Inflation table for positioning and locking wafer cassette

Abstract

An air inflation table for positioning and locking a wafer box comprises an air inflation table seat for bearing equipment, an air inflation table assembly arranged on the air inflation table seat and used for fixing the wafer box, and a plurality of air measurement control devices located in the air inflation table seat and used for detecting air data. The inflation pedestal is externally connected with a gas conveying device used for conveying gas to the inflation pedestal, and the gas measurement control device is externally connected with control equipment used for controlling the equipment to move. The air inflation table assembly comprises an air inflation table base plate used for bearing a wafer box, a gripper arranged in the air inflation table assembly, a set of fixing assemblies arranged on the air inflation table base plate and a set of positioning assemblies arranged on the air inflation table base plate. The wafer box is fixed and locked through the gripper arranged on the inflation table substrate, so that the wafer box is prevented from moving up and down along with the impact of gas during inflation.

Description

Technical Field

[0001] This utility model belongs to the technical field of inflation devices, and in particular, an inflation platform for positioning and locking wafer cassettes. Background Technology

[0002] In semiconductor manufacturing, wafer boxes primarily serve to place and transport wafers. To simplify transportation and minimize the risk of contamination, chip manufacturers utilize wafer boxes to handle and store wafers.

[0003] During handling and storage, semiconductor factories fill the wafer carriers, such as wafer cassettes, with inert gases like nitrogen to protect the wafers. When using a traditional inflation platform, the platform only functions to inflate the wafers, relying solely on the weight of the cassette itself for stability. However, during inflation, the cassette may sway slightly with the airflow, potentially causing unnecessary damage to the wafers inside. Summary of the Invention

[0004] In view of this, the present invention provides an inflatable stage for positioning and locking wafer cassettes to solve the above problems.

[0005] An inflatable table for wafer cassette positioning and locking, which includes an inflatable table base for carrying equipment, an inflatable table assembly arranged on the inflatable table base, multiple gas measurement and control devices located inside the inflatable table base for detecting gas data, and a control device connected to the inflatable table assembly. The inflatable table for wafer cassette positioning and locking is externally connected to a wafer cassette. The inflatable table assembly includes an inflatable table substrate for carrying the wafer cassette, a receiving through-hole arranged on the inflatable table substrate, a gripper arranged in the receiving through-hole for preventing the wafer cassette from moving up and down during inflation, an inflating member arranged on the inflatable table substrate for inflating the wafer cassette, an exhaust member arranged on the inflatable table substrate for exhausting air from the wafer cassette, at least one induction sensor arranged on the inflatable table substrate for sensing the placement of the wafer cassette, a set of positioning baffle members arranged on the inflatable table substrate for defining the placement range of the wafer cassette, a set of positioning protrusion members arranged on the inflatable table substrate for preventing the wafer cassette from moving left and right during inflation, and an air inlet arranged on the inflatable table substrate. The gripper includes a gripper shaft rod and a gripper frame arranged at one end of the gripper shaft rod away from the inflatable table base. The control device is connected to an actuator for controlling the movement of the gripper shaft rod. The inflating member includes a buffer member. During use, the buffer member is located between the wafer cassette and the inflatable table substrate. The wafer cassette includes a wafer cassette body for carrying and placing wafers, a top groove opened at the bottom of the wafer cassette body for cooperating with the gripper frame described below to fix the wafer cassette, and three positioning grooves opened at the bottom of the wafer cassette body. The top groove is a groove opened at the bottom of the wafer cassette body, the grooving direction is towards the direction away from the wafer cassette body, and the cross-section of the groove body is a "convex" shape. The width of the top groove near the bottom of the cross-section is smaller than the width at the groove opening, and two relatively extending top bumps are formed at the groove opening. The size of the gripper frame in the width direction is smaller than the distance between the two top bumps, the size of the gripper frame in the length direction is larger than the distance between the two top bumps, and the size of the gripper frame in the length direction is smaller than the distance between the groove walls inside the top groove.

[0006] Further, the inflatable table base includes an inflatable table base body for carrying the inflatable table assembly and protecting the gas measurement and control devices, an air outlet opened on the inflatable table base body for gas discharge, and a set of roller assemblies opened on the side of the inflatable table near the ground.

[0007] Further, the inflatable table substrate is also provided with a receiving concave groove for placing the inflating member and the exhaust member.

