinder (19) are fixedly connected.

5. A semiconductor component press-fitting apparatus according to claim 4, characterized in that: A limiting plate (20) is fixedly connected to the outside of the base (1), and the limiting plate (20) and the gear (10) are used in conjunction.

6. A semiconductor component press-fitting apparatus according to claim 5, characterized in that: A mounting plate (21) is fixedly connected to the outside of the base (1), and a friction block (22) is fixedly connected to the outside of the mounting plate (21).

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