[0008] Furthermore, the inflation component includes a delivery pipe embedded in the accommodating concave groove for delivering gas, two bases embedded in the accommodating concave groove and located at both ends of the delivery pipe for delivering gas to the wafer cassette, an air inlet formed on the inflation stage substrate for the bases to deliver gas to the wafer cassette, and a buffer component sleeved on the outside of the bases.

[0009] Furthermore, the air inlet is formed on the gas filling stage substrate, and the gas transported through the delivery pipe enters the wafer cell through the air inlet. The air inlet is a circular through hole.

[0010] Furthermore, the buffer component includes a buffer column disposed on the base, a fixing groove formed on the buffer column, a buffer surface formed on the fixing groove, and a gas through hole formed on the buffer column for gas to pass through. The buffer component fits tightly against the base and is integrally formed by injection molding.

[0011] Furthermore, the positioning baffle includes three positioning edges, which are arranged in a non-closed rectangular frame.

[0012] Furthermore, the positioning stop includes a fixing stage disposed on the inflatable stage substrate for fixing the wafer cassette, and a guide stage disposed on the side of the fixing side away from the inflatable stage substrate.

[0013] Furthermore, the positioning protrusion includes three positioning pins arranged in an equilateral triangle, each positioning pin being a cylinder disposed on the inflatable platform base plate.

[0014] Furthermore, the gas measurement and control device includes a filter element disposed inside the inflation platform for filtering the incoming gas, an inlet flow sensor disposed inside the inflation platform and connected to the filter element for measuring the flow rate of the incoming gas, an inlet pressure sensor disposed inside the inflation platform and connected to the inlet flow sensor for measuring the pressure of the incoming gas, a solenoid valve disposed inside the inflation platform and connected to the inlet pressure sensor for controlling the gas flow rate, a humidity sensor disposed inside the inflation platform for measuring the humidity of the outgoing gas, an outlet pressure sensor disposed inside the inflation platform and connected to the humidity sensor for measuring the pressure of the outgoing gas, an outlet flow sensor disposed inside the inflation platform and connected to the outlet pressure sensor for measuring the flow rate of the outgoing gas, an inlet pipe passing through the inlet, and an outlet pipe passing through the outlet.

[0015] Compared with existing technologies, the inflation platform for positioning and locking wafer cassettes provided in this utility model quickly positions the wafer cassettes placed on the inflation platform substrate using positioning baffles and positioning protrusions set on the substrate. The grippers on the substrate securely lock the wafer cassettes, preventing them from moving up and down due to gas impact during inflation. Furthermore, the exhaust system, exhaust pressure sensor, and exhaust flow sensor allow the inflation platform to function not only for inflation but also for exhaust, with the exhaust pressure and flow sensors measuring the discharged gas, thus making the inflation platform versatile. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the inflatable platform for positioning and locking wafer cassettes provided by this utility model.

[0017] Figure 2 for Figure 1 An exploded view of the gas-filled stage used for positioning and locking wafer cassettes.

[0018] Figure 3 for Figure 1 A schematic diagram of the structure of the gas-filled stage base used for positioning and locking wafer cassettes.

[0019] Figure 4 for Figure 1 A schematic diagram of the structure of the wafer cassette in the inflatable stage used for positioning and locking the wafer cassette.

[0020] Figure 5 for Figure 1 A top view of the inflation stage surface of the inflation stage used for positioning and locking wafer cassettes.

[0021] Figure 6 for Figure 1 A bottom view of the inflation platform of the inflation stage used for positioning and locking wafer cassettes.

[0022] Figure 7 for Figure 1 A schematic diagram of the inflation component of the inflation stage used for positioning and locking wafer cassettes.

[0023] Figure 8 for Figure 1 An exploded view of the base and buffer components of the gas-filled stage used for positioning and locking wafer cassettes.

[0024] Figure 9 for Figure 8 An exploded view of the base and buffer components of the gas-filled stage used for positioning and locking wafer cassettes in another direction.

[0025] Figure 10 for Figure 1 A schematic diagram of the positioning guard edge of the inflatable stage used for positioning and locking wafer cassettes.

[0026] Figure 11 for Figure 1 An exploded view of the gripper and the substrate of the inflatable stage used for positioning and locking wafer cassettes.

[0027] Figure 12 for Figure 1 A schematic diagram of the gas flow path within the testing device for the gas filling stage used for wafer cell positioning and locking. Detailed Implementation

[0028] The specific embodiments of this utility model are described in further detail below. It should be understood that the description of the embodiments of this utility model herein is not intended to limit the scope of protection of this utility model.

[0029] like Figures 1 to 12 The diagram shows a gas-filled platform for positioning and locking a wafer cassette, as provided by this invention. The gas-filled platform includes a gas-filled platform base 10, a gas-filled platform assembly 20 mounted on the base 10, multiple gas measurement and control devices 30 located inside the base 10 for detecting gas data, and a control device 40 connected to the gas-filled platform assembly 20 for controlling the assembly. A wafer cassette 50 is externally connected to the gas-filled platform base 10 for use. A gas delivery device 60 is externally connected to the base 10 for supplying gas to it. The gas-filled platform also includes other functional modules, such as a power supply connected to the platform for controlling the device's switch, etc., which are technologies known to those skilled in the art and will not be described in detail here.

[0030] It should be noted that the wafer cassette 50 is the product used for sealing testing of the equipment in this application. The wafer cassette 50 includes a wafer cassette body 51 for holding and placing wafers, a top groove 52 formed on the bottom of the wafer cassette body 51 for cooperating with the gripper frame 232 described below to fix the wafer cassette 50, and three positioning grooves 53 formed on the bottom of the wafer cassette body 51.

[0031] The wafer cassette body 51 is an internally enclosed rectangular box. A similar structure is described in Chinese invention publication CN119673833A, titled "Wafer Cassette with Protective Limiting Device," and will only be briefly described here. Furthermore, the bottom of the wafer cassette body 51 is provided with multiple air inlets for inflating the product.

[0032] The abutting groove 52 is a groove provided at the bottom of the wafer cassette body 51, and the grooving direction is away from the wafer cassette body 51. The cross-section of the groove body is in the shape of a "convex" character, that is, the width of the abutting groove 52 near the groove bottom in the cross-section is smaller than the width at the groove opening, and two oppositely extending abutting protrusions 521 are formed at the groove opening. The abutting protrusions 521 are used for abutting after the corresponding components of the gas charging table assembly 20 extend into the abutting groove 52, which will be described in detail below in combination with the specific parts of the gas charging table assembly 20.

[0033] The depth of the positioning groove 53 is less than the thickness of the bottom plate of the wafer cassette body 51, so that the positioning groove 53 will not penetrate the bottom plate of the wafer cassette body 51, thereby affecting the airtightness of the wafer cassette 50.

[0034] The gas charging table base 10 is used to protect the gas measurement and control device 30 located inside the gas charging table base 10 and carry the gas charging table assembly 20. The gas charging table base 10 includes a gas charging table base body 11 for carrying the gas charging table assembly 20 and protecting the test device 30, an air outlet 12 opened on the gas charging table base body 11 for gas discharge, and a set of roller assemblies 13 opened on the side of the gas charging table base 10 close to the ground for facilitating the free movement of the gas charging table base 10.

[0035] The gas charging table base body 11 is a hollow frame. Preferably, the gas charging table base body 11 is made of a metal material such as iron, so as to have better stability.

[0036] The roller assembly 13 includes at least three rollers 131. In this embodiment, the number of the rollers 131 is four. The rollers 131 can be slid according to actual needs, and then the gas charging table base 10 can be moved.

[0037] The inflation stage assembly 20 includes an inflation stage base plate 21 for supporting the wafer cassette 50, a receiving through hole 22 disposed on the inflation stage base plate 21, a gripper 23 disposed in the receiving through hole 22, an inflation component 24 disposed on the inflation stage base plate 21 for inflating the wafer cassette 50, an exhaust component 25 disposed on the inflation stage base plate 21 for venting the wafer cassette 50, at least one sensing sensor 26 disposed on the inflation stage base plate 21 for sensing whether the wafer cassette 50 is on the inflation stage base plate 21, a set of positioning baffles 27 disposed on the inflation stage base plate 21 for limiting the placement range of the wafer cassette 50, a set of positioning protrusions 28 disposed on the inflation stage base plate 21 for preventing the wafer cassette 50 from moving left and right during inflation, and an air inlet 29 disposed on the inflation stage base plate 21 for sending the gas delivered by the gas delivery device 60 to the gas measurement and control device 30 for gas measurement and control.

[0038] The inflation platform substrate 21 can be a rectangular plate used to support the wafer cassette 50. Preferably, the inflation platform substrate 21 is made of a metal material such as iron, thereby having better load-bearing capacity. The inflation platform substrate 21 is also provided with accommodating recesses 211 for placing the inflation component 24 and the de-gas component 25 respectively. In this embodiment, the number of the inflation component 24 and the de-gas component 25 is one, therefore the number of accommodating recesses 211 is two.

[0039] The accommodating through hole 22 passes through the inflatable platform substrate 21. Preferably, the accommodating through hole 22 can be made by drilling.

[0040] The gripper 23 is used to fix the wafer cassette 50 when it is being inflated, preventing the wafer cassette 50 from moving in a direction perpendicular to the ground. The gripper 23 includes a gripper shaft 231 and a gripper frame 232 disposed at the end of the gripper shaft 231 away from the inflation platform 10.

[0041] The gripper frame 232 can be a cuboid. The dimension of the gripper frame 232 in the width direction is smaller than the distance between the two abutting protrusions 521, while the dimension in the length direction is larger than the distance between the two abutting protrusions 521 and smaller than the distance between the groove walls in the abutting groove 52. This allows the gripper frame 232 to pass between the two abutting protrusions 521. After passing through completely, the gripper shaft 231 is rotated along the central axis, causing the gripper frame 232 to abut against the two abutting protrusions 521.

[0042] When not in use, the gripper bracket 232 is placed inside the receiving through hole 22. In use, the actuator 41 controls the gripper shaft 231 to rise away from the inflation platform 10. At this time, the gripper bracket 232 passes between the two abutment protrusions 521 until it is completely passed through. Then, the gripper shaft 231 rotates axially under the control of the actuator 41. Preferably, the rotation angle is ninety degrees, and the gripper bracket 232 rotates synchronously, with its bottom surface resting on the top surface of the abutment protrusions 521. During inflation of the wafer cassette 50, the bottom surface of the gripper bracket 232 is in close contact with the top surface of the abutment protrusions 521. When the wafer cassette 50 is inflated and tends to move upwards due to gas force, the gripper bracket 232 abuts against the two abutment protrusions 521, thereby limiting the movement of the wafer cassette 50. After use, the actuator 41 controls the gripper shaft 231 to rotate in the opposite direction by the same angle to reset it, and then retracts the gripper shaft 231 so that the gripper bracket 232 passes through the two abutting protrusions 521 and returns to the receiving through hole 22 for storage and placement, ready for the next use.

[0043] The inflation component 24 includes a delivery pipe 241 embedded in the accommodating concave groove 211 for delivering gas, two bases 242 embedded in the accommodating concave groove 211, an air inlet 243 formed on the inflation stage substrate 21 for delivering gas from the base 242 to the wafer cassette, and a buffer component 244 sleeved on the outside of the base 242 to prevent direct contact between the wafer cassette and the base 243, thereby preventing damage to the wafer cassette.

[0044] The accommodating concave groove 211 is used to accommodate the conveying pipe 241 and the base 242.

[0045] The delivery pipe 241 is used to transport gas through the delivery pipe 241 to the wafer cassette.

[0046] Each of the bases 242 has the same structure. In this embodiment, two bases 242 are located at both ends of the delivery pipe 242.

[0047] The air inlet 243 is formed on the gas filling platform substrate 21, and the gas transported by the delivery pipe 241 enters the wafer cassette 50 through the air inlet 243. The air inlet 243 can be a circular through hole.

[0048] The buffer component 244 includes a buffer column 2441 disposed on the base 242, a fixing groove 2442 formed on the buffer column 2441, a buffer surface 2443 formed on the fixing groove 2442, and a gas through hole 2444 formed on the buffer column 2441.

[0049] The buffer column 2441 is used to support the buffer surface 2443.

[0050] The fixing groove 2442 is a circular groove, and the radius of the fixing groove 2442 is larger than the radius of the gas through hole 2444.

[0051] The buffer surface 2443 is shaped like an inverted bowl, and the opening of the buffer surface 2443 faces away from the buffer column 2441.

[0052] The gas through-hole 2444 also passes through the fixing groove 2442 and the buffer surface 2443. The gas through-hole 2444 is used for gas flow.

[0053] The buffer 244 fits tightly against the base 242. Preferably, the buffer 244 can be integrally molded by injection molding. The buffer 244 is made of elastic materials such as rubber, thus having good elasticity. In use, when the wafer cassette 50 is placed on the inflation platform 10, the buffer 244 is located between the wafer cassette 50 and the inflation platform substrate 21. The buffer 244 deforms under the gravity of the wafer cassette 50 and generates an elastic reaction force on the wafer cassette 50 in the opposite direction of gravity, thereby compensating for any gaps that may occur between the gripper bracket 232 and the abutment groove 52 due to insufficient product precision. During inflation, the wafer cassette 50 is subjected not only to the downward pulling force of the gripper bracket 232 but also to the upward force of the buffer 244. The buffer 244 can prevent the wafer cassette 50 from moving downwards during inflation and can position the wafer cassette 50 to prevent it from shaking up and down.

[0054] The venting component 25 is used to vent the wafer cassette. The venting component 25 has the same structure as the inflation component 24, and will not be described in detail here.

[0055] The sensor 26 is used to sense whether the wafer cassette 50 is placed on the inflation platform substrate 21. When the wafer cassette 50 is placed on the inflation platform substrate 21, the wafer cassette 50 sinks under the influence of gravity, thereby pressing the sensor 26. At this time, the sensor 26 senses and determines that the wafer cassette 50 is placed on the inflation platform substrate 21. When the wafer cassette 50 is removed, the sensor 26 returns to its original state and is no longer under external pressure. At this time, the sensor 26 senses and determines that the wafer cassette 50 is not placed on the inflation platform substrate 21.

[0056] The positioning baffle 27 includes three positioning baffles 271, which are arranged in an open rectangular frame to guide the placement of the wafer cassette 50.

[0057] The positioning edge 271 includes a fixing platform disposed on the inflation platform substrate 21 for fixing the wafer cassette 50, and a guiding platform 2712 disposed on the side of the fixing edge 2711 away from the inflation platform substrate 21 for guiding the wafer cassette 50.

[0058] The fixing stage 2711 can be a cuboid. When the wafer cassette 50 is placed into the inflatable platform 20, the three fixing stages 2711 abut against the wafer cassette 50 three times, thereby limiting the horizontal movement of the wafer cassette 50 in these three directions.

[0059] The guide platform 2712 can be a trapezoid with its waist facing the wafer cassette 50. When placed, the wafer cassette 50 can slide quickly down the waist of the guide platform 2712 into the inflation platform assembly 20.

[0060] The positioning protrusion 28 includes three positioning pins 281 arranged in an equilateral triangle.

[0061] The positioning pin 281 is a cylinder disposed on the inflatable platform base plate 21. The size and shape of the positioning pin 281 match the size and shape of the positioning groove 53, thereby enabling the positioning pin 281 to be tightly connected and fixed to the wafer cassette 50. The three positioning pins 281 can reposition the wafer cassette 50 to prevent it from moving left or right. This is prior art and will not be described in detail here.

[0062] The air inlet 29 can be a circular through hole disposed on the inflation platform substrate 21 and penetrating the inflation platform substrate 21.

[0063] The gas measurement and control device 30 includes a filter element 31 disposed inside the inflation platform 10 for filtering the incoming gas, an inlet flow sensor 32 disposed inside the inflation platform 10 and connected to the filter element 31 for measuring the flow rate of the incoming gas, an inlet pressure sensor 33 disposed inside the inflation platform 10 and connected to the inlet flow sensor 32 for measuring the pressure of the incoming gas, a solenoid valve 34 disposed inside the inflation platform 10 and connected to the inlet pressure sensor 33 for controlling the gas flow rate, a humidity sensor 35 disposed inside the inflation platform 10 for measuring the humidity of the outgoing gas, an outlet pressure sensor 36 disposed inside the inflation platform 10 and connected to the humidity sensor 35 for measuring the pressure of the outgoing gas, an outlet flow sensor 37 disposed inside the inflation platform 10 and connected to the outlet pressure sensor 36 for measuring the flow rate of the outgoing gas, an inlet pipe 38 passing through the inlet 29, and an outlet pipe 39 passing through the outlet 12.

[0064] The filter element 31 is used to filter the incoming gas. It is a simple device for purifying fluid resources and separating resources. It is an existing technology and will not be described in detail here.

[0065] The intake flow sensor 32 is used to measure the flow rate of the incoming gas. It is an air flow sensor, which is existing technology and will not be described in detail here.

[0066] The intake pressure sensor 33 is used to measure the pressure of the incoming gas. It is an air pressure sensor, which is existing technology and will not be described in detail here.

[0067] The solenoid valve 34 is used to control the gas flow rate within the inflation platform 10. It is an electromagnetically controlled industrial device and a basic component for fluid control automation. As existing technology, it will not be described in detail here. The solenoid valve 34 is controlled by the control device 60, thereby controlling the pressure and flow rate of the incoming gas.

[0068] The humidity sensor 35 is used to measure the humidity of the outflowing gas. It is a humidity sensor and is existing technology, so it will not be described in detail here.

[0069] The outflow pressure sensor 36 is used to measure the pressure of the outflowing gas. It is an air pressure sensor, which is existing technology and will not be described in detail here.

[0070] The outflow flow sensor 37 is used to measure the flow rate of the outflowing gas. It is an air flow sensor, which is existing technology and will not be described in detail here.

[0071] The intake pipe 38 is sequentially connected to the filter element 31, the intake flow sensor 32, the intake pressure sensor 33, the solenoid valve 34, and the intake assembly 24. The intake pipe 38 is used to deliver the gas delivered by the gas delivery device 60 to the wafer cassette 50.

[0072] The exhaust pipe 39 is sequentially connected to the exhaust component 25, the humidity sensor 35, the exhaust pressure sensor 36, and the exhaust flow sensor 37. The exhaust pipe 39 is used to output the gas inside the wafer cassette 50.

[0073] The control device 40 is a controller for controlling the movement of the gripper 23. The control device 40 is also connected to an actuator 41 for controlling the movement of the gripper shaft 231. In this embodiment, the control device 40 can be a computer, and it is also electrically connected to the intake air flow sensor 32, the intake air pressure sensor 33, the humidity sensor 35, the exhaust air pressure sensor 36, and the exhaust air flow sensor 37. The data measured by each sensor can be converted into electrical signals by a circuit, which are then reflected on the control device 40, allowing the sensor data to be observed in real time through the control device 40.

[0074] The actuator 41 is electrically connected to the control device 40. The electrical signal of the control device 40 can be converted into a mechanical signal through a wire, thereby driving the actuator 41 to move.

[0075] The gas delivery device 60 is used to deliver gas to the gas filling platform 10. The gas delivery device 60 can be a gas source or a hydraulic cylinder filled with gas.

[0076] Compared with the prior art, the inflation platform for positioning and locking wafer cassettes provided in this utility model quickly positions the wafer cassette 50 placed on the inflation platform base plate 21 using the positioning baffle 27 and the positioning protrusion 28 set on the inflation platform base plate 21. The gripper 23 set on the inflation platform base plate 21 fixes and locks the wafer cassette 50, preventing it from moving up and down due to the impact of gas during inflation. Furthermore, the inflation platform can be used not only for inflation but also for deflation via the exhaust component 25, the exhaust pressure sensor 36, and the exhaust flow sensor 37, and the exhaust gas is measured by the exhaust pressure sensor 36 and the exhaust flow sensor 37, thus making the inflation platform versatile.

[0077] The above are merely preferred embodiments of the present utility model and are not intended to limit the scope of protection of the present utility model. Any modifications, equivalent substitutions or improvements within the spirit of the present utility model are covered within the scope of the claims of the present utility model.

Claims

1. An inflatable stage for positioning and locking wafer cassettes, characterized in that: The inflatable table for wafer cassette positioning and locking includes an inflatable table base for carrying the device, an inflatable table assembly provided on the inflatable table base, multiple gas measurement and control devices located inside the inflatable table base for detecting gas data, and a control device connected to the inflatable table assembly. The inflatable table for wafer cassette positioning and locking is externally connected to a wafer cassette. The inflatable table assembly includes an inflatable table substrate for carrying the wafer cassette, a receiving through-hole provided on the inflatable table substrate, a gripper provided in the receiving through-hole for preventing the wafer cassette from moving up and down during inflation, an inflating member provided on the inflatable table substrate for inflating the wafer cassette, an exhaust member provided on the inflatable table substrate for exhausting the wafer cassette, at least one induction sensor provided on the inflatable table substrate for sensing the placement of the wafer cassette, a set of positioning baffle members provided on the inflatable table substrate for defining the placement range of the wafer cassette, a set of positioning protrusion members provided on the inflatable table substrate for preventing the wafer cassette from moving left and right during inflation, and an air inlet provided on the inflatable table substrate. The gripper includes a gripper shaft rod and a gripper frame provided at one end of the gripper shaft rod away from the inflatable table base. The control device is connected to an actuator for controlling the movement of the gripper shaft rod. The inflating member includes a buffer member. During use, the buffer member is located between the wafer cassette and the inflatable table substrate. The wafer cassette includes a wafer cassette body for carrying and placing wafers, a top groove opened at the bottom of the wafer cassette body for cooperating with the following gripper frame to fix the wafer cassette, and three positioning grooves opened at the bottom of the wafer cassette body. The top groove is a groove provided at the bottom of the wafer cassette body, and the grooving direction is towards the direction away from the wafer cassette body. The cross-section of the groove body is a "convex" shape. The width of the top groove near the bottom of the cross-section is smaller than the width at the groove opening, and two relatively extending top bumps are formed at the groove opening. The size of the gripper frame in the width direction is smaller than the distance between the two top bumps, the size of the gripper frame in the length direction is larger than the distance between the two top bumps, and the size of the gripper frame in the length direction is smaller than the distance between the groove walls inside the top groove.

2. The gas-filled stage for positioning and locking wafer cassettes as described in claim 1, characterized in that: The inflatable table base includes an inflatable table base body for carrying the inflatable table assembly and protecting the gas measurement and control devices, an air outlet opened on the inflatable table base body for gas discharge, and a set of roller assemblies opened on one side of the inflatable table base close to the ground.

3. The gas-filled stage for positioning and locking wafer cassettes as described in claim 1, characterized in that: A receiving concave groove for placing the inflating member and the exhaust member is further opened on the inflatable table substrate.

4. The gas-filling stage for positioning and locking wafer cassettes as described in claim 3, characterized in that: The inflating member includes a conveying pipe embedded in the receiving concave groove for conveying gas, two bases embedded in the receiving concave groove and located at both ends of the conveying pipe for conveying gas to the wafer cassette, an air inlet hole opened on the inflatable table substrate for the base to convey gas to the wafer cassette, and a buffer member sleeved outside the base.

5. The gas-filled stage for positioning and locking wafer cassettes as described in claim 4, characterized in that: The air inlet is formed on the gas filling stage substrate. Gas transported through the delivery pipe enters the wafer cell through the air inlet, which is a circular through hole.

6. The gas-filled stage for positioning and locking wafer cassettes as described in claim 4, characterized in that: The buffer component includes a buffer column disposed on the base, a fixing groove formed on the buffer column, a buffer surface formed on the fixing groove, and a gas passage hole formed on the buffer column for gas passage. The buffer component fits tightly against the base and is integrally formed by injection molding.

7. The gas-filled stage for positioning and locking wafer cassettes as described in claim 1, characterized in that: The positioning baffle includes three positioning edges, which are arranged in a non-closed rectangular frame.

8. The gas-filled stage for positioning and locking a wafer cassette as described in claim 7, characterized in that: The positioning stop includes a fixing stage disposed on the inflation stage substrate for fixing the wafer cassette, and a guide stage disposed on the side of the fixing side away from the inflation stage substrate.

9. The gas-filled stage for positioning and locking a wafer cassette as described in claim 1, characterized in that: The positioning protrusion includes three positioning pins arranged in an equilateral triangle, and each positioning pin is a cylinder disposed on the inflatable platform base plate.

10. The gas-filled stage for positioning and locking a wafer cassette as described in claim 2, characterized in that: The gas measurement and control device includes a filter element disposed inside the inflation platform for filtering the incoming gas, an inlet flow sensor disposed inside the inflation platform and connected to the filter element for measuring the flow rate of the incoming gas, an inlet pressure sensor disposed inside the inflation platform and connected to the inlet flow sensor for measuring the pressure of the incoming gas, a solenoid valve disposed inside the inflation platform and connected to the inlet pressure sensor for controlling the gas flow rate, a humidity sensor disposed inside the inflation platform for measuring the humidity of the outgoing gas, an outlet pressure sensor disposed inside the inflation platform and connected to the humidity sensor for measuring the pressure of the outgoing gas, an outlet flow sensor disposed inside the inflation platform and connected to the outlet pressure sensor for measuring the flow rate of the outgoing gas, an inlet pipe passing through the inlet, and an outlet pipe passing through the outlet.

